The promises of nanotechnology: will they be kept?
This presentation provides an overview of NASA microspacecraft and nanospacecraft mission applications.
microspacecraft nanospacecraft↗
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NASA Planned Development Program for Microspacecraft Product Assurance
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NASA Microspacecraft↗
Report of the Microspacecraft Panel
These findings and recommendations are based solely on the material presented during the Microtechnologies and Applications to Space Systems Workshop, 5/27 and 28/92, and the personal knowledge and judgment of the panel members. These findings and recommendations represent the consensus views of the committee. This mission utility of microspacecraft for NASA space science missions was not an issue that the panel addressed. For the purposes of this panel, a microspacecraft was defined to be a fully functional spacecraft, intended for use on NASA space science missions, whose mass is on the order of 10 kg. During the panel discussions the microspacecraft mass definition was used somewhat loosely to be not less than 10 kg but certainly not more than 100, dependent upon the mission requirements.
Jones, Ross M.↗
Miniaturization Methods for Deep Space Microspacecraft
Due to the shrinking NASA budget, future scientific spacecraft programs will be driven by their "life cycle" cost.
smaller↗
Electronic Brain Design for Advanced Microspacecraft
A brief history of NASA robotic spacecraft computing architectures is given. Changing needs driving changes in features (10x reduction in cost, various increases in capability, 10x to 100x reduction in power, mass and volume) for spacecraft computing are discussed. A scaleable, parallel/neural computing architecture which addresses these changes is proposed. Evaluation of some of this architecture's components is detailed. Finally, future directions of exploration for this spacecraft computing architecture are considered.
robotic↗
Integrated Utility Module for Future NASA Miniature Spacecraft
NASA initiated a program for space-validation of selected technologies relating to miniature spacecraft and microinstruments. Addressed is the proposed development of the Integrated Utility Module (IUM) which integrates structural integrity, thermal management, power distribution, data & signal transmission, radiation & meteoroid protection, etc. into a lightweight, compact, cableless package.
NASA↗
Quantitative Analysis of Charge Injection and Discharging of Si Nanocrystals and Arrays by Electrostatic Force Microscopy
NASA requirements for computing and memory for microspacecraft emphasize high density, low power, small size, and radiation hardness. The distributed nature of storage elements in nanocrystal floating-gate memories leads to intrinsic fault tolerance and radiation hardness. Conventional floating-gate non-volatile memories are more susceptible to radiation damage. Nanocrystal-based memories also offer the possibility of faster, lower power operation. In the pursuit of filling these requirements, the following tasks have been accomplished: (1) Si nanocrystal charging has been accomplished with conducting-tip AFM; (2) Both individual nanocrystals on an oxide surface and nanocrystals formed by implantation have been charged; (3) Discharging is consistent with tunneling through a field-lowered oxide barrier; (4) Modeling of the response of the AFM to trapped charge has allowed estimation of the quantity of trapped charge; and (5) Initial attempts to fabricate competitive nanocrystal non-volatile memories have been extremely successful.
Bell, L. D.↗
Quantitative analysis of charge injection and discharging of Si nanocrystals and arrays by electrostatic force microscopy
NASA requirements for computing and memory for microspacecraft emphasizes high density, low power, small size, and radiation hardness. The distributed nature of a storage elements in nanocrystal floating-gate memories leads to instrinsic fault tolerance and radiation-hardness. Nanocrystal-based memories also offer the possibility of a faster, lower power operation.
atomic↗
A Review of Chip Scale Package Assembled Reliability
NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies.
Chip Scale Packaging Microspacecraft↗
Packaging and Qualification of Mems-Based Space Systems
The number of spacecraft designed and built over the next century will grow exponentially as communication satellite networks proliferate and NASA continues to push towards the development of many microspacecraft to replace its traditional.
communication satellite networks satellite network↗
MEMS Using SOI Substrate
At NASA, the focus for smaller, less costly missions has given impetus for the development of microspacecraft. MicroElectroMechanical System (MEMS) technology advances in the area of sensor, propulsion systems, and instruments, make the notion of a specialized microspacecraft feasible in the immediate future. Similar to the micro-electronics revolution,the emerging MEMS technology offers the integration of recent advances in micromachining and nanofabrication techniques with microelectronics in a mass-producible format,is viewed as the next step in device and instrument miniaturization. MEMS technology offers the potential of enabling or enhancing NASA missions in a variety of ways. This new technology allows the miniaturization of components and systems, where the primary benefit is a reduction in size, mass and power. MEMS technology also provides new capabilities and enhanced performance, where the most significant impact is in performance, regardless of system size. Finally,with the availability of mass-produced, miniature MEMS instrumentation comes the opportunity to rethink our fundamental measurement paradigms. It is now possible to expand our horizons from a single instrument perspective to one involving multi-node distributed systems. In the distributed systems and missions, a new system in which the functionality is enabled through a multiplicity of elements. Further in the future, the integration of electronics, photonics, and micromechanical functionalities into "instruments-on-a-chip" will provide the ultimate size, cost, function, and performance advantage. In this presentation, I will discuss recent development, requirement, and applications of various MEMS technologies and devices for space applications.
Tang, Tony K.↗
Microelectromechanical Systems (MEMS) Technology Integration Into Microspacecraft
The need to significantly reduce the mass, power, and volume of future scientific spacecraft has resulted in an increased interest on the part of NASA in the relatively new technology of microelectro- mechanical systems (MEMS). In addition to being light, compact and low-power-consuming, this technology offers other advantages to space applications, such as high performance solid-state reliability.
microelectromechanical↗
Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)
Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.
Ramesham, Rajeshuni↗
Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications
MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.
Ramesham, Rajeshuni↗
(abstract) Overview of NASA's Adaptive Structures Program
NASA's research program in Adaptive Structures was initiated seven years ago to provide the technology required for large (20-50 meters in dimension) precision (submicron) structures for observations from space. The current approach of designing thermally stable passive structures cannot meet the requirements and moreover the systems cannot be validated by ground tests. Adaptive Structures provides the capability to adjust the quasistatic dimensions of the structures, preload joints, add active damping, and provide the actuation forces necessary to attenuate the undesired dynamic motions. The technology is applicable to space platforms with various pointing instruments as well as for microspacecraft. This technology has been incorporated as part of a small Active Fold Mirror on the Wide Field Planetary Camera to be flown within the year to correct the optical errors in the Hubble Telescope. Highlights of NASA's Adaptive Structures research and applications will be presented along with future technology and research requirements for both small inexpensive spacecraft and large precision systems.
adaptive↗
Low energy CMOS for space applications
The current focus of NASA's space flight programs reflects a new thrust towards smaller, less costly, and more frequent space missions, when compared to missions such as Galileo, Magellan, or Cassini. Recently, the concept of a microspacecraft was proposed. In this concept, a small, compact spacecraft that weighs tens of kilograms performs focused scientific objectives such as imaging. Similarly, a Mars Lander micro-rover project is under study that will allow miniature robots weighing less than seven kilograms to explore the Martian surface. To bring the microspacecraft and microrover ideas to fruition, one will have to leverage compact 3D multi-chip module-based multiprocessors (MCM) technologies. Low energy CMOS will become increasingly important because of the thermodynamic considerations in cooling compact 3D MCM implementations and also from considerations of the power budget for space applications. In this paper, we show how the operating voltage is related to the threshold voltage of the CMOS transistors for accomplishing a task in VLSI with minimal energy. We also derive expressions for the noise margins at the optimal operating point. We then look at a low voltage CMOS (LVCMOS) technology developed at Stanford University which improves the power consumption over conventional CMOS by a couple of orders of magnitude and consider the suitability of the technology for space applications by characterizing its SEU immunity.
Panwar, Ramesh↗
Small spacecraft for planetary exploration
There is need for lower cost, more frequent planetary science missions to compliment the 'once a decade' large multidisciplinary missions. The Solar System Exploration Division of NASA's Office of Space Science and Applications has initiated a program of planetary missions using small spacecraft. This program is called Discovery. Conceptual designs of small spacecraft (100 to 500 kg) for potential Discovery missions to near Earth asteroids are summarized. Another class of spacecraft that could be used for Discovery missions are called microspacecraft. Microspacecraft would be compatible with small launch vehicles such as Pegasus. The term 'microspacecraft' is used here for spacecraft concepts whose mass is about 10 kg. A study of a microspacecraft for a mission to near Earth asteroids is also summarized.
Jones, Ross M.↗
Nanotechnology at NASA Ames
Advanced miniaturization, a key thrust area to enable new science and exploration missions, provides ultrasmall sensors, power sources, communication, navigation, and propulsion systems with very low mass, volume, and power consumption. Revolutions in electronics and computing will allow reconfigurable, autonomous, 'thinking' spacecraft. Nanotechnology presents a whole new spectrum of opportunities to build device components and systems for entirely new space architectures: (1) networks of ultrasmall probes on planetary surfaces; (2) micro-rovers that drive, hop, fly, and burrow; and (3) collections of microspacecraft making a variety of measurements.
Srivastava, Deepak↗