Temperature Qualification Device Conceptual Design
This powerpoint is documenting the conceptual design of the Temperature Qualification Device (TQD) as developed under the the Advanced Sensors and Instrumentation (ASI) program.
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Laboratory Testing of the Temperature Sensor Qualification Device
The Temperature sensor Qualification Device (TQD) has been developed and tested under laboratory conditions to evaluate its thermal performance and the reliability of its retractable sensor system. The TQD is designed to provide an isothermal environment for temperature sensors in both test and reference zones during irradiation experiments. Initial testing revealed minimal radial and azimuthal temperature variations but identified a significant axial gradient. To address this, design modifications were implemented, including enhanced insulation and the addition of a small heater at the device's top. These changes are expected to produce a more uniform axial temperature profile, though further testing is recommended prior to irradiation. The retractable sensor mechanism was rigorously tested, achieving 1,350 cycles at room temperature and 332 cycles at 400°C before failure. The primary failure mechanism was the thermocouple becoming stuck in the wire guide or capillary tube. Based on these results, design improvements were proposed, such as incorporating a load cell for force monitoring and a stepper motor for precise sensor positioning.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
Sensor Qualification for the Development of Advanced Reactors
A temperature sensor qualification device is undergoing development and testing in order to qualify temperature sensors for advanced reactor metrology applications. This device will provide National Institute of Standards and Technology (NIST) traceable performance testing of temperature sensors while under the high radiation environments experienced while in-core. This is completed by utilizing retractable sensors which transfer the measurements from ex-core to in-core sensors. A detailed discussion of the uncertainty propagation associated with this comparative process is provided. Experimental testing of the temperature distribution occurring in the device has begun and is reported on. It is pertinent to minimize this temperature distribution to prevent variation in sensor measurements. This variation will be indistinguishable from sensor drift for in-pile applications and would result in unnecessarily conservative uncertainty bounds.
46 - INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AN↗
Design, Qualification and Integration Testing of the High-Temperature Resistance Temperature Device for Stirling Power System
The Advanced Stirling Radioisotope Generator (ASRG), developed from 2006 to 2013 under the joint sponsorship of the United States Department of Energy (DOE) and National Aeronautics and Space Administration (NASA) to provide a high-efficiency power system for future deep space missions, employed Sunpower Incorporated's Advanced Stirling Convertors (ASCs) with operating temperature up to 840 C. High-temperature operation was made possible by advanced heater head materials developed to increase reliability and thermal-to-mechanical conversion efficiency. During a mission, it is desirable to monitor the Stirling hot-end temperature as a measure of convertor health status and assist in making appropriate operating parameter adjustments to maintain the desired hot-end temperature as the radioisotope fuel decays. To facilitate these operations, a Resistance Temperature Device (RTD) that is capable of high-temperature, continuous long-life service was designed, developed and qualified for use in the ASRG. A thermal bridge was also implemented to reduce the RTD temperature exposure while still allowing an accurate projection of the ASC hot-end temperature. NASA integrated two flight-design RTDs on the ASCs and assembled into the high-fidelity Engineering Unit, the ASRG EU2, at Glenn Research Center (GRC) for extended operation and system characterization. This paper presents the design implementation and qualification of the RTD, and its performance characteristics and calibration in the ASRG EU2 testing.
Deep Space↗
Thermal Performance of Neutron Sensor Qualification Device
The neutron sensor qualification device was developed to provide a temperature-controlled environment for neutron sensors and dosimetry, enabling irradiation in a neutron field at the Armed Forces Radiobiology Research Institute (AFRRI) TRIGA reactor facility. The device, constructed from low-activation and low neutron cross-section materials, features a modular tube furnace design with three independently controlled heating zones for controlling axial temperature distribution. Laboratory testing validated the device's thermal performance, including uniform temperature distribution with less than 6°C variation across the central region, a steady-state operational temperature of 350°C achieved in approximately 3 hours, and a cooling time constant of 3.5 hours. External surface temperatures remained safe for handling, with the surrounding aluminum structure remaining at ambient conditions. The results confirm the device’s suitability for neutron sensor qualification experiments, with potential for future operation at higher temperatures and further optimization of performance.
46 - INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AN↗
Conceptual Design of Neutron Sensor Qualification Device
The Advanced Sensors and Instrumentation Program at Idaho National Laboratory has been formulating strategies to qualify sensors for use in nuclear environments, particularly in irradiation experiments and advanced reactors. When qualifying neutron sensors for use in high-temperature environments, the wide range of neutron flux levels and representative energy spectra presents significant challenges. This paper discusses the development of the Neutron Sensor Qualification Device (NQD), which is designed to test neutron sensors in high temperature controlled environments with known neutron spectra, addressing the spatial and spectral complexities of neutron fluxes in reactor cores. The proposed NQD will be situated in the exposure room at the Armed Forces Radiobiology Research Institute, thus affording a unique capability to expose sensors to high neutron and gamma fluxes. To achieve thermal control, the device will utilize a radiation-hardened tube furnace, accommodating multiple sensors and neutron activation dosimetry wires. Titanium, iron, and cobalt dosimeter wires are chosen from the American Society for Testing and Materials and International Reactor Dosimetry and Fusion File libraries as references for providing energy-dependent fluence measurements. The design ensures precise sensor positioning to minimize mutual shielding and flux perturbation, which are evaluated via Monte Carlo N particle Transport Code (MCNP) simulations. These simulations have informed the development of guidelines on sensor placement within the NQD. The NQD is essential to the qualification of neutron sensors for advanced reactor technologies. It enables controlled testing of a statistically significant number of sensors, thereby supporting assessments of sensor performance across various neutron flux levels and temperatures. This paper highlights the detailed planning for the NQD prototype, along with its inaugural irradiation (scheduled for fiscal year [FY] 2025). The results from this initial testing will be fundamental in evaluating the device’s performance and establishing measurement uncertainty for in-pile neutron sensor measurements.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
The high temperature superconductivity space experiment
The history and the current status of the high temperature superconductivity space experiment (HTSSE) initiated in 1988 are briefly reviewed. The goal of the HTSSE program is to demonstrate the feasibility of incorporating high temperature superconductivity (HTS) technology into space systems. The anticipated payoffs include the development of high temperature superconductor devices for space systems; preparation and space qualification of a cryogenically cooled experimental package containing HTS devices and components; and acquisition of data for future space experiments using more complex HTS devices and subsystems. The principal HTSSE systems and devices are described.
Webb, Denis C.↗
What Reliability Engineers Should Know about Space Radiation Effects
Space radiation in space systems present unique failure modes and considerations for reliability engineers. Radiation effects is not a one size fits all field. Threat conditions that must be addressed for a given mission depend on the mission orbital profile, the technologies of parts used in critical functions and on application considerations, such as supply voltages, temperature, duty cycle, and redundancy. In general, the threats that must be addressed are of two types-the cumulative degradation mechanisms of total ionizing dose (TID) and displacement damage (DD). and the prompt responses of components to ionizing particles (protons and heavy ions) falling under the heading of single-event effects. Generally degradation mechanisms behave like wear-out mechanisms on any active components in a system: Total Ionizing Dose (TID) and Displacement Damage: (1) TID affects all active devices over time. Devices can fail either because of parametric shifts that prevent the device from fulfilling its application or due to device failures where the device stops functioning altogether. Since this failure mode varies from part to part and lot to lot, lot qualification testing with sufficient statistics is vital. Displacement damage failures are caused by the displacement of semiconductor atoms from their lattice positions. As with TID, failures can be either parametric or catastrophic, although parametric degradation is more common for displacement damage. Lot testing is critical not just to assure proper device fi.mctionality throughout the mission. It can also suggest remediation strategies when a device fails. This paper will look at these effects on a variety of devices in a variety of applications. This paper will look at these effects on a variety of devices in a variety of applications. (2) On the NEAR mission a functional failure was traced to a PIN diode failure caused by TID induced high leakage currents. NEAR was able to recover from the failure by reversing the current of a nearby Thermal Electric Cooler (turning the TEC into a heater). The elevated temperature caused the PIN diode to anneal and the device to recover. It was by lot qualification testing that NEAR knew the diode would recover when annealed. This paper will look at these effects on a variety of devices in a variety of applications. Single Event Effects (SEE): (1) In contrast to TID and displacement damage, Single Event Effects (SEE) resemble random failures. SEE modes can range from changes in device logic (single-event upset, or SEU). temporary disturbances (single-event transient) to catastrophic effects such as the destructive SEE modes, single-event latchup (SEL). single-event gate rupture (SEGR) and single-event burnout (SEB) (2) The consequences of nondestructive SEE modes such as SEU and SET depend critically on their application--and may range from trivial nuisance errors to catastrophic loss of mission. It is critical not just to ensure that potentially susceptible devices are well characterized for their susceptibility, but also to work with design engineers to understand the implications of each error mode. -For destructive SEE, the predominant risk mitigation strategy is to avoid susceptible parts, or if that is not possible. to avoid conditions under which the part may be susceptible. Destructive SEE mechanisms are often not well understood, and testing is slow and expensive, making rate prediction very challenging. (3) Because the consequences of radiation failure and degradation modes depend so critically on the application as well as the component technology, it is essential that radiation, component. design and system engineers work togetherpreferably starting early in the program to ensure critical applications are addressed in time to optimize the probability of mission success.
DiBari, Rebecca↗
Qualification of Engineering Camera for Long-Duration Deep Space Missions
Qualification and verification of advanced electronic packaging and interconnect technologies, and various other types of hardware elements for the Mars Exploration Rover s Spirit and Opportunity (MER)/Mars Science Laboratory (MSL) flight projects, has been performed to enhance the mission assurance. The qualification of hardware (engineering camera) under extreme cold temperatures has been performed with reference to various Mars-related project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times the total number of expected diurnal temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware, including all relevant manufacturing, ground operations, and mission phases. Qualification has been performed by subjecting above flight-like hardware to the environmental temperature extremes, and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Engineering camera packaging designs, charge-coupled devices (CCDs), and temperature sensors were successfully qualified for MER and MSL per JPL design principles. Package failures were observed during qualification processes and the package redesigns were then made to enhance the reliability and subsequent mission assurance. These results show the technology certainly is promising for MSL, and especially for longterm extreme temperature missions to the extreme temperature conditions. The engineering camera has been completely qualified for the MSL project, with the proven ability to survive on Mars for 2010 sols, or 670 sols times three. Finally, the camera continued to be functional, even after 2010 thermal cycles.
Ramesham, Rajeshuni↗
Qualification test results for blue-red reflecting solar covers
Recent market forces and design innovations have spurred the development of solar cell covers that significantly reduce the solar absorptance for a cell array. GaAs cells, using Ge as the substrate host material, can have a significantly higher output if the solar absorptance of the cell array is reduced. New optical coating design techniques have allowed the construction of covers that reflect the ultraviolet energy (below 350 nm) and the near infrared energy (above 900 nm) resulting in the beneficial reduction in absorptance. Recent modeling suggests three or more present output increase due to the lowered temperature with such a device. Within the last several months we have completed the testing of production samples of these new covers in a qualification series that included the usual environmental effects associated with the routine testing of solar cell covers and the combined effects of protons, electrons and solar UV as would be encountered in space. For the combined effects testing the samples were exposed to 300 sun days equivalent UV, 5 x 10(exp 14)/sq cm of 0.5 MeV protons and 10(exp 15)/sq cm of 1.0 MeV electrons. Measurements of the reflectance, transmission, emittance and other appropriate parameters were made before and after the testing. As measured by the averaged transmission over the cell operating band, the change in transmission for the samples was less than or about equal to 1 percent. The details of the testing and the results in terms of transmission, reflectance and emittance are discussed in the paper.
Beauchamp, W. T.↗
High Temperature Devices for Aerospace Applications
This presentation will overview important new capabilities and benefits that next-generation higher temperature electronics promise for a variety of aerospace systems and missions. Initial aerospace infusions of higher temperature electronics to be discussed include jet engines and the prolonged robotic exploration of the Venus surface. Complete redesign of systems compared to prior conventional electronics practices would yield the most revolutionary benefits. However, the inherent higher risk and expense associated with new technology adoption will likely drive a more evolutionary technology infusion process, especially since flight qualification demands large safety margins and testing that ensures reliable operation for far longer than actual mission duration. SiC pn-junction based devices are inherently capable of the most durable operation at the highest application temperatures compared other transistor technologies, but such integrated circuits (ICs) will never achieve integration levels near today’s silicon ICs. Extreme temperature high-power devices will also be de-rated compared to room-temperature performance. While the high temperature market will always be small compared to the conventional temperature mass-market, compatibility and leveraging of existing foundry manufacturing is vital to the establishment of a sustainable high temperature electronics ecosystem sufficient to significantly improve aerospace systems.
High Temperature↗
Reliability of hybrid microcircuit discrete components
Data accumulated during 4 years of research and evaluation of ceramic chip capacitors, ceramic carrier mounted active devices, beam-lead transistors, and chip resistors are presented. Life and temperature coefficient test data, and optical and scanning electron microscope photographs of device failures are presented and the failure modes are described. Particular interest is given to discrete component qualification, power burn-in, and procedures for testing and screening discrete components. Burn-in requirements and test data will be given in support of 100 percent burn-in policy on all NASA flight programs.
Allen, R. V.↗
Screening Metal Halide Perovskite Solar Modules for Premature Field Failures
Developing metal halide perovskite (MHP) photovoltaic (PV) devices into reliable large-area solar modules could accelerate global solar energy deployment. Many MHP devices are susceptible to degradation under light and elevated temperature (LT). Published research on LT testing is limited at the module level, and LT testing has not yet been developed for qualification testing of commercial PV products. This report assesses whether results of LT testing at moderately elevated temperatures correlate with those of field-tested modules from the same batch. Six batches of samples from four manufacturers are assessed. It is shown that modules with a robust package that can maintain over 80% of their peak efficiency during LT testing at 55 °C for 100 h are more likely to retain over 80% of their peak efficiency during outdoor operation for 10 weeks. This finding is a step towards developing a validated test protocol that could be incorporated into a qualification standard for the commercialization of MHP PV technologies.
14 SOLAR ENERGY↗
Applications of Fracture Mechanics to Quantitative Accelerated Life Testing of Plastic Encapsulated Microelectronics
Accelerated testing must address the failure mechanisms active within the devices undergoing tests in order to assess lifetimes in a meaningful way. The assumption of constant temperature, thermally activated lifetime, based upon the Arrhenius assumptions, does not always provide the necessary understanding to interpret accelerated tests in microelectronics. Plastic encapsulants, dielectric polymers, and underfill materials are subject to delamination and cracking with thermal cycling. Crack propagation during use environment exposure, drives the potential for failure of microelectronic devices and is therefore a necessary focal point in qualification and life testing. This paper reviews the available research in the application of fracture mechanics to this class of problems in microelectronics including relevant test data. In addition, useful acceleration factor models are derived for polymer crack propagation based on principles of linear elastic fracture mechanics. Further, a simple approach to estimating the minimum temperature cycling ranges, necessary to propagate a crack, is also presented. Finally, a methodology of applying acceleration factors to develop testing plans is shown, with an example in spaceflight for a cubesat in low Earth orbit. Overall, this is a paper that shows a useful and appropriate process for creating physics of failure based life testing for delamination and cracking failures in microelectronic polymers in a temperature cycling environment.
Accelerated testing↗
Centrifugal regulator for control of deployment rates of deployable elements
The requirements, design, and performance of a centrifugal regulator aimed at limiting deployment rates of deployable elements are discussed. The overall mechanism is comprised of four distinct functional parts in a machined housing: (1) the centrifugal brake device, which checks the payout of a deployment cable; (2) the reducing gear, which produces the spin rate necesary for the braking device; (3) the payout device, which allows the unwinding of the cable; and (4) the locking device, which prevents untimely unwinding. The centrifugal regulator is set into operation by a threshold tension of the cable which unlocks the mechanism and allows unwinding. The pulley of the windout device drives the centrifugal brake with the help of the reducing gear. The centrifugal force pushes aside weights that produce friction of the studs in a cylindrical housing. The mechanism behaved well at qualification temperature and vibrations.
Vermalle, J. C.↗
Space Cryogenic Workshop, 8th, California Institute of Technology, Pasadena, July 31, Aug. 1, 1989, Proceedings
Recent advances in cryogenic technology for space applications are examined in reviews and reports. Topics addressed include very-low-force cooling contacts for the ISO cryostat cover, convective heat flow in space cryogenics plugs, liquid-acquisition devices for superfluid He transfer, and pressure drop in the SHOOT superfluid-He acquisition system. Consideration is given to a liquid-He vibration cryostat for space qualification tests, closed-cycle coolers for temperatures below 30 K, stress analysis down to liquid-He temperature, a cryogenic valve actuator, and a spaceborne He-3 refrigerator. Also discussed are an adiabatic-demagnetization refrigerator for SIRTF, rejection of waste heat from O liquefaction operations at a lunar O production plant, SHOOT flowmeter and pressure transducers, and space qualification of the ISO cryogenic rupture disks.
Source record↗
Techniques for control of long-term reliability of complex integrated circuits. I - Reliability assurance by test vehicle qualification.
Development of an alternate approach to the conventional methods of reliability assurance for large-scale integrated circuits. The product treated is a large-scale T squared L array designed for space applications. The concept used is that of qualification of product by evaluation of the basic processing used in fabricating the product, providing an insight into its potential reliability. Test vehicles are described which enable evaluation of device characteristics, surface condition, and various parameters of the two-level metallization system used. Evaluation of these test vehicles is performed on a lot qualification basis, with the lot consisting of one wafer. Assembled test vehicles are evaluated by high temperature stress at 300 C for short time durations. Stressing at these temperatures provides a rapid method of evaluation and permits a go/no go decision to be made on the wafer lot in a timely fashion.
Van Vonno, N. W.↗
A Spacecraft Housekeeping System-on-Chip in a Radiation Hardened Structured ASIC
Housekeeping systems are essential to health monitoring of spacecraft and instruments. Typically, sensors are distributed across various sub-systems and data is collected using components such as analog-to-digital converters, analog multiplexers and amplifiers. In most cases programmable devices are used to implement the data acquisition control and storage, and the interface to higher level systems. Such discrete implementations require additional size, weight, power and interconnect complexity versus an integrated circuit solution, as well as the qualification of multiple parts. Although commercial devices are readily available, they are not suitable for space applications due the radiation tolerance and qualification requirements. The Housekeeping System-o n-A-Chip (HKSOC) is a low power, radiation hardened integrated solution suitable for spacecraft and instrument control and data collection. A prototype has been designed and includes a wide variety of functions including a 16-channel analog front-end for driving and reading sensors, analog-to-digital and digital-to-analog converters, on-chip temperature sensor, power supply current sense circuits, general purpose comparators and amplifiers, a 32-bit processor, digital I/O, pulse-width modulation (PWM) generators, timers and I2C master and slave serial interfaces. In addition, the device can operate in a bypass mode where the processor is disabled and external logic is used to control the analog and mixed signal functions. The device is suitable for stand-alone or distributed systems where multiple chips can be deployed across different sub-systems as intelligent nodes with computing and processing capabilities.
Suarez, George↗