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At least 19 records

Design, Qualification and Integration Testing of the High-Temperature Resistance Temperature Device for Stirling Power System

The Advanced Stirling Radioisotope Generator (ASRG), developed from 2006 to 2013 under the joint sponsorship of the United States Department of Energy (DOE) and National Aeronautics and Space Administration (NASA) to provide a high-efficiency power system for future deep space missions, employed Sunpower Incorporated's Advanced Stirling Convertors (ASCs) with operating temperature up to 840 C. High-temperature operation was made possible by advanced heater head materials developed to increase reliability and thermal-to-mechanical conversion efficiency. During a mission, it is desirable to monitor the Stirling hot-end temperature as a measure of convertor health status and assist in making appropriate operating parameter adjustments to maintain the desired hot-end temperature as the radioisotope fuel decays. To facilitate these operations, a Resistance Temperature Device (RTD) that is capable of high-temperature, continuous long-life service was designed, developed and qualified for use in the ASRG. A thermal bridge was also implemented to reduce the RTD temperature exposure while still allowing an accurate projection of the ASC hot-end temperature. NASA integrated two flight-design RTDs on the ASCs and assembled into the high-fidelity Engineering Unit, the ASRG EU2, at Glenn Research Center (GRC) for extended operation and system characterization. This paper presents the design implementation and qualification of the RTD, and its performance characteristics and calibration in the ASRG EU2 testing.

Deep Space↗

The high temperature superconductivity space experiment

The history and the current status of the high temperature superconductivity space experiment (HTSSE) initiated in 1988 are briefly reviewed. The goal of the HTSSE program is to demonstrate the feasibility of incorporating high temperature superconductivity (HTS) technology into space systems. The anticipated payoffs include the development of high temperature superconductor devices for space systems; preparation and space qualification of a cryogenically cooled experimental package containing HTS devices and components; and acquisition of data for future space experiments using more complex HTS devices and subsystems. The principal HTSSE systems and devices are described.

Webb, Denis C.↗

What Reliability Engineers Should Know about Space Radiation Effects

Space radiation in space systems present unique failure modes and considerations for reliability engineers. Radiation effects is not a one size fits all field. Threat conditions that must be addressed for a given mission depend on the mission orbital profile, the technologies of parts used in critical functions and on application considerations, such as supply voltages, temperature, duty cycle, and redundancy. In general, the threats that must be addressed are of two types-the cumulative degradation mechanisms of total ionizing dose (TID) and displacement damage (DD). and the prompt responses of components to ionizing particles (protons and heavy ions) falling under the heading of single-event effects. Generally degradation mechanisms behave like wear-out mechanisms on any active components in a system: Total Ionizing Dose (TID) and Displacement Damage: (1) TID affects all active devices over time. Devices can fail either because of parametric shifts that prevent the device from fulfilling its application or due to device failures where the device stops functioning altogether. Since this failure mode varies from part to part and lot to lot, lot qualification testing with sufficient statistics is vital. Displacement damage failures are caused by the displacement of semiconductor atoms from their lattice positions. As with TID, failures can be either parametric or catastrophic, although parametric degradation is more common for displacement damage. Lot testing is critical not just to assure proper device fi.mctionality throughout the mission. It can also suggest remediation strategies when a device fails. This paper will look at these effects on a variety of devices in a variety of applications. This paper will look at these effects on a variety of devices in a variety of applications. (2) On the NEAR mission a functional failure was traced to a PIN diode failure caused by TID induced high leakage currents. NEAR was able to recover from the failure by reversing the current of a nearby Thermal Electric Cooler (turning the TEC into a heater). The elevated temperature caused the PIN diode to anneal and the device to recover. It was by lot qualification testing that NEAR knew the diode would recover when annealed. This paper will look at these effects on a variety of devices in a variety of applications. Single Event Effects (SEE): (1) In contrast to TID and displacement damage, Single Event Effects (SEE) resemble random failures. SEE modes can range from changes in device logic (single-event upset, or SEU). temporary disturbances (single-event transient) to catastrophic effects such as the destructive SEE modes, single-event latchup (SEL). single-event gate rupture (SEGR) and single-event burnout (SEB) (2) The consequences of nondestructive SEE modes such as SEU and SET depend critically on their application--and may range from trivial nuisance errors to catastrophic loss of mission. It is critical not just to ensure that potentially susceptible devices are well characterized for their susceptibility, but also to work with design engineers to understand the implications of each error mode. -For destructive SEE, the predominant risk mitigation strategy is to avoid susceptible parts, or if that is not possible. to avoid conditions under which the part may be susceptible. Destructive SEE mechanisms are often not well understood, and testing is slow and expensive, making rate prediction very challenging. (3) Because the consequences of radiation failure and degradation modes depend so critically on the application as well as the component technology, it is essential that radiation, component. design and system engineers work togetherpreferably starting early in the program to ensure critical applications are addressed in time to optimize the probability of mission success.

DiBari, Rebecca↗

Qualification of Engineering Camera for Long-Duration Deep Space Missions

Qualification and verification of advanced electronic packaging and interconnect technologies, and various other types of hardware elements for the Mars Exploration Rover s Spirit and Opportunity (MER)/Mars Science Laboratory (MSL) flight projects, has been performed to enhance the mission assurance. The qualification of hardware (engineering camera) under extreme cold temperatures has been performed with reference to various Mars-related project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times the total number of expected diurnal temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware, including all relevant manufacturing, ground operations, and mission phases. Qualification has been performed by subjecting above flight-like hardware to the environmental temperature extremes, and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Engineering camera packaging designs, charge-coupled devices (CCDs), and temperature sensors were successfully qualified for MER and MSL per JPL design principles. Package failures were observed during qualification processes and the package redesigns were then made to enhance the reliability and subsequent mission assurance. These results show the technology certainly is promising for MSL, and especially for longterm extreme temperature missions to the extreme temperature conditions. The engineering camera has been completely qualified for the MSL project, with the proven ability to survive on Mars for 2010 sols, or 670 sols times three. Finally, the camera continued to be functional, even after 2010 thermal cycles.

Ramesham, Rajeshuni↗

Qualification test results for blue-red reflecting solar covers

Recent market forces and design innovations have spurred the development of solar cell covers that significantly reduce the solar absorptance for a cell array. GaAs cells, using Ge as the substrate host material, can have a significantly higher output if the solar absorptance of the cell array is reduced. New optical coating design techniques have allowed the construction of covers that reflect the ultraviolet energy (below 350 nm) and the near infrared energy (above 900 nm) resulting in the beneficial reduction in absorptance. Recent modeling suggests three or more present output increase due to the lowered temperature with such a device. Within the last several months we have completed the testing of production samples of these new covers in a qualification series that included the usual environmental effects associated with the routine testing of solar cell covers and the combined effects of protons, electrons and solar UV as would be encountered in space. For the combined effects testing the samples were exposed to 300 sun days equivalent UV, 5 x 10(exp 14)/sq cm of 0.5 MeV protons and 10(exp 15)/sq cm of 1.0 MeV electrons. Measurements of the reflectance, transmission, emittance and other appropriate parameters were made before and after the testing. As measured by the averaged transmission over the cell operating band, the change in transmission for the samples was less than or about equal to 1 percent. The details of the testing and the results in terms of transmission, reflectance and emittance are discussed in the paper.

Beauchamp, W. T.↗

High Temperature Devices for Aerospace Applications

This presentation will overview important new capabilities and benefits that next-generation higher temperature electronics promise for a variety of aerospace systems and missions. Initial aerospace infusions of higher temperature electronics to be discussed include jet engines and the prolonged robotic exploration of the Venus surface. Complete redesign of systems compared to prior conventional electronics practices would yield the most revolutionary benefits. However, the inherent higher risk and expense associated with new technology adoption will likely drive a more evolutionary technology infusion process, especially since flight qualification demands large safety margins and testing that ensures reliable operation for far longer than actual mission duration. SiC pn-junction based devices are inherently capable of the most durable operation at the highest application temperatures compared other transistor technologies, but such integrated circuits (ICs) will never achieve integration levels near today’s silicon ICs. Extreme temperature high-power devices will also be de-rated compared to room-temperature performance. While the high temperature market will always be small compared to the conventional temperature mass-market, compatibility and leveraging of existing foundry manufacturing is vital to the establishment of a sustainable high temperature electronics ecosystem sufficient to significantly improve aerospace systems.

High Temperature↗

Reliability of hybrid microcircuit discrete components

Data accumulated during 4 years of research and evaluation of ceramic chip capacitors, ceramic carrier mounted active devices, beam-lead transistors, and chip resistors are presented. Life and temperature coefficient test data, and optical and scanning electron microscope photographs of device failures are presented and the failure modes are described. Particular interest is given to discrete component qualification, power burn-in, and procedures for testing and screening discrete components. Burn-in requirements and test data will be given in support of 100 percent burn-in policy on all NASA flight programs.

Allen, R. V.↗

Applications of Fracture Mechanics to Quantitative Accelerated Life Testing of Plastic Encapsulated Microelectronics

Accelerated testing must address the failure mechanisms active within the devices undergoing tests in order to assess lifetimes in a meaningful way. The assumption of constant temperature, thermally activated lifetime, based upon the Arrhenius assumptions, does not always provide the necessary understanding to interpret accelerated tests in microelectronics. Plastic encapsulants, dielectric polymers, and underfill materials are subject to delamination and cracking with thermal cycling. Crack propagation during use environment exposure, drives the potential for failure of microelectronic devices and is therefore a necessary focal point in qualification and life testing. This paper reviews the available research in the application of fracture mechanics to this class of problems in microelectronics including relevant test data. In addition, useful acceleration factor models are derived for polymer crack propagation based on principles of linear elastic fracture mechanics. Further, a simple approach to estimating the minimum temperature cycling ranges, necessary to propagate a crack, is also presented. Finally, a methodology of applying acceleration factors to develop testing plans is shown, with an example in spaceflight for a cubesat in low Earth orbit. Overall, this is a paper that shows a useful and appropriate process for creating physics of failure based life testing for delamination and cracking failures in microelectronic polymers in a temperature cycling environment.

Accelerated testing↗

Centrifugal regulator for control of deployment rates of deployable elements

The requirements, design, and performance of a centrifugal regulator aimed at limiting deployment rates of deployable elements are discussed. The overall mechanism is comprised of four distinct functional parts in a machined housing: (1) the centrifugal brake device, which checks the payout of a deployment cable; (2) the reducing gear, which produces the spin rate necesary for the braking device; (3) the payout device, which allows the unwinding of the cable; and (4) the locking device, which prevents untimely unwinding. The centrifugal regulator is set into operation by a threshold tension of the cable which unlocks the mechanism and allows unwinding. The pulley of the windout device drives the centrifugal brake with the help of the reducing gear. The centrifugal force pushes aside weights that produce friction of the studs in a cylindrical housing. The mechanism behaved well at qualification temperature and vibrations.

Vermalle, J. C.↗

Space Cryogenic Workshop, 8th, California Institute of Technology, Pasadena, July 31, Aug. 1, 1989, Proceedings

Recent advances in cryogenic technology for space applications are examined in reviews and reports. Topics addressed include very-low-force cooling contacts for the ISO cryostat cover, convective heat flow in space cryogenics plugs, liquid-acquisition devices for superfluid He transfer, and pressure drop in the SHOOT superfluid-He acquisition system. Consideration is given to a liquid-He vibration cryostat for space qualification tests, closed-cycle coolers for temperatures below 30 K, stress analysis down to liquid-He temperature, a cryogenic valve actuator, and a spaceborne He-3 refrigerator. Also discussed are an adiabatic-demagnetization refrigerator for SIRTF, rejection of waste heat from O liquefaction operations at a lunar O production plant, SHOOT flowmeter and pressure transducers, and space qualification of the ISO cryogenic rupture disks.

Source record↗

Techniques for control of long-term reliability of complex integrated circuits. I - Reliability assurance by test vehicle qualification.

Development of an alternate approach to the conventional methods of reliability assurance for large-scale integrated circuits. The product treated is a large-scale T squared L array designed for space applications. The concept used is that of qualification of product by evaluation of the basic processing used in fabricating the product, providing an insight into its potential reliability. Test vehicles are described which enable evaluation of device characteristics, surface condition, and various parameters of the two-level metallization system used. Evaluation of these test vehicles is performed on a lot qualification basis, with the lot consisting of one wafer. Assembled test vehicles are evaluated by high temperature stress at 300 C for short time durations. Stressing at these temperatures provides a rapid method of evaluation and permits a go/no go decision to be made on the wafer lot in a timely fashion.

Van Vonno, N. W.↗

A Spacecraft Housekeeping System-on-Chip in a Radiation Hardened Structured ASIC

Housekeeping systems are essential to health monitoring of spacecraft and instruments. Typically, sensors are distributed across various sub-systems and data is collected using components such as analog-to-digital converters, analog multiplexers and amplifiers. In most cases programmable devices are used to implement the data acquisition control and storage, and the interface to higher level systems. Such discrete implementations require additional size, weight, power and interconnect complexity versus an integrated circuit solution, as well as the qualification of multiple parts. Although commercial devices are readily available, they are not suitable for space applications due the radiation tolerance and qualification requirements. The Housekeeping System-o n-A-Chip (HKSOC) is a low power, radiation hardened integrated solution suitable for spacecraft and instrument control and data collection. A prototype has been designed and includes a wide variety of functions including a 16-channel analog front-end for driving and reading sensors, analog-to-digital and digital-to-analog converters, on-chip temperature sensor, power supply current sense circuits, general purpose comparators and amplifiers, a 32-bit processor, digital I/O, pulse-width modulation (PWM) generators, timers and I2C master and slave serial interfaces. In addition, the device can operate in a bypass mode where the processor is disabled and external logic is used to control the analog and mixed signal functions. The device is suitable for stand-alone or distributed systems where multiple chips can be deployed across different sub-systems as intelligent nodes with computing and processing capabilities.

Suarez, George↗

Space-qualified Chalcogenide Materials through ISS MISSE Exposure —From Property to Application

In March 2021, twenty-four samples of various phase change materials (PCMs - Ge2Sb2Te5, Ge2Sb2Se4Te1, and Sb2Se3) along with metasurface optical components comprised of these PCMs, were delivered to the International Space Station (ISS) as part of the Materials International Space Station Experiment (MISSE-14) test campaign [1]. Although PCMs have previously been noted for their resilience to various forms of radiation [2], they had not been tested in a realistic space environment until this exposure campaign with joint NASA and MIT collaboration. During the six-month total open exposure time in low earth orbit (LEO), high-resolution cameras scanned and captured photographs of the samples to detect changes as a function of time along with on-orbit measured temperature, UV radiation, total atomic oxygen fluence, and total ionizing radiation doses. The samples were returned to NASA Langley Research Center in March 2022 for post-flight characterization. This duplicated the preflight characterization (i.e., material composition and crystallinity that limits switching speed, index contrast, loss, etc.) conducted before launch. The space sector has witnessed tremendous growth within the past decade—not only from government agencies but also entrants from the private sector. Future growth in the capabilities of Earth observation, deep space, and planetary surface missions using miniaturized spacecraft platforms can only be sustained by innovations in the design of remote sensors and other sub-systems. Active metasurface optics with enhanced tunability and reconfigurability continues to redefine the boundaries of optical science [3]. The introduction of PCM technology and associated optical devices will help to accelerate the adoption of new architectures for reduced size, weight, power, and cost (SWaP-C) platforms in space.Here we introduce results obtained from the MISSE-14 mission related to space qualification of PCM-based optic devices and constituent materials. We then discuss our recent work developing active integrated photonic devices and metasurface optics based on PCMs for space applications. This includes tunable and reconfigurable optical metasurface devices to support NASA space communication and LIDAR applications. PCMs are quickly becoming interesting photonics materials but questions related to mission suitability remain, particularly in regard to key properties like figures-of-merit (FOM, Δn/Δk), glass forming temperatures, and phase transition speeds. This talk will describe efforts to afford researchers the ability to have access to cost-effective data on exposure-induced changes to PCM fundamental physical and optical properties to assess their utility for space applications. The MISSE-14 sample exposure campaign allows a complete understanding of the limitations of the PCMs for various space-based electronic and optoelectronic applications.

Chalcogenide Phase change material↗

Qualification of Laser Diode Arrays for Mercury Laser Altimeter

NASA's requirements for high reliability, high performance satellite laser instruments have driven the investigation of many critical components; specifically, 808 nm laser diode array (LDA) pump devices. Performance of Quasi-CW, High-power, laser diode arrays under extended use is presented. We report the optical power over several hundred million pulse operation and the effect of power cycling and temperature cycling of the laser diode arrays. Data on the initial characterization of the devices is also presented.

Stephen, Mark↗

PEM-INST-001: Instructions for Plastic Encapsulated Microcircuit (PEM) Selection, Screening, and Qualification

Potential users of plastic encapsulated microcircuits (PEMs) need to be reminded that unlike the military system of producing robust high-reliability microcircuits that are designed to perform acceptably in a variety of harsh environments, PEMs are primarily designed for use in benign environments where equipment is easily accessed for repair or replacement. The methods of analysis applied to military products to demonstrate high reliability cannot always be applied to PEMs. This makes it difficult for users to characterize PEMs for two reasons: 1. Due to the major differences in design and construction, the standard test practices used to ensure that military devices are robust and have high reliability often cannot be applied to PEMs that have a smaller operating temperature range and are typically more frail and susceptible to moisture absorption. In contrast, high-reliability military microcircuits usually utilize large, robust, high-temperature packages that are hermetically sealed. 2. Unlike the military high-reliability system, users of PEMs have little visibility into commercial manufacturers proprietary design, materials, die traceability, and production processes and procedures. There is no central authority that monitors PEM commercial product for quality, and there are no controls in place that can be imposed across all commercial manufacturers to provide confidence to high-reliability users that a common acceptable level of quality exists for all PEMs manufacturers. Consequently, there is no guaranteed control over the type of reliability that is built into commercial product, and there is no guarantee that different lots from the same manufacturer are equally acceptable. And regarding application, there is no guarantee that commercial products intended for use in benign environments will provide acceptable performance and reliability in harsh space environments. The qualification and screening processes contained in this document are intended to detect poor-quality lots and screen out early random failures from use in space flight hardware. However, since it cannot be guaranteed that quality was designed and built into PEMs that are appropriate for space applications, users cannot screen in quality that may not exist. It must be understood that due to the variety of materials, processes, and technologies used to design and produce PEMs, this test process may not accelerate and detect all failure mechanisms. While the tests herein will increase user confidence that PEMs with otherwise unknown reliability can be used in space environments, such testing may not guarantee the same level of reliability offered by military microcircuits. PEMs should only be used where due to performance needs there are no alternatives in the military high-reliability market, and projects are willing to accept higher risk.

Teverovsky, Alexander↗

Electrical Evaluation of RCA MWS5001D Random Access Memory, Volume 1

Electrical characterization and qualification tests were performed on the RCA MWS5001D, 1024 by 1-bit, CMOS, random access memory. Characterization tests were performed on five devices. The tests included functional tests, AC parametric worst case pattern selection test, determination of worst-case transition for setup and hold times and a series of schmoo plots. The qualification tests were performed on 32 devices and included a 2000 hour burn in with electrical tests performed at 0 hours and after 168, 1000, and 2000 hours of burn in. The tests performed included functional tests and AC and DC parametric tests. All of the tests in the characterization phase, with the exception of the worst-case transition test, were performed at ambient temperatures of 25, -55 and 125 C. The worst-case transition test was performed at 25 C. The preburn in electrical tests were performed at 25, -55, and 125 C. All burn in endpoint tests were performed at 25, -40, -55, 85, and 125 C.

Klute, A.↗

Comprehensive Radiation Testing of Uncooled, Free Space Coupled, InGaAs Quad Photoreceivers

We have comprehensively tested uncooled, free space coupled, InGaAs Quad Photoreceivers having 0.5mm, 1mm, and 2mm diameter integrated with a low noise transimpedance amplifier (TIA)using 30MeV Protons, 100MeV Protons, 662keV Gamma Rays, 1GeV/n Helium, and 1GeV/n Iron at room temperature of ~20°C.These devices find multiple applications in space for differential wave front sensing as part of a Gravitational Wave Observatory, as well as instrumentation and control for next generation space telescopes. The bandwidth of all receivers was 20MHz which was TIA limited. All 0.5mm and 1mm devices were found to be fully functional at normal operating conditions and at room temperature for Protons, Gamma Rays, 1GeV/n Helium, and 1GeV/n Iron. Only one quadrant of a 2mm In GaAs Quad had hard failure due to 1GeV/n Helium Ions; otherwise it too survived all other radiation tests. Detailed test results follow in the manuscript including recommendations for future space flights. These radiation test results, combined with the earlier successful mechanical shock and vibration testing mean these devices have passed preliminary testing for space qualification.

Abhay M Joshi↗

Development, qualification, and delivery of a hydrogen burnoff igniter

The hydrogen burnoff igniter, a pyrotechnic device used to burn off excess hydrogen gas near the Space Shuttle Main Engine (SSME) nozzle, was designed, fabricated, and qualified. Characteristics of the burnoff igniter include a function time of 8 + or - 2 seconds, a minimum three foot flame length at maximum output, and hot particles projected 15 feet when fired directly into or perpendicular to a 34.5 knot wind. The three foot flame length was considered to be of questionable importance, since the hot particles are the media for igniting the hydrogen. Flame temperature is greater than 1500 F.

Ray, D.↗