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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS2011

Deep Space Networking Experiments on the EPOXI Spacecraft

NASA's Space Communications & Navigation Program within the Space Operations Directorate is operating a program to develop and deploy Disruption Tolerant Networking [DTN] technology for a wide variety of mission types by the end of 2011. DTN is an enabling element of the Interplanetary Internet where terrestrial networking protocols are generally unsuitable because they rely on timely and continuous end-to-end delivery of data and acknowledgments. In fall of 2008 and 2009 and 2011 the Jet Propulsion Laboratory installed and tested essential elements of DTN technology on the Deep Impact spacecraft. These experiments, called Deep Impact Network Experiment (DINET 1) were performed in close cooperation with the EPOXI project which has responsibility for the spacecraft. The DINET 1 software was installed on the backup software partition on the backup flight computer for DINET 1. For DINET 1, the spacecraft was at a distance of about 15 million miles (24 million kilometers) from Earth. During DINET 1 300 images were transmitted from the JPL nodes to the spacecraft. Then, they were automatically forwarded from the spacecraft back to the JPL nodes, exercising DTN's bundle origination, transmission, acquisition, dynamic route computation, congestion control, prioritization, custody transfer, and automatic retransmission procedures, both on the spacecraft and on the ground, over a period of 27 days. The first DINET 1 experiment successfully validated many of the essential elements of the DTN protocols. DINET 2 demonstrated: 1) additional DTN functionality, 2) automated certain tasks which were manually implemented in DINET 1 and 3) installed the ION SW on nodes outside of JPL. DINET 3 plans to: 1) upgrade the LTP convergence-layer adapter to conform to the international LTP CL specification, 2) add convergence-layer "stewardship" procedures and 3) add the BSP security elements [PIB & PCB]. This paper describes the planning and execution of the flight experiment and the validation results.

automated data communication↗
NASA NTRS2006

The Ability of AMSTAR Dechlorination Solution to Remove and Degrade PCBs from Contaminated Surfaces

Polychlorinated biphenyls (PCBs) are a group of synthetic aromatic compounds with the general formula C12H(10-x)Cl(-x) that were historically used in industrial paints, caulking material and adhesives, as their properties enhanced structural integrity, reduced flammability and boosted antifungal properties. Although the United States Environmental Protection Agency (USEPA) has banned the manufacture of PCBs since 1979, they have been found in at least 500 of the 1,598 National Priorities List (Superfund) sites identified by the USEPA. Prior to the US EPA's ban on PCB production, PCBs were commonly used as additives in paints and asphalt-based adhesives that were subsequently applied to a variety of structures. Government facilities constructed as early as 1930 utilized PCB-containing binders or PCB-containing paints, which are now leaching into the environment and posing ecological and worker health concerns. In 2006, a commercially available product known as AMSTAR Dechlorination Solution was tested at NASA's Kennedy Space Center for its ability to remove and degrade PCBs from structural materials. This evaluation was requested by the Environmental Security Technology Certification Program (ESTCP) evaluating the ability of NASA's Bimetallic Treatment System (BTS) to remove and degrade PCBs from structural materials. The results of the laboratory testing are to be used to determine if a side-by-side field-scale test comparing BTS to AMSTAR was warranted. A recommended sampling and analysis testing program was submitted to ESTCP that included triplicate screening of AMSTAR's PCB dechlorination capabilities on a variety of surfaces including glass, bare metal, and painted metal coupons. The test procedures, analytical techniques and results obtained are presented in this interim report to ESTCP.

Quinn, Jacqueline E.↗
NASA NTRS2012

Focal Plane Alignment Utilizing Optical CMM

In many applications, an optical detector has to be located relative to mechanical reference points. One solution is to specify stringent requirements on (1) mounting the optical detector relative to the chip carrier, (2) soldering the chip carrier onto the printed circuit board (PCB), and (3) installing the PCB to the mechanical structure of the subsystem. Figure 1 shows a sketch of an optical detector mounted relative to mechanical reference with high positional accuracy. The optical detector is typically a fragile wafer that cannot be physically touched by any measurement tool. An optical coordinate measuring machine (CMM) can be used to position optical detectors relative to mechanical reference points. This approach will eliminate all requirements on positional tolerances. The only requirement is that the PCB is manufactured with oversized holes. An exaggerated sketch of this situation is shown in Figure 2. The sketch shows very loose tolerances on mounting the optical detector in the chip carrier, loose tolerance on soldering the chip carrier to the PCB, and finally large tolerance on where the mounting screws are located. The PCB is held with large screws and oversized holes. The PCB is mounted loosely so it can move freely around. The optical CMM measures the mechanical reference points. Based on these measurements, the required positions of the optical detector corners can be calculated. The optical CMM is commanded to go to the position where one detector corner is supposed to be. This is indicated with the cross-hairs in Figure 2(a). This figure is representative of the image of the optical CMM monitor. Using a suitable tapping tool, the PCB is manually tapped around until the corner of the optical detector is at the crosshairs of the optical CMM. The CMM is commanded to another corner, and the process is repeated a number of times until all corners of the optical detector are within a distance of 10 to 30 microns of the required position. The situation is sketched in Figure 2(b) (the figure also shows the tapping tool and where to tap). At this point the fasteners for the PCB are torqued slightly so the PCB can still move. The PCB location is adjusted again with the tapping tool. This process is repeated 3 to 4 times until the final torque is achieved. The oversized mounting holes are then filled with a liquid bonding agent to secure the board in position (not shown in the sketch). A 10- to 30-micron mounting accuracy has been achieved utilizing this method..

Liebe, Carl Christian↗