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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1981

An experimental investigation of silicon wafer surface roughness and its effect on the pull-strength of plated metals

Plated silicon wafers with surface roughness ranging from 0.4 to 130 microinches, subjected to tensile pull-strength tests, were analyzed. Results show that the measured pull-strength of plated metals decrease with increasing silicon surface roughness, effecting a weakening of the cohesive strength of the wafer, possibly caused by microcracks or 'etch pits' in the silicon surface. The mean value of pull-strength for all wafers plated with the Ni-Cu-Cu sequence exceeded the required 450 g/0.02 sq cm, and at Ra = 0.4 microinches, the mean pull-strength for the Ni-Cu-Cu and Ni-Cu wafers were 2290 and 850 g/0.02 sq cm, respectively. The development of standardized methods for measuring contact pull-strength is suggested. These results may have some bearing on solar cell arrays problems.

Spiers, G. D.↗
NASA NTRS1981

An experimental investigation of silicon wafer surface roughness and its effect on the full strength of plated metals

Plated silicon wafers with surface roughness ranging from 0.4 to 130 microinches were subjected to tensile pull strength tests. Electroless Ni/electroless Cu/electroplated Cu and electroless Ni/electroplated Cu were the two types of plate contacts tested. It was found that smoother surfaces had higher pull strength than rougher, chemically etched surfaces. The presence of the electroless Cu layer was found to be important to adhesion. The mode of fracture of the contact as it left the silicon was studied, and it was found that in almost all cases separation was due to fracture of the bulk silicon phase. The correlation between surface roughness and mode of contact failure is presented and interpreted.

Spiers, G. D.↗
NASA NTRS1964

Metals plated on fluorocarbon polymers

Electroplating lead on fluorocarbon polymer parts is accomplished by etching the parts to be plated with sodium, followed by successive depositions of silver and lead from ultrasonically agitated plating solutions. Metals other than lead may be electroplated on the silvered parts.

Ford, H.↗
NASA NTRS1978

The Pd2Si - /Pd/ - Ni - solder plated metallization system for silicon solar cells

The rationale and application of a plated metal system, Pd2Si Pd - Ni - solder, is presented. This metallization system is particularly useful on shallow p-n junction solar cells. The advantages of such plated solar cell contacts are discussed. A process sequence for applying the metallization system is outlined. A specific example is presented, including chemical plating solution formulations and detailed process step descriptions. Electrical test data for solar cells metallized with the palladium-nickel-solder system are provided.

Coleman, M. G.↗
NASA NTRS1992

Detection and characterization of fatigue cracks in thin metal plates by low frequency resonant model analysis

Low-frequency resonant model analysis, a technique for the detection and characterization of fatigue cracks in thin metal plates, which could be adapted to rapid scan or large area testing, is considered. Experimental data displaying a direct correlation between fatigue crack geometry and resonance frequency for the second vibrational plate mode are presented. FEM is used to calculate the mechanical behavior of the plates, and provides a comparison basis for the experimentally determined resonance frequency values. The waveform of the acoustic emission generated at the resonant frequency is examined; it provides the basis for a model of the interaction of fatigue crack faces during plate vibration.

Wincheski, B.↗
NASA NTRS2003

Electromagnetic Scattering From a Polygonal Thin Metallic Plate Using Quadrilateral Meshing

The problem of electromagnetic (EM) scattering from irregularly shaped, thin, metallic flat plates in free space is solved using the electric field integral equation (EFIE) approach in conjunction with the method of moments (MoM) with quadrilateral meshing. An irregularly shaped thin plate is discretized into quadrilateral patches and the unknown electric surface current over the plate is expressed in terms of proper basis functions over these patches. The basis functions for the electric surface current density that satisfy the proper boundary conditions on these quadrilateral patches are derived. The unknown surface current density on these quadrilateral patches is determined by setting up and solving the electric field integral equation by the application of the MoM. From the knowledge of the surface current density, the EM scattering from various irregularly shaped plates is determined and compared with the earlier published results. The novelty in the present approach is the use of quadrilateral patches instead of well known and often used triangular patches. The numerical results obtained using the quadrilateral patches compare favorably with measured results.

Deshpande, Manohar D.↗
NASA NTRS1994

Forming Weld Lands On Metal Plates

Forming shoe pounds edge of newly inserted plate workpiece. After many passes of shoe and advances of plate, thick land builds up at edge. Workpiece heated to enable metal to flow without strain hardening. Proposed upset-forming process replaces relatively expensive, time-consuming, and wasteful process in which integral weld lands created by machining metal away from plates everywhere except at lands.

Weddendorf, Bruce↗
NASA NTRS1992

Thermal conductance of gold plated metallic contacts at liquid helium temperatures

The thermal conductance of gold plated OFHC copper, 6061-T6 aluminum, free-machining brass, and 304 stainless steel contacts has been measured over the temperature range of 1.6 to 4.2 K, with applied forces from 22 N to 670 N. The contact surfaces were prepared with a 0.8 micron lapped finish prior to gold coating. It was found that for all materials, except stainless steel, the thermal conductance was significantly improved as the result of gold coating the contact surfaces.

Kittel, Peter↗
NASA NTRS1976

Aeroheating model advancements featuring electroless metallic plating

Discussed are advancements in wind tunnel model construction methods and hypersonic test data demonstrating the methods. The general objective was to develop model fabrication methods for improved heat transfer measuring capability at less model cost. A plated slab model approach was evaluated with cast models containing constantan wires that formed single-wire-to-plate surface thermocouple junctions with a seamless skin of electroless nickel alloy. The surface of a space shuttle orbiter model was selectively plated with scaled tiles to simulate, with high fidelity, the probable misalignments of the heatshield tiles on a flight vehicle. Initial, Mach 8 heating results indicated a minor effect of tile misalignment roughness on boundary layer transition, implying a possible relaxation of heatshield manufacturing tolerances. Some loss of the plated tiles was experienced when the model was tested at high heating rates.

Stalmach, C. J., Jr.↗
NASA NTRS1984

Plated Metal Powders for Electrode Pastes

Metal grains to be sintered precoated with frit metal. Coated metal powders used to make ink-like electrode pastes for printing and sintering electrode-fabrication process. Grains of base metal coated with lowmelting-point--, lead or tin-- by electroless deposition.

Bickler, D. B.↗
NASA NTRS1992

Imaging flaws in thin metal plates using a magneto-optic device

An account is given of the capabilities of the magnetooptic/eddy-current imager (MEI) apparatus in the case of aging aircraft structure-type flaws in 2024-T3 Al alloy plates. Attention is given to images of cyclically grown fatigue cracks from rivetted joints in fabricated lap-joint structures, electrical discharge machining notches, and corrosion spots. Although conventional eddy-current methods could have been used, the speed and ease of MEI's use in these tests is unmatched by such means. Results are displayed in real time as a test piece is scanned, furnishing easily interpreted flaw images.

Wincheski, B.↗
NASA NTRS1991

Modal analysis for characterization of fatigue cracks in thin metal plates

Detailed experimental investigation and numerical analysis were performed on the characterization of fatigue cracks in thin aluminum alloys by a low frequency resonant modal analysis technique. The resonance frequency of plate modes is altered by the presence of fatigue cracks. This frequency shift was analyzed using a finite element approach and the results were compared to experimental data. Acoustic sensors were used to detect the fatigue cracks which were stimulated by standing waves in 0.1 cm aluminum alloy plates. The response of several different sensors to the crack noise was studied, as was the response at higher order modes. It was found that critical crack information can be obtained from the amplitude and phase of the emitted signal with respect to that of the external driving force.

Wincheski, B.↗
NASA NTRS1993

An Application of a New Electromagnetic Sensor to Real-Time Monitoring of Fatigue Crack Growth in Thin Metal Plates

A major part of fracture mechanics is concerned with studying the initiation and propagation of fatigue cracks. This typically requires constant monitoring of crack growth during fatigue cycles which necessitates automation of the whole process. If the rate of crack growth can be determined the experimenter can vary externally controlled parameters such as load level, load cycle frequency and so on. Hence, knowledge of the precise location of the crack tip at any given time is very valuable. One technique currently available for measuring fatigue crack length is the DC potential drop method. The method, however, may be inaccurate if the direction of crack growth deviates considerably from what was assumed initially or the curvature of the crack becomes significant. Another approach is to digitize an optical image of the test specimen surface and then apply a pattern recognition technique to locate the crack tip, but this method is still under development. The present work is an initial study on applying eddy current-type probes to monitoring fatigue crack growth. The performance of two types of electromagnetic probes, a conventional eddy current probe and a newly developed self-nulling probe, was evaluated for the detection characteristics at and near the tips of fatigue cracks. The scan results show that the latter probe provides a very well defined local maximum in its output in the crack tip region suggesting the definite possibility of precisely locating the tip, while the former provides a somewhat ambiguous distribution of the sensor output in the same region. The paper is organized as follows: We start by reviewing the design and performance characteristics of the self-nulling probe and then describe the scan results which demonstrate the basic properties of the self-nulling probe. Next, we provide a brief description of the software developed for tracing a simulated crack and give a brief discussion of the main results of the test. The final section summarizes the major accomplishments of the present work and the elements of the future R&D needs.

Namkung, M.↗
NASA NTRS1993

Mutual Inductance Problem for a System Consisting of a Current Sheet and a Thin Metal Plate

Rapid inspection of aircraft structures for flaws is of vital importance to the commercial and defense aircraft industry. In particular, inspecting thin aluminum structures for flaws is the focus of a large scale R&D effort in the nondestructive evaluation (NDE) community. Traditional eddy current methods used today are effective, but require long inspection times. New electromagnetic techniques which monitor the normal component of the magnetic field above a sample due to a sheet of current as the excitation, seem to be promising. This paper is an attempt to understand and analyze the magnetic field distribution due to a current sheet above an aluminum test sample. A simple theoretical model, coupled with a two dimensional finite element model (FEM) and experimental data will be presented in the next few sections. A current sheet above a conducting sample generates eddy currents in the material, while a sensor above the current sheet or in between the two plates monitors the normal component of the magnetic field. A rivet or a surface flaw near a rivet in an aircraft aluminum skin will disturb the magnetic field, which is imaged by the sensor. Initial results showed a strong dependence of the flaw induced normal magnetic field strength on the thickness and conductivity of the current-sheet that could not be accounted for by skin depth attenuation alone. It was believed that the eddy current imaging method explained the dependence of the thickness and conductivity of the flaw induced normal magnetic field. Further investigation, suggested the complexity associated with the mutual inductance of the system needed to be studied. The next section gives an analytical model to better understand the phenomenon.

Fulton, J. P.↗
NASA NTRS1981

Frictional and morphological characteristics of ion plated soft, metallic films

Ion plated metallic films in contrast to films applied by other deposition techniques offer a lower friction coefficient, longer endurance lives and exhibit a gradual increase in friction coefficient after the film has been worn off. The friction coefficients of metallic films are affected by the degree of adherence, thickness and nucleation and growth characteristics during ion plating lead to a fine, continuous crystalline structure, which contributes to a lower friction coefficient.

Spalvins, T.↗
NASA NTRS1981

Frictional and morphological characteristics of ion plated soft, metallic films

Ion plated metallic films in contrast to films applied by other deposition techniques offer a lower friction coefficient, longer endurance lives and exhibit a gradual increase in friction coefficient after the film has been worn off. The friction coefficients of metallic films are affected by the degree of adherence, thickness and nucleation and growth characteristics. The effective film thickness for the minimum friction coefficient was established for Au and Pb films. The nucleation and growth characteristics during ion plating lead to a fine, continuous crystalline structure, which contributes to a lower friction coefficient.

Spalvins, T.↗