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ARPA-E: Actively Managing Projects to Accelerate Impact
The ARPA-E model is unique in that the agency does not just provide teams funding. Throughout the lifetime of an ARPA-E award, ARPA-E Program Directors and Tech-to-Market Advisors also provide teams with expert advice through quarterly reviews and onsite visits. This hands-on approach helps ensure teams can meet ambitious milestones, target and tackle problems early on, and advance their technologies towards commercialization. Program Director Dr. Isik Kizilyalli explains the importance of this active project management approach in helping teams identify and overcome barriers. In this video, Energy Storage Systems (ESS) from the GRIDS program and Monolith Semiconductors from the SWITCHES program discuss how ARPA-E’s active project management approach helped them find solutions to technical challenges.
Highly Integrated WBG Power Module for Next Generation Plug-In Vehicles
Current inverter technologies used in electric vehicles (EVs) are bulky, heavy, and expensive. The performance of the inverter is also limited by the traditional Si-based semiconductor and packaging technology. These constraints are responsible for extra weight and volume in the vehicle that reduces the driving range along with usable space within the vehicle. Moreover, operating temperature restrictions, and boundaries on the inverter location within the vehicle drastically reduces the inverter performance. Thus an improved inverter design is required for next generation electric vehicles. The objective of this project was to research, develop and demonstrate a highly integrated WBG power module targeting the next generation of plugin hybrid electric vehicles (PHEVs). This power module needed to be functionally and mechanically optimized for General Motors (GM) traction inverter architecture. General Motors was the prime contractor, led the project, and oversaw the design, build, and test of the integrated power module. Virginia Polytechnic Institute and State University (VT) performed modeling and simulation tasks as well as power module design support. Monolith Semiconductor, Inc provided SiC dies and consulted on devices for the inverter. Oak Ridge National Laboratory (ORNL) performed power module technology evaluations, design evaluations of interconnect options, and performed material analysis and cross-sectioning of die activities.
High-gain monolithic 3D CMOS inverter using layered semiconductors
Here, we experimentally demonstrate a monolithic 3D integrated complementary metal oxide semiconductor (CMOS) inverter using layered transition metal dichalcogenide semiconductor N-channel (NMOS) and P-channel (PMOS) MOSFETs, which are sequentially integrated on two levels. The two devices share a common gate. Molybdenum disulphide and tungsten diselenide are used as channel materials for NMOS and PMOS, respectively, with an ON-to-OFF current ratio (I ON /I OFF ) greater than 106 and electron and hole mobilities of 37 and 236 cm 2 /Vs, respectively. The voltage gain of the monolithic 3D inverter is about 45 V/V at a supply voltage of 1.5 V and a gate length of 1 μm. This is the highest reported gain at the smallest gate length and the lowest supply voltage for any 3D integrated CMOS inverter using any layered semiconductor.
Monolithic High Voltage SiC Semiconductor Switch Development.
Abstract not provided.
III-V semiconductor nanoresonators-a new strategy for passive, active, and nonlinear all-dielectric metamaterials
We demonstrate 2D and multilayer dielectric metamaterials made from III–V semiconductors using a monolithic fabrication process. The resulting structures could be used to recompress chirped femtosecond optical pulses and in a variety of other optical applications requiring low loss. Moreover, these III–V all-dielectric metamaterials could enable novel active applications such as efficient nonlinear frequency converters, light emitters, detectors, and modulators.
All-Epitaxial Integration of Long-Wavelength Infrared Plasmonic Materials and Detectors for Enhanced Responsivity
Here, infrared detectors using monolithically integrated doped semiconductor “designer metals” are proposed and experimentally demonstrated. We leverage the “designer metal” groundplanes to form resonant cavities with enhanced absorption tuned across the long-wave infrared (LWIR). Detectors are designed with two target absorption enhancement wavelengths: 8 and 10 μm. The core of our detectors are quantum-engineered LWIR type-II superlattice p-i-n detectors with total thicknesses of only 1.42 and 1.80 μm for the 8 and 10 μm absorption enhancement devices, respectively. Our 8 and 10 μm structures show peak external quantum efficiencies of 45 and 27%, which are 4.5× and 2.7× enhanced, respectively, compared to control structures. We demonstrate the clear advantages of this detector architecture, both in terms of ease of growth/fabrication and enhanced device performance. The proposed architecture is absorber- and device-structure agnostic, much thinner than state-of-the-art LWIR T2SLs, and offers the opportunity for the integration of low dark current LWIR detector architectures for significant enhancement of IR detectivity.
Lateral Heterogeneous Integration of Quantum Cascade Lasers
Broadband terahertz radiation potentially has extensive applications, ranging from personal health care to industrial quality control and security screening. While traditional methods for broadband terahertz generation rely on bulky and expensive mode-locked lasers, frequency combs based on quantum cascade lasers (QCLs) can provide an alternative compact, high power, wideband terahertz source. QCL frequency combs incorporating a heterogeneous gain medium design can obtain even greater spectral range by having multiple lasing transitions at different frequencies. However, despite their greater spectral coverage, the comparatively low gain from such gain media lowers the maximum operating temperature and power. Lateral heterogeneous integration offers the ability to cover an extensive spectral range while maintaining the competitive performance offered from each homogeneous gain media. In this paper, we present the first lateral heterogeneous design for broadband terahertz generation: by combining two different homogeneous gain media, we have achieved a two-color frequency comb spaced by 1.5 THz.
LARGE GAIN IN GATED MONOLITHIC SURFACE ACOUSTIC WAVE AMPLIIFER ON HETEROGENOUSLY INTEGRATED III-V EPITAXIAL SEMICONDUCTOR AND LITHIUM NIOBATE.
Abstract not provided.
Atomic layer deposition of perovskite oxides and their epitaxial integration with Si, Ge, and other semiconductors
Atomic layer deposition (ALD) is a proven technique for the conformal deposition of oxide thin films with nanoscale thickness control. Most successful industrial applications have been with binary oxides, such as Al{sub 2}O{sub 3} and HfO{sub 2}. However, there has been much effort to deposit ternary oxides, such as perovskites (ABO{sub 3}), with desirable properties for advanced thin film applications. Distinct challenges are presented by the deposition of multi-component oxides using ALD. This review is intended to highlight the research of the many groups that have deposited perovskite oxides by ALD methods. Several commonalities between the studies are discussed. Special emphasis is put on precursor selection, deposition temperatures, and specific property performance (high-k, ferroelectric, ferromagnetic, etc.). Finally, the monolithic integration of perovskite oxides with semiconductors by ALD is reviewed. High-quality epitaxial growth of oxide thin films has traditionally been limited to physical vapor deposition techniques (e.g., molecular beam epitaxy). However, recent studies have demonstrated that epitaxial oxide thin films may be deposited on semiconductor substrates using ALD. This presents an exciting opportunity to integrate functional perovskite oxides for advanced semiconductor applications in a process that is economical and scalable.
Triple integrated laser – thyristor
A triple laser – thyristor, i. e., a semiconductor laser with three emitting sections monolithically integrated with an electronic switch (thyristor) is experimentally studied. For comparison, the output characteristics of single and double laser – thyristors are presented. It is shown that the functional integration of a laser with a thyristor in one heterostructure allows the laser to efficiently operate in a pulsed regime (output power ∼50 W), the use of vertical integration of two laser sections increases the power to ∼90 W, and the integration of three laser sections makes it possible to increase the output optical power to ∼120 W with all other conditions being the same. (paper)
An In 0.42 Ga 0.58 N tunnel junction nanowire photocathode monolithically integrated on a nonplanar Si wafer
Group III-nitride semiconductors exhibit many ideal characteristics for solar water splitting, including a tunable energy bandgap across nearly the entire solar spectrum and suitable band edge positions for water oxidation and proton reduction under visible and near-infrared light irradiation. To date, however, the best reported energy conversion efficiency for III-nitride semiconductor photocathodes is still below 1%. Here we report on the demonstration of a relatively efficient p-type In 0.42 Ga 0.58 N photocathode, which is monolithically integrated on an n-type nonplanar Si wafer through a GaN nanowire tunnel junction. The open pillar design, together with the nonplanar Si wafer can significantly maximize light trapping, whereas the tunnel junction reduces the interfacial resistance and enhances the extraction of photo-generated electrons. In addition, photodeposited Pt nanoparticles on InGaN nanowire surfaces significantly improve the cathodic performance. The nanowire photocathode exhibits a photocurrent density of 12.3 mA cm -2 at 0 V vs. RHE and an onset potential of 0.79 V vs. RHE under AM 1.5G one-sun illumination. Here, the maximum applied bias photon-to-current efficiency reaches 4% at ~0.52 V vs. RHE, which is one order of magnitude higher than the previously reported values for III-nitride photocathodes. Significantly, no performance degradation was measured for over 30 hours solar water splitting with a steady photocurrent density ~12 mA cm -2 without using any extra surface protection, which is attributed to the spontaneous formation of N-terminated surfaces of InGaN nanowires to protect against photocorrosion.
A transmission electron microscopy study of dislocation propagation and filtering in highly mismatched GaSb/GaAs heteroepitaxy
Monolithic integration of lattice-mismatched semiconductor materials opens up access to a wide range of bandgaps and new device functionalities. However, it is inevitably accompanied by defect formation. A thorough analysis of how these defects propagate and interact with interfaces is critical to understanding their effects on device parameters. In this study, we present a comprehensive study of dislocation networks in the GaSb/GaAs heteroepitaxial system using transmission electron microscopy (TEM). Specifically, the sample analyzed is a GaSb film grown on GaAs using dislocation–reduction strategies such as interfacial misfit array formation and introduction of a dislocation filtering layer. Using various TEM techniques, it is shown that such an analysis can reveal important information on the dislocation behavior including filtering mechanism, types of dislocation reactions, and other interactions with interfaces. A novel method that enables plan-view imaging of deeply embedded interfaces using TEM and a demonstration of independent imaging of different dislocation types are also presented. While clearly effective in characterizing dislocation behavior in GaSb/GaAs, we believe that the methods outlined in this article can be extended to study other heteroepitaxial material systems.
Monolithically-integrated AC switch having JBSFETs therein with commonly-connected drain and cathode electrodes
A monolithically-integrated AC switch includes a semiconductor substrate having first and second insulated-gate field effect transistors therein, which contain first and second spaced-apart and independently-controllable source terminals extending adjacent a first surface of the semiconductor substrate, yet share a common drain electrode extending adjacent a second surface of the semiconductor substrate. According to some of these embodiments of the invention, the first and second insulated-gate field effect transistors include respective first and second independently-controllable gate electrodes, which extend adjacent the first surface. The first and second insulated-gate field effect transistors may be configured as first and second vertical power MOSFETs, respectively. The semiconductor substrate may also include at least one edge termination region therein, which extends between the first and second vertical power MOSFETs.
Ultrafast carrier dynamics in multiple quantum well p–i–n photodiodes
Quantum well (QW) structures are widely used in lasers, semiconductor optical amplifiers, and modulators, enabling their monolithic integration on the same substrate. As optoelectronic systems evolve to meet the growing bandwidth demands in the terahertz regime, a deep understanding of ultrafast carrier dynamics in QW structures becomes essential. We introduce a comprehensive model to analyze the ultrafast dynamics of interband photo-excited carriers in QW p–i–n structures and to calculate their frequency response. This model characterizes the entire photocarrier transport process, including carrier escape from QWs and movement across heterojunction interfaces. Additionally, we outline theoretical methods for calculating carrier escape times from both QWs and heterojunction interfaces. Using a GaAs/AlGaAs QW p–i–n structure as a case study, we discuss the effects of carrier escape times from QWs and heterojunction interfaces, as well as carrier transit time through the intrinsic region, on the frequency response of QW p–i–n structures.
Digital pixel test structures implemented in a 65 nm CMOS process
The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20–40 µm and bent to form truly cylindrical half barrels. Among the first critical steps towards the realisation of this detector is to validate the sensor technology through extensive characterisation both in the laboratory and with in-beam measurements. The Digital Pixel Test Structure (DPTS) is one of the prototypes produced in the first sensor submission in this technology and has undergone a systematic measurement campaign whose details are presented in this article. The results confirm the goals of detection efficiency and non-ionising and ionising radiation hardness up to the expected levels for ALICE ITS3 and also demonstrate operation at + 20 °C and a detection efficiency of 99% for a DPTS irradiated with a dose of 10 15 1 MeV n eq cm -2 . Furthermore, spatial, timing and energy resolutions were measured at various settings and irradiation levels.
Group IV topological quantum alloy and the role of short-range order: the case of Ge-rich Ge 1– x Pb x
Despite the explosion of interest in topological materials over the last decades, their applications remain limited due to challenges in growth and incorporation with today’s microelectronics. As a potential bridge to close this gap, we investigate the group-IV alloy Ge 1–x Pb x , in the Ge-rich condition using density functional theory and show that relatively low concentrations of Pb (~9.4%) can lead to a topological phase transition. Furthermore, the calculation of the Z 2 invariant for both the random alloy and the alloy with short-range order (SRO) indicate that the topological phase of the material can be directly modified by the degree of SRO. These findings are understood in terms of local structural relaxation, which decreases the bandgap in the random alloy. However, in the SRO case, the mutual avoidance of Pb leads to minimal structural relaxation, alleviating strain. Our findings not only highlight the emerging importance of SRO in alloy properties but also indicate the possibility of constructing topological interfaces between materials of identical composition (and nominally identical structure). Moreover, they uncover a viable avenue toward the monolithic integration of quantum materials with today’s semiconductor industry.