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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗

TPS Certification by Analysis: Model-Driven Characterization of Properties and Failure in Woven Thermal Protection Systems

Woven, ablative thermal protection system (TPS) materials provide a robust option for aggressive (re)entries and thus have been baselined for the upcoming Mars Sample Return (MSR) mission's Earth Entry System (EES). The reliability requirements for MSR-EES necessitate understanding of material property variability, which could be significant given the complex structure and anisotropic nature of properties in TPS weaves, as well as the response to potential impact with micrometeoroids or orbital debris during the EES re-entry. The TPS Certification by Analysis effort within the Entry Systems Modeling project seeks to provide computational models and analyses that support the certification against such material-based risks. For the present talk, focus will be given to the characterization of baseline woven TPS material properties and mechanical failure limits, which entails (1) use of computational techniques (e.g., machine learning) to interpret computed tomography images of the weave to generate representative structural models and (2) application of multiscale material modeling approaches to characterize thermomechanical and failure properties.

thermal protection systems↗

P-ACTIVE Project Report

The Phase change material-based actively-tunable filter (P-ACTIVE, Dr. Hyun Jung Kim, the Principal Investigator / PI) project is a NASA Langley Research Center (LaRC)-led research endeavor that began as a NASA CIF (Center Innovation Fund) project in 2019. The goal of P-ACTIVE is to develop all-solid-state tunable optical filters that can serve as low-Size, Weight, and Power (SWaP) replacements to the ubiquitous filter wheel technology current in use, and serve as a starting point for completely new optical component technologies. By using materials commonly used in electronic memory devices, namely chalcogenide phase-change materials (PCMs), in conjunction with nanostructured surfaces with exotic, tailored optical responses (“metasurfaces”), the P-ACTIVE filters are able to tune their optical transmission/reflection behavior in real-time. Because of this new functionality, P-ACTIVE filters are highlighted for NASA science and space programs such as next generation Lidar, landing system (SLS) thermal monitoring, thermal imaging, imaging spectroscopy, and disaster monitoring (e.g., volcanic eruption observations from SmallSats). This document intends to serve as a compendium of the P-ACTIVE project. We begin by describing the project from background science and assume no prior knowledge of the subject. We then address experimental and theoretical results of P-ACTIVE device performance, as well as recent results obtained from the MISSE-14 mission related to space qualification of P-ACTIVE devices and constituent materials. We conclude with a prospective view of the P-ACTIVE technology, and discuss the potential for these filters and other similar metasurface devices to serve NASA’s mission.

metamaterial↗

TPS Certification by Analysis: Model-Driven Characterization of Properties and Failure in Woven Thermal Protection Systems

Woven, ablative thermal protection system (TPS) materials provide a robust option for aggressive (re)entries and thus have been baselined for the upcoming Mars Sample Return (MSR) mission’s Earth Entry System (EES). The reliability requirements for MSR-EES necessitate understanding of material property variability, which could be significant given the complex structure and anisotropic nature of properties in TPS weaves, as well as the response to potential impact with micrometeoroids or orbital debris during the EES re-entry. The TPS Certification by Analysis effort within the Entry Systems Modeling project seeks to provide computational models and analyses that support the certification against such material-based risks. For the present talk, focus will be given to the characterization of baseline woven TPS material properties and mechanical failure limits, which entails (1) use of computational techniques (e.g., machine learning) to interpret computed tomography images of the weave to generate representative structural models and (2) application of multiscale material modeling approaches to characterize thermomechanical and failure properties.

Justin B. Haskins↗

Reconfigurable Metasurface Optics at NASA LaRC Towards Space Image Sensing

Reconfigurable optical metasurfaces are rapidly emerging as a major frontier in photonics research, development, and applications. They promise compact, lightweight, and energy-efficient reconfigurable optical systems with unprecedented performance and functions that can be dynamically defined on-demand. Space applications represent an emerging area in which these characteristics are highly prized. The ability to dynamically tune optical functions through selective modulation of electromagnetic waves is crucial to the advancement of a variety of sensing applications, from imaging spectrometers to light detection and ranging (LiDAR). This presentation introduces a reconfigurable metasurface optic project led by a research team at NASA Langley Research Center (NASA LaRC) since 2019. It covers advances in phase change material-based reconfigurable optics, performance data on reliability enhancement of photonic devices, image sensing system architectures, and mission concepts enabled through these advances.

metasurface↗