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Results for “Plastic incompatibility”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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Functioning of inorganic/organic battery separators in silver-zinc cells

The results of three experimental studies related to the inorganic/organic battery separator operating mechanism are described: saponification of the plasticizer, resistivity of the simulated separators, and zincate diffusion through the separators. The inorganic/organic separator appears to be a particular example of a general class of ionic conducting films composed of inorganic fillers and/or substrates bonded together by an organic polymer containing an incompatible plasticizer that may be leached by the electrolyte. The I/O separator functions as a microporous film of varying tortuosity with essentially no specific chemical inhibition to zincate diffusion.

Philipp, W. H.↗

A transient plasticity study and low cycle fatigue analysis of the Space Station Freedom photovoltaic solar array blanket

The Space Station Freedom photovoltaic solar array blanket assembly is comprised of several layers of materials having dissimilar elastic, thermal, and mechanical properties. The operating temperature of the solar array, which ranges from -75 to +60 C, along with the material incompatibility of the blanket assembly components combine to cause an elastic-plastic stress in the weld points of the assembly. The weld points are secondary structures in nature, merely serving as electrical junctions for gathering the current. The thermal mechanical loading of the blanket assembly operating in low earth orbit continually changes throughout each 90 min orbit, which raises the possibility of fatigue induced failure. A series of structural analyses were performed in an attempt to predict the fatigue life of the solar cell in the Space Station Freedom photovoltaic array blanket. A nonlinear elastic-plastic MSC/NASTRAN analysis followed by a fatigue calculation indicated a fatigue life of 92,000 to 160,000 cycles for the solar cell weld tabs. Additional analyses predict a permanent buckling phenomenon in the copper interconnect after the first loading cycle. This should reduce or eliminate the pulling of the copper interconnect on the joint where it is welded to the silicon solar cell. It is concluded that the actual fatigue life of the solar array blanket assembly should be significantly higher than the calculated 92,000 cycles, and thus the program requirement of 87,500 cycles (orbits) will be met. Another important conclusion that can be drawn from the overall analysis is that, the strain results obtained from the MSC/NASTRAN nonlinear module are accurate to use for low-cycle fatigue analysis, since both thermal cycle testing of solar cells and analysis have shown higher fatigue life than the minimum program requirement of 87,500 cycles.

Armand, Sasan C.↗

Materials for a Stirling engine heater head

Work done on the 25-kW advanced Stirling conversion system (ASCS) terrestrial solar program in establishing criteria and selecting materials for the engine heater head and heater tubes is described. Various mechanisms contributing to incompatibility between materials are identified and discussed. Large thermal gradients, coupled with requirements for long life (60,000 h at temperature) and a large number of heatup and cooldown cycles (20,000) drive the design from a structural standpoint. The pressurized cylinder is checked for creep rupture, localized yielding, reverse plasticity, creep and fatigue damage, and creep ratcheting, in addition to the basic requirements for bust and proof pressure. In general, creep rupture and creep and fatigue interaction are the dominant factors in the design. A wide range of materials for the heater head and tubes was evaluated. Factors involved in the assessment were strength and effect on engine efficiency, reliability, and cost. A preliminary selection of Inconel 713LC for the heater head is based on acceptable structural properties but driven mainly by low cost. The criteria for failure, the structural analysis, and the material characteristics with basis for selection are discussed.

Noble, J. E.↗

A review of some problems in global-local stress analysis

The various types of local-global finite-element problems point out the need to develop a new generation of software. First, this new software needs to have a complete analysis capability, encompassing linear and nonlinear analysis of 1-, 2-, and 3-dimensional finite-element models, as well as mixed dimensional models. The software must be capable of treating static and dynamic (vibration and transient response) problems, including the stability effects of initial stress, and the software should be able to treat both elastic and elasto-plastic materials. The software should carry a set of optional diagnostics to assist the program user during model generation in order to help avoid obvious structural modeling errors. In addition, the program software should be well documented so the user has a complete technical reference for each type of element contained in the program library, including information on such topics as the type of numerical integration, use of underintegration, and inclusion of incompatible modes, etc. Some packaged information should also be available to assist the user in building mixed-dimensional models. An important advancement in finite-element software should be in the development of program modularity, so that the user can select from a menu various basic operations in matrix structural analysis.

Nelson, Richard B.↗

Performance of High Temperature Operational Amplifier, Type LM2904WH, under Extreme Temperatures

Operation of electronic parts and circuits under extreme temperatures is anticipated in NASA space exploration missions as well as terrestrial applications. Exposure of electronics to extreme temperatures and wide-range thermal swings greatly affects their performance via induced changes in the semiconductor material properties, packaging and interconnects, or due to incompatibility issues between interfaces that result from thermal expansion/contraction mismatch. Electronics that are designed to withstand operation and perform efficiently in extreme temperatures would mitigate risks for failure due to thermal stresses and, therefore, improve system reliability. In addition, they contribute to reducing system size and weight, simplifying its design, and reducing development cost through the elimination of otherwise required thermal control elements for proper ambient operation. A large DC voltage gain (100 dB) operational amplifier with a maximum junction temperature of 150 C was recently introduced by STMicroelectronics [1]. This LM2904WH chip comes in a plastic package and is designed specifically for automotive and industrial control systems. It operates from a single power supply over a wide range of voltages, and it consists of two independent, high gain, internally frequency compensated operational amplifiers. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗