Low temperature thermal cycle survivability and reliability study for brushless motor drive electronics (#1360)
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Effects of thermal and mechanical fatigue on the flexural strength of G40-600/PMR-15 cross-ply laminates
The effects of thermal and mechanical fatigue on the flexural strength of G40-600/PMR-15 cross-ply laminates with ply orientation of (0(2),90(2))2S and (90(2),0(2))2S are examined. The relative importance of shear and tensile stresses is examined by varying the span-to-depth ratios of flexural test specimens from 8 to 45. Acoustic emission signals are measured during the flexural tests in order to monitor the initiation and growth of damage. Optical microscopy is used to examine specimens for resin cracking, delamination, and fiber breaks after testing. Transverse matrix cracks and delaminations occur in all specimens, regardless of ply orientation, span-to-depth ratio, or previous exposure of specimens to thermal and mechanical fatigue. A small amount of fiber tensile fracture occurs in the outer 0 deg ply of specimens with high span-to-depth ratios. Because of the complex failure modes, the flexural test results represent the 'apparent' strengths rather than the true flexural or shear strengths for these cross-ply laminates. Thermal cycling of specimens prior to flexural testing does not reduce the apparent flexural strength or change the mode of failure. However, fewer acoustic events are recorded at all strains during flexural testing of specimens exposed to prior thermal cycling. High temperature thermal cycling (32 to 260 C, 100 cycles) causes a greater reduction in acoustic events than low temperature thermal cycling (-85 to +85 C, 500 cycles). Mechanical cycling (0 to 50 percent of the flexural strength, 100 cycles) has a similar effect, except that acoustic events are reduced only at strains less than the maximum strain applied during flexural fatigue.
Roberts, Gary D.↗
Effects of mechanical and thermal cycling on composite and hybrid laminates with residual stresses
The effects of tensile load cycling and thermal cycling on residual stiffness and strength properties of the following composite and hybrid angle-ply laminates were studied: boron/epoxy, boron/polyimide, graphite/low-modulus epoxy, graphite/high-modulus epoxy, graphite/polyimide, S-glass/epoxy, graphite/Kevlar 49/epoxy, and graphite/S-glass/epoxy. Specimens of the first six types were mechanically cycled up to 90% of static strength. Those that survived 10 million cycles were tested statically to failure, and no significant changes in residual strength and modulus were noted. Specimens of all types were subjected to thermal cycling between room temperature and 411 K for the epoxy-matrix composites and 533 K for the polyimide-matrix composites. The residual strength and stiffness remained largely unchanged, except for the graphite/low-modulus epoxy, which showed reductions in both of approximately 35%. When low-temperature thermal cycling under tensile load was applied, there was a noticeable reduction in modulus and strength in the graphite/low-modulus epoxy and some strength reduction in the S-glass/epoxy.
Daniel, I. M.↗
Effect of Cristobalite on the Mechanical Properties of Silica RSI Materials
The strength of various silica surface insulation materials was measured after high temperature heat treatment to develop substantial crystalline phases, and after low temperature thermal cycling through the alpha-beta cristobalite transformation. It appears that the presence of cristobalite in the structural elements (the fibers) is highly detrimental to tensile strength. When crystallization does not occur in silica material, the strength improves with heat treatment.
Khandelwal, P. K.↗
The problem of dimensional instability in airfoil models for cryogenic wind tunnels
The problem of dimensional instability in airfoil models for cryogenic wind tunnels is discussed in terms of the various mechanisms that can be responsible. The interrelationship between metallurgical structure and possible dimensional instability in cryogenic usage is discussed for those steel alloys of most interest for wind tunnel model construction at this time. Other basic mechanisms responsible for setting up residual stress systems are discussed, together with ways in which their magnitude may be reduced by various elevated or low temperature thermal cycles. A standard specimen configuration is proposed for use in experimental investigations into the effects of machining, heat treatment, and other variables that influence the dimensional stability of the materials of interest. A brief classification of various materials in terms of their metallurgical structure and susceptability to dimensional instability is presented.
Wigley, D. A.↗
Vacuum thermal-mechanical fatigue behavior of two iron-base alloys
The present study extends the concept of in-phase grain boundary ratcheting to two iron-base alloys (Type 304 stainless steel and A286 alloy) and provides a clearer interpretation of out-of-phase grain boundary ratcheting effects observed in the A286 alloy which does not exhibit geometric instability. Elevated-temperature low-cycle thermal-mechanical fatigue tests in an ion-pumped ultrahigh vacuum chamber revealed significant effects of frequency and combined temperature-strain cycling on fatigue life. In-phase thermal cycling (tension at high temperature and compression at low temperature) caused large life reductions in both materials due to grain boundary cavitation caused by unreversed grain boundary sliding (grain boundary ratcheting). Out-of-phase thermal cycling (tension at low temperature and compression at high temperature) also caused large cyclic life reductions in both materials. In the A286 alloy, out-of-phase life reductions are attributed to compressive ratcheting.
Sheffler, K. D.↗
Vacuum thermal-mechanical fatigue testing of two iron base high temperature alloys
Ultrahigh vacuum elevated temperature low cycle fatigue and thermal fatigue tests of 304 stainless steel and A-286 alloy have shown significant effects of frequency and combined temperature-strain cycling on fatigue life. At constant temperature, the cyclic life of both alloys was lower at lower frequencies. Combined temperature-strain cycling reduced fatigue life with respect to isothermal life at the maximum temperature of the thermal cycle. Life reductions with in-phase thermal cycling (tension at high temperature, compression at low temperature) were attributed to grain boundary cavitation caused by unreversed tensile grain boundary sliding. The proposed mechanism for out-of-phase cavity generation involved accumulation of unreversed compressive grain boundary displacements which could not be geometrically accomodated by intragranular deformation in the low-ductility A-286 alloy.
Sheffler, K. D.↗
Assessment of SOI Devices and Circuits at Extreme Temperatures
Electronics designed for use in future NASA space exploration missions are expected to encounter extreme temperatures and wide thermal swings. Such missions include planetary surface exploration, bases, rovers, landers, orbiters, and satellites. Electronics designed for such applications must, therefore, be able to withstand exposure to extreme temperatures and to perform properly for the duration of mission. The Low Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electrical devices, circuits, and systems suitable for applications in deep space exploration missions and aerospace environment. Silicon-On-Insulator (SOI) technology has been under active consideration in the electronics industry for many years due to the advantages that it can provide in integrated circuit (IC) chips and computer processors. Faster switching, less power, radiationtolerance, reduced leakage, and high temp-erature capability are some of the benefits that are offered by using SOI-based devices. A few SOI circuits are available commercially. However, there is a noticeable interest in SOI technology for different applications. Very little data, however, exist on the performance of such circuits under cryogenic temperatures. In this work, the performance of SOI integrated circuits, evaluated under low temperature and thermal cycling, are reported. In particular, three examples of SOI circuits that have been tested for operation at low at temperatures are given. These circuits are SOI operational amplifiers, timers and power MOSFET drivers. The investigations were carried out to establish a baseline on the functionality and to determine suitability of these circuits for use in space exploration missions at cryogenic temperatures. The findings are useful to mission planners and circuit designers so that proper selection of electronic parts can be made, and risk assessment can be established for such circuits for use in space missions.
Elbuluk, Malik↗
Low Temperature Creep of Hot-Extruded Near-Stoichiometric NiTi Shape Memory Alloy: Effect of Thermal Cycling - Part 2
This paper is the first report on the effect prior low temperature creep on the thermal cycling behavior of NiTi. The isothermal low temperature creep behavior of near-stoichiometric NiTi between 300 and 473 K was discussed in Part I. The effect of temperature cycling on its creep behavior is reported in the present paper (Part II). Temperature cycling tests were conducted between either 300 or 373 K and 473 K under a constant applied stress of either 250 or 350 MPa with hold times lasting at each temperature varying between 300 and 700 h. Each specimen was pre-crept either at 300 or at 473 K for several months under an identical applied stress as that used in the subsequent thermal cycling tests. Irrespective of the initial pre-crept microstructures, the specimens exhibited a considerable increase in strain with each thermal cycle so that the total strain continued to build-up to 15 to 20 percent after only 5 cycles. Creep strains were immeasurably small during the hold periods. It is demonstrated that the strains in the austenite and martensite are linearly correlated. Interestingly, the differential irrecoverable strain, in the material measured in either phase decreases with increasing number of cycles, similar to the well-known Manson-Coffin relation in low cycle fatigue. Both phases are shown to undergo strain hardening due to the development of residual stresses. Plots of true creep rate against absolute temperature showed distinct peaks and valleys during the cool-down and heat-up portions of the thermal cycles, respectively. Transformation temperatures determined from the creep data revealed that the austenitic start and finish temperatures were more sensitive to the pre-crept martensitic phase than to the pre-crept austenitic phase. The results are discussed in terms of a phenomenological model, where it is suggested that thermal cycling between the austenitic and martensitic phase temperatures or vice versa results in the deformation of the austenite and a corresponding development of a back stress due to a significant increase in the dislocation density during thermal cycling.
Raj, S. V.↗
Electronics for Low Temperature Space Exploration Missions
Exploration missions to outer planets and deep space require spacecraft, probes, and on-board data and communication systems to operate reliably and efficiently under severe harsh conditions. On-board electronics, in particular those in direct exposures to the space environment without any shielding or protection, will encounter extreme low temperature and thermal cycling in their service cycle in most of NASA s upcoming exploration missions. For example, Venus atmosphere, Jupiter atmosphere, Moon surface, Pluto orbiter, Mars, comets, Titan, Europa, and James Webb Space Telescope all involve low-temperature surroundings. Therefore, electronics for space exploration missions need to be designed for operation under such environmental conditions. There are ongoing efforts at the NASA Glenn Research Center (GRC) to establish a database on the operation and reliability of electronic devices and circuits under extreme temperature operation for space applications. This work is being performed under the Extreme Temperature Electronics Program with collaboration and support of the NASA Electronic Parts and Packaging (NEPP) Program. The results of these investigations will be used to establish safe operating areas and to identify degradation and failure modes, and the information will be disseminated to mission planners and system designers for use as tools for proper part selection and in risk mitigation. An overview of this program along with experimental data will be presented.
Patterson, Richard L.↗
Die Attachment for -120(sup o)C to +20(sup o)C Thermal Cycling of Microelectronics for Future Mars Rovers - an Overview
Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability.
Microelectronics electronic system reliability eli↗
Collaborative Evaluation of GaN FET Reliability
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GaN↗
Influence of creep damage on the low cycle thermal-mechanical fatigue behavior of two tantalum base alloys
Low cycle fatigue tests have been performed on the tantalum base alloys T-111 and ASTAR 811C with synchronized, independently programmed temperature and strain cycling. The thermal-mechanical cycles applied fell into three basic categories: these were isothermal cycling, in-phase thermal cycling, and out-of-phase thermal cycling. In-phase cycling was defined as tensile deformation associated with high temperature and compressive deformation with low temperature, while out-of-phase thermal cycling was defined as the reverse case. The in-phase thermal cycling had a pronounced detrimental influence on the fatigue life of both alloys, with the life reduction being greater in the solid solution strengthened T-111 alloy than in the carbide strengthened ASTAR 811C alloy. The out-of-phase tests also showed pronounced effects on the fatigue life of both alloys, although not as dramatic.
Sheffler, K. D.↗
Probabilistic material strength degradation model for Inconel 718 components subjected to high temperature, high-cycle and low-cycle mechanical fatigue, creep and thermal fatigue effects
This report presents the results of both the fifth and sixth year effort of a research program conducted for NASA-LeRC by The University of Texas at San Antonio (UTSA). The research included on-going development of methodology for a probabilistic material strength degradation model. The probabilistic model, in the form of a postulated randomized multifactor equation, provides for quantification of uncertainty in the lifetime material strength of aerospace propulsion system components subjected to a number of diverse random effects. This model is embodied in the computer program entitled PROMISS, which can include up to eighteen different effects. Presently, the model includes five effects that typically reduce lifetime strength: high temperature, high-cycle mechanical fatigue, low-cycle mechanical fatigue, creep and thermal fatigue. Statistical analysis was conducted on experimental Inconel 718 data obtained from the open literature. This analysis provided regression parameters for use as the model's empirical material constants, thus calibrating the model specifically for Inconel 718. Model calibration was carried out for five variables, namely, high temperature, high-cycle and low-cycle mechanical fatigue, creep and thermal fatigue. Methodology to estimate standard deviations of these material constants for input into the probabilistic material strength model was developed. Using an updated version of PROMISS, entitled PROMISS93, a sensitivity study for the combined effects of high-cycle mechanical fatigue, creep and thermal fatigue was performed. Then using the current version of PROMISS, entitled PROMISS94, a second sensitivity study including the effect of low-cycle mechanical fatigue, as well as, the three previous effects was performed. Results, in the form of cumulative distribution functions, illustrated the sensitivity of lifetime strength to any current value of an effect. In addition, verification studies comparing a combination of high-cycle mechanical fatigue and high temperature effects by model to the combination by experiment were conducted. Thus, for Inconel 718, the basic model assumption of independence between effects was evaluated. Results from this limited verification study strongly supported this assumption.
Bast, Callie C.↗
Probabilistic Material Strength Degradation Model for Inconel 718 Components Subjected to High Temperature, High-Cycle and Low-Cycle Mechanical Fatigue, Creep and Thermal Fatigue Effects
The development of methodology for a probabilistic material strength degradation is described. The probabilistic model, in the form of a postulated randomized multifactor equation, provides for quantification of uncertainty in the lifetime material strength of aerospace propulsion system components subjected to a number of diverse random effects. This model is embodied in the computer program entitled PROMISS, which can include up to eighteen different effects. Presently, the model includes five effects that typically reduce lifetime strength: high temperature, high-cycle mechanical fatigue, low-cycle mechanical fatigue, creep and thermal fatigue. Results, in the form of cumulative distribution functions, illustrated the sensitivity of lifetime strength to any current value of an effect. In addition, verification studies comparing predictions of high-cycle mechanical fatigue and high temperature effects with experiments are presented. Results from this limited verification study strongly supported that material degradation can be represented by randomized multifactor interaction models.
Bast, Callie C.↗
Temperature-mediated molecular ladder self-assembly employing Diels–Alder cycloaddition
Dynamic covalent self-assembly processes often exhibit poor capacities for error-correction owing to the relatively low connectivity rearrangement rates of dynamic covalent interactions and the common use of reaction conditions where the equilibrium state remains fixed. Here, we report a dynamic covalent self-assembly technique employing temperature, a conventional, externally-applied stimulus, to mediate the hybridization of peptoid oligomers bearing maleimide- and furan-based pendant groups to afford molecular ladders incorporating Diels–Alder adduct-based rungs. By raising or lowing the reaction temperature, this system enables the equilibrium state to be readily varied without altering reagent concentrations. Both triethylamine and the Lewis acidic scandium triflate were examined as candidate reaction catalysts; however, only scandium triflate increased the rate of single strand conversion. Additionally, as the Diels–Alder cycloaddition reaction does not liberate a small molecule, a registry-dependent mass change was effected by employing a base-catalyzed thiol-Michael addition reaction between any un-reacted maleimide pendant groups and a low molecular weight thiol to enable the number of Diels–Alder adduct rungs to be readily determined by mass spectrometry. Finally, by employing a slow temperature ramp from high to low temperature, approximating the thermal cycle employed for nucleic acid hybridization, sequence-selective hybridization between model, tetra-functional precursor strands was demonstrated.
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
Testing Various Cement Formulations under Temperature Cycles and Drying Shrinkage for Low-Temperature Geothermal Wells
Low-enthalpy geothermal wells are considered a sustainable energy source, particularly for district heating in the Netherlands. The cement sheath in these wells experiences thermal cycles. The stability of cement recipes under such conditions is not well understood. In this work, thermal cycling experiments for intermediate- and low-temperature geothermal well cements have been conducted. The samples were cured either under ambient conditions or under realistic pressure and temperature for 7 days. The samples did not show any signs of failure after performing 10 cycles of thermal treatment between 100 °C and 18 °C. We also tested cement formulations under drying conditions. Drying shrinkage is caused by a reduction in the water content of cement, which leads to capillary forces that can damage cement. Such circumstances lead to tensile stresses causing radial cracks. Most samples exhibited cracks under low humidity conditions (drying). Fiber reinforcement, especially using short PP fibers, improved the cement’s resilience to temperature and humidity changes. Such additives can improve the longevity of cement sheaths in geothermal wells.
36 MATERIALS SCIENCE↗
Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)
This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.
Ghaffarian, Reza↗