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Results for “Interpass dwell time”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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Infrared triggered dwell and active cooling thermal control effects on microstructural uniformity in DED

Directed Energy Deposition (DED) offers rapid large scale fabrication, but difficulty in delivering consistent microstructures and properties hinders the use of DED fabricated components in safety or performance critical applications. Variability stems from the complex thermal cycles generated by the toolpath used to print the required geometry. Several practical methods have become established in DED to regulate overheating, such as active cooling of the baseplate structure or the use of an infrared camera to inject interlayer pauses to ensure the top layer of the component cools to a set temperature, which have been shown to affect microstructure. However, no critical assessment has been performed as to how effective these controls are in promoting microstructural uniformity in the context of complex layer timing commonly generated by non-prismatic geometries. Here we show how controls influence the thermal field, phase transformations, and dynamic annealing of a low-temperature transformation steel using infrared imaging and operando neutron diffraction. Counterintuitively, common thermal homogenization process controls can reduce microstructural uniformity because these approaches stabilize peak temperature while overlooking temperatures near the solid-state phase transformation fronts. Instead, the cyclic reheating induces spatially-variant dynamically annealed regions which can be modulated via control parameters. We show that these controls have spatially linked effects centimeters away from the active weld, which implies that microstructure control must co-optimize thermal input across many subsequent layers. In conclusion, our results demonstrate the pressing need for higher order controls that integrate predictive elements of simulation data to stabilize printed properties for future qualification of DED components.

Directed energy deposition↗

Residual stress and microstructure in IN718-René41 graded superalloy fabricated by laser blown directed energy deposition

Additively printed Ni-based superalloy with a compositionally graded transition from IN718 to René41 was fabricated by laser blown-powder directed energy deposition (DED/LB-M), with the goals of meeting location-specific temperature capability and reducing component cost for hot gas path turbine components. Residual stress distribution in thin wall specimens with three sets of DED build parameters in the as-built and stress-relieved states was measured by neutron diffraction. For calculating residual stress, the calculated d0 method was found to be more appropriate as stress-free reference than using the lattice spacing measured from the stress-relief heat treated specimens. Longer dwell time (lower interpass temperature), higher energy input, smaller layer thickness resulted in a higher magnitude of tensile residual stresses at edges and compressive residual stresses at center of the specimens. The residual stress results did not show a strong dependence on graded compositions, indicating that the residual stress build-up was more geometry and process dependent. Non-destructive neutron imaging based on the attenuation coefficient qualitatively visualized the compositional variation in the bulk and showed good agreement with quantitative Electron Probe Micro-Analysis (EPMA) measurement. Grain structure, texture, and residual plastic strain along the build direction were characterized by Electron Backscatter Diffraction (EBSD). Long columnar grains with (001) preferred grain orientation were dominant along the build direction. Compositional change did not show an obvious effect on the epitaxial growth of dendrites and the continuation of the columnar grains. Residual plastic strain was relatively low in the as-built specimens.

36 MATERIALS SCIENCE↗

Analysis of Conduction Cooling Strategies for Wire Arc Additive Manufacturing

Metal additive manufacturing (AM) processing consists of numerous parameters which take time to optimize for various geometries. One aspect of the metal AM process that continues to be explored is the control of thermal energy accumulation during component manufacturing due to the melting and solidification of the feedstock. Excessive energy accumulation causes thermal failure of the component while minimal energy accumulation causes lack of fusion with the build plate or previous layer. The ability to simulate the thermal response of an AM component can increase research efficiency by reducing the time to optimize thermal energy accumulation. This paper presents an effective implementation of finite element analysis to determine the thermal response of a wire arc additive manufactured component with various build plate sizes and cooling methods including, integral build plate cooling, oversized build plates with passive cooling, and non-integral build plate cooling. The use of integral build plate cooling channels was shown to decrease the interpass temperature at the conclusion of the build process by 55% and build plate temperature by 96% compared to the conventionally deposited sample with 20 second dwell time. The use of a tall build plate with passive cooling was shown to reduce the interpass temperature by 32% as compared to the conventionally deposited sample with 20 second dwell time. Each cooling strategy evaluated decreased the interpass temperature within a range of 20–55% which enables higher deposition rates and decreased dwell times during depositions. The cooling strategies are designed to be implemented in a hybrid or retrofit AM platform to mitigate concerns of the thermal input from the additive process having detrimental effects on the precision of the machining process. This paper shows that accurate simulations of all strategies can be used to accurately predict the thermal response of the various strategies discussed. These cooling strategies will allow for increased deposition rates with comparable interpass temperature and decreased dwell time, increasing deposition efficiency. This model and these simulations are verified by experimental results. It is concluded that passive strategies, such as the over-sized tall build plate, can be used when liquid coolant in the AM environment could negatively affect the deposition process. Active cooling strategies, such as the integral build plate cooling could be used if low thermal conductivity materials are deposited or higher material deposition rates are desired. This paper discusses the use of active and passive cooling used during AM and shows how a simulation model can be used to make design choices for cooling strategies. The model also enables verification of select critical process parameters such as dwell times for a desired interpass temperature.

Heinrich, Lauren↗