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Potting compounds include series of modified silicone RTV polymers and series of coreacted epoxy urethanes. Special properties are obtained by including Br, P, and N in polymeric structure.
Silicone rubber adhesives and potting compounds - polymeric materials for spacecraft
The requirements for nonflammable potting compounds for use in spacecraft electric and electronic equipment are discussed. The development of a suitable nonflammable compound is described. Flammability testing and acceptance criteria for Apollo spacecraft are presented. The dielectric properties of various ceramic materials used as conformal coatings are examined.
Development of heat sterilizable potting compound
Effect of environmental temperatures and relative humidities on curing times of polyurethane and polysulfide potting compounds
Sterilizable potting compounds and conformal coatings for space applications
Report evaluates silicone potting materials for electrical connectors. Describes tests of connector specimens made with CV-2510 and DC-6-1104 silicones with dibutyl tin dilaurate catalyst and evaluates test results in light of previously published test results for polyurethanes. Discusses requirements for connector-potting materials, methods used to evaluate silicones, techniques for preparing specimens, and results of tests. Identifies commercial sources of silicone potting materials.
Chemical sterilization of microorganisms in potting compounds
The feasibility of using formaldehyde-liberating synthetic resins or polymers for the sterilization of potting compounds, mated and occluded areas, and spacecraft surfaces was demonstrated. The detailed study of interrelated parameters of formaldehyde gas sterilization revealed that efficient cycle conditions can be developed for the sterilization of spacecraft components. It was determined that certain parameters were more important than others in the development of cycles for specific applications. The use of formaldehyde gas for the sterilization of spacecraft components provides NASA with a highly efficient method which is inexpensive, reproducible, easily quantitated, materials compatible, operationally simple, generally non-hazardous and not thermally destructive.
Study determines optimum fastener insert size and shape, type of embedding cement, diameter, undercut and depth control by fiber glass plug in a honeycomb structure for maximum tensile strength The best potting compound is 5-5-1 weight mixture of epoxy resin, curing agent, and milled glass fibers.
RTV-615 has been devolatilized by subjecting the uncatalyzed resin to a temperature of between 125 and 150 C for 24 hours in a vacuum of about 10 to the -6th torr. The resultant resin can be catalyzed and after a room temperature cure the outgassing of the resin is sufficiently low when tested according to ASTM E-595 that it is suitable for space flight use. Tests of physical properties of the cured devolatilized resin were compared with those of the as received silicone. The devolatilized silicones are slightly harder, have a higher tear resistance and higher tensile strengths.
New low viscosity urethanes easily mixed, molded, and outgassed. Alkane-based urethanes resist hydrolysis and oxidation and have excellent dielectric properties. Low-viscosity alkane-based urethane prepolymer prepared by one-step reaction of either isophorone diisocyanate or methyl-bis (4-cyclohexyl isocyanate) with hydrogenated, hydroxy-terminated polybutadiene (HTPBD).
A method for determining the quantity of buried contamination using solvents is presented. A nonsporocidal method with which high spore recoveries are achievable from silicone coatings and potting compounds was developed. An extension of the method to silicon potting compound RTV 60 is reported. It is stated that spores remain viable during chemical curing of silicone potting compounds and more than ninety percent of the spore population is recoverable by amine dissolution and proper plating techniques.
An investigation was made to determine (1) sporicidal properties of amine solvents that solubilize silicon resins, (2) recovery properties of a silicon potting compound (RTV 41) used in spacecraft, and (3) viability of spores during chemical curing of the potting compound. Results show that: (1) spores do remain viable during RTV 41 silicon potting chemical curing, and (2) spore recovery from cured silicon potting compound RTV 41 is very high when silicon rubber is dissolved in butylamine and series dilution with benzene prior to plate curing.
Thermal conductivity measurements of organometallic compounds used as additives for potting compounds and adhesives in unmanned spacecraft
Encapsulant and back pressure provide double protection. Cable-feedthrough tube between ambient air and interior of vessel containing liquid oxygen protects external instrumentation and cable from oxygen. Cable in tube surrounded by potting compound. Provides flow of gaseous nitrogen to dilute oxidant and makes it harmless in case of leakage through crack in potting compound.
Sponge inserts compensate for potting-compound expansion and relieve thermal stresses on circuit boards. Technique quality of production runs on PC boards intended for applications in environments less severe than those for aerospace equipment. Pads reduce weight of modules because they weigh far less than potting compound they displace.
Analysis of GLAST ACD Photo-Multiplier Tube (PMT) assembly under thermal loading demonstrates that the glass tube experiences high stresses due to Coefficient of Thermal Expansion mismatch, as well as increased stress due to high stiffness and incompressibility of potting compound. Further investigation shows adverse loading effects due to the magnetic shield, a thin piece of steel wrapped around the PMT. This steel, Mu Metal, contained an overlap region that directly attributed to crack propagation in the outside surface of the tube. Sensitivities to different configurations were studied to reduce the stress and provide a more uniform loading throughout the PMT to ensure mission success. Studies indicate substituting a softer and more compressible potting compound and moving the Mu metal from the glass tube to the outside wall of the aluminum housing yields lower stress.