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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

The reverse laser drilling of transparent materials

Within a limited range of incident laser-beam intensities, laser drilling of a sapphire wafer initiates on the surface of the wafer where the laser beam exits and proceeds upstream in the laser beam to the surface where the laser beam enters the wafer. This reverse laser drilling is the result of the constructive interference between the laser beam and its reflected component on the exit face of the wafer. Constructive interference occurs only at the exit face of the sapphire wafer because the internally reflected laser beam suffers no phase change there. A model describing reverse laser drilling predicts the ranges of incident laser-beam intensity where no drilling, reverse laser drilling, and forward laser drilling can be expected in various materials. The application of reverse laser drilling in fabricating feed-through conductors in silicon-on-sapphire wafers for a massively parallel processer is described.

Anthony, T. R.↗

Reverse laser drilling

This invention provides a method for laser drilling small diameter, closely-spaced, and accurately located holes in a body of material which is transparent or substantially transparent to the laser radiation employed whereby the holes are drilled through the thickness of the body from the surface opposite to that on which the laser beam impinges to the surface of laser beam impingement.

Anthony, Thomas R.↗

In situ x-ray imaging to understand subsurface behavior during continuous wave laser drilling

A limited understanding regarding the underlying dynamics and mechanisms of material removal during continuous wave laser drilling has presented significant challenges in achieving precision and process control. Here, to address this, we employed high-fidelity, in situ synchrotron x-ray imaging to reveal previously unknown material behaviors during continuous wave laser drilling with power modulation. Our findings highlight that high-aspect ratio drill holes are achieved when the laser modulation frequency falls within the range of 8–12 kHz, provided that the laser average power and modulation amplitude levels meet the specified limits. Under these conditions, we identified a material removal mechanism driven by incremental accumulation of recoil pressure that gradually pushes material upward from deep within the substrate to the surface. This mechanism manifested as a low-frequency fluctuation in the vapor depression depth, resulting in periodic instances of material ejection. Furthermore, our study underscores that rapid expansion of the melt pool and the widening of the drill hole opening can impede effective material removal by redirecting energy from material ejection to increasing the melt pool size. This investigation contributes essential insights into the subsurface dynamics involved in the drilling of high-aspect ratio holes, furthering our fundamental understanding of this intricate process.

47 OTHER INSTRUMENTATION↗

FEMTOSECOND LASER DRILLING OF SILICON NITRIDE

Ceramics are employed in various engineering applications including electronics, semiconductors, automotive and aerospace industry, among others. Ceramics are desirable materials due to their high hardness, thermal resistance, chemical, thermal, and mechanical properties. A drawback of engineering ceramics is the manufacturing process. Ceramics are hard and brittle and conventional drilling or cutting methods can damage the material. These challenges in manufacturing have limited the application of ceramics in certain engineering applications. The non-contact machining of ceramics through ultrashort pulsed laser drilling offers a possible solution to the manufacturing issues. The advantage of laser drilling is the ability to machine hard and brittle materials. A laser, pulsed in the time regime of femtoseconds (fs), drills/machines sharp and well-defined holes and cuts. Additionally, the short pulse width results in limited melting, cracking, or heat transfer to the surrounding material, as well as no residual stresses. This non-contact process can greatly aid in the machining of hard materials. This study focuses on drilling into silicon nitride to produce zero-taper through holes. With this, other thicknesses can be explored, to achieve zero-taper holes.

Femtosecond laser ablation, Ceramics, Silicon Nitr↗

The random walk of a drilling laser beam

The disregistry of holes drilled with a pulse laser beam in 330-micron-thick single-crystal silicon-on-sapphire wafers is examined. The exit positions of the holes were displaced from the hole entrance positions on the opposing face of the wafer, and this random displacement increased with the number of laser pulses required. A model in which the bottom of the drill hole experiences small random displacements during each laser pulse is used to describe the experimental observations. It is shown that the average random displacement caused by each pulse is only a few percent of the hole diameter and can be reduced by using as few laser pulses as necessary while avoiding the cracking and spalling of the wafer that occur with a hole drilled with a single pulse.

Anthony, T. R.↗

Laser drilling and machining enhancement using gated CW and short pulsed lasers

The present disclosure relates to a laser system for processing a material. The system may make use of a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power. The second duration may be shorter than the first duration by a factor of at least 100, and directed at the spot. The second laser pulse is generated after the first laser pulse is generated. The first laser pulse is used to heat the spot on the surface of the material, while the second laser pulse induces a melt motion and material ejection of molten material from the melt pool.

Ly, Sonny S.↗

SR23012, A Pragmatic Approach to Laser Drilling and Rewelding of Fill Stems, SRNL-TR-2023-00551

The current approach to disposing unloaded reservoirs is to snap the remaining stem, and seal the hole with JB weld, a two-part epoxy mix that is messy to work with and that takes many hours to ensure it is property cured. During this time, reservoirs may be outgassing and cause higher than desired activity in the glovebox. This project will develop, characterize, and deploy a method to drill stems to unload the reservoirs (already in use in the facility, but may require some simple process / procedure modifications), demonstrate that the reservoirs are fully unloaded, and reweld stems by returning to the unloading station and firing the laser to weld the unloading hole closed.

Korinko, Paul S.↗

Laser drilling of vias in dielectric for high density multilayer LSHI thick film circuits

A design analysis of a high density multilevel thick film digital microcircuit used for large scale integration is presented. The circuit employs 4 mil lines, 4 mil spaces and requires 4 mil diameter vias. Present screened and fired thick film technology is limited on a production basis to 16 mil square vias. A process whereby 4 mil diameter vias can be fabricated in production using laser technology was described along with a process to produce 4 mil diameter vias for conductor patterns which have 4 mil lines and 4 mil spacings.

Cocca, T.↗

Protective Coating For Laser Drilling Of Silicon

Sodium silicate prevents spattered silicon from fusing with surrounding material. Sodium silicate solution applied to wafer by dipping and draining or by spinning; application by spraying also works. When dried in oven, solution leaves thin coating of sodium silicate glass.

Shlichta, Paul J.↗

Carbon/Carbon Grids For Ion Sources

Ion-extraction grids made of carbon/carbon composites used in spacecraft ion engines and industrial ion sources in place of molybdenum grids. In principle, carbon/carbon grids offer greater extraction efficiency and longer life. Grid fabricated by mechanical drilling, laser drilling, or electrical-discharge machining of array of holes in sheet of carbon/carbon. Advantages; better alignment and slower erosion.

Garner, Charles E.↗

Mode I fracture testing fixture

An apparatus and method for preparing Double Cantilever Beam (DCB) specimens are disclosed as an apparatus and method for conducting Mode I fracture resistance testing using the DCB specimens. In a first embodiment, a drill jig is used to locate the DCB specimen and guide a drilling process during creation of at least one through-hole in the DCB specimen. The drilling process may employ a traditional drill and drill bit, a laser drill, or a water jet. In another embodiment, a set of rotating pin blocks, each with a full-round or a half-round specimen pin at one end and a hanger full-round pin at the other end, engage the DCB specimen and facilitate the internal application of a fracturing load to the DCB specimen for the Mode I fracture resistance test. The present invention may significantly reduce the time and materials needed to prepare and test a DCB specimen.

Briggs, Timothy↗

Mode I fracture testing fixture

An apparatus and method for preparing Double Cantilever Beam (DCB) specimens are disclosed as an apparatus and method for conducting Mode I fracture resistance testing using the DCB specimens. In a first embodiment, a drill jig is used to locate the DCB specimen and guide a drilling process during creation of at least one through-hole in the DCB specimen. The drilling process may employ a traditional drill and drill bit, a laser drill, or a water jet. In another embodiment, a set of rotating pin blocks, each with a full-round or a half-round specimen pin at one end and a hanger full-round pin at the other end, engage the DCB specimen and facilitate the internal application of a fracturing load to the DCB specimen for the Mode I fracture resistance test. The present invention may significantly reduce the time and materials needed to prepare and test a DCB specimen.

Briggs, Timothy↗

Enhanced Carbon Dioxide Uptake in Drilled Hollow Core Fibers for Raman Spectroscopy

Fiber-based Raman spectroscopy enhances the Raman signal by maximizing the overlap of the optical field and the gas species. However, filling the hollow-core fiber (HCF) with gas requires time that is dependent on the fiber core diameter, fiber length, and pressure of the gas. At ambient pressure, the fiber gas uptake is driven by diffusion into the fiber ends, severely limiting the response time of the system. By laser drilling access holes to the core along the length of the fiber, the uptake time of the gas is reduced, improving the system response time. In this work, we study the carbon dioxide (CO 2 ) sensor dynamics based on Raman signal intensity generated in HCFs. The signal intensity versus gas concentration is characterized by controlling the CO 2 concentration in the surrounding environment of the fiber. Next, we characterize the gas uptake time in HCFs as a function of fiber length. Finally, we optimize the access hole configuration along the fiber, demonstrating reduced sensor uptake time by a factor of three.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Controlled thermal expansion printed wiring boards based on liquid crystal polymer dielectrics

Dielectric materials based on innovative Liquid Crystal Polymers (LCP's) have been used to fabricate surface mount printed wiring boards (PWB's) with a coefficient of thermal expansion matched to leadless ceramic chip carriers. Proprietary and patented polymer processing technology has resulted in self reinforcing material with balanced in-plane mechanical properties. In addition, LCP's possess excellent electrical properties, including a low dielectric constant (less than 2.9) and very low moisture absorption (less than 0.02%). LCP-based multilayer boards processed with conventional drilling and plating processes show improved performance over other materials because they eliminate the surface flatness problems of glass or aramid reinforcements. Laser drilling of blind vias in the LCP dielectric provides a very high density for use in direct chip attach and area array packages. The material is ideally suited for MCM-L and PCMCIA applications fabricated with very thin dielectric layers of the liquid crystal polymer.

Knoll, Thomas E.↗

Elucidating the effect of preheating temperature on melt pool morphology variation in Inconel 718 laser powder bed fusion via simulation and experiment

In laser powder bed fusion (L-PBF) additive manufacturing, the mechanical performance, microstructure and defects of fabricated parts are closely associated with the melt pool morphology, e.g., its dimension and shape through the building process. Past studies have largely focused on how the process parameters such as laser power and scan speed affect melt pool characteristics. In this study, the melt pool morphology variation as a function of preheating temperature in the conduction, transition, and keyhole regimes and the underlying mechanisms in each regime are investigated through ex-situ sample characterization and computation thermal fluid dynamics (CtFD) simulation. Single tracks with different combinations of laser power and scan speed are deposited on an Inconel 718 bare plate preheated to a temperature range of 100–500 °C in the experiment. Significant changes are observed in melt pool morphology as a function of preheating temperature from optical measurements of melt track cross sections. The depth of melt pool in the three regimes increases monotonically with preheating temperature, e.g., at 500 °C, the experimental melt pool depth is increased by 49% in conduction regime, 34% in transition regime and 33% in keyhole regime, respectively, while the variation of melt pool width in each regime does not all follow an increasing trend but depends on the melt pool regimes. Melt pool width variation in the conduction and transition regimes is found to depend on the enhanced heat conduction directly related to temperature dependent thermal properties. Through validated CtFD simulations, it is found that in the keyhole regime the evaporation mass, recoil pressure, and laser drilling effect is enhanced with higher preheating temperature, which gives rise to a deeper melt pool. The simulations also reveal that preheating temperature significantly elongates the melt track length due to the increased flow rate and strong recoil pressure that accelerates the backward flow.

36 MATERIALS SCIENCE↗

Improved Glow Discharge Polymer Removal from Beryllium Capsules Using Ozone

Copper-doped beryllium spheres are an attractive ablator for inertial confinement fusion experiments. Beryllium spheres are made by sputtering beryllium onto spherical plastic mandrels which must then be removed through a hole that is laser drilled through the shell wall. The currently used mandrel material is glow discharge polymer. This material cannot be removed by solvent and must be “burned” out. The burnout process was originally performed by etching with dry air at 425°C, but this process can substantially roughen the inner surface, which can seed instabilities and increase mix during implosion experiments. In this paper, we explore the use of pure oxygen and ozone to reduce process temperature and improve inner and outer surface quality.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗