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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

High dynamic range CdTe mixed-mode pixel array detector (MM-PAD) for kilohertz imaging of hard x-rays

A hard x-ray, high-speed, high dynamic range scientific x-ray imager is described. The imager is based on the mixed-mode pixel array detector (MM-PAD) readout chip coupled to a 750 µm thick cadmium telluride (CdTe) sensor. The full imager is a 2 × 3 tiled array of MM-PAD sensor/readout chip hybrids. CdTe improves detection for high energy x-rays as compared to silicon sensors, enabling efficient x-ray imaging to extend to >100 keV. The detector is capable of 1 kHz imaging and in-pixel circuitry has been designed to allow for well depths of greater than 4 × 10 6 80 keV x-rays. Here, a charge integrating front-end allows for quantitative measurement of high flux x-ray images beyond the capabilities of photon counting detectors. Detector performance is summarized and experimental measurements are presented.

99 GENERAL AND MISCELLANEOUS↗
DOE OSTI2021

Performance of Subyearling Fall Chinook Salmon Tagged with 8-, 9-, and 12-mm Passive Integrated Transponder Tags in the Snake River

Abstract Inferences based on tagged individuals from a population are limited in part by the minimum size of fish that can be tagged. Smaller tags allow a greater proportion of a population to be represented by tagging and should reduce potential tag effects on fish performance. We evaluated different performance metrics of juvenile fall Chinook Salmon Oncorhynchus tshawytscha tagged with 8-, 9-, and 12-mm PIT tags in the Snake River. We did not find evidence that posttagging mortality of 45–49-mm-FL fish tagged with 8-mm tags was higher than the posttagging mortality of larger fish tagged with 9- and 12-mm tags. The incisions of fish tagged with 8-mm tags using 14-guage needles healed faster than those of fish tagged with larger tags using 12-guage needles. For individuals that received 8-mm tags, growth in length and mass was higher for 45–49-mm fish than for 50–59-mm fish and 60-mm and larger fish. Growth of the larger size-classes (50–59 and ≥60 mm) was also generally higher for those tagged with 8-mm tags compared to those tagged with 9- and 12-mm tags, respectively. There were no strong relationships between tag burden (i.e., tag weight expressed as a percentage of fish weight) at the time of tagging and growth metrics for any tag size or fish size-class. Releases made to compare the detection efficiency of the three tag types in the juvenile fish bypass at Lower Granite Dam, Washington, showed that 99–100% of all fish were detected. Survival of fish from rearing areas to Lower Granite Dam generally increased with fish size and varied by year, but there was no strong evidence of a tag size effect. The 8-mm PIT tag allowed us to represent a larger portion (i.e., 6.2–24.1%) of the subyearling fall Chinook Salmon population in the Snake River without compromising fish performance or detectability at the dam.

Tiffan, Kenneth F.↗
DOE OSTI2023

Perovskite CsPbBr 3 Single-Crystal Detector Operating at 10 10 Photons s -1 mm -2 for Ultra-High Flux X-ray Detection

Semiconductors for detecting hard radiation are confronted with considerable problems when operating at high photon fluxes. A perovskite CsPbBr 3 single-crystal detector capable of operating at X-ray fluxes of up to 10 10 photons s -1 mm -2 with beam area ≤ 0.25 mm 2 at 58.61 keV for current-mode X-ray detection is reported. The spectrometer-grade melt-grown CsPbBr 3 detectors show a gamma-ray energy resolution of ~7.5% at 122 keV for 57 Co and dark current as low as 4.3 nA (0.5 nA mm -2 ) at a reverse bias voltage of 200 V (118 V mm -1 ). The detector is tested at X-ray energies of 8.2, 10, and 58.61 keV at a synchrotron light source under a reverse bias voltage of up to 1000 V (588 V mm -1 ). Under a sufficiently high bias voltage and within several hundreds of seconds X-ray exposure, good photocurrent linearity (goodness of fit R 2 > 0.99) and reproducibility are obtained up to a flux of ≈10 10 photons s -1 mm -2 at beam area 0.25 mm 2 with Lower Limit of Detection of ≈10 5 photons s -1 mm -2 and Charge Collection Efficiency of ≈100% for 58.61 keV X-rays. Therefore, wide application of CsPbBr 3 detectors in high-flux X-ray detection is anticipated.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Perform Life Cycle Energy and GHG Emission Analysis, Select Candidate Refrigerant(s), Developing Heat Pump by Using Low-GWP Refrigerants and 5 mm Diameter Tubes

Reducing environmental impacts from the energy conversion systems has been an important research topic due to recent severe global climate changes. In residential buildings, the space heating and cooling are main energy consumers, which are relying on vapor compression based heat pumps. To mitigate the environmental impacts of residential systems, the heat pumps using low-GWP refrigerants and 5mm-tube heat exchangers are proposed to replace the conventional 9 mm or 7 mm tube heat exchangers. This research uses a simulation-based design method to optimize the refrigerant circuitries of a 5-ton low-GWP refrigerant heat pumps whose indoor and outdoor heat exchangers adopt 5 mm tubes. Heat pump systems using four commercially available low-GWP refrigerants (R454A, R454C, ARM20A and ARM20B) are optimized and compared with the baseline R410A system. The results indicate that directly replacing 9 mm tubes into 5mm tubes in the baseline systems induces heat pump performance degradation; by optimizing the 5 mm tube heat pumps with added tube rows, the system refrigerant charge is reduced up to 33% compared with the baseline; the optimized low-GWP 5 mm tube heat pumps offer the same or higher performance under both cooling and heating mode; that under cooling mode, the EER improvement is up to 10.7% and under heating mode the COP improvement is up to 3.4%; and a smart flow control device to maintain counter-flow circuitry pattern on both operating modes can improve the heating performance of 5 mm tube optimized system by up to 3.0%. In an effort to better understand the environmental impacts of these systems, life cycle climate performance (LCCP) evaluation method is used to assess the baseline and optimized systems. LCCP considers the direct and indirect emissions of the system over the course of its lifetime from manufacturing to disposal. Our analyses indicate that the optimized systems using 5mm tubes and low-GWP refrigerants can reduce life-cycle CO 2 emission significantly. And improving system efficiency is the most effective way to reduce the emission of low-GWP refrigerant systems. This report shows that using 5 mm diameter tubes in heat exchangers is a feasible approach to develop heat pumps with low-GWP refrigerants. Using the proposed design approach can yield higher system efficiency with lower environmental impact.

42 ENGINEERING↗
DOE OSTI2020

Performance of 8 × 8 × 32 and 10 × 10 × 32 mm 3 CdZnTe position-sensitive virtual Frisch-grid detectors for high-energy gamma ray cameras

CdZnTe (CZT) crystals with thicknesses up to 20 mm and diameters up to 75 mm have become available from Redlen Technologies, Inc. for making large-volume gamma-ray detectors. The modified growth and optimized annealing conditions allowed Redlen to minimize the dark current and improve the uniformity of CZT crystals. Two detector designs, pixelated (H3D) and position-sensitive virtual Frisch-grid (VFG), have greatly benefitted from the availability of such big crystals. Encouraging results from testing of 40×40×15 mm 3 pixelated detectors were recently reported by the University of Michigan. In this work, we evaluated the spectroscopic properties of 8×8×32 and 10×10×32 mm 3 crystals configured as position-sensitive VFG detectors. Both digitized waveforms and an analog ASIC were used to read and process the signals from the detectors and test their spectral- and spatial-resolution. The VFG design provides the flexibility to scale-up the dimensions of the detectors for the desired efficiency, while the position information allows for correcting the detectors' response non-uniformity caused by crystal defects and devices geometry, thereby reducing the instrument cost and making them more feasible for emerging applications in gamma-ray astronomy, nonproliferation, portal screening and nuclear safeguards, where large detector arrays are often required.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2021

An ACA 1 mm survey of HzRGs in the ELAIS-S1: survey description and first results

ABSTRACT Radio-emitting jets might be one of the main ingredients shaping the evolution of massive galaxies in the Universe since early cosmic times. However, identifying early radio active galactic nuclei (AGNs) and confirming this scenario have been hard to accomplish, with studies of samples of radio AGN hosts at z > 2 becoming routinely possible only recently. With the above in mind, we have carried out a survey with the Atacama Compact Array (ACA or Morita Array) at 1.3 mm (rms = 0.15 mJy) of 36 high-redshift radio AGN candidates found within 3.9 deg2 in the ELAIS-S1 field. The work presented here describes the survey and showcases a preliminary set of results. The selection of the sample was based on three criteria making use of infrared (IR) and radio fluxes only. The criterion providing the highest selection rate of high-redshift sources (86 per cent at z > 0.8) is one combining an IR colour cut and radio flux cut (S5.8μm/S3.6μm > 1.3 and $S_{\rm 1.4\, GHz}\gt 1\,$ mJy). Among the sample of 36 sources, 16 show a millimetre (mm) detection. In eight of these cases, the emission has a non-thermal origin. A zsp = 1.58 object, with a mm detection of non-thermal origin, shows a clear spatial offset between the jet-dominated mm continuum emission and that of the host’s molecular gas, as traced by serendipitously detected CO(5-4) emission. Among the objects with serendipitous line detections there is a source with a narrow jet-like region, as revealed by CS(6-5) emission stretching 20 kpc out of the host galaxy.

Messias, Hugo G.↗
DOE OSTI2023

Low-thermal-budget synthesis of monolayer molybdenum disulfide for silicon back-end-of-line integration on a 200 mm platform

Two-dimensional (2D) materials are promising candidates for future electronics due to their excellent electrical and photonic properties. Although promising results on the wafer-scale synthesis (≤150 mm diameter) of monolayer molybdenum disulfide (MoS 2 ) have already been reported, the high-quality synthesis of 2D materials on wafers of 200 mm or larger, which are typically used in commercial silicon foundries, remains difficult. The back-end-of-line (BEOL) integration of directly grown 2D materials on silicon complementary metal–oxide–semiconductor (CMOS) circuits is also unavailable due to the high thermal budget required, which far exceeds the limits of silicon BEOL integration (<400 °C). This high temperature forces the use of challenging transfer processes, which tend to introduce defects and contamination to both the 2D materials and the BEOL circuits. Here we report a low-thermal-budget synthesis method (growth temperature < 300 °C, growth time ≤ 60 min) for monolayer MoS 2 films, which enables the 2D material to be synthesized at a temperature below the precursor decomposition temperature and grown directly on silicon CMOS circuits without requiring any transfer process. We designed a metal–organic chemical vapour deposition reactor to separate the low-temperature growth region from the high-temperature chalcogenide-precursor-decomposition region. We obtain monolayer MoS 2 with electrical uniformity on 200 mm wafers, as well as a high material quality with an electron mobility of ~35.9 cm 2 V -1 s -1 . Finally, we demonstrate a silicon-CMOS-compatible BEOL fabrication process flow for MoS 2 transistors; the performance of these silicon devices shows negligible degradation (current variation < 0.5%, threshold voltage shift < 20 mV). We believe that this is an important step towards monolithic 3D integration for future electronics.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
DOE OSTI2020

Process Development of a Direct Cast U-6Nb 250 mm Cylinder

Direct Casting is the process of casting a near-net shape part of U-6wt%Nb in a multi-zone VIM furnace for subsequent heat treatment and machining in to a final component. This interim report describes ongoing work to further develop a sound technical basis and best practices for mold design and process parameters for the Direct Casting of U-6Nb components with a cylindrical geometry. Specifically, process parameters and mold design are examined in detail for producing a hollow cylinder 250 mm diameter by 450 mm long which is 10 to 12 mm thick. The goal is to efficiently produce a sound casting with a minimum of microporosity and uniform niobium composition.

36 MATERIALS SCIENCE↗
DOE OSTI2023

CMOS-Compatible Ultrathin Superconducting NbN Thin Films Deposited by Reactive Ion Sputtering on 300 mm Si Wafer

We report a milestone in achieving large-scale, ultrathin (~5 nm) superconducting NbN thin films on 300 mm Si wafers using a high-volume manufacturing (HVM) industrial physical vapor deposition (PVD) system. The NbN thin films possess remarkable structural uniformity and consistently high superconducting quality across the entire 300 mm Si wafer, by incorporating an AlN buffer layer. High-resolution X-ray diffraction and transmission electron microscopy analyses unveiled enhanced crystallinity of (111)-oriented δ-phase NbN with the AlN buffer layer. Notably, NbN films deposited on AlN-buffered Si substrates exhibited a significantly elevated superconducting critical temperature (~2 K higher for the 10 nm NbN) and a higher upper critical magnetic field or H c2 (34.06 T boost in H c2 for the 50 nm NbN) in comparison with those without AlN. These findings present a promising pathway for the integration of quantum-grade superconducting NbN films with the existing 300 mm CMOS Si platform for quantum information applications.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Array of Graphene Variable Capacitors on 100 mm Silicon Wafers for Vibration-Based Applications

Highly flexible, electrically conductive freestanding graphene membranes hold great promise for vibration-based applications. This study focuses on their integration into mainstream semiconductor manufacturing methods. We designed a two-mask lithography process that creates an array of freestanding graphene-based variable capacitors on 100 mm silicon wafers. The first mask forms long trenches terminated by square wells featuring cone-shaped tips at their centers. The second mask fabricates metal traces from each tip to its contact pad along the trench and a second contact pad opposite the square well. A graphene membrane is then suspended over the square well to form a variable capacitor. The same capacitor structures were also built on 5 mm by 5 mm bare dies containing an integrated circuit underneath. We used atomic force microscopy, optical microscopy, and capacitance measurements in time to characterize the samples.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Reduction of Radiographic Spot Size with Dual Diameter Sub-mm Rods

Among the most dominant factors in x-ray radiographic image resolution is the radiographic spot size, which is primarily a function of the physical extent of the x-ray source, so the most marked improvements in image resolution come from modifying the pulse power driver’s diode configuration to reduce that extent. The smaller the size of the x-ray spot, the higher the image resolution potential. The U.S. Naval Research Laboratory’s Mercury pulsed power accelerator has been configured with a rod-pinch diode, and recent measurements were conducted to demonstrate the impact of anode rod geometry on x-ray spot size. The “standard” anode rod is a 0.75 mm diameter cylinder that is tapered down to 0.25 mm over a length of 5 mm, and, in this study, it was replaced by rods with a sharp step between their two diameters, rather than a taper. The effect on spot size was assessed by analyzing the edge and line spread functions calculated from high-mag rolled edge and pinhole camera images. For certain diameter pairs, a reduction in radiographic spot size is observed. In addition, the dual-diameter rods have provided unique insight into the electron-anode coupling dynamics that are at play in all diodes of this type.

X-ray radiography, spot size↗
DOE OSTI2026

Towards High-Speed friction stir welding of 25 mm Thick AA2139-T8: tool innovation and process development

Joining thick plates (≥ 12 mm) of aluminum (Al) alloys is challenging due to high tool forces, uneven material flow, and non-uniform heat distribution through the material’s thickness. Recent advancements in tool design and welding parameters for friction stir welding (FSW) in thick plates butt joining have encountered a developmental plateau, highlighting the need for innovative approaches to overcome existing limitations. Here, this study focuses on the systematic development of single-pass and double-pass FSW processes for high-strength aluminum alloy AA2139-T8, to improve joint efficiency and enable high-speed welding capabilities. Experimental evidence is presented for a novel tool design with opposing pin threads, enabling high-speed (178 mm/min) single-pass friction stir butt welding of 25 mm thick AA2139-T8. A series of FSW trials was conducted both in air and with a trailing water spray, using steel backing plates (BPs) to investigate the impact of quenching and cooling rates on process response and joint performance. A joint efficiency of 83% was attained using the novel tool features and effectively controlling process forces and thermal boundary conditions.

AA2139-T8↗
DOE OSTI2023

High-speed friction stir butt welding of 25.4 mm thick 7175-T79 aluminum alloy

This presents the first experimental demonstration of friction stir butt welding of 25.4 mm thick high-strength, precipitate-strengthened 7XXX aluminum alloy at a welding speed above 500 mm/min and penetration depth greater than 10 mm. Tool pin threads that terminate away from the shoulder region, helped mitigate nearby stress concentration during tool traversing, enabling a higher welding speed while avoiding pin fracture near shoulder. Two kinds of welds—one-sided with full penetration of the plate thickness and double-sided with partial penetration of the plate thickness—were conducted. Significant grain refinement (grain size 1.3 ± 0.8 µm) was evident at the junction of double-sided friction stir welding (FSW) compared to other regions of weld-nugget or base material. Cross-weld tensile testing with digital image correlation revealed high local strains at the junction of double-sided FSW before macro-yield. This strain concentration impeded the typical early necking on advancing/retreating sides of FSW joints, improving the yield strength of as-welded double-sided FSW by 20–24% over slow- to medium-speed one-sided FSW. In conclusion, the joint efficiency of as-welded, double-sided high-speed FSW was about 76% with respect to the base material’s ultimate tensile strength.

36 MATERIALS SCIENCE↗
DOE OSTI2024

3x3 array module of 8×8×32 mm 3 position-sensitive virtual frisch-grid CdZnTe detectors for imaging and spectroscopy of cosmic gamma-rays

Here, we evaluated the performance of the 3x3 array of 32-mm long position-sensitive virtual Frisch-grid (VFG) CdZnTe (CZT) detectors read out by the IDEAS GDS-100 data acquisition system. The array is a mechanically solid module designed for integration into a large effective area gamma-ray telescope proposed for imaging and spectroscopy of cosmic gamma-rays. The array employs the bar-shaped 8x8x32 mm 3 CZT crystals which recently became available from Redlen Technologies, Inc. and Kromek-eV Group PLC at affordable costs. The waveform sampling IDE3421 application-specific integrated circuit (ASIC), developed by the University of Michigan and IDEAS for CZT pixel detectors, was adapted to capture the signals from the array's VFG detectors. We showed good spectral performance of the Redlen detectors with an energy resolution of <1% FWHM at 662 keV and slightly poorer performance of the Kromek-eV detectors with a resolution of <2% measured at a reduced temperature of 13 °C. By testing the same detectors as single devices using hybrid charge-sensitive preamplifiers, we demonstrated improved energy resolutions at a normal temperature of ~25°C: <1% and 1.3-1.7%, respectively. However, the Kromek-eV detectors did not perform as well as the Redlen ones. We explained this by the space charge formation (polarization) decreasing the electric field and the electron drift times. The polarization was likely caused by the high injections of holes from the anode contacts. The absence of polarization in Redlen detectors suggested that the quality of the contacts might have played a role in this case.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

Performance characterization of 5×5×12 mm 3 virtual Frisch-grid TlBr detectors

Thallium bromide (TlBr) is a promising material for semiconductor gamma-ray detectors due to its high atomic number (Tl = 81, Br = 35), high density (7.56 g/cm 3 ), and relatively low melting point (460 °C). These properties give TlBr several competitive features, including high detection efficiency, good energy resolution, and lower fabrication costs, making it suitable for applications requiring compact, highly sensitive gamma-ray detection systems. Recent developments of TlBr detectors have progressed toward thicker crystals, up to 10–20 mm, configured as pixelated or virtual Frisch-grid (VFG) devices with volumes >1 cm 3 . Despite these advances, challenges remain in practical implementation, including material and fabrication issues that affect energy resolution, device stability, performance, and longevity. These challenges are similar to those faced by HgI 2 and lead-halide perovskite detectors. Here, this study presents results from characterizing over 100 position-sensitive 5×5×12 mm 3 virtual Frisch-grid detectors fabricated by Radiation Monitoring Devices Inc. For a prototype Radioisotope Identification Device (RIID). The work identified factors limiting the performance and longevity of TlBr detectors, including stochastic response variations that limit the energy resolution to 2–3 % (at 662 keV) for most devices, performance degradation associated with defect decoration, and contact delamination. Addressing these issues advances the use of TlBr and similar materials for reliable, high-resolution gamma-ray spectroscopy.

47 OTHER INSTRUMENTATION↗
DOE OSTI2023

40-meter-long REBCO tapes with critical current over 4,000 A/12 mm at 4.2 K and 13 T by advanced MOCVD

REBa 2 Cu 3 O 7–δ (REBCO, RE = rare earth) tapes doped with 5% and 15% Zr have been scaled up to lengths more than 40 m in a pilot-scale advanced metal organic chemical vapor deposition (A-MOCVD) tool. The precursor compositions used for the long tapes were guided by a study of the influence of (Ba + dopant)/Cu content on the critical current density (J c ) of 5 and 15 mol.% Hf- and Zr-added tapes at 4.2 K and 13 T. The 40-m-long tapes exhibited a critical current (I c ) over 4,000 A/12 mm at 4.2 K and 13 T as well as over 1,400 A/12 mm at 20 K and 20 T. The critical current densities of a 40-m-long tape doped with 5% Zr at 4.2 K measured at the National High Magnetic Field Laboratory (NHMFL) were > 10 MAcm –2 and >5 MAcm –2 at 14 T and 30 T, respectively, which are over three times those of commercial REBCO tapes. The infield J c of 5% Zr-added 40-m-long tapes was similar to those of previously-reported high-performance short samples made with 15% Zr or Hf. These results demonstrate the excellent potential of A-MOCVD for manufacturing high I c REBCO tapes for use in ultrahigh-field magnet applications.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2024

Properties of Nb x Ti (1–x) N thin films deposited on 300 mm silicon wafers for upscaling superconducting digital circuits

Scaling superconducting digital circuits requires fundamental changes in the current material set and fabrication process. The transition to 300 mm wafers and the implementation of advanced lithography are instrumental in facilitating mature CMOS processes, ensuring uniformity, and optimizing the yield. Here, this study explores the properties of Nb x Ti (1–x) N films fabricated by magnetron DC sputtering on 300 mm Si wafers. As a promising alternative to traditional Nb in device manufacturing, Nb x Ti (1–x) N offers numerous advantages, including enhanced stability and scalability to smaller dimensions, in both processing and design. As a ternary material, Nb x Ti (1–x) N allows engineering material parameters by changing deposition conditions. The engineered properties can be used to modulate device parameters through the stack and mitigate failure modes. We report characterization of Nb x Ti (1–x) N films at less than 2% thickness variability, 2.4% T c variability and 3% composition variability. Film resistivity (140–375 Ωcm) shows a strong correlation with the film oxygen content, while the critical temperature T c (4.6 K–14.1 K) is strongly affected by film stoichiometry and its microstructure has only a moderate effect on modifying T c . Our results offer insights about the interplay between film stoichiometry, film microstructure and critical temperature.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2022

Characterization of 128 × 128 MM-PAD-2.1 ASIC: a fast framing hard x-ray detector with high dynamic range

Here, we characterize a new x-ray Mixed-Mode Pixel Array Detector (MM-PAD-2.1) Application Specific Integrated Circuit (ASIC). Using an integrating pixel front-end with dynamic charge removal architecture, the MM-PAD-2.1 ASIC extends the maximum measurable x-ray signal (in 20 keV photon units) to > 10 7 x-rays/pixel/frame while maintaining a low read noise across the full dynamic range, all while imaging continuously at a frame rate of up to 10 kHz. The in-pixel dynamic charge removal mechanism prevents saturation of the input amplifier and proceeds in parallel with signal integration to achieve deadtime-less measurements with incident x-ray rates of > 10 10 x-rays/pixel/s. The ASIC format consists of 128 × 128 square pixels each 150 μm on a side and is designed to be 3-side buttable so large arrays can be effectively tiled. Here we use both laboratory x-ray sources and the Cornell High Energy Synchrotron Source (CHESS) to characterize two single ASIC prototype detectors for both low (single x-ray) and high incident flux detection. In the first detector the ASIC was solder bump-bonded to a 500 μm thick Si sensor for efficient detection of x-rays below 20 keV, whereas the second detector used a 750 μm thick CdTe sensor for x-rays above ~20 keV.

36 MATERIALS SCIENCE↗