Search NASA⌕ Search

SEARCH · Search NASA

Results for “THERMAL STRESSES”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records

Buckling of Two-Dimensional Covalent Organic Frameworks under Thermal Stress

Two-dimensional covalent organic frameworks (2D COFs) are periodic, permanently porous, and lightweight solids that are polymerized from topologically designed monomers. The predictable design and structural modularity of these materials make them promising candidates for applications including catalysis, environmental remediation, chemical separations, and organic electronics, many of which will require stability to mechanical and thermal stress. Based on their reinforced structures and high degradation temperatures, as determined by thermal gravimetric analysis (TGA), many reports have claimed that COFs have excellent thermal stability. However, their stability to heat and pressure has not been probed using methods that report on structural changes rather than the loss of volatile compounds. Here, we explore two structurally analogous 2D COFs with different polymerization chemistries using in operando X-ray diffraction (XRD), which demonstrates the loss of crystallinity at lower temperatures than the degradation temperatures measured by TGA. Density functional theory calculations suggest that an asymmetric buckling of the COF lattice is responsible for the observed loss of crystallinity. In addition to their thermal stability, XRD of the 2D COFs under gas pressures up to 100 bar showed no loss in crystallinity or structural changes, indicating that these materials are robust to mechanical stress by applied pressure. We expect that these results will encourage further exploration of COF stability as a function of framework design and isolated form, which will guide the design of frameworks that withstand demanding application-relevant conditions.

Evans, Austin↗

Thermal Stress Awareness, Self-Study #18649

Thermal stresses can expose individuals to a variety of health hazards at work, home, and play. Every year thermal stresses cause severe injuries and death to a large range of people, from elderly people in cities during summer heat waves to young people engaged in winter mountaineering. Awareness is the key to preventing the health hazards associated with thermal stresses. This course is designed for personnel at Los Alamos National Laboratory (LANL). It addresses both heat and cold stresses and discusses their factors, signs and symptoms, treatments, and controls.

54 ENVIRONMENTAL SCIENCES↗

A Study of Temperature Distribution and Thermal Stresses in a Hot Rock Due to Rapid Cooling

Thermal stresses may be induced in a hot dry rock when a cold fluid is injected in the well. To study this problem, we look at the thermoelastic response of a hot rock that is suddenly cooled. The cooling is assumed to be either at a constant temperature or at a constant heat flux per unit depth. Our approach is to nondimensionalize the equations and perform a parametric study and look at the temperature distribution and the induced-thermal stresses. The results indicate that depending on the extent of cooling and the cooling time, thermal stresses can be induced. Numerical simulations on sandstone, with an initial uniform temperature of 473 K, are also carried out. The results show that if the cooling is due to the surface temperature maintained at 463 K (10 °C lower than the initial temperature of the hot rock), thermal stresses that are larger than the rock tensile strength could be induced. When the cooling is due to a constant surface heat flux, this temperature can be reached after about 777 days of cooling with a minimum value of a heat flux of -20 W/m.

Tran, Phuoc↗

THERMAL STRESS ANALYSIS OF A SPENT NUCLEAR FUEL CANISTER

The potential for chloride induced stress corrosion cracking (CISCC) in spent nuclear fuel dry storage canisters is a current topic of research by the US Department of Energy Spent Fuel and Waste Science and Technology program. One of the important prerequisites for CISCC is a tensile residual stress state. This study utilizes computational models to provide an initial analysis of thermal stresses in a generic spent nuclear fuel canister. A STAR-CCM+ thermal fluid model provides a temperature profile analysis of the canister based on four different ambient temperature conditions. An ANSYS APDL finite element model incorporates the temperature profiles to analyze the thermal stresses in the canister. The calculated thermal stress magnitudes are in the range of 10 MPa to 80 MPa, which could be significant for crack propagation through the canister wall. The maximum thermal stress is not a concern for the structural failure of the canister, but it is high enough that it is a significant contribution to the total stress state of the canister wall, which also includes residual stress from fabrication, internal pressure from helium cover gas, and potential transient mechanical loads, such as earthquakes. This paper describes the initial finite element thermal stress analysis that was completed in 2020, reports the initial findings, and identifies areas where model refinement is still needed to complete this work in the future.

Jensen, Ben J.↗

CODE-TO-CODE BENCHMARK STUDY FOR THERMAL STRESS MODELING AND PRELIMINARY ANALYSIS OF THE HIGH-TEMPERATURE SINGLE HEAT PIPE EXPERIMENT

Microreactors are very small nuclear reactors with typical thermal-energy output of up to 20 MWth. The microreactor concept is gaining more and more attention for safe, robust, and reliable supply of electricity for remote locations and to meet industrial process heat needs. Heat-pipe-cooled microreactor is one of the microreactors being investigated at Idaho National Laboratory. In the heat-pipe-cooled microreactor, heat pipes remove heat from the reactor core as a passive heat-transfer device, so the fluid circulation is not required for cooling, which can substantially simplify the overall reactor design. However, given the extremely high temperatures in the core region and potentially large temperature gradients across the structure materials, thermal stresses need to be well-analyzed to ensure structural integrity during normal operations and accident scenarios for the heat-pipe-cooled microreactor designs. This paper discusses finite element method-based thermal-stress analysis for the high-temperature single heat-pipe test article in the Single Primary Heat Extraction and Removal Emulator (SPHERE) facility at Idaho National Laboratory, using two commercial software packages, Abaqus and STAR-CCM+. A code-to-code benchmark study was performed to crosscheck the model setup and capability of each code and to gain insights into the potential thermal stress concerns from the current experimental setup. It is observed the significant thermal stresses happen at the locations where the largest temperature gradients appeared between heat pipe and electric heater. The temperature fields have good agreements between Abaqus and STAR-CCM+, while the induced thermal stresses show modest deviations probably due to differences of meshing engines used in these two codes.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

[Presentation Slides] Code-to-Code Benchmark Study for Thermal Stress Modeling and Preliminary Analysis of the High-temperature Single Heat-Pipe Experiment

In the heat-pipe-cooled microreactor, heat pipes remove heat from the reactor core as a passive heat-transfer device, so the fluid circulation is not required for cooling, which can substantially simplify the overall reactor design. However, given the extremely high temperatures in the core region and potentially large temperature gradients across the structure materials, thermal stresses need to be well-analyzed to ensure structural integrity during normal operations and accident scenarios. This presentation slides discuss finite element method-based thermal-stress analysis for the high-temperature single heat-pipe test article in the Single Primary Heat Extraction and Removal Emulator (SPHERE) facility at Idaho National Laboratory (INL), using two commercial software packages, Abaqus and Star-CCM+. A code-to-code benchmark study was performed to crosscheck the model setup and capability of each code and to gain preliminary insights into the potential thermal stress concerns from the current experimental setup. It is observed the significant thermal stresses happen at the inner surface of the heat pipe hole surrounded by electric heaters where the largest temperature gradients appear. The temperature fields have good agreements between Abaqus and Star-CCM+, while the induced thermal stresses show modest deviations probably due to differences of meshing engines used in these two codes. It is found that the local maximum thermal stresses may reach close to the ultimate tensile strength and yield strength of structural material depending on the heater power. Ultimately, the coupled thermal-structural analysis will help guide the current experimental plan and ensure the facility safety for future experimental study.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

Impact of thermal stress on the piezoelectric and dielectric properties of PbTiO{sub 3} thick films on various substrates

The impact of thermal stress on the polarization, as well as dielectric and piezoelectric properties of (001) oriented PbTiO{sub 3} (PTO) thick films deposited on various substrates was investigated based on Landau-Devonshire thermodynamic model. The results showed that dielectric and piezoelectric properties of PTO films depend strongly on the thermal stress in PTO films decided by the deposition temperature T{sub G} and the thermal expansion coefficients' difference between PTO films and substrates. For IC-compatible substrates such as Si, c-sapphire, and a-sapphire that induce tensile in-plane thermal stresses, the dielectric and piezoelectric responses and tunabilities of PTO films were enhanced. Whereas for PTO films on MgO, compressive thermal in-plane stresses can degraded the dielectric and piezoelectric responses and tunabilities of the films.

36 MATERIALS SCIENCE↗

Thermal stress in degraded forests in the Brazilian Amazon Arc of Deforestation

Understanding thermal stress in tropical forests has taken on new urgency in light of accelerating climate change and expansion of deforestation and forest degradation. Degraded tropical forests in particular may be approaching critical temperature thresholds even more rapidly than intact forests, with implications for tree survival and ecosystem recovery. We investigate thermal stress in degraded tropical forests within the Brazilian Amazon Arc of Deforestation. Using land surface temperature data from the ECOsystem Spaceborne Thermal Radiometer Experiment on the international Space Station (ECOSTRESS), we compared canopy temperatures of intact, selectively logged, and burned forests in Feliz Natal, Mato Grosso, Brazil. Upper canopy temperatures in previously burned forests were 4.1% higher (mean = 36.5 °C) and 50.9% more variable compared to intact and logged forests, which showed remarkably similar temperature distributions (means of 34.9 °C and 35.1 °C, respectively). Modeled leaf temperature distributions based on canopy temperature measurements from one of the warmest days in a 2 year dry season record indicated that 87% of leaves in the warmest burned forest patches exceeded the temperature threshold where respiration surpasses photosynthesis, compared to approximately 72%–74% in intact and logged forests, respectively, in the same time period. After controlling for environmental factors, burned forests were predicted to be 2.6 °C warmer on average [1.39 °C–3.96 °C, 95% credible interval] than intact forests across a 5–40 m canopy height range. Burned forests showed modest thermal recovery over time, with temperatures decreasing by approximately 1.2 °C over a 30 year recovery period. In contrast, logged forests showed minimal thermal differences from intact forests (−0.353 on average, [−1.125–0.274, 95% credible interval]) and negligible change (0.15 °C) over the same timeframe. While the absolute probabilities of exceeding damaging thermal thresholds remain low across all forest types under current climate conditions, the probability of leaves exceeding temperatures that cause permanent leaf damage was ten times higher in burned forests, with implications for the future of burned forest regeneration in water-limited regions of the Amazon basin. In particular, the combination of higher mean temperatures, greater temperature variability, and more frequent exposure to damaging thermal thresholds implies that burned tropical forests will experience substantially higher mortality rates and slower biomass recovery compared to intact and selectively logged forests, especially in water-limited regions where trees cannot rely on evaporative cooling to moderate canopy temperatures.

Brazilian Amazon Arc of Deforestation↗

RF, Disruption, and Thermal Stress Analyses of EAST I and B Port Antennas

Chinese Academy of Sciences Institute of Plasma Physics and Massachusetts Institute of Technology Plasma Science and Fusion Center have been collaborating on experimental advanced superconducting tokamak (EAST). Presented in this paper are RF, disruption, and thermal stress analyses of EAST antennas. Analyzed are I port four-strap and B port 2 × 2 strap antennas, which are currently installed on EAST. As for RF analysis, scattering parameters are checked to make sure that the antennas are loaded, and then electric field parallel to magnetic field are checked to find out if they are below the permissible level. As for disruption analysis, mechanical stresses for both straps with the support box and Faraday screen are obtained. As for thermal stress analysis, temperature and thermal stress for a typical strap and a Faraday tube were presented. Furthermore, all analyses were performed by COMSOL commercial finite-element analysis software package version 5 or 5.2.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Influence of quenching agent on microstructure, properties and thermal stress of SiC{sub p}/2009 composites

15% vol. SiC{sub p}/2009 composites prepared by powder metallurgy were quenched in room temperature water and 20% polyethylene glycol (PEG) solution respectively, then aged naturally. The influence of quenching agent on microstructure, properties and thermal stress of SiC{sub p}/2009 composites were investigated by means of scanning/transmission electron microscope, hardness and tensile test. The results showed that the number of precipitated phase in water quenched composites increased, with much finer in size and more homogeneous in distribution compared with 20% PEG quenched one. Meanwhile, the density of dislocation in composites by water quenching was also much higher. Intergranular corrosion did not occur with the two quenching agents. The 20% PEG quenched composites exhibited slight lower hardness and higher electrical conductivity than that of water quenched one. The two quenched composites showed same level in tensile strength, but the yield strength of water-quenched composites was higher (8 MPa, 3%). The usage of 20% PEG reduced thermal stress and minimized warping deformation of the parts, it is a more suitable quenching agent for SiC{sub p}/2009 composites in engineering application fields. - Highlights: •SiC{sub p}/2009 composites quenched by water and 20% PEG solution were investigated. •Aging precipitation behavior of SiC{sub p}/2009 composites is sensitive to quenchant. •Influence of quenching agent on properties of SiC{sub p}/2009 composites are minimal. •Quenching with 20% PEG reduces thermal stress of SiC{sub p}/2009 composites remarkably. •20% PEG is a more suitable quenching agent for SiC{sub p}/2009 composites than water.

36 MATERIALS SCIENCE↗

Thermal Stress Modeling and Analysis of Packed-bed Thermocline Energy Storage Tank for INL Thermal Energy Distribution System (TEDS)

The Thermal Energy Distribution System (TEDS) at Idaho National Laboratory (INL) is a thermal-hydraulic flow loop to support the integration of co-located multiple experimental systems, where a packed-bed thermal energy storage (TES) is installed as a thermal buffer and storage unit for TEDS. The packed-bed TES is adopted in TEDS because of its benefit as a low-cost single-tank storage option compared to the traditional two-tank storage. However, thermal ratcheting is one potential design concern which is caused by the rearrangement of granular filler inside a packed-bed tank during continuous thermal cycling operation of the packed-bed TES tank. If the thermally induced stress exceeds yield strength of the tank wall, it may cause catastrophic consequences like rupture of the thermal storage tank. Thus, it is crucial to understand the phenomenon to ensure the robust operation. Based on the temperature boundary conditions given by transient thermal analyses with computational fluid dynamics (CFD) simulations, the thermal ratcheting analysis is then conducted to evaluate the hoop stress and resultant thermal ratcheting potential of the TES tanks with two different modeling approaches: (1) infinite rigidity model and (2) Drucker-Prager (DP) model. The validity of each modeling method was examined by comparing the numerical simulation with the experimental data obtained from the packed-bed TES tank for Solar One Plant and evaluate the thermal ratcheting potential of the TEDS TES tank.

25 ENERGY STORAGE↗

Thermal Stress Reduction in Power Switching Devices Using Distributed Loss PWM Concept for Current Source Inverters

A new modulation scheme is proposed for current source inverters (CSIs) that reduces the variation and peak junction temperature in the CSIs' power devices. The distributed loss pulse-width modulation (DLM) concept is introduced and applied to traditional space vector modulation methods to develop modified modulation schemes that reduce the thermal stress on power devices. The device junction temperatures resulting from conventional and DLM schemes are compared. Simulation and experimental results confirm that the proposed DLM concept reduces thermal stress on the devices while maintaining the same high output current waveform quality compared to traditional CSI modulation schemes. The CSI power device lifetime (i.e., the number of cycles to failure) are estimated using the simulation and experimental results. The proposed DLM significantly increases the device lifetime (by 5 to 6 times) by reducing the junction temperature variation compared to the conventional modulations.

42 ENGINEERING↗

Direct and Inverse Problems of Thermomechanics Concerning the Optimization and Identification of the Thermal Stressed State of Deformed Solids

We describe the main stages of the development of investigations originated by Prof. Vihak in the fields of the theory and methods of optimal control over the thermal processes and thermal stressed state of deformed solids, theory of inverse problems of heat conduction and thermomechanics, and the mathematical methods in the mechanics of deformable solids. We indicate the existence of close relationship between the obtained theoretical results and the applied problems of thermal power engineering motivating investigations of this kind. We describe a significant contribution made by the researchers of the Pidstryhach Institute for Applied Problems in Mechanics and Mathematics of the Ukrainian National Academy of Sciences to the development of investigations in these fields. The prospects of further development of these studies are analyzed and some facts from the life and creative activity of Prof. V. М. Vihak are presented.

42 ENGINEERING↗

Transient thermal stress wave and vibrational analyses of a thin diamond crystal for X-ray free-electron lasers under high-repetition-rate operation

High-brightness X-ray free-electron lasers (FELs) are perceived as fourth-generation light sources providing unprecedented capabilities for frontier scientific researches in many fields. Thin crystals are important to generate coherent seeds in the self-seeding configuration, provide precise spectral measurements, and split X-ray FEL pulses, etc . In all of these applications a high-intensity X-ray FEL pulse impinges on the thin crystal and deposits a certain amount of heat load, potentially impairing the performance. In the present paper, transient thermal stress wave and vibrational analyses as well as transient thermal analysis are carried out to address the thermomechanical issues for thin diamond crystals, especially under high-repetition-rate operation of an X-ray FEL. The material properties at elevated temperatures are considered. It is shown that, for a typical FEL pulse depositing tens of microjoules energy over a spot of tens of micrometers in radius, the stress wave emission is completed on the tens of nanoseconds scale. The amount of kinetic energy converted from a FEL pulse can reach up to ~10 nJ depending on the layer thickness. Natural frequencies of a diamond plate are also computed. The potential vibrational amplitude is estimated as a function of frequency. Here, due to the decreasing heat conductivity with increasing temperature, a runaway temperature rise is predicted for high repetition rates where the temperature rises abruptly after ratcheting up to a point of trivial heat damping rate relative to heat deposition rate.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Impact of Thermal Stress on Attachment and Stability of High Temperature Strain Sensors

Static and dynamic strain sensing is required in high-temperature (HT), harsh-environments (HE) for industrial, aerospace, and energy sector applications to ensure equipment and process safety, reduce the cost of operation and maintenance, and increase process efficiency. Challenges that arise in HT HE sensing applications include device mounting, packaging, integrity, and stability to HT HE conditions. In previously reported work, static and dynamic strain surface acoustic wave resonator (SAWR) sensors were fabricated on langasite (LGS) and mounted on Inconel 625 strain beams for wireless testing up to 400°C. In this work, it has been identified that after subjecting the mounted SAWR strain sensor to thermal cycling between 100°C and 425°C, the measured sensitivity to dynamic strain decreased by 73% due to cracking at the adhesive/LGS interface, further deteriorating after additional thermal cycles. Strain modeling of the mounted LGS sensor chip up to 400°C revealed the existence of concentrated strain at the borders of the LGS chip. Microcracks caused by dicing make the chip boarders the most susceptible location for cracks to initiate when the sensor is subjected to thermal stress. In an attempt to mitigate the high strain at the LGS chip borders due to heating, adhesive shaping is proposed in this work. Simulations indicate a strain reduction of 50% at the border is achieved using both circular and triangular adhesive shapes, while also reducing the maximum strain over the entire adhesive/LGS interface by around 30%. Furthermore, the technique is thus promising for improving the integrity, reliability, and stability of static and dynamic strain sensors, particularly while operating under HT HE with several hundreddegree Celsius temperature excursions.

47 OTHER INSTRUMENTATION↗

Thermal Stress in HFEF Hot Cell Windows Due to an In-Cell Metal Fire

This work investigates an accident during the pyrochemical extraction of Uranium and Plutonium from PWR spent fuel in an argon atmosphere hot cell. In the accident, the heavy metals (U and Pu) being extracted are accidentally exposed to air from a leaky instrument penetration which goes through the cell walls. The extracted pin size pieces of U and Pu metal readily burn when exposed to air. Technicians perform the electrochemical extraction using manipulators through a 4 foot thick hot cell concrete wall which protects them from the radioactivity of the spent fuel. Four foot thick windows placed in the wall allow the technicians to visually control the manipulators. These windows would be exposed to the heat of the metal fire. As a result, this analysis determines if the thermal stress caused by the fire would crack the windows and if the heat would degrade the window seals allowing radioactivity to escape from the cell.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Destructive Behavior, Judgment, and Economic Decision-Making Under Thermal Stress

Accumulating evidence indicates that environmental temperature substantially affects economic outcomes and violence, but the reasons for this linkage are not well understood. We systematically evaluate the effect of thermal stress on multiple dimensions of economic decisionmaking, judgment, and destructive behavior with 2,000 participants in Kenya and the US who were randomly assigned to different temperatures in a laboratory. We find that most dimensions of decision-making are unaffected by temperature. However, heat causes individuals to voluntarily destroy other participants’ assets, with more pronounced effects during a period of heightened political conflict in Kenya.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗

Coupled thermal stress simulations of ductile tearing

Predictions for ductile tearing of a geometrically complex Ti-6Al-4V plate were generated using a Unified Creep Plasticity Damage model in fully coupled thermal stress simulations. Uniaxial tension and butterfly shear tests performed at displacement rates of 0.0254 and 25.4 mm/s were also simulated. Results from these simulations revealed that the material temperature increase due to plastic work can have a dramatic effect on material ductility predictions in materials that exhibit little strain hardening. Furthermore, this occurs because the temperature increase causes the apparent hardening of the material to decrease which leads to the initiation of deformation localization and subsequent ductile tearing earlier in the loading process.

36 MATERIALS SCIENCE↗