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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

LC-Opt: Benchmarking Reinforcement Learning and Agentic AI for End-to-End Liquid Cooling Optimization in Data Centers

Liquid cooling is critical for thermal management in high-density data centers with the rising AI workloads. However, machine learning-based controllers are essential to unlock greater energy efficiency and reliability, promoting sustainability. We present LC-Opt, a Sustainable Liquid Cooling (LC) benchmark environment, for reinforcement learning (RL) control strategies in energy-efficient liquid cooling of high-performance computing (HPC) systems. Built on the baseline of a high-fidelity digital twin of Oak Ridge National Lab's Frontier Supercomputer cooling system, LC-Opt provides detailed Modelica-based end-to-end models spanning site-level cooling towers to data center cabinets and server blade groups. RL agents optimize critical thermal controls like liquid supply temperature, flow rate, and granular valve actuation at the IT cabinet level, as well as cooling tower (CT) setpoints through a Gymnasium interface, with dynamic changes in workloads. This environment creates a multi-objective real-time optimization challenge balancing local thermal regulation and global energy efficiency, and also supports additional components like a heat recovery unit (HRU). We benchmark centralized and decentralized multi-agent RL approaches, demonstrate policy distillation into decision and regression trees for interpretable control, and explore LLM-based methods that explain control actions in natural language through an agentic mesh architecture designed to foster user trust and simplify system management. LC-Opt democratizes access to detailed, customizable liquid cooling models, enabling the ML community, operators, and vendors to develop sustainable data center liquid cooling control solutions.

Naug, Avisek [Hewlett Packard Enterprise]↗
DOE OSTI2026

Cooling Matters: Benchmarking Large Language Models and Vision-Language Models on Liquid-Cooled Versus Air-Cooled H100 GPU Systems

The unprecedented growth in artificial intelligence (AI) workloads, recently dominated by large language models (LLMs) and vision-language models (VLMs), has intensified power and cooling demands in data centers. This study benchmarks LLMs and VLMs on two HGX nodes, each with 8× NVIDIA H100 graphics processing units (GPUs), using liquid and air cooling. Leveraging GPU Burn, Weights & Biases, and IPMItool, we collect detailed thermal, power, and computation data. Results show that the liquid-cooled systems maintain GPU temperatures between 41-50$^\circ$C, while the air-cooled counterparts fluctuate between 54-72$^\circ$C under load. This thermal stability of liquid-cooled systems yields 17% higher performance (54 TFLOPs/ GPU vs. 46 TFLOPs/GPU), performance-per-watt, reduced energy overhead, and greater system efficiency than the air-cooled counterparts. These findings underscore the energy and sustainability benefits of liquid cooling, offering a compelling path forward for hyperscale data centers seeking to optimize AI infrastructure. https://github.com/iscaas/Cooling-Matters.

Latif, Imran↗
DOE OSTI2026

Data Center High-Temperature Liquid Cooling and Heat Reuse Techno-Economic Study: Preprint

Data centers are energy-intensive facilities with growing demands for efficiency and cost-effective operations. Smaller, more distributed edge inference data centers are expected to proliferate as AI applications require low latency closer to the user of AI tools, which presents a growing opportunity to explore the systems implications of liquid cooling on water and energy use. This study analyzes the implementation of high-temperature liquid cooling systems in a prototypical inference 1-MW data center and explores the potential for heat reuse across varying climates with a goal to optimize energy efficiency, reduce capital and operational costs, and identify opportunities for high-performance cooling and water use reduction infrastructure. This analysis evaluated configurations utilizing a peak day hourly sizing and systems performance spreadsheet to evaluate design and operational conditions from which component sizes, installed cost, operational cost, and performance metrics were determined for the Base case and the Elevated case. The techno-economic analysis included heat reuse applications across a range of heat recovery temperatures and heat rejection options. The analysis shows that high-temperature liquid cooling allows for improved energy efficiency, lower water consumption, and lower capital costs compared to traditional cooling approaches. Transitioning to elevated water inlet/outlet temperatures (50 degrees C/60 degrees C) eliminates the need for chillers, cooling towers, and heat recovery equipment in many scenarios across three distinct climate zones. This results in up to 75% capital cost savings for the cooling and heat recovery equipment, and with significantly reduced water consumption, especially in non-heat reuse applications. Heat generated from data centers can also be repurposed for space heating, domestic hot water, and other applications, and is most cost-effective when data center outlet temperatures exceed 55-60 degrees C.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2024

A Digital Twin Framework for Liquid-cooled Supercomputers as Demonstrated at Exascale

We present ExaDigiT, an open-source framework for developing comprehensive digital twins of liquid-cooled supercomputers. It integrates three main modules: (1) a resource allocator and power simulator, (2) a transient thermo-fluidic cooling model, and (3) an augmented reality model of the supercomputer and central energy plant. The framework enables the study of "what-if" scenarios, system optimizations, and virtual prototyping of future systems. Using Frontier as a case study, we demonstrate the framework's capabilities by replaying six months of system telemetry for systematic verification and validation. Such a comprehensive analysis of a liquid-cooled exascale supercomputer is the first of its kind. ExaDigiT elucidates complex transient cooling system dynamics, runs synthetic or real workloads, and predicts energy losses due to rectification and voltage conversion. Throughout our paper, we present lessons learned to benefit HPC practitioners developing similar digital twins. We envision the digital twin will be a key enabler for sustainable, energy-efficient supercomputing.

Brewer, Wes↗
DOE OSTI2023

Liquid Cooling for HPC - National Renewable Energy Lab

NREL has nearly a decade of experience in liquid cooling or HPC. The technical approach will be presented along with success stories on energy, cost and emission savings over two generations of HPC systems. Lessons learned will also be shared.

energy efficient computing↗
DOE OSTI2024

Three-dimensional airgap electric machines employing winding embedded liquid cooling

Various examples are provided related to 3D airgap electric machines and winding embedded liquid cooling. In one example, an electric machine includes a stator assembly with stator windings supported by a stator core and an outer rotor assembly includes a radial plate surrounding the stator assembly and an endplate at a first end of the radial plate adjacent to the first end of the stator core. The stator windings can include a first portion extending along an axial length of the stator core and a second portion at a first end of the stator core that extends radially inward towards a shaft of the electric machine. The radial plate can include magnets distributed about the radial plate. In another example, a stator assembly includes stator windings supported by a stator core with a winding support including cooling channels distributed between the stator windings. The winding support can be nonmagnetic.

Islam, Md Sariful↗
DOE OSTI2026

Case Study of Integrating High-Temperature Heat Pump with LiBr-H2O Absorption Chiller for Data Center Liquid Cooling

Data centers (DCs) are physical infrastructures that support artificial intelligence workloads. The rapid growth of artificial intelligence is putting substantial pressure on the US power grid. Most of electricity consumed by IT equipment, accounting for 50%-60% of total DC power, ultimately becomes waste heat. This heat is dissipated by DC’s cooling facilities, accounting for an additional 30%-40% of total DC power. Recovering and repurposing this waste heat offers a significant opportunity to enhance energy efficiency and reduce operating costs of DCs. One potential pathway is converting heat to cold using thermal-driven absorption chillers, therefore, reducing the power consumption in DC cooling facilities. Existing studies mainly demonstrate the technical and economic feasibility of repurposing DC’s waste heat for cooling applications but provide limited technical details on how to integrate the thermal-driven absorption chillers with DC cooling systems. In addition, the low-grade waste heat available from DCs must be upgraded to higher temperatures suitable for absorption chillers. This paper presents a case study on integrating high-temperature heat pumps with a LiBr-H2O absorption chiller to use DC waste heat for cooling. A thermodynamic model of single-effect, LiBr-H2O absorption chiller and an empirical model of high-temperature heat pumps were built. The case study considers ASHRAE W17 liquid-cooled DC, with facility service water supplied at 17.0℃ and returned at 25.3℃. The thermal behaviors of absorption chiller components were predicted for the generation temperature ranging from 75.0℃ to 115.0℃. Based on the available waste heat in the integrated system, two waste heat recovery strategies were evaluated: a facility service water-based strategy and cooling water-based strategy. Results indicated that the cooling water-based strategy achieves higher Coefficient of Performance (COPs) than the facility service water-based strategy. The relatively low cooling COPs of single-effect LiBr-H2O absorption chillers could be offset by high heating COP of high temperature heat pumps. The maximum cooling COP of absorption chiller and the overall COP of integrated systems occur at lower generation temperatures, but these conditions also yield lower cooling capacities. In practice, system operation should balance the trade-off between the COP and cooling capacity

Wang, Pengtao [ORNL] (ORCID:0000000214713429)↗
DOE OSTI2023

Performance Evaluation of Liquid-Cooled Open Stand-Alone Refrigerated Cases

This project is part of a joint effort between Commonwealth Edison Company (ComEd) and the National Renewable Energy Laboratory (NREL) to evaluate the energy and demand savings potential of emerging efficient buildings technologies. This project quantifies the energy efficiency benefits from retrofitting an air-cooled, constant-speed compression, self-contained medium-temperature open-vertical display case with a high efficiency water-cooled condensing unit. In addition to a water-cooled heat rejection mechanism, the high-efficiency condensing unit utilizes a variable-speed compressor, electronic expansion valve and advanced controls system. The focus of this project, however, was mainly on capturing the energy savings potentials of the water-cooled condenser, variable-speed compression and electronic expansion valve, and not on the advanced controls. The results of this evaluation will be considered by ComEd and CLEAResult for future energy efficiency rebate offerings.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2026

Ultra-low thermal resistance and pressure drop copper and copper-tungsten diamond-shaped pin fin cold plates for liquid cooling of electronics

Modern and future data centers face increasing cooling challenges due to increasing chip thermal design power and die size, along with the need to reduce energy consumption used for cooling. High performance cooling solutions that maintain a low chip junction temperature are needed to ensure electronics reliability. This work develops an ultra-low thermal resistance and low pressure drop 75 mm × 75 mm cold plate, intended for next-generation electronics cooling. The cold plate features an array of diamond-shaped pin fins and integrated copper tungsten heat spreader, selected for its low coefficient of thermal expansion which reduces thermomechanical deformation and allows for closer integration of the cold plate with silicon dies. Starting with 300 candidate designs, three-dimensional computational fluid dynamics simulations predict the thermal-hydraulic performance of cold plate subsections. The highest performing geometries are evaluated with high fidelity simulations. Four cold plates are manufactured for experiments: three with diamond-shaped pin fins and one with straights fins for comparison purposes. The cold plates are fabricated from copper-tungsten (CuW), copper (Cu), or aluminum-silicon-magnesium alloy (AlSi10Mg). The diamond-shaped pin fins achieve a roughly 15 % lower thermal resistance compared to the conventional straight fin microchannel. The highest performing design achieves a chip-to-coolant (including thermal interface material) thermal resistance of 9.0 K/kW in CuW and 6.9 K/kW in Cu under a 1 kW heat load with an inlet-to-outlet pressure drop of 9.0 kPa and water as the working fluid. This work demonstrates ultra-low thermal resistance and pressure drop cold plates for large die, high heat load applications, and shows that CuW is an attractive cold plate material for improved reliability in next generation data center cooling.

Coefficient of thermal expansion↗
DOE OSTI2025

Thermal Management for Planar Package Power Electronics (CRADA Final Report)

The National Renewable Energy Laboratory (NREL) and John Deere Electronic Solutions (JDES) collaborated to develop and evaluate computer models and simulations related to the thermal performance of semiconductor device packaging for an inverter of an off-road vehicle ("Semiconductor Packaging"). The objective of the research was for NREL and JDES to develop a two or three-dimensional computer-aided design model of the Semiconductor Packaging ("Computer Model") for thermal performance evaluation in a simulation. The project developed computer models of a Semiconductor Package of silicon-carbide semiconductor devices with appropriate thermal dissipation via one or more of the following thermal features: a double-sided planar cooling configuration, an air-cooled configuration, a liquid-cooled configuration for off-road inverter applications in a relevant simulated operating environment. It is noted that surface area and prototype product embodiment consisting of air-cooled and liquid-cooled configurations may and may not be in direct contact with power semiconductor chips. The idea was to explore and develop packaging and thermal management technology for power semiconductors that was most effective in the performance yet had least burden in overall product cost for a given application.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2024

Aircraft electric motor with integrated cooling system

Aircraft electric motors include a motor unit having a rotor and a stator. The stator includes a plurality of windings and cooling channels arranged to provide cooling thereto. A drive unit is configured to drive operation of the motor unit. A cooling system includes a working fluid arranged within a cooling fluid flow path, wherein the cooling fluid flow path includes a liquid cooling path configured to direct flow of the working fluid through, at least, the cooling channels of the motor unit and a vapor cooling path configured to direct flow of the working fluid through the drive unit and a separator arranged upstream of each of the liquid cooling path and the vapor cooling path and configured to direct a liquid portion of the working fluid into the liquid cooling path and configured to direct a vapor portion of the working fluid into the vapor cooling path.

Alahyari, Abbas A.↗
DOE OSTI2023

Experimental testing of a prototype cantilevered liquid-nitrogen-cooled silicon mirror

This report presents testing of a prototype cantilevered liquid-nitrogen-cooled silicon mirror. This mirror was designed to be the first mirror for the new soft X-ray beamlines to be built as part of the Advanced Light Source Upgrade. Test activities focused on fracture, heat transfer, modal response and distortion, and indicated that the mirror functions as intended.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
DOE OSTI2024

Thermo-Fluid Modeling Framework for Supercomputer Digital Twins: Part 1, Demonstration at Exascale

A thermo-fluid modeling framework is being developed for ExaDigiT---an open-source framework for developing comprehensive digital twins of liquid-cooled supercomputers. The work is being conducted in two parts, and discussion is divided into two companion papers. The work documented in this paper focuses on the development of a cooling system library in Dymola for the Frontier supercomputer at Oak Ridge National Laboratory. The second part, outlined in a companion paper, focuses on a templating structure called Auto-CSM for easily creating model-agnostic, physics-based thermo-fluid cooling system models for liquid-cooled supercomputers using a text-based schema. The cooling model is being developed using primarily the open-source Transient Simulation Framework of Reconfigurable Models (TRANSFORM) library. The library follows the templating architecture developed within the TRANSFORM library for modeling subsystems. A full-system validation was performed to validate a very simple model that is integrated with the system controls, and the results are presented herein.

Kumar, Vineet↗
DOE OSTI2026

Metal additively manufactured wavy fin cold-plate architecture for improved thermal-hydraulic performance

Rapid growth in artificial intelligence and data center workloads demands high-performance liquid cooling to manage increasing chip power. This study presents two metal-additive-manufactured cold plates with sinusoidal fins, constant-amplitude wavy fins and linearly variable-amplitude wavy fins and compares them against metal-additive-manufactured straight fins using experiments conducted at 1 kW heat dissipation as well as high-fidelity 3D conjugate computational fluid dynamic simulations. The cold plates were printed in AlSi10Mg material and underwent design using a Python-automated workflow prior to manufacture and testing. The experiments show that wavy fins reduce the normalized thermal resistance by 35 to 45 % at water flow rates from 1 to 4 LPM. At a fixed 20 kPa pressure drop, the variable-waviness design lowered peak surface temperature by 9 °C and thermal resistance by 51 %, while edge-channel maldistribution in the constant wavy fin design limited gains. A thermal resistance breakdown revealed that 55–63 % of the total thermal resistance in wavy designs comes from base heat conduction, 27–33 % from fin heat conduction, and 9–13 % from fin heat convection, indicating the need to address conduction bottlenecks. Parametric sweeps identify a 3 mm fin pitch as optimal, and that horizontal inlet/outlet manifolds further reduce pressure drop by 30–60 % and thermal resistance by 9–16 % relative to vertical inlet-outlet manifolds. The results yield comprehensive guidelines for fin geometry, manifold alignment, material selection and additive-manufacturing constraints to realize high-performance liquid-cooled cold plates for power-dense electronics.

3d printing↗