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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2010

System on a Chip (SoC) Overview

System-on-a-chip or system on chip (SoC or SOC) refers to integrating all components of a computer or other electronic system into a single integrated circuit (chip). It may contain digital, analog, mixed-signal, and often radio-frequency functions all on a single chip substrate. Complexity drives it all: Radiation tolerance and testability are challenges for fault isolation, propagation, and validation. Bigger single silicon die than flown before and technology is scaling below 90nm (new qual methods). Packages have changed and are bigger and more difficult to inspect, test, and understand. Add in embedded passives. Material interfaces are more complex (underfills, processing). New rules for board layouts. Mechanical and thermal designs, etc.

LaBel, Kenneth A.↗
DOE OSTI2024

Frontier system-on-chip (SoC) technology for microwave diagnostics (invited)

The next generation of fusion reactors, exemplified by projects such as the Demonstration Power Plant following the International Thermonuclear Experimental Reactor, faces the monumental challenge of proving the viability of generating electricity through thermonuclear fusion. This pursuit introduces heightened complexities in diagnostic methodologies, particularly in microwave-based diagnostics. The increased neutron fluence necessitates significant reductions in vessel penetrations and the elimination of internal diagnostics, posing substantial challenges. SoC technology offers a promising solution by enabling the miniaturization, modularization, integration, and enhancing the reliability of microwave systems. After seven years of research, our team successfully pioneered the V- and W-band system-on-chip approach, leading to the development of active transmitters and passive receiver modules applied in practical settings, notably within the DIII-D tokamak project. Arrays of these modules have supported microwave imaging diagnostics. New physics measurement results from the Electron Cyclotron Emission Imaging system on DIII-D provide compelling evidence of improved diagnostics following the adoption of SoC technology. Furthermore, we achieved a breakthrough in developing an F-band SoC, advancing higher frequency capabilities for fusion devices. These achievements represent a significant leap forward in fusion diagnostic technology, marking substantial progress toward establishing reliable and efficient plasma diagnostics for future fusion reactors.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
NASA NTRS2022

Radiation Effects Characterization and System Architecture Options for the 7nm Snapdragon SA8155P Automotive Grade System on Chip (SoC)

The SA8155P SoC is a complex heterogeneous computational platform with CPUs, GPU, DSPs and NPU. The SA8155P is a 7 TOPS/7 Watts capable AI/ML platform and as such represents a game changing breakthrough in terms computational power for space applications. We characterize the TID and SEE effects of the Qualcomm SA8155P Automotive grade SoC. Individual sub-system testing as well as application specific full device testing was conducted. We also discuss the commercial and automotive recovery mechanisms that are available with the SA8155P SoC generation and how those can form the basis for resilient architecture options for use in future space missions

Allen, Greg↗
NASA NTRS2018

Guideline for Single-Event Effect (SEE) Testing of System on a Chip (SOC) Devices

The use of complex single and multicore processors with significant cache memory, on-chip peripherals, memory controllers, and high speed input/output (IO) that integrate many of the parts of a traditional computer system is becoming more common in space applications. Such devices are often referred to as system on a chip devices (SOCs), even though the term is used somewhat inaccurately due to the lack of analog and mixed signal subcircuits. These devices are complex combinations of single- or multi-core processors with memory controllers, high-speed input/output (IO), and other peripheral structures that formerly would have been handled by off-chip resources. In the past the processors were tested for single event effects (SEE) separately, and the peripherals were often put into custom application-specific integrated circuits (ASICs) along with other resources required by the user. Performance and cost pressures have pushed commercial devices to incorporate many of the functional blocks into a single chip, an SOC. The NASA Electronic Parts and Packaging Program (NEPP) has been examining ways to perform SEE radiation hardness assurance (RHA) testing of these processor-centric SOCs to achieve reasonable understanding of their performance in space missions.

Guertin, Steven M.↗
DOE OSTI2021

Toward Performance Portable Programming for Heterogeneous System-on-Chips: Case Study with Qualcomm Snapdragon SoC

Future heterogeneous Domain-Specific System-on-Chips (DSSoC) will be extraordinarily complex in terms of processors, memory hierarchies, and interconnection networks.To manage this complexity, architects, system software designers, and application developers need programming technologies that are flexible, accurate, efficient, and productive. These technologies will need to be as independent of any one specific architecture as is practical, because the sheer dimensionality and scale of the complexity will not allow porting and optimizing applications foreach given DSSoC. To address these issues, we are developing Cosmic Castle, a performance portable programming toolchain for streaming applications on heterogeneous architectures. The primary focus of Cosmic Castle is on enabling efficient and performant code generation through the smart compiler and intelligent runtime system. This paper presents the preliminary evaluation of our ongoing work toward Cosmic Castle. Specifically, we detail our code porting efforts and evaluate various benchmarks on the Qualcomm Snapdragon SoC using tools developed through Cosmic Castle.

Cabrera, Anthony↗
DOE OSTI2022

A 194nW Energy-Performance-Aware loT SoC Employing a 5.2nW 92.6% Peak Efficiency Power Management Unit for System Performance Scaling, Fast DVFS and Energy Minimization

A self-powered IoT system-on-chip (SoC) reduces power to sub-μw and employs multiple power-management techniques to trade-off ultra-low power (ULP), higher performance, smaller energy harvester footprint, and longer operating lifetime. Minimum Energy Point Tracking (MEPT) [1]–[4] keeps an SoC operating at the minimum energy point (MEP) to enhance system lifetime. Previous sample-and-hold MEPT schemes need frequent voltage comparisons and a high-frequency clock that increases power [2]. Current-ratio-based MEPT relies on specialized CMOS technology for body-bias tuning [3]. A switched-capacitor-based MEPT can achieve energy minimization at a targeted performance [4], but it uses a 30MHz clock witμW power consumption and low power efficiency. For ULP IoT applications, SoCs need to have ultra-low quiescent power, high efficiency for energy delivery, performance scaling based on available energy, and energy minimization to increase system lifetime. In this work, we propose an ULP IoT SoC with a triple-mode power management unit (PMU) that integrates energy-performance scaling, event-driven fast DVFS, and MEPT features to improve the system energy efficiency, as shown in Fig. 13.8.1. This work achieves a minimum 194nW power consumption for the SoC and 5.2nW quiescent power for the PMU with a 92.6% peak efficiency and >10 4 dynamic range. The timing waveform in Fig. 13.8.1 (bottom), demonstrates the transition of the three modes including energy aware (EA), performance aware (PA), and MEPT based on event priority and input voltage level which reflects the energy availability. As such, the system energy consumption and performance could be well-balanced based on both the input and output conditions.

self-powered IoT system-on-chip (SoC)↗
NASA NTRS2018

High Performance Space Computing with System-on-Chip Instrument Avionics for Space-based Next Generation Imaging Spectrometers (NGIS).

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind stateof-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This presentation will describe a Xilinx Zynq-based data acquisition, cloud-screening and compression computing system that has been developed at the Jet Propulsion Laboratory (JPL) for JPL’s Next Generation Imaging Spectrometers (NGIS). The Xilinx Zynq-based Alpha Data hardware assembly fits into a 120mm by 190m by 40mm assembly and uses 9 watts at peak performance. The computing element is a Xilinx Zynq Z7045Q which includes a Kintex-7 FPGA (equivalent to 3 RAD Virtex5 FPGAs in terms of logic cell resources) and dual-core ARM Cortex-A9 Processors (equivalent to 10 RAD750 Power PCs in term of processing capability).

Smith, Adam↗
NASA NTRS2018

High Performance Space Computing with System-on-Chip Instrument Avionics for Space-based Next Generation Imaging Spectrometers (NGIS).

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind state-of-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This presentation will describe a Xilinx Zynq-based data acquisition, cloud-screening and compression computing system that has been developed at the Jet Propulsion Laboratory (JPL) for JPL’s Next Generation Imaging Spectrometers (NGIS). The Xilinx Zynq-based Alpha Data hardware assembly fits into a 120mm by 190m by 40mm assembly and uses 9 watts at peak performance. The computing element is a Xilinx Zynq Z7045Q which includes a Kintex-7 FPGA (equivalent to 3 RAD Virtex5 FPGAs in terms of logic cell resources) and dual-core ARM Cortex-A9 Processors (equivalent to 10 RAD750 Power PCs in term of processing capability).

Dolinar, Sam↗
NASA NTRS2019

High performance space computing with system-on-chip instrument avionics for space-based Next Generation Imaging Spectrometers (NGIS)

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind state-of-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This presentation will describe a Xilinx Zynq-based data acquisition, cloud-screening and compression computing system that has been developed at the Jet Propulsion Laboratory (JPL) for JPL’s Next Generation Imaging Spectrometers (NGIS). The Xilinx Zynq-based Alpha Data hardware assembly fits into a 120mm by 190m by 40mm assembly and uses 9 watts at peak performance. The computing element is a Xilinx Zynq Z7045Q which includes a Kintex-7 FPGA (equivalent to 3 RAD Virtex5 FPGAs in terms of logic cell resources) and dual-core ARM Cortex-A9 Processors (equivalent to 10 RAD750 Power PCs in term of processing capability).

Dolinar, Sam↗
NASA NTRS2019

Proton Testing of nVidia Jetson TX2

Single-Event Effects (SEE) testing was conducted on the nVidia Jetson TX2 System on Chip (SOC). Testing was conducted at Massachusetts General Hospital's (MGH) Francis H. Burr Proton Therapy Center on June 2nd, 2019.

System on Chip (SOC)↗
NASA NTRS2018

LiveCheckHSI: a Hardware/Software Co-verification Tool for Hyperspectral Imaging Systems with Embedded System-on-Chip Instrument Avionics

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind state-of-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This paper describes hardware/software co-verification tools for the Xilinx Zynq-based control and data handling system that have been developed at the Jet Propulsion Laboratory (JPL) for visible-infrared imaging spectrometers. The system acquires and compresses images in real-time, in addition to programming the spectrometer (frame rate, exposure time), focus step motor, and heaters and reporting telemetry.

Dolman, David↗
DOE OSTI2020

An 85 nW IoT Node-Controlling SoC for MELs Power-Mode Management and Phantom Energy Reduction

This paper presents an ultra-low power (ULP) node-controlling system-on-chip (SoC) used for power-mode management and phantom energy reduction of miscellaneous electric loads (MELs). The SoC is powered from a single 2.5 V voltage supply enabled by the integrated power management unit (PMU) and can control up to 16 MELs due to the on-chip 16-channel correlator and the 32b RISC-V microprocessor. To further reduce the system power consumption, two clock domains have been adopted for the correlator and the processor separately. Fabricated in 65-nm CMOS, the measured minimum power consumption of the proposed SoC is only 85 nW at 0.45 V voltage supply and 1 kHz clock frequency. The measured maximum operating frequency can go up to 148 kHz with a 0.55 V supply. An application experiment successfully demonstrates that the SoC controls the power modes of MELs from wake-up to cut-off to save the average power and phantom energy.

power-mode management, phantom energy, phantom pow↗
NASA NTRS2017

Proton Testing of nVidia Jetson TX1

Single-Event Effects (SEE) testing was conducted on the nVidia Jetson TX1 System on Chip (SOC); herein referred to as device under test (DUT). Testing was conducted at Massachusetts General Hospitals (MGH) Francis H. Burr Proton Therapy Center on October 16th, 2016 using 200MeV protons. This testing trip was purposed to provide a baseline assessment of the radiation susceptibility of the DUT as no previous testing had been conducted on this component.

Proton testing↗
DOE OSTI2020

W-band system-on-chip electron cyclotron emission imaging system on DIII-D

Monolithic, millimeter wave “system-on-chip” (SoC) technology has been employed in heterodyne receiver integrated circuit radiometers in a newly developed Electron Cyclotron Emission Imaging (ECEI) system on the DIII-D tokamak for 2D electron temperature profile and fluctuation evolution diagnostics. Here, a prototype module operating in E-band (72-80 GHz) was first employed in a 2 x 10 element array that demonstrated significant improvements over the previous quasi-optical Schottky diode mixer arrays during the 2018 operational campaign of the DIII-D tokamak. For compatibility with International Thermonuclear Experimental Reactor (ITER) relevant scenarios on DIII-D, the SoC ECEI system was upgraded with 20 horn-waveguide receiver modules. Each individual module contains a University of California at Davis designed W-band (75 -110 GHz) receiver die that integrates a broadband low noise amplifier (LNA), a double balanced down-converting mixer, and a x4 multiplier on the local oscillator (LO) chain. A x2 multiplier and two IF amplifiers are packaged and selected to further boost the signal strength as well as downconvert the signal frequency. The upgraded W-band array exhibits > 30 dB additional gain and 20x improvement in noise temperature comparing with the previous Schottky diode radio frequency (RF) mixer input systems; an internal 8 times multiplier chain is used to bring down the LO frequency below 12 GHz, thereby obviating the need for a large aperture for quasi-optical LO coupling and replacing it with coaxial connectors. The horn-waveguide shielding housing avoids out-of-band noise interference on each individual module. The upgraded ECEI system plays an important role for absolute electron temperature evolution and fluctuation measurements for edge and core region transport physics studies.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
NASA NTRSDate not supplied

A Novel RF Architecture for Simultaneous Communication, Navigation, and Remote Sensing with Software-Defined Radio

The rapid growth of SmallSat and CubeSat missions at NASA has necessitated a re-evaluation of communication and remote-sensing architectures. Novel designs for CubeSat-sized single-board computers can now include larger Field-Programmable Gate Arrays (FPGAs) and faster System-on-Chip (SoCs) devices. These components substantially improve onboard processing capabilities so that varying subsystems no longer require an independent processor. By replacing individual Radio Frequency (RF) systems with a single software-defined radio (SDR) and processor, mission designers have greater control over reliability, performance, and efficiency. The presented architecture combines individual processing systems into a single design and establishes a modular SDR architecture capable of both remote-sensing and communication applications. This new approach based on a multi-input multi-output (MIMO) SDR features a scalable architecture optimized for Size, Weight, Power, and Cost (SWaP-C), with sufficient noise performance and phase-coherence to enable both remote-sensing and navigation applications, while providing a communication solution for simultaneous S-band and X-band transmission. This SDR design is developed around the NASA CubeSat Card Standard (CS2) that provides the required modularity through simplified backplane and interchangeable options for multiple radiation-hardened/tolerant processors. This architecture provides missions with a single platform for high-rate communication and a future platform to develop cognitive radio systems.

Advanced Avionics, Hybrid Processing, Data Process↗
DOE OSTI2021

System-on-Chip approach microwave diagnostics development for burning plasma

System-on-chip (SoC) millimeter wave integrated circuit technology has been developed and employed in chip heterodyne radiometers in Electron Cyclotron Emission Imaging (ECEI) and Microwave Imaging Reflectometer (MIR) on the DIII-D tokamak for 2D electron temperature and density fluctuation diagnostics. The W-band (75-110 GHz) ECEI system has been employed with 20 poloidal horn receiver modules with customized monolithic integrated circuit chips and internal local oscillator coupling path. The new SoC approach demonstrates > 30 dB additional gain on the receiver and 95% electronics noise suppression compared to the previous Schottky diode mixer array . An F-band (110-140 GHz) receiver chip has been developed to measure MHD and turbulence behavior on the DIII-D high-field side, such as Alfven eigenmodes. Furthermore, it can image pedestal structure evolution on fusion facilities with stronger magnetic fields, such as ASDEX-U, EAST, HL-2M, and LHD. The F-band chip performance has been tested in the laboratory. Also, V-band (55-75 GHz) transmitter and receiver modules (55-75 GHz) have been developed for DIII-D and NSTX-U Furthermore, microwave Imaging Reflectometer (MIR) application suitability for 2D density fluctuation imaging on the pedestal region.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2020

MEPHESTO: Modeling Energy-Performance in Heterogeneous SoCs and Their Trade-Offs

Integrated shared memory heterogeneous architectures are pervasive because they satisfy the diverse needs of mobile, autonomous, and edge computing platforms. Although specialized processing units (PUs) that share a unified system memory improve performance and energy efficiency by reducing data movement, they also increase contention for this memory since the PUs interact with each other. Prior work has investigated performance degradation due to memory contention, but few have studied the relationship of power and energy to memory contention. Moreover, a comprehensive solution that models memory contention for kernel placement on contemporary heterogeneous systems on chip (SoCs) in response to energy and performance has been largely unaddressed.This paper presents MEPHESTO, a novel and holistic approach for managing this balance. The authors characterize applications and PUs in terms of two memory contention factors - time factors and power factors - to achieve the desired trade-off between energy and performance for collocated kernel execution on heterogeneous systems. The authors believe that this investigation is the first to combine all of these factors and present a simple knob-based approach that expresses the target trade-off. The approach is evaluated on a diverse integrated shared memory heterogeneous system with a CPU, GPU, and programmable vision accelerator. By using an empirical model for memory contention that provides up to 92% accuracy, the kernel collocation approach can provide a near-optimal ordering and placement based on the user-defined, energy-performance trade-off parameter. Moreover, the dynamic programming-based heuristics provide up to 30% better energy or 20% performance benefits when compared with the greedy approaches commonly employed by previous studies.

Alaul haque monil, Mohammad↗