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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Fiber Optic Control System integration for advanced aircraft. Electro-optic and sensor fabrication, integration, and environmental testing for flight control systems

This report describes the design, development, and testing of passive fiber optic sensors and a multiplexing electro-optic architecture (EOA) for installation and flight test on a NASA-owned F-18 aircraft. This hardware was developed under the Fiber Optic Control Systems for Advanced Aircraft program, part of a multiyear NASA initiative to design, develop, and demonstrate through flight test 'fly-by-light' systems for application to advanced aircraft flight and propulsion control. This development included the design and production of 10 passive optical sensors and associated multiplexed EOA hardware based on wavelength division multiplexed (WDM) technology. A variety of sensor types (rotary position, linear position, temperature, and pressure) incorporating a broad range of sensor technologies (WDM analog, WDM digital, analog microbend, and fluorescent time rate of decay) were obtained from different manufacturers and functionally integrated with an independently designed EOA. The sensors were built for installation in a variety of aircraft locations, placing the sensors in a variety of harsh environments. The sensors and EOA were designed and built to have the resulting devices be as close as practical to a production system. The integrated system was delivered to NASA for flight testing on a NASA-owned F-18 aircraft. Development and integration testing of the system provided valuable information as to which sensor types were simplest to design and build for a military aircraft environment and which types were simplest to operate with a multiplexed EOA. Not all sensor types met the full range of performance and environmental requirements. EOA development problems provided information on directions to pursue in future fly-by-light flight control development programs. Lessons learned in the development of the EOA and sensor hardware are summarized.

Seal, Daniel W.↗

Hydrogen Gas Sensors Fabricated on Atomically Flat 4H-SiC Webbed Cantilevers

This paper reports on initial results from the first device tested of a "second generation" Pt-SiC Schottky diode hydrogen gas sensor that: 1) resides on the top of atomically flat 4H-SiC webbed cantilevers, 2) has integrated heater resistor, and 3) is bonded and packaged. With proper selection of heater resistor and sensor diode biases, rapid detection of H2 down to concentrations of 20 ppm was achieved. A stable sensor current gain of 125 +/- 11 standard deviation was demonstrated during 250 hours of cyclic test exposures to 0.5% H2 and N2/air.

Neudeck, Philip G.↗

Performance of High-Resolution Mo/Cu Transition Edge Sensors Fabricated Using a Lift-Off Process

The soft X-ray band below ≈0.5 keV is expected to provide rich information on metallicity, temperature, and distribution of hot gas in our galaxy and the intergalactic medium. Resolving these densely spaced emission lines requires energy resolution on the order of 1--2 eV. The low count rates from diffuse astrophysical sources also necessitate large collection areas, particularly for a sounding rocket instrument with short exposure times and limited resources. This translates to large pixel sizes (about 1 mm 2 ) for a reasonable number of read-out channels. To achieve the required energy resolution with 200 nm thin Au absorbers (heat capacity C about 1 pJ/K), we are developing TES microcalorimeters with very high temperature sensitivity (αI), low enough current sensitivity (βI), and minimal excess noise (M). Out of the various fabrication approaches for the TES bilayer we have explored, the lift-off approach (as pioneered for Mo/Au TES by Joel Weber at NIST) so far is the simplest to execute. The simple square TES geometries we have tested to date show promising results for αI and βI. Measured complex impedance and noise for bare devices without absorbers are well described by two-body thermal models and their excess noise is found to be consistent with predictions for mixed-down Johnson noise by Wessels et al. More sensitive measurements with larger heat capacity are planned to accurately determine excess noise. In this paper, we give an overview of the process and summarize results of our detailed characterization measurements for thermal conductance G, αI, βI, and noise for several devices across a range of bias points.

Felix T Jaeckel↗

Development of optical diaphragm deflection sensors

The objective of this project was to develop high-temperature pressure sensors using non-metallic components and optical sensing methods. The sensors are to operate over a temperature range from room temperature approx. 20C to 540C, to respond to internal pressure up to 690 kPa, to respond to external pressure up to 690 kPa, and to withstand external overpressure of 2070 kPa. Project tasks include evaluating sensing techniques and sensor systems. These efforts include materials and sensing method selection, sensor design, sensor fabrication, and sensor testing. Sensors are tested as a function of temperature, pressure, overpressure, and vibration. The project results show that high-temperature pressure sensors based on glass components and optical sensing methods are feasible. The microbend optical diaphragm deflection sensor exhibits the required sensitivity and stability for use as a pressure sensor with temperature compensation. for the microbend sensor, the 95% confidence level deviation of input pressure from the pressure calculated from the overall temperature-compensated calibration equation is 3.7% of full scale. The limitations of the sensors evaluated are primarily due to the restricted temperature range of suitable commercially available optical fibers and the problems associated with glass-to-metal pressure sealing over the entire testing temperature range.

Ghering, W. L.↗

Indium Tin Oxide Resistor-Based Nitric Oxide Microsensors

A sensitive resistor-based NO microsensor, with a wide detection range and a low detection limit, has been developed. Semiconductor microfabrication techniques were used to create a sensor that has a simple, robust structure with a sensing area of 1.10 ~ 0.99 mm. A Pt interdigitated structure was used for the electrodes to maximize the sensor signal output. N-type semiconductor indium tin oxide (ITO) thin film was sputter-deposited as a sensing material on the electrode surface, and between the electrode fingers. Alumina substrate (250 m in thickness) was sequentially used for sensor fabrication. The resulting sensor was tested by applying a voltage across the two electrodes and measuring the resulting current. The sensor was tested at different concentrations of NO-containing gas at a range of temperatures. Preliminary results showed that the sensor had a relatively high sensitivity to NO at 450 C and 1 V. NO concentrations from ppm to ppb ranges were detected with the low limit of near 159 ppb. Lower NO concentrations are being tested. Two sensing mechanisms were involved in the NO gas detection at ppm level: adsorption and oxidation reactions, whereas at ppb level of NO, only one sensing mechanism of adsorption was involved. The NO microsensor has the advantages of high sensitivity, small size, simple batch fabrication, high sensor yield, low cost, and low power consumption due to its microsize. The resistor-based thin-film sensor is meant for detection of low concentrations of NO gas, mainly in the ppb or lower range, and is being developed concurrently with other sensor technology for multispecies detection. This development demonstrates that ITO is a sensitive sensing material for NO detection. It also provides crucial information for future selection of nanostructured and nanosized NO sensing materials, which are expected to be more sensitive and to consume less power.

Xu, Jennifer C.↗

Thin Film Sensors for Fission Surface Power

Physical sensors fabricated with thin films could result a significant savings in space and weight with improved reliability for monitoring the long-term operation of fission surface power systems. Thin film sensors of 1 µm or less are attractive for FSP applications because they can be incorporated onto component surfaces with minimal machining and the additional weight to a system is minimal compared to thick film-, wire-, or foil-based sensors. The thin, surface fabrication of the sensors is also expected to make them less susceptible to deep dose effects that affect thicker sensors. An overview of thin film sensors using thermocouples and resistive elements designed, fabricated, and demonstrated at GRC for aerospace applications exceeding 900°C is presented.

Fission Surface Power↗

Prototype Magnetic Calorimeter Arrays with Buried Wiring for the Lynx X-Ray Microcalorimeter

Metallic magnetic calorimeter (MMC) technology is a leading contender for detectors for the Lynx X-ray Microcalorimeter, which is an imaging spectrometer consisting of an array of greater than 100,000 pixels. The fabrication of such large arrays presents a challenge when attempting to route the superconducting wiring from the pixels to the multiplexed readout. If the wiring is designed to be planar, then an aggressive, submicron scale wiring pitch has to be employed, which is technically challenging to design and fabricate on account of the requirements of low inductance, low cross-talk, high critical currents and high yield. An alternative way to achieve large scale, high density wiring is through the use of multiple buried metal layers, planarized by Chemical Mechanical Planarization. This approach is well-suited for connecting thousands of pixels on a large focal plane to readout chips, and also for fabricating sensor meander coils with narrow line widths, which helps in increasing the sensor inductance and thus alleviates stray inductance issues associated with the wiring in large size arrays. In this work we describe the fabrication of high sensor inductance MMC arrays implementing Lynx concepts and incorporating multiple layers of buried Nb wiring. The detector array is composed of three sub-arrays with pixels optimized to meet the different science driven performance requirements of Lynx. In two of the sub-arrays we adopt a thermal multiplexing scheme to read out pixels by coupling 25 absorbers to a single sensor through thermal links of varied thermal conductance. We demonstrate the successful fabrication of multi-absorber MMCs with fine pitch pixels in very large size arrays.

Solid-State Physics↗

Thin Film Heat Flux Sensor Development for Ceramic Matrix Composite (CMC) Systems

The NASA Glenn Research Center (GRC) has an on-going effort for developing high temperature thin film sensors for advanced turbine engine components. Stable, high temperature thin film ceramic thermocouples have been demonstrated in the lab, and novel methods of fabricating sensors have been developed. To fabricate thin film heat flux sensors for Ceramic Matrix Composite (CMC) systems, the rough and porous nature of the CMC system posed a significant challenge for patterning the fine features required. The status of the effort to develop thin film heat flux sensors specifically for use on silicon carbide (SiC) CMC systems with these new technologies is described.

Wrbanek, John D.↗

Detection of Carbon Monoxide Using Polymer-Carbon Composite Films

A carbon monoxide (CO) sensor was developed that can be incorporated into an existing sensing array architecture. The CO sensor is a low-power chemiresistor that operates at room temperature, and the sensor fabrication techniques are compatible with ceramic substrates. Sensors made from four different polymers were tested: poly (4-vinylpryridine), ethylene-propylene-diene-terpolymer, polyepichlorohydrin, and polyethylene oxide (PEO). The carbon black used for the composite films was Black Pearls 2000, a furnace black made by the Cabot Corporation. Polymers and carbon black were used as received. In fact, only two of these sensors showed a good response to CO. The poly (4-vinylpryridine) sensor is noisy, but it does respond to the CO above 200 ppm. The polyepichlorohydrin sensor is less noisy and shows good response down to 100 ppm.

Homer, Margie L.↗

High heat flux measurements and experimental calibrations/characterizations

Recent progress in techniques employed in the measurement of very high heat-transfer rates in reentry-type facilities at the Arnold Engineering Development Center (AEDC) is described. These advances include thermal analyses applied to transducer concepts used to make these measurements; improved heat-flux sensor fabrication methods, equipment, and procedures for determining the experimental time response of individual sensors; performance of absolute heat-flux calibrations at levels above 2,000 Btu/cu ft-sec (2.27 kW/cu cm); and innovative methods of performing in-situ run-to-run characterizations of heat-flux probes installed in the test facility. Graphical illustrations of the results of extensive thermal analyses of the null-point calorimeter and coaxial surface thermocouple concepts with application to measurements in aerothermal test environments are presented. Results of time response experiments and absolute calibrations of null-point calorimeters and coaxial thermocouples performed in the laboratory at intermediate to high heat-flux levels are shown. Typical AEDC high-enthalpy arc heater heat-flux data recently obtained with a Calspan-fabricated null-point probe model are included.

Kidd, Carl T.↗

Piezoresistive stress sensors on (110) silicon wafers

Structural reliability of electronic packages has become an increasing concern for a variety of reasons including the advent of higher integrated circuit densities, power density levels, and operating temperatures. A powerful method for experimental evaluation of die stress distributions is the use of test chips incorporating integral piezoresistive sensors. In this paper, the basic equations needed for the design of stress sensors fabricated on the surface of (110) oriented silicon wafers have been presented. Several sensor rosette configurations have been explored, including the familiar three-element 0-45-90 rosette. Rosette designs have been found which minimize the necessary calibration procedures and permit more stress components to be measured. It has been established that stress sensors on the surface of (110) test chips are sensitive to four out of the six stress components at a point.

Kang, Y. L.↗

Platinum thin film resistors as accurate and stable temperature sensors

The measurement characteristics of thin-Pt-film temperature sensors fabricated using advanced methods are discussed. The limitations of wound-wire Pt temperature sensors and the history of Pt-film development are outlined, and the commonly used film-deposition, structuring, and trimming methods are presented in a table. The development of a family of sputtered film resistors is described in detail and illustrated with photographs of the different types. The most commonly used tolerances are reported as + or - 0.3 C + 0.5 percent of the temperature measured.

Diehl, W.↗

Novel sensors for continuous crack-length measurement

A continuous crack-length sensor, fabricated from a carbon powder filled polymer, is described. The paper describes the basic sensor as well as some suggestions for improving the response by altering the sensor shape. The paper also describes two modes of using the sensor: measuring the change in electrical resistance and measuring the potential drop when a constant current is passed through the gage. The paper concludes with some results showing the temperature sensitivity of the sensor.

Prabhakaran, R.↗