Printed Hybrid Electronics (PHE) in a Flight Environment: 3D Printed Electronics on Suborbital Technology Experiment Carrier 9 (SubTEC-9)
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Additive Manufacturing↗
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Printed Hybrid Electronics (PHE) in a Flight Environment: 3D Printed Electronics on Suborbital Technology Experiment Carrier 9 (Sub TEC 9)
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Beth Paquette↗
Damage Detection Sensor System for Aerospace and Multiple Applications
NASA has identified structural health monitoring and damage detection and verification as critical needs in multiple technology roadmaps. The sensor systems can be customized for detecting location, damage size, and depth, with velocity options and can be designed for particular environments for monitoring of impact or physical damage to a structure. The damage detection system has been successfully demonstrated in a harsh environment and remote integration tested over 1000 miles apart. Multiple applications includes: Spacecraft and Aircraft; Inflatable, Deployable and Expandable Structures; Space Debris Monitoring; Space Habitats; Military Shelters; Solar Arrays, Smart Garments and Wearables, Extravehicular activity (EVA) suits; Critical Hardware Enclosures; Embedded Composite Structures; and Flexible Hybrid Printed Electronics and Systems. For better implementation and infusion into more flexible architectures, important and improved designs in advancing embedded software and GUI interface, and increasing flexibility, modularity, and configurable capabilities of the system are currently being carried out.
Williams, Martha↗
Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies
Aerosol Jet Printing (AJP) and other additive electronics technologies will enable new detector assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument and electronics concepts by reducing trace widths down to 10 microns, printing on complex geometries, and allowing new concept production. This poster summarizes development efforts of printed interconnects for space applications.
Printed Hybrid Electronics↗
Additive Manufacturing of Electronics for Space Applications
Additive manufacturing techniques for electronics will enable new detector and electronic assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument, and electronics concepts by printing fine feature sizes, printing on complex geometries, and allowing new concept production. This presentation summarizes efforts developing printing techniques to manufacture detectors and circuitry for two different space applications.
Additive Manufacturing↗
Additive Manufacturing Circuitry on Rigid and Flexible Substrates for Space Applications
Additive manufacturing techniques for electronics, including Aerosol Jet Printing (AJP), Syringe Printing, and Ink Jet Printing, will enable new detector assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument and electronics concepts by reducing trace widths down to 10 microns, printing on complex geometries, and allowing new concept production. This presentation summarizes efforts developing printing techniques to manufacture detectors and circuitry for space applications.
Detectors↗
Process Development for Printing Copper Conductible Ink on Flexible Substrates Using Aerosol Jet Technology
Rise in demand for wearable consumer electronics products has given an impetus to the development of flexible electronics technology encompassing flexible substrates and compatible circuitry. Also, additive manufacturing of flexible electronics is emerging rapidly via several techniques such as Inkjet and Aerosol Jet Printing (AJP). The basic component of all flexible circuits to be printed by these technologies is conductible ink, which is generally silver ink. Few studies exist on the printing of copper conductible ink and not many copper ink formulations are available in the market as that of silver inks. This study aims to develop a process development study for deposition of copper conductible lines on flexible substrates using the aerosol jet printing technology. The process development study includes investigation of photosintering parameters for obtaining desirable electrical resistance and shear load to failure values for the printed line. Different pre-drying techniques such as oven pre-drying and platen pre-drying have been used for improving the electrical and mechanical properties of the conductive traces. Techniques such as optical microscopy and white light interferometry have been used for the characterization of print quality of the conductible lines.
printed electronics↗
An application protocol for CAD to CAD transfer of electronic information
The exchange of Computer Aided Design (CAD) information between dissimilar CAD systems is a problem. This is especially true for transferring electronics CAD information such as multi-chip module (MCM), hybrid microcircuit assembly (HMA), and printed circuit board (PCB) designs. Currently, there exists several neutral data formats for transferring electronics CAD information. These include IGES, EDIF, and DXF formats. All these formats have limitations for use in exchanging electronic data. In an attempt to overcome these limitations, the Navy's MicroCIM program implemented a project to transfer hybrid microcircuit design information between dissimilar CAD systems. The IGES (Initial Graphics Exchange Specification) format is used since it is well established within the CAD industry. The goal of the project is to have a complete transfer of microelectronic CAD information, using IGES, without any data loss. An Application Protocol (AP) is being developed to specify how hybrid microcircuit CAD information will be represented by IGES entity constructs. The AP defines which IGES data items are appropriate for describing HMA geometry, connectivity, and processing as well as HMA material characteristics.
Azu, Charles C., Jr.↗
Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods
In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.
Process control↗
Marshall Space Flight Center Faculty Fellowship Program
The 2018 Marshall Faculty Fellowship Program involved 16 faculty in the laboratories and departments at Marshall Space Flight Center. These faculty engineers and scientists worked with NASA collaborators on NASA projects, bringing new perspectives and solutions to bear. This Technical Memorandum is a compilation of the research reports of the 2018 Marshall Faculty Fellowship program, along with the Program Announcement (Appendix A) and the Program Description (Appendix B). The research affected the following five areas: (1) Materials (2) Propulsion (3) Spacecraft systems (4) Vehicle systems (5) Space science The materials investigations includes Lunar Regolith for habitats, friction stir welding, and composite joints. Propulsion studies included cryogenic tank pressurization, transmitted torque in a cryogenic environment, and condensation in presence of noncondensables, Europa Lander Deorbit Stage, and catalyst development for a hybrid rocket. Spacecraft systems include wireless sensor networks and printed electronic inks. Vehicle systems studies were performed on Mars ascent vehicle analysis, architecture models, and Space Launch System manual steering. Space science studies included planetary lava flow. Our goal is to continue the Marshall Faculty Fellowship Program funded by Center internal project offices. Faculty Fellows in this 2018 program represented the following minority-serving institutions: Alabama A&M University, Southern University, Delgado Community College, and Dillard University.
Six, N. F.↗
AIAA Ascend 2021 Conference On Demand Manufacturing of Electronics Panel Abstract
1. Session Proposal o Session Title NASA’s In Space Manufacturing and the On Demand Manufacturing of Electronics o Session Topic Primary -- Space Logistics, Autonomy, and Robotics; Secondary – Transformative Research and Technologies o Session Format: Panel Discussion. o Requested Session Duration: 60 minutes o Short Session Description: The goal of NASA’s On Demand Manufacturing of Electronics project is to develop and demonstrate the feasibility of a low-gravity, on-demand manufacturing system for flexible hybrid electronic devices on the International Space Station. This panel will feature several key collaborators and team members from the commercial sector, academia, and internal to NASA, each of which are contributing an unique and vital role to the design and implementation of this new technology system. o Extended Session Description (Please describe in detail the activity proposed, including how you intend to use the requested session duration. This session description will be provided to the reviewers for consideration and will not be displayed in the online agenda.): The session will be moderated by Curtis Hill, the Project Lead for the On Demand Manufacturing of Electronics (ODME), and he will start by giving a brief introduction to the ODME project which is working to produce a demo system for the manufacturing of electronic devices on the International Space Station. Panelists consisting of collaborators and team members to the ODME project will then give a brief (~5 min) introduction highlighting their contributions to the project, followed by time for Q&A from the audience. The panel will consist of: 1. Kenneth Church, nScrypt. nScrypt is a leader in multi-material printing with a modular system that incorporates a direct write thick film print head, a polymer fused filament fabrication print head, a laser sintering attachment, a drill head attachment for milling, and a pick and place. The system can print a layer and scan for accuracy of prints. The combination of multiple print heads and scanning allows for the on-demand production of intricate electronic components. 2. Andy Kurk, TechShot, Inc. Techshot, Inc. has collaborated extensively with NASA on the in space manufacturing of both printed electronics and fused metal materials. They are currently working to develop and integrate a test system for printed electronics, and a flight demonstration on the International Space Station is anticipated in 2024. 3. Ed Hendricks, NextFlex. NextFlex has the goal of advancing the manufacture of flexible hybrid electronics in the U.S. They are working with ODME on the development of AstroSense, an additively manufactured, wireless, flexible, and wearable health sensor. 4. Dr. Pradeep Lall, Auburn University. Professor Lall is the MacFarlane Endowed Distinguished Professor in the Department of Mechanical Engineering with a Courtesy Joint Appointment in the Department of Electrical and Computer Engineering and a Courtesy Joint Appointment in the Department of Finance. He is collaborating with NASA’s ODME project to develop multilayer printable devices and to develop techniques to test the quality of a printed electronic device. 5. Dr. Wei Gao, California Institute of Technology. Professor Gao is an Assistant Professor of Medical Engineering. His group is developing fully printed, flexible, and wearable biosensors for crew health monitoring in collaboration with NASA’s ODME project. In addition, they are working on using sweat to power biofuel cells for wearable, self-powered electronic devices. 6. Beth Paquette, NASA Goddard. The ODME branch at NASA Goddard is spearheading a sounding rocket flight demo to prove the capability of a printed electronic device with multiple sensors. In addition, they focus on thin film and flexible energy storage evaluations. o Session Goal(s)/Outcome(s): Please list the learning objectives and/or tangible outcomes (technical paper or other publication). The goal of this session is to highlight the internal and collaborative efforts of NASA’s On Demand Manufacturing of Electronics project to develop a system for printing electronics that will be tested on the International Space Station in 2024. In addition, the session with facilitate discussion with the community on the state of the art of printable electronics, current challenges, and new avenues for collaboration.
Jennifer McInnis Jones↗
Electrical and Thermal Characterization of 3D Printed Thermoplastic Parts with Embedded Wires for High Current-Carrying Applications
Fabrication of parts exhibiting multi-functionality has recently been complemented by hybrid polymer extrusion additive manufacturing in combination with wire embedding technology. While much mechanical characterization has been performed on parts produced with fused deposition modeling, limited characterization has been performed when combined electrical and thermal loads are applied to 3D printed multi-material parts. As such, this work describes the design, fabrication, and testing of 3D printed thermoplastic coupons containing embedded copper wires that carried current. An automated fabrication process was used employing a hybrid additive manufacturing machine that dispensed polycarbonate thermoplastic and embedded bare copper wires. Testing included AC and DC hipot testing as well as thermal testing on as-fabricated and heat treated coupons to determine the effect of porosity in the substrate. The heat-treated parts contained reduced amounts of porosity, as corroborated through scanning electron microscopy, which led to 50 % increased breakdown strength and 30 to 40 % increased heat dissipation capabilities. The results of this research are describing a set of design protocol that can be used as a guideline for 3D printed embedded electronics to predict the electrical and thermal behavior.
Hipot testing↗
Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications
Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.
Electric aircrafts↗
Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications
Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.
Multifunctional↗
NASA Tech Briefs, August 2012
Topics covered include: Mars Science Laboratory Drill; Ultra-Compact Motor Controller; A Reversible Thermally Driven Pump for Use in a Sub-Kelvin Magnetic Refrigerator; Shape Memory Composite Hybrid Hinge; Binding Causes of Printed Wiring Assemblies with Card-Loks; Coring Sample Acquisition Tool; Joining and Assembly of Bulk Metallic Glass Composites Through Capacitive Discharge; 670-GHz Schottky Diode-Based Subharmonic Mixer with CPW Circuits and 70-GHz IF; Self-Nulling Lock-in Detection Electronics for Capacitance Probe Electrometer; Discontinuous Mode Power Supply; Optimal Dynamic Sub-Threshold Technique for Extreme Low Power Consumption for VLSI; Hardware for Accelerating N-Modular Redundant Systems for High-Reliability Computing; Blocking Filters with Enhanced Throughput for X-Ray Microcalorimetry; High-Thermal-Conductivity Fabrics; Imidazolium-Based Polymeric Materials as Alkaline Anion-Exchange Fuel Cell Membranes; Electrospun Nanofiber Coating of Fiber Materials: A Composite Toughening Approach; Experimental Modeling of Sterilization Effects for Atmospheric Entry Heating on Microorganisms; Saliva Preservative for Diagnostic Purposes; Hands-Free Transcranial Color Doppler Probe; Aerosol and Surface Parameter Retrievals for a Multi-Angle, Multiband Spectrometer LogScope; TraceContract; AIRS Maps from Space Processing Software; POSTMAN: Point of Sail Tacking for Maritime Autonomous Navigation; Space Operations Learning Center; OVERSMART Reporting Tool for Flow Computations Over Large Grid Systems; Large Eddy Simulation (LES) of Particle-Laden Temporal Mixing Layers; Projection of Stabilized Aerial Imagery Onto Digital Elevation Maps for Geo-Rectified and Jitter-Free Viewing; Iterative Transform Phase Diversity: An Image-Based Object and Wavefront Recovery; 3D Drop Size Distribution Extrapolation Algorithm Using a Single Disdrometer; Social Networking Adapted for Distributed Scientific Collaboration; General Methodology for Designing Spacecraft Trajectories; Hemispherical Field-of-View Above-Water Surface Imager for Submarines; and Quantum-Well Infrared Photodetector (QWIP) Focal Plane Assembly.
Source record↗
MSAT-X electronically steered phased array antenna system
A low profile electronically steered phased array was successfully developed for the Mobile Satellite Experiment Program (MSAT-X). The newly invented cavity-backed printed crossed-slot was used as the radiating element. The choice of this element was based on its low elevation angle gain coverage and low profile. A nineteen-way radial type unequal power divider and eighteen three-bit diode phase shifters constitute the beamformer module which is used to scan the beams electronically. A complete hybrid mode pointing system was also developed. The major features of the antenna system are broad coverage, low profile, and fast acquisition and tracking performance, even under fading conditions. Excellent intersatellite isolation (better than 26 dB) was realized, which will provide good quality mobile satellite communication in the future.
Chung, H. H.↗
MEMS Technology for Space Applications
Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).
vandenBerg, A.↗
Green Monopropellant Status at Marshall Space Flight Center
NASA Marshall Space Flight Center is continuing investigations into the use of green monopropellants as a replacement for hydrazine in spacecraft propulsion systems. Work to date has been to push technology development through multiple activities designed to understand the capabilities of these technologies. Future work will begin to transition to mission pull as these technologies are mature while still keeping a solid goal of pushing technology development as opportunities become available. The AF-M315E activities began with hot-fire demonstration testing of a 1N monopropellant thruster in FY 14 and FY15. Following successful completion of the preliminary campaign, changes to the test stand to accommodate propellant conditioning capability and better control of propellant operations was incorporated to make testing more streamlined. The goal is to conduct hot-fire testing with warm and cold propellants using the existing feed system and original thruster design. Following the 1N testing, a NASA owned 100 mN thruster will be hot-fire tested in the same facility to show feasibility of scaling to smaller thrusters for cubesat applications. The end goal is to conduct a hot-fire test of an integrated cubesat propulsion system using an SLM printed propellant tank, an MSFC designed propulsion system electronic controller and the 100 mN thruster. In addition to the AF-M315E testing, MSFC is pursuing hot-fire testing with LMP-103S. Following our successful hot-fire testing of the 22N thruster in April 2015, a test campaign was proposed for a 440N LMP-103S thruster with Orbital ATK and Plasma Processes. This activity was funded through the Space Technology Mission Directorate (STMD) ACO funding call in the last quarter of CY15. Under the same funding source a test activity with Busek and Glenn Research Center for testing of 5N AF-M315E thrusters was proposed and awarded. Both activities are in-work with expected completion of hot-fire testing by the end of FY17. MSFC is continuing to coordinate with the AF and academia on understanding the chemical reactions that occur in AF-M315E. An on-going investigation of the catalyst bed species using Raman Spectroscopy through the NASA Technology Research Fellowship Program (NSTRF) is looking for ways to minimize the amount of computation required by understanding the intermediate species created in the catalyst bed. The MSFC team is also working with commercial partners through Cooperative Agreement Notices (CAN's). Partnerships with commercial and academia include work in non-catalytic ignition of AF-M315, spark ignition of hybrid cubesat systems, printed SLM tanks, and dual-mode (electric and chemical) propulsion systems is continuing.
Burnside, Christopher G.↗