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At least 19 records

Interfacial fracture of Space-Shuttle thermal-protection system

Stable crack growth and fracture at the interface of undensified LI-900 reusable surface insulation (RSI) tile and the Nomex strain isolation pad (SIP) of the Space-Shuttle thermal-protection system (TPS) were modeled by double-edged notch-tension specimens. These specimens were loaded under uniaxial tension or 50-Hz cyclic loading and the resultant stable crack growth leading to eventual fracture was monitored by a videocamera. These tests showed that successive local tear-outs due to local tensile overload in the RSI tile resulted in the interfacial fracture where the crack-tip opening angle, CTOA, of the SIP was related to initiation and intermittent stable crack propagation. Fractures in similar static and dynamic test specimens using densified LI-900 RSI tiles occurred in the undensified regions of the RSI tiles. These failures were consistent with the above failure mechanism based on the local tensile strength of the undensified LI-900 RSI tile. The intermittent stable crack growth of undensified LI-900 RSI tile was reproduced by a deterministic, two-dimensional finite-element model with SIP of variable elastic moduli.

Komine, A.↗

Computation of Anisotropic Bi-Material Interfacial Fracture Parameters and Delamination Creteria

This report documents the recent developments in methodologies for the evaluation of the integrity and durability of composite structures, including i) the establishment of a stress-intensity-factor based fracture criterion for bimaterial interfacial cracks in anisotropic materials (see Sec. 2); ii) the development of a virtual crack closure integral method for the evaluation of the mixed-mode stress intensity factors for a bimaterial interfacial crack (see Sec. 3). Analytical and numerical results show that the proposed fracture criterion is a better fracture criterion than the total energy release rate criterion in the characterization of the bimaterial interfacial cracks. The proposed virtual crack closure integral method is an efficient and accurate numerical method for the evaluation of mixed-mode stress intensity factors.

Chow, W-T.↗

LightMAT - Pediction of Aluminum/Steel Joint Failure

Develop a predictive model of dissimilar metallic spot joints and their behavior during fracture; specifically, whether the joint fractures via interfacial fracture or button pull-out as a function of alloy, sheet thickness, faying interface microstructure, and thermal-mechanical treatment of the weld nugget and heat affected zone. Having the ability to model whether a given joint structure would fracture inter-facially or via button pullout will reduce development time and provide savings to vehicle design programs. This would provide a significant step function improvement in reducing the time-to-market for this multi-material, weight-saving technology.

36 MATERIALS SCIENCE↗

Separation of crack extension modes in composite delamination problems

This work concerns fracture mechanics modeling of composite delamination problems. In order to predict delamination resistance, an applied stress intensity factor, K, or energy release rate, G, must be compared to a mode-dependent critical value of K or G from experiment. In the interfacial fracture analysis of most applications and some tests, the mode of crack extension is not uniquely defined. It is instead a function of distance from the crack tip due to the oscillating singularity existing at the tip. In this work, a consistent method is presented of extracting crack extension modes in such cases. In particular, use of the virtual crack closure technique (VCCT) to extract modes of crack extension is studied for cases of a crack along the interface between two in-plane orthotropic materials. Modes of crack extension extracted from oscillatory analyses using VCCT are a function of the virtual crack extension length, delta. Most existing efforts to obtain delta-independent modes of crack extension involve changing the analysis in order to eliminate its oscillatory nature. One such method involves changing one or more properties of the layers to make the oscillatory exponent parameter, epsilon, equal zero. Standardized application of this method would require consistent criteria for identifying which properties can be altered without changing the physical aspects of the problem. Another method involves inserting a thin homogeneous layer (typically referred to as a resin interlayer) along the interface and placing the crack within it. The drawbacks of this method are that it requires increased modeling effort and introduces the thickness of the interlayer as an additional length parameter. The approach presented here does not attempt to alter the interfacial fracture analysis to eliminate its oscillatory behavior. Instead, the argument is made that the oscillatory behavior is non-physical and that if its effects were separated from VCCT quantities, then consistent, delta-independent modes of crack extension could be defined. Knowledge of the near-tip fields in a planar orthotropic material interfacial fracture analysis is used to determine the explicit delta dependence of VCCT parameters. Once this delta dependence is determined, energy release rates are defined with this delta dependence factored out. This modified VCCT method is applied to results from two finite element test cases. It is shown that, as predicted, delta-independent modes of crack extension result. The modified VCCT approach shows potential as a consistent method of extracting crack extension modes. It uses the same information from a finite element analysis (i.e., nodal forces and displacements) as the traditional VCCT method does. The A-independent modes extracted using the modified VCCT approach can also be used as guides to test the convergence of finite element solutions.

Beuth, Jack L.↗

Mode I tensile fracture behavior of adhesively-bonded metal–metal, metal–CFRP, and CFRP–CFRP bi-material combinations analyzed by size effect method

Understanding the adhesive and interfacial fracture is important for developing and achieving better adhesive jointing in bi-materials, the location which becomes less vulnerable in engineered structure components. Still, to characterize the fracturing behavior of various adhesively-bonded materials, it was shown in this work that the Mode I fracture energies estimated from conventional methods (e.g., work-of-fracture, (modified) compliance calibration method, (modified) beam theory, etc.) can be strongly affected by adherent thickness, adhesive bond length, and material type. Consequently, this hindered the proper understanding of fracturing in adhesive jointing of bi-materials since the estimated fracture energies can exhibit unreasonable difference among various material combinations, thus leading to the confusion in the literature due to the unfair comparison on these non-objective results estimated by leveraging conventional methods on the specimens with different geometries. This work compared size effect method with conventional methods on the calculation of the Mode I fracture energies of metal-metal, metal-CFRP, and CFRP-CFRP material combinations via Double Cantilever Beam (DCB) tests. The results showed that the estimated fracture energies of various material combinations are not dependent on the specimen geometries. This aspect allowed the fair comparison particularly on the interfacial fracturing between metal/adhesive and CFRP/adhesive, and the difference was further explained and correlated with the damage morphology on the material surface after failure identified through three-dimensional profilometer.

36 MATERIALS SCIENCE↗

Magnetohydrodynamic Control of Interfacial Degradation in Lithium-Ion Batteries for Fast Charging Applications

Interfacial anodic degradation in graphitic materials under fast charging conditions causes severe performance loss and safety hazard in lithium ion batteries. We present a novel method for minimizing the growth of these aging mechanism by application of an external magnetic field. Under magnetic field, paramagnetic lithium ions experience a magnetohydrodynamic force, which rotates the perpendicularly diffusing species and homogenizes the ionic transport. This phenomenon minimizes the overpotential hotspots at the anode/separator interface, consequently reducing SEI growth, lithium plating, and interfacial fracture. In situ electrochemical measurements indicate an improvement in capacity for lithium cobalt oxide/graphite pouch cell (20 mAh) charged from 1–5 C under an applied field of 1.8 kG, with a maximum capacity gain of 22% at 5C. Post-mortem FE-SEM and EDS mapping shows that samples charged with magnetic field have a reduced lithium deposition at 3C and a complete suppression of interfacial fracture at 5C. At 5C, a 24% reduction in the lithium content is observed by performing XPS on the anodic interfacial film. Finally, fast charging performance under variable magnetic field strengths indicate a saturation behavior in capacity at high fields (>2 kG), thereby limiting the field and consequent energy requirements to obtain maximum capacity gain under extreme conditions.

electromagnetism↗

Interpreting test temperature and loading rate effects on the fracture toughness of polymer-metal interfaces via time–temperature superposition

Here, in this letter, we present interfacial fracture toughness data for a polymer-metal interface where tests were conducted at various test temperatures T and loading rates $\dot{δ}$. An adhesively bonded asymmetric double cantilever beam (ADCB) specimen was utilized to measure toughness. ADCB specimens were created by bonding a thinner, upper adherend to a thicker, lower adherend (both 6061 T6 aluminum) using a thin layer of epoxy adhesive, such that the crack propagated along the interface between the thinner adherend and the epoxy layer. The specimens were tested at T from 25 to 65 °C and $\dot{δ}$ from 0.002 to 0.2 mm/s. The measured interfacial toughness Γ increased as both T and $\dot{δ}$ increased. For an ADCB specimen loaded at a constant $\dot{δ}$, the energy release rate G increases as the crack length a increases. For this reason, we defined rate effects in terms of the rate of change in the energy release rate $\dot{G}$. Although not rigorously correct, a formal application of time–temperature superposition (TTS) analysis to the Γ data provided useful insights on the observed dependencies. In the TTS-shifted data, Γ decreased and then increased for monotonically increasing $\dot{G}$. Thus, the TTS analysis suggests that there is a minimum value of Γ. This minimum value could be used to define a lower bound in Γ when designing critical engineering applications that are subjected to T and $\dot{δ}$ excursions.

36 MATERIALS SCIENCE↗

Variational mechanics analysis of the stresses in microdrop debond specimens

A recently derived variational mechanics analysis of stresses in single-fiber model composites has been applied to the analysis of the stresses in the microdrop debond specimen. The new analysis is more accurate than the commonly applied shear-lag or elastic-plastic analyses. The results from a sample stress state calculation suggest that interfacial failure between the fiber and the microdrop is by mode I or opening mode failure at the beginning of the microdrop. The opening mode failure is caused by a large tensile radial stress at the fiber/matrix interface. Previous analyses of microdrop debond data have been in terms of a shear strength. It is suggested that these analyses misrepresent microdrop debond results and recommend instead a failure analysis based on energy release rate and interfacial fracture toughness. A procedure for calculating the energy release rate for the growth of an interfacial crack is described.

Scheer, Robert J.↗

Temperature and radiation effects on brittle versus ductile fracture behavior in miscible phase boundaries: insight from atomistic simulations

Temperature- and irradiation-assisted failure mechanisms in miscible phase boundaries are clarified via atomistic calculations. We first establish the temperature-dependent brittle-to-ductile transition in U–Zr miscible phase boundaries. Our results confirm that these boundaries are mostly brittle at low temperatures and ductile at elevated temperatures. We then investigate the changes induced by irradiation on the fracture mechanisms in such phase boundaries. The irradiation-induced defect accumulation follows a multi-stage process that starts with the accumulation of isolated small dislocation loops before transitioning to the saturation and growth of larger dislocation loops and end up with a reorganization into forest dislocations. The accumulation of loops is the primary feature to participate in the delineation between brittle and ductile interfacial fracture in irradiated phase boundaries. At low damage levels, radiation defect interactions with the crack tip are limited and U–Zr miscible boundaries fail through the emission of dislocations ahead of the crack tip followed by brittle cleavage in agreement with the classical Griffith’s criterion for crack stability. At higher damage levels, the failure mode transitions from brittle crack growth to ductile void growth. In this case, the microcrack tip is blunted by the high density of pre-existing, radiation-induced defects in the vicinity of the crack. This interaction leads to the development and growth of a cavity at the interface as opposed to interfacial cleavage.

36 MATERIALS SCIENCE↗

Numerical Simulation of Delamination Growth in Composite Materials

The use of decohesion elements for the simulation of delamination in composite materials is reviewed. The test methods available to measure the interfacial fracture toughness used in the formulation of decohesion elements are described initially. After a brief presentation of the virtual crack closure technique, the technique most widely used to simulate delamination growth, the formulation of interfacial decohesion elements is described. Problems related with decohesion element constitutive equations, mixed-mode crack growth, element numerical integration and solution procedures are discussed. Based on these investigations, it is concluded that the use of interfacial decohesion elements is a promising technique that avoids the need for a pre-existing crack and pre-defined crack paths, and that these elements can be used to simulate both delamination onset and growth.

Camanho, P. P.↗

Fundamental tribological properties of ion-beam-deposited boron nitride films

The adhesion, friction, and micromechanical properties of ion-beam-deposited boron nitride (BN) films are reviewed. The BN films are examined in contact with BN metals and other harder materials. For simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. First, the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces are discussed. The effects of surface films, hardness of metals, and temperature on tribological response with respect to adhesion and friction are considered. The second part deals with the abrasion of the BN films. Elastic, plastic, and fracture behavior of the BN films in solid-state contact are discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of BN films deposited on substrates is also addressed.

Miyoshi, Kazuhisa↗

Fundamental tribological properties of ion-beam-deposited boron nitride films

The adhesion, friction, and micromechanical properties of ion-beam-deposited boron nitride (BN) films are reviewed. The BN films are examined in contact with BN metals and other harder materials. For simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. First, the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces are discussed. The effects of surface films, hardness of metals, and temperature on tribological response with respect to adhesion and friction are considered. The second part deals with the abrasion of the BN films. Elastic, plastic, and fracture behavior of the BN films in solid-state contact are discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of BN films deposited on substrates is also addressed.

Miyoshi, K.↗

Adhesion, friction and micromechanical properties of ceramics

The adhesion, friction, and micromechanical properties of ceramics, both in monolithic and coating form, are reviewed. Ceramics are examined in contact with themselves, other harder materials, and metals. For the simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. The first part discusses the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces. The role of chemical bonding in adhesion and friction, and the effects of surface contaminant films and temperature on tribological response with respect to adhesion and friction are discussed. The second part deals with abrasion of ceramics. Elastic, plastic, and fracture behavior of ceramics in solid state contact is discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of ceramic deposited on substrates is also addressed.

Miyoshi, Kazuhisa↗

Adhesion, friction and micromechanical properties of ceramics

The adhesion, friction, and micromechanical properties of ceramics, both in monolithic and coating form, are reviewed. Ceramics are examined in contact with themselves, other harder materials, and metals. For the simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. The first part discusses the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces. The role of chemical bonding in adhesion and friction, and the effects of surface contaminant films and temperature on tribological response with respect to adhesion and friction are discussed. The second part deals with abrasion of ceramics. Elastic, plastic, and fracture behavior of ceramics in solid state contact is discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of ceramic deposited on substrates is also addressed.

Miyoshi, Kazuhisa↗