Search NASA⌕ Search

SEARCH · Search NASA

Results for “THERMAL CONDUCTOR”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records

Resistance heater rod and method of making such

A resistive heater capable of delivering heat loads on the same order as those produced by in-pile nuclear fuel experiments. The heater rod provides the energy for high-temperature steady-state testing, as well as the power needed to simulate the transient pulse in the Transient Reactor Test Loop (TRTL) system. The resistive heater includes a removable housing, two or more thermal conductors in the housing; and one or more stabilizers coupled to the two or more thermal conductors to keep the two or more thermal conductors separated to avoid shorting, wherein the two or more thermal conductors are coupled to the housing via an inert gas (e.g., Helium). The two or more thermal conductors comprise a material with substantially zero infrared spectrum (e.g., sapphire, silica, or glass).

LaBrier, Daniel↗

Thermomechanical Modeling of Copper

The plastic deformation of metals is a dissipative process. Some fraction of the plastic work is converted to heat which, given the temperature dependent response of metals, produces a thermal-mechanical coupling. In various cases, for instance when the loading is dynamic, this interaction can impact the resulting response of a material and/or system. Thus, appropriately capturing the heat generation from plastic work is necessary for various solid mechanics analysis. Determination of the fraction of work converted to heat has been long studied. Recent developments have demonstrated that the fraction is not constant but depends on various state variables. Resolving these features requires combined modeling and experimental studies. To this end, 304L stainless steel – a poor thermal conductor – was recently subjected to such an investigation. Advanced modeling capabilities were deployed to assess novel thermomechanically coupled experiments. As a complement to that study, in the current work a similar investigation is performed on copper – a good thermal conductor – to assess performance on the opposite end of the spectrum. The current document discusses these modeling efforts.

36 MATERIALS SCIENCE↗

Heat transport with a twist

Despite the desirability of polymers for use in many products due to their flexibility, light weight, and durability, their status as thermal insulators has precluded their use in applications where thermal conductors are required. However, recent results suggest that the thermal conductance of polymers can be enhanced and that their heat transport behaviors may be highly sensitive to nanoscale control. Here we use non-equilibrium molecular dynamics simulations to study the effect of mechanical twist on the steady-state thermal conductance across multi-stranded polyethylene wires. We find that a highly twisted double-helical polyethylene wire can display a thermal conductance up to three times that of its untwisted form, an effect which can be attributed to a structural transition in the strands of the double helix. We also find that in thicker wires composed of many parallel strands, adding just one twist can increase its thermal conductance by over 30%. However, we find that unlike stretching a polymer wire, which causes a monotonic increase in thermal conductance, the effect of twist is highly non-monotonic, and certain amounts of twist can actually decrease the thermal conductance. Finally, we apply the Continuous Chirality Measure (CCM) in an attempt to explore the correlation between heat conductance and chirality. The CCM is found to correlate with twist as expected, but we attribute the observed heat transport behaviors to structural factors other than chirality.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Thermal Conductivity of Graphene Coated Copper Under Uniaxial Tensile Mechanical Strain

Graphene continues to demonstrate promise as a highly effective barrier coating, even at only one atom thick. The thermal properties of this coating are also promising to allow diffusion of heat across the surface, as the isolated graphene is an intrinsically good thermal conductor, yet this and its behavior under mechanical deformation has been less extensively studied. This report demonstrates that the in-plane thermal conductivity and interfacial thermal conductance of graphene coatings on copper are affected by mechanical strain. By inducing a strain in the copper substrate, the Raman-active 2D peak exhibits a change in position as well as a change in laser power dependence as the copper substrate is uniaxially elongated to a maximum of 0.5%. Non-linear trends in thermal conductivity are observed with tensile strain in samples with differing strain transfer rates from the substrate, indicating the close correlation between intrinsic thermal conduction and interfacial properties in atomically thin coatings transferred onto metals.

36 MATERIALS SCIENCE↗

Carbon Fiber Reinforced Plastic with Substantially Improved Through-plane Thermal Conductivity

Thermal conductivity of carbon fiber support structures that also serve as cooling substrates is of increasing importance for high energy physics detectors. One of the shortcomings of current carbon fiber laminates is that they exhibit excellent thermal conductivity of order several hundred W/(m*K) along the fiber direction, whereas the through plane thermal conductivity perpendicular to the fibers is orders of magnitude lower, and at about 1 W/(m*K) more in the range of thermal insulators. This proposal aims to significantly improve the through plane thermal conductivity, by at least a factor five, changing CFRP from being a thermal insulator to a thermal conductor in the through plane direction. Between June 2021 and December 2022, a total of 36 carbon fiber laminate test samples and two carbon loaded epoxy test samples were manufactured and analyzed for thermal performance. Unfortunately, the promising results obtained with a similar sample manufactured in 2017 were not reproduced. We believe this to be mainly due the excessive age of the carbon fiber prepreg material used for this SBIR - the same material batch, produced in 2015, was used in 2017 and in 2021/2022, i.e. the material was seven years old when the final samples were produced - , and to a lesser degree to the difference in pressure attainable with the 2017 and 2021/2022 laminate curing setups. While disappointing, the results are not completely discouraging, since for the samples with the highest compression the through-plane thermal conductivities plotted as a function of per-ply thickness extrapolate well to the data point from the 2017 sample.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Power Electronics Module with Integrated Ceramic Heat Exchanger

NREL, in partnership with Synteris and Packet Digital, has developed a 3D-printable ceramic package for power electronic modules to improve their thermal management, power density, performance, and lifetime. Existing power modules contain flat ceramic substrates that serve as both the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. The team has developed an additive manufacturing process that replaces the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with an additively-manufactured ceramic packaging that acts as both an electrical insulator and heat exchanger for better thermal management. The design, manufacturability, and function of this power module will be discussed.

25 ENERGY STORAGE↗

Cost-efficient copper-nickel alloy for active cooling applications

It is recently proposed that active (Peltier) and passive (conductive) cooling could be combined to design highly-efficient thermal conductors as active heat sinks. Here we study the potential of low-cost copper-nickel alloys for active cooling applications. We show that for this application, copper-nickel alloys prepared using industrial-grade powders to lower the manufacturing cost, are as good as copper-nickel alloys made out of high purity metals. Furthermore, directed energy deposition, a type of additive manufacturing, can produce copper-nickel alloys which have about 10 percent lower thermoelectric power factor compared to mechanical-alloying methods but have larger thermal conductivity values, hence, possessing similar effective thermal conductivity values, reaching 403 W m -1 K -1 at 390K. Much larger values are expected at higher temperatures. The usage of additive manufacturing enables complex geometries and large-scale production.

36 MATERIALS SCIENCE↗

Transition between Heavy-Fermion-Strange-Metal and Quantum Spin Liquid in a $4⁢d$-Electron Trimer Lattice

We present experimental evidence that a heavy Fermi surface consisting of itinerant, charge-neutral spinons underpins both heavy-fermion-strange-metal (without f electrons) and quantum-spin-liquid states in the 4d-electron trimer lattice, Ba 4 Nb 1-x Ru 3+x O 12 (|x| < 0.20). These two exotic states both exhibit an extraordinarily large entropy, a linear heat capacity extending into the milli-Kelvin regime, a linear thermal conductivity at low temperatures, and separation of charges and spins. Furthermore, the insulating spin liquid is a much better thermal conductor than the heavy-fermion-strange-metal that separately is observed to strongly violate the Wiedemann- Franz law. Here, we propose that at the heart of this 4d system is a universal, heavy spinon Fermi surface that provides a unified framework for explaining the exotic phenomena observed throughout the entire series. The control of such exotic ground states provided by variable Nb concentration offers a new paradigm for studies of correlated quantum matter.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

GOTHIC Aerosol Source Depletion Studies

Pacific Northwest National Laboratory has continued work to develop an aerosol-laden flow modeling capability with the Generation of Thermal Hydraulic Information in Containment (GOTHIC TM ) computer code to perform simulations for thermal hydraulic conditions and aerosol transport and deposition in spent fuel casks. This report describes our recent work to expand our model that was originally developed in 2019 to allow for thermal characterization, carrier gas flow determination, and tracking of particulate behavior throughout the entire canister volume. This was achieved through conversion of decay heat source in all fuel tubes within the model from heaters to thermal conductors in GOTHIC as well as remeshing the internal volume of the canister. These model improvements allowed for simulations of base case scenarios for comparison of similar efforts by our collaborators with alternative tools at Sandia and Oak Ridge. Several characteristics of the GOTHIC code were elucidated by this effort and were documented for consideration in how the code is used for this effort moving forward. For instance, treatment of particle size distributions, initial spatial distributions, mesh gradients, and minimum volume concentrations were identified as important issues for consideration. Ultimately, the current version of the code is capable of tracking temperatures, flow rates, and particle behavior throughout the canister internal volume. This report presents predicted depletion times and preferred deposition patterns within the canister. Additionally, this report documents code performance and insights for further model development and use for comparisons to other codes and for predicting system behavior in experiments being performed and planned by our collaborators.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Development of an Integrated Thermal Energy Storage Heat Exchanger for Concentrating Solar Power

In this design and development effort a latent-heat energy storage heat exchanger was designed for a 10MW e sCO 2 power plant as a basis for detailed design and testing of a new phase-change heat exchanger technology. High efficiency thermal conductors of graphite foam or folded copper were employed within chloride salt phase-change volumes bounded by alternating high density compact plate-fin heat exchange cells in this new heat exchanger technology. Test articles were constructed at Brayton Energy and tested at Argonne National Laboratory. Copper-conducting samples were constructed and tested at Brayton Energy.

14 SOLAR ENERGY↗

Thermal Management System for an Electric Machine with Additively Manufactured Hollow Conductors with Integrated Heat Pipes: Preprint

This paper discusses steps taken to size a thermal management system for an aircraft propulsion electric machine containing additively manufactured coils integrated with heat pipes aimed at boosting its specific power. Experimental setups are used to size and characterize heat pipes for the application and 3D thermal FEA is used to determine optimum heat transfer coefficient of convective boundaries. Geometric details of fin-based surface area enhancement required to reach target combined overall heat transfer coefficient (U) and surface area (A) performance (UA) in W/K, is worked out for relevant boundaries and the resulting UA is verified in 3D thermal FEA. Thermal management system's UA (by extension specific power) sensitivity to coolant temperature is explored and temperature distribution plots of optimized machine components are presented and discussed.

additive manufacturing↗

Hierarchical thermal-conductive polymer nanocomposites for thermal management

Managing heat in electrical conductors is a major challenge to meet the demands for sustainable energy use and electrical reliability, most notably power electronics and energy-critical electrical machines. Achieving such disparate functionalities, such as high temperature thermal and electrical reliability, require rational design and manufacturing of thermal conductor material and its hierarchical structures. Here we present hierarchical thermal-conductive nanocomposites, consisting of nanostructured ceramic conformal coating and aligned ultrahigh molecular weight polyethylene fiber, to tailor heat dissipation in electric conductors. The hybrid aligned thermal interface exhibits a highly desirable temperature dependent anisotropic high thermal conductivity with 0.98W m –1 K –1 and dielectric strength with 3.4. In addition, electrically insulating thermal interfaces demonstrate high-performing and reliable electrical systems under the dynamic load conditions. The surface temperature of heterogeneous ceramic-polymer encapsulated conductor is 17.8 °C lower than that of polymer-encapsulated conductor at the same electrical load. Consequently, the findings shown here hold great promises for directing heat extraction in electrical machine systems, advancing thermal management for emerging electronic applications.

36 MATERIALS SCIENCE↗

Dimer rattling mode induced low thermal conductivity in an excellent acoustic conductor

A solid with larger sound speeds usually exhibits higher lattice thermal conductivity. Here, we report an exception that CuP2 has a quite large mean sound speed of 4155 m s –1 , comparable to GaAs, but single crystals show very low lattice thermal conductivity of about 4 W m –1 K –1 at room temperature, one order of magnitude smaller than GaAs. To understand such a puzzling thermal transport behavior, we have thoroughly investigated the atomic structures and lattice dynamics by combining neutron scattering techniques with first-principles simulations. This compound crystallizes in a layered structure where Cu atoms forming dimers are sandwiched in between P atomic networks. In this work, we reveal that Cu atomic dimers vibrate as a rattling mode with frequency around 11 meV, which is manifested to be remarkably anharmonic and strongly scatters acoustic phonons to achieve the low lattice thermal conductivity.

36 MATERIALS SCIENCE↗

In Situ Observation of Ion Migration in a Ferroelectric Ionic Conductor Rb-KTP during Thermal Annealing

Ion exchange in Rb-doped KTiOPO 4 has facilitated significant advancements in ferroelectric domain engineering, yet understanding the underlying mechanisms remains in its infancy. We perform time-of-flight secondary ion mass spectrometry analysis on multiple periodically ion-exchanged and periodically poled Rb-doped KTiOPO 4 samples under different temperatures and annealing durations. The results are compared between annealing in air, which involved ex situ annealing before periodic poling, and vacuum annealing conducted in situ after periodic poling. The Rb + diffusion profile after periodic ion exchange forms a tooth-shaped pattern. We show that in situ annealing causes a surface pinning effect on the nonpolar face, limiting Rb + migration along the polar axis at the surface. Once the pinned layer is removed through milling, the underlying Rb + diffusion is distinctively different from the surface. Additionally, the rate of Rb + diffusion during in situ annealing is linear, while the periodic domain structures remain stable after annealing. These results contribute to understanding the ionic diffusion process in a ferroelectric ionic conductor and using ion exchange to tailor the linear and nonlinear properties of KTiOPO 4 .

36 MATERIALS SCIENCE↗

A round bobbin critical current measurement and thermal runaway simulation of REBCO coated conductors

A round bobbin test has been widely used to measure critical current Ic of practical superconductors including Nb–Ti, Nb3Sn, and Bi-2212 round strands at 4.2 K and in high magnetic fields but rarely used for rare earth-barium-copper-oxide (REBCO) coated conductor tapes. Here, we applies this method to REBCO tapes and test their Ic at 77 K, self-field, and 4.2 K with a magnetic field of 14 T applied parallel to the tape. The sample carries very high current densities; it is 1.3 m long and has a dense array of voltage taps that allows probing localized thermal runaways and correlation with Ic variations along the length. At 77 K, the Ic values of all sections were measured and found to be rather uniform. However, at 4.2 K, we found that a 3 cm section has 90% of the overall voltage drop and it went into thermal runaways upon further increasing current. Thus, at 4.2 K, we were prevented by localized thermal runaways and unable to determine Ic of most of the REBCO conductor sections; this behavior is different from Bi-2212 and Bi-2223 for which Ic of all turns of a round barrel sample can be determined. We simulate REBCO tapes during current ramping to a thermal runaway and analyze impacts of various factors including cooling, conductor n-values, and thickness of stabilizer on the thermal runaway current Iq. The combined experiments and simulations identify n-value as a crucial factor that leads to the observed differences between Bi-2212 and REBCO. Together with cooling and the standard deviation of Ic variations along the length, the n-value determines whether Iq is above or below the average Ic of a long piece of conductor and their ratio Iq/Ic,ave, greatly affecting quench detection and thermal runaway prevention strategies of Bi-2212 and REBCO magnets.

Mosat, Marek↗

Sequential Doping of Ladder-Type Conjugated Polymers for Thermally Stable n-Type Organic Conductors

Doping of organic semiconductors is a powerful tool to optimize the performance of various organic (opto)electronic and bioelectronic devices. Despite recent advances, the low thermal stability of the electronic properties of doped polymers still represents a significant obstacle to implementing these materials into practical applications. Hence, the development of conducting doped polymers with excellent long-term stability at elevated temperatures is highly desirable. Here, we report on the sequential doping of the ladder-type polymer poly(benzimidazobenzophenanthroline) (BBL) with a benzimidazole-based dopant (i.e., N-DMBI). By combining electrical, UV–vis/infrared, X-ray diffraction, and electron paramagnetic resonance measurements, we quantitatively characterized the conductivity, Seebeck coefficient, spin density, and microstructure of the sequentially doped polymer films as a function of the thermal annealing temperature. Importantly, we observed that the electrical conductivity of N-DMBI-doped BBL remains unchanged even after 20 h of heating at 190 °C. This finding is remarkable and of particular interest for organic thermoelectrics.

36 MATERIALS SCIENCE↗

Degradation of REBCO coated conductors due to a combination of epoxy impregnation, thermal cycles, and quench: Characteristics and a method of alleviation

REBa2Cu3Ox (REBCO) coated conductors are an enabling technology for >1 GHz nuclear magnetic resonance spectrometers that need >23.5 T solenoids, compact high-field fusion reactors beyond the International Thermonuclear Experimental Reactor, and 20 T class accelerator magnets. An in-depth understanding of stress and strain management is critically needed for these applications. Here, we report experimental data and an analysis of damages of REBCO-coated conductors in several scenarios relevant for their applications in high-field magnets and unique to their multi-layer thin film structure. The examined scenarios include failure induced by quench, failure induced by epoxy impregnation, and failure induced by a combination of epoxy impregnation and quench. The root cause is film blistering and peeling induced by thermally interfacial stresses characteristic of multilayered heteroepitaxial thin film structures on thick substrates utilized. The quantitative stress analysis is introduced using simple and easy to use formulas and clearly indicates how materials and structural characteristics affect the magnitude and the distribution of stresses and deflections. Finally, a simple method is introduced for removing degradation of REBCO coated conductors due to epoxy impregnation. Our data and analysis help our understanding of the practical limit of REBCO-coated conductors and can be utilized as a guidance for the physical design of REBCO coated conductors and high-current cables assembled from them and for minimizing damages.

Yin, Shijian (ORCID:0000000224312274)↗