In situ imaging of three dimensional freeze printing process using rapid x-ray synchrotron radiography
Explore the source record for details and available documents.
Guang Yang↗
SEARCH · Search NASA
Results for “Printing process”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Entropy of printed matter at the threshold of legibility for efficient coding in digital image-processing
Printed matter as two dimensional, two valued, and stochastic process
Arps, R. B.↗
Large-scale Additive Manufacturing for Exploration
Additive Manufacturing (AM) is emerging as a mainstream manufacturing technology, and demand for large part manufacturing is getting stronger. Direct Metal Deposition (DMD) is a DED technology based on laser and powder metal application using a closed-loop-feedback control system. This webinar focuses on additive manufacturing of NASA’s RS-25 engine nozzle liner using DMD technology. This liner (10ft in height and 8ft in diameter) is beyond the print capability of existing 3D printing processes. To print this part, significant advancements were made to the DMD technology by deploying two process heads in the machine and expanding the machine work envelop to allow manufacturing of such large parts in a safe and efficient environment. A successful demonstration of the AM of the RS25 engine nozzle liner marks a new era in 3D printing and elevates the current 3D printing technology to a new level for affordable manufacturing of large metal parts.
Additive Manufacturing↗
Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate
Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.
printed electronics↗
Design, Development and Hotfire Testing of Monolithic Copper and Bimetallic Additively Manufactured Combustion Chambers
NASA and industry partners are working towards fabrication process development to reduce costs and schedules associated with manufacturing liquid rocket engine components with the goal of reducing overall mission costs. One such technique being evaluated is powder-bed fusion or selective laser melting (SLM) otherwise commonly referred to as additive manufacturing. The NASA Low Cost Upper Stage Propulsion (LCUSP) program was designed to develop processes and material characterization for the GRCop-84 copper-alloy commensurate with powder bed additive manufacturing, evaluate bimetallic deposition and complete testing of a full scale combustion chamber. As part of this development, the process has been transferred to industry partners to enable a long-term supply chain of monolithic copper combustion chambers. As a direct spin off of this program, NASA is working with industry partners to further develop the printing process for the GRCop-84 material in addition to the C-18150 (CuCrZr) material. To advance the process further and allow for optimization with multiple materials, NASA is also investigating the feasibility of bimetallic additively manufactured chambers. A 1.2k sized thrust-chamber was designed and developed to compare the printing process of the GRCop-84 and C-18150 SLM materials. A series of similar MCC liners also completed development with an Inconel 625 jacket bonded to the GRcop-84 liner evaluating direct metal deposition (DMD) laser and arc-based techniques. This paper describes the design, development, manufacturing and testing of these combustion chambers and associated lessons learned throughout the design and development process.
Gradl, Paul↗
Selection, Production, and Properties of Regolith Polymer Composites for Lunar Construction
NASA’s Artemis Program seeks to establish a long-term presence on the moon to enable scientific discoveries and utilization of lunar resources through public-private partnerships. Over the next decades, a lunar spaceport enabling regular transportation from and to Earth will need to be established to provide the services and facilities that are necessary to achieve this goal. Robotic construction technologies using in-situ materials must be developed to build up enabling infrastructure such as launch/landing pads, blast protection, power/communications towers, improved trafficability pathways and radiation protection shelters. Kennedy Space Center’s Granular Mechanics and Regolith Operations laboratory at Swamp Works has partnered with AI SpaceFactory to develop the architectural and structural design of an unpressurized shelter. The shelter, called Lina, is designed to protect astronauts and surface assets from radiation, meteoroid impact, moon quakes and thermal gradients. Lina’s structural design criteria and the resulting structure design are detailed in separate papers. A Fused Filament Fabrication (FFF) construction process using regolith polymer composites has been developed. This paper presents the material formulations and selection rationale for each of the composite components. Formulations include 70:30, 80:20, and 85:15 wt.% mixture ratios of lunar mare simulant Black Point-1 (BP-1): Polylactic Acid (PLA), 80:20 Lunar Highlands Simulant (LHS-1): PLA and an 80:20 BP-1:PLA formulation with a processing aid/compatibilizer additive. Test samples were printed in simulated lunar dirty thermal vacuum conditions (~-180 °C, ~10 -3 torr). The test environment evolved throughout the duration of the print process. A series of tests were performed to characterize the mixture ratios achieved for each formulation, the off-gassing products during vacuum printing, the strength properties, and porosity of printed products. The LHS-1: PLA formulation yielded an advantageous combination of properties and was used in a final test that additively constructed a sub-scaled Lina on regolith simulant in dirty vacuum conditions.
lunar infrastructure↗
Metal Fused Filament Fabrication of Titanium Alloy for In Space Manufacturing
NASA is developing materials and processes for the in-space manufacturing of many items for the International Space Station (ISS) and future exploration platforms. These new manufacturing processes will require the further development of current 3D printing processes to achieve high-performance metal parts within the power and space constraints of the ISS. Manufacturing Ti-6Al-4V alloy parts with 3D printing using a metal fused filament fabrication (MF3) process is an alternative process to the Direct Metal Laser Sintering (DMLS) of the metal powders additive manufacturing process. Our initial work fabricating Ti-6Al-4V parts from Ti-6Al-4V powder-binder feedstock and processed with the MF3 process has resulted in 95-97% sintered densities. The current development work of optimized sintered properties investigates the effects of variation in sintering time, temperature, and vacuum on the sintered properties of Ti-6Al-4V MF3 printed tensile bars. Sintered properties such as density, hardness, and tensile properties were characterized followed by microstructural and chemical (O/C/N) analysis to understand the role of sintering process on the ensuing material properties. Future development of the MF3 process will also involve investigation of the effects of micro-milling the Ti-64Al-4V powder to nanometer particle sizes and the investigation of laser sintering of the 3D printed devices. This new micro-milling technique will have broad application to other areas that require particle size reduction of hard metallic materials, such as Nuclear Thermal Propulsion and other NASA technologies. Laser sintering in lieu of high temperature thermal sintering should allow for significant power reduction and improved processing speeds.
sintering, alloys, 3D printing↗
Using Additive Manufacturing to Print a CubeSat Propulsion System
Small satellites, such as CubeSats, are increasingly being called upon to perform missions traditionally ascribed to larger satellite systems. However, the market of components and hardware for small satellites, particularly CubeSats, still falls short of providing the necessary capabilities required by ever increasing mission demands. One way to overcome this shortfall is to develop the ability to customize every build. By utilizing fabrication methods such as additive manufacturing, mission specific capabilities can be built into a system, or into the structure, that commercial off-the-shelf components may not be able to provide. A partnership between the University of Texas at El Paso, COSMIAC at the University of New Mexico, Northrop Grumman, and the NASA Glenn Research Center is looking into using additive manufacturing techniques to build a complete CubeSat, under the Small Spacecraft Technology Program. The W. M. Keck Center at the University of Texas at El Paso has previously demonstrated the ability to embed electronics and wires into the addtively manufactured structures. Using this technique, features such as antennas and propulsion systems can be included into the CubeSat structural body. Of interest to this paper, the team is investigating the ability to take a commercial micro pulsed plasma thruster and embed it into the printing process. Tests demonstrating the dielectric strength of the printed material and proof-of-concept demonstration of the printed thruster will be shown.
manufacturing processes↗
Serrating Nozzle Surfaces for Complete Transfer of Droplets
A method of ensuring the complete transfer of liquid droplets from nozzles in microfluidic devices to nearby surfaces involves relatively simple geometric modification of the nozzle surfaces. The method is especially applicable to nozzles in print heads and similar devices required to dispense liquid droplets having precise volumes. Examples of such devices include heads for soft printing of ink on paper and heads for depositing droplets of deoxyribonucleic acid (DNA) or protein solutions on glass plates to form microarrays of spots for analysis. The main purpose served by the present method is to ensure that droplets transferred from a nozzle have consistent volume, as needed to ensure accuracy in microarray analysis or consistent appearance of printed text and images. In soft printing, droplets having consistent volume are generated inside a print head, but in the absence of the present method, the consistency is lost in printing because after each printing action (in which a drop is ejected from a nozzle), a small residual volume of liquid remains attached to the nozzle. By providing for complete transfer of droplets (and thus eliminating residual liquid attached to the nozzle) the method ensures consistency of volume of transferred droplets. An additional benefit of elimination of residue is prevention of cross-contamination among different liquids printed through the same nozzle a major consideration in DNA microarray analysis. The method also accelerates the printing process by minimizing the need to clean a printing head to prevent cross-contamination. Soft printing involves a hydrophobic nozzle surface and a hydrophilic print surface. When the two surfaces are brought into proximity such that a droplet in the nozzle makes contact with the print surface, a substantial portion of the droplet becomes transferred to the print surface. Then as the nozzle and the print surface are pulled apart, the droplet is pulled apart and most of the droplet remains on the print surface. The basic principle of the present method is to reduce the liquid-solid surface energy of the nozzle to a level sufficiently below the intrinsic solid-liquid surface energy of the nozzle material so that the droplet is not pulled apart and, instead, the entire droplet volume becomes transferred to the print surface. In this method, the liquid-solid surface energy is reduced by introducing artificial surface roughness in the form of micromachined serrations on the inner nozzle surface (see figure). The method was tested in experiments on soft printing of DNA solutions and of deionized water through 0.5-mm-diameter nozzles, of which some were not serrated, some were partially serrated, and some were fully serrated. In the nozzles without serrations, transfer was incomplete; that is, residual liquids remained in the nozzles after printing. However, in every nozzle in which at least half the inner surface was serrated, complete transfer of droplets to the print surface was achieved.
Kim, Chang-Jin "CJ"↗
Screen printed Y and Bi-based superconductors
High T(sub c) superconducting thick film was prepared by screen printing process. Y-based (YBa2Cu3O(7 - x)) superconducting thick films were printed on 211/Al2O3, SNT/Al2O3, and YSZ substrates. Because of poor adhesion of the superconducting thick films to 211/Al2O3 and SNT/Al2O3 substrates, relatively low T(sub c) and J(sub c) values were obtained from the films printed on these substrates. Critical temperatures of YBa2Cu3O(7 - x) thick films deposited on 211/Al2O3 and SNT/Al2O3 substrates were about 80 K. The critical current densities of these films were less than 2 A/cm(exp 2). Higher T(sub c) and J(sub c) films were printed on the YSZ substrates; T(sub c) = 86.4 K and J(sub c) = 50.4 A/cm(exp 2). Multiple lead samples were also prepared on the YSZ substrates. These showed lower T(sub c) and J(sub c) values than plain samples. The heat treatment conditions of the multiple lead samples are still under investigation. Bi-based superconductor thick films have been obtained so far. Improving the superconducting properties of the BSCCO screen printed thick films will be emphasized in future work.
Haertling, Gene H.↗
Superconductivity devices: Commercial use of space
High T sub C superconducting thick film were prepared by a screen printing process. Y-based (YBa2Cu3O(7-x) superconducting thick film were printed on 211/Al2O3, SNT/Al2O3, and YSZ substrates. Because of poor adhesion of the superconductor thick films to 211/Al2O3 and SNT/Al2O3 substrates, relatively low T sub C and J sub C values were obtained from the films printed on these substrates. Critical temperatures (T sub C) of YBa2Cu3O(7-x) thick films deposited on 211/Al2O3 and SNT/Al2O3 substrates were about 80 K. The critical current densities (J sub C) of these films were less than 2 A/sq cm. Higher T sub C and J sub C YBa2Cu3O(7-x) thick films were printed on YSZ substrates. A YBa2Cu3O(7-x) thick film with T sub C=86.4 and J sub C= 50.4 A/sq cm was prepared by printing the film on YSZ substrate and firing at 990 C for 10 minutes. Multiple-lead samples were also prepared on the YSZ substrates. The multiple-lead samples showed lower T sub C and/or J sub C values than those of the plain samples. The electrical properties of YBa2Cu3O(7-x) thick films were determined by the microstructures of the films. The YBa2Cu3O(7-x) thick films printed on the YSZ substrates, which had the best properties among the films printed on the three different kinds of substrates, had the highest density and the best particle interconnection. The YBa2Cu3O(7-x) thick films with preferred orientation in (001) direction were obtained on the YSZ substrates. Cracks, which retard the properties of the films, were found from the films deposited on the YSZ substrates. Currently, a MSZ (Magnesium Stabilized Zirconia) substrate, which had higher thermal expansion coefficient than the YSZ substrate, is used as substrate for the YBa2Cu3O(7-x) thick film in order to eliminate the cracks on the film. Bi-based superconductor thick films were printed on polycrystalline MgO and YSZ substrates. Interactions between BSCCO thick films and the YSZ substrates were observed. Various buffer layer materials were applied onto the substrates in order to avoid the interactions between the BSCCO thick films and the ZrO2-based substrates. So far, a BSCCO printed on MgO substrate with T Sub C=89K was obtained. The J sub C of the film was lower than 0.1 A/sq cm by reason of poor interconnectivity of the BSCCO particles.
Haertling, Gene↗
Development of metallization process: FSA project, cella and module formation research area
The optimization, evaluation, and demonstration of a novel metallization applied by a screen printing process is examined. Based on previous results of High Resolution, Low Cost Solar Cell Contact Development, a paste consisting of molybdenum, tin, and titanium hydride was selected as the promising composition. No satisfactory cells were made using any of the molybdenum/tin pastes used as a complete replacement for conventional silver pastes. The major problem is the inability to form a bond between the pastes and silicon that withstands soldering.
Garcia, A., III↗
The development of a method of producing etch resistant wax patterns on solar cells
A potentially attractive technique for wax masking of solar cells prior to etching processes was studied. This technique made use of a reuseable wax composition which was applied to the solar cell in patterned form by means of a letterpress printing method. After standard wet etching was performed, wax removal by means of hot water was investigated. Application of the letterpress wax printing process to silicon was met with a number of difficulties. The most serious shortcoming of the process was its inability to produce consistently well-defined printed patterns on the hard silicon cell surface.
Pastirik, E.↗
Building a Plastics Fabrication Laboratory on the ISS: FabLab, MANTIS, Refabricator, CRISSP, ERASMUS, and MAMBA
The objective of NASA's In Space Manufacturing program is to develop manufacturing technologies and processes necessary to provide "on-demand, sustainable operations for exploration missions." Using the ISS as a test bed, in 2014, NASA installed and successfully tested a 3D printer for in-space operations, demonstrating the 3D printing process as well as sending digital files for printing from earth to the printer. The success of this technology demonstration has shown that on-orbit manufacturing technologies can be used to limit the earth reliance for cis-lunar missions. Because of this success, numerous opportunities have been provided by NASA to further in-space manufacturing by focusing on the development of highly autonomous manufacturing systems, recycling technologies, and robotics with the ultimate goal of building a fabrication laboratory now within reach. From technologies developed for ISS activities and demonstration missions, Tethers Unlimited, Inc. (TUI) is building a Plastics Manufacturing Laboratory capable of fabricating parts on-demand and as-needed while recycling waste plastics with minimal human interaction required. Parts will be manufactured through additive manufacturing. Precision machining will ensure manufactured parts are in tolerance with the end-use requirements. Recycling waste plastics will enable both waste from the crew and waste from processing to be re-processed into something new. In addition, these manufacturing and recycling technologies are supported by part verification/validation technique and robotic servicing, minimizing human interaction with the system and eventually enabling unmanned off-world manufacturing.
Muhlbauer, Rachel↗
Coplanar back contacts for thin silicon solar cells
A process for fabricating 2 to 3 mil wraparound solar cells was formulated. Sample thin wraparound cells were fabricated using this process. The process used a reinforced perimeter construction to reduce the breakage that occurs during handling of the wafers. A retracting piston post was designed and fabricated to help minimize the breakage that occurs during the screen printing process. Two alternative methods of applying the aluminum back surface field were investigated. In addition to the standard screen printed back surface field, both spin-on and evaporated aluminum techniques were researched. Neither spin-on nor evaporated aluminum made any noticeable improvement over the screen printing technique. A fine screen mesh was chosen for the application of the aluminum paste back surface field. The optimum time and temperature for firing the aluminum turned out to be thirty seconds at 850 C. The development work on the dielectric included looking at three dielectrics for the wraparound application. Transene 1000, Thick Film Systems 1126RCB and an in house formulation 61-2-2A were all tested. Cells with pre-dielectric thickness of 3.0-0-3.5 mils using Transene 1000 as the wraparound dielectric and the procedure outlined above showed an average efficiency of 10.7 percent. Thinner cells were fabricated, but had an unacceptable yield and efficiency.
Thornhill, J. W.↗
Development of metallization process. FSA project, cell and module formation research area
New pastes were evaluated that contained additives to aid in the silicon-to-metallization contact. None were completely successful. A reevaluation of the molybdenum oxide paste and the two-step screen printing process was done. The oxide paste did not show promise. The two-step process enabled soldering of the cells but the cells still had a high series resistance. Pastes are on order from a different manufacturer.
Garcia, A., III↗
3D Printed Substrate
In preparation for long-term, manned, deep space missions, NASA requires a sustainable system for crop and food production. This system has a variety of benefits, including a fresh food supply, improvements in air quality, a lower need to resupply and psychological benefits for the gardeners. Specifically, NASA is attempting to improve and iterate their Vegetable Production System (VEGGIE), a plant growth unit currently aboard the International Space Station (ISS). The VEGGIE unit is highly dependent on a variety of factors, including passive water delivery, growth lights, rooting pillows and cabin conditions. While previous teams have improved and redesigned water reservoirs, the primary objective of the project was to create a new substrate unit to replace the current rooting pillow design. The current design consists of an electrostatic bag filled with arcillite and a slow-release fertilizer pellet. The prototype design retains the fertilizer pellet for nutrient consistency, however the outer bag and arcillite fillings have been replaced with a 3D printed lattice block. This lattice block has several key points that allow it to function in similar ways to the current design: 1. The lattice planes are porous, with each pore offset such that the overall porosity is the same as the arcillite filling. 2. The block demonstrates a wicking nature and is able to pull water upwards towards the roots. This minimizes time needed to integrate with the existing water reservoir. 3. The filament used is highly flexible and is able to pull apart to accommodate root growth. 4. The lattice planes are connected by microfibers left behind from the printing process. These fibers provide support for the growing roots and keep the lattice planes properly aligned. The substrate block design seeks to reduce the payload costs by being entirely 3D printed. While filament would still need to be provided to the ISS, it is far less expensive than shipping arcillite due to the significantly lower weight. The final design has iterated the lattice plane concept and utilizes vertically placed planes with pores running parallel to the water reservoir. This design has reliably shown water uptake and retention and has been successful in growing multiple romaine lettuce plants. Future work should include further growth testing using multiple plant species, compost and reusability testing, food safety testing and microgravity growth testing.
Affan Bhutta↗
RF Characterization of a Photocurable PEDOT:PSS:PEGDA Conductive Biomaterial for 3D-Printing Implantable Antennas
In this work, we demonstrate photocurable PEDOT:PSS:PEGDA biomaterial as a promising candidate for intracorporeal 3D printing. Intracorporeal 3D printing offers a less invasive method which offer flexibility to tailor the form factor of printed structures. Previous work has demonstrated the feasibility of a robotic probe to 3D-print biological tissues intracorporeally via a minor incision. This same probe could also 3D-print implantable antennas as long as a suitable conductive material is identified in terms of conductivity, biocompatibility, and ability to cure at room/body temperature for safety purposes. We assess the frequency-dependent conductivity of this biomaterial and explore the Radio-Frequency (RF) performance of resulting antennas operating in free-space and inside tissue-emulating phantoms. Results show that PEDOT:PSS biomaterial with 21% and 30% PEGDA content exhibit a conductivity of ~10 4 S/m up to 5 GHz, suitable for wireless implants. Comparing the two, 21% PEGDA content exhibits poorer curing abilities, while 30% PEGDA exhibits slightly lower conductivity. Measurements for 2.4 GHz free-space dipoles conducted in an anechoic chamber reveal only ~0.8 dB and ~1 dB lower gain for PEDOT:PSS:21%PEGDA and PEDOT:PSS:30%PEGDA biomaterial, respectively, as compared to their copper counterpart. For a 5 mm-deep implanted patch antenna, these two biomaterials exhibit 3.05 dB and 3.84 dB higher transmission loss than copper, respectively. If deemed necessary, this performance degradation can be overcome by increasing the overall antenna size since the printing process is now minimally invasive and miniaturization requirements can be relaxed.
3D-printing↗