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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2019

Thermal & Fluids Analysis and the NASA Launch Services Program

This presentation provides the What, Where, Why, and How of the thermal and fluids analysis disciplines within the Launch Services Program (LSP). The LSP manages all commercial launch services to match NASA science mission payloads to the appropriate launch system. The Flight Analysis Division within the LSP provides multi disciplinary analysis support of these flight systems to characterize payload and launch vehicle environments from payload mate to upper stage through on orbit separation. The Thermal Analysis and Fluids Analysis teams are two distinct groups within the Flight Analysis Division of the LSP who cover a wide array of standard and non standard analytical tasks. These teams offer a significant benefit to both the payload design and integration team and the launch vehicle supplier. These benefits, along with the tools and methods are described in this talk to inform engineers and analysts from both sides of the launch system interface how the LSP Thermal and Fluids Analysis teams can benefit the success of their mission.

Fortenberry, Cindy↗
NASA NTRSDate not supplied

Thermal-Fluid Analysis of a Liquid-Cooled Battery Module for Electrified Aircraft

The development of safe, energy-dense batteries is critical to advancing hybrid electric and fully electrified aircraft propulsion. Achieving this capability requires a thermal management system that can maintain battery performance and safety under demanding operational conditions. The objective of this project is to support the maturation of next-generation lithium-ion batteries for electrified aircraft by conducting performance testing on integrated battery modules, specifically a 2-cell series configuration module housed within an aluminum enclosure. Designed to operate at a nominal 7.2 V with discharge rates up to 2.5C, the module will eventually be used to power an electric motor and DC-DC converter, generating substantial thermal loads that must be effectively managed to increase the usable energy and power density of electrified aircraft. To address these thermal challenges, this study presents the development and thermal-fluid analysis of a liquid-cooled thermal management system. While the full aircraft architecture utilizes an eight-string configuration, the present work evaluates a representative single-string water coolant loop to characterize baseline performance. The active cooling loop circulates water through a reservoir, pump, the battery module, and a variable area flow meter. Key performance metrics including component-level temperatures, mass flow rates, and pressure drops are quantified across the loop. Across discharge rates ranging from 0.5C to 2.5C, the active thermal loop consistently and effectively removed heat from the module, validating the design approach and confirming readiness for further development. The validated thermal performance indicates a path toward scalable battery modules that could enable energy and power dense systems for hybrid electric aircraft.

Electrified Aircraft↗
NASA NTRSDate not supplied

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗
NASA NTRSDate not supplied

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗
DOE OSTI2022

Preliminary Primary System Thermal Fluids Analysis of a Horizontal Compact HTGR

The Horizontal Compact High Temperature Gas Reactor (HC-HTGR) is being designed by a multi-disciplinary team of nuclear, mechanical, and structural engineers, under the support of a DOE-NE Advanced Reactor Demonstration Program’s Advanced Reactor Concepts-20 (ARC-20) award. The objective of this ARC-20 project is to deliver a conceptual design for the proposed HC-HTGR in 3 years and support its commercialization as a safe, low-cost HTGR. Argonne National Laboratory (Argonne) is collaborating on the thermal hydraulic design and analysis of the HC-HTGR reactor pressure vessel internals. The scope of this work includes ensuring the reactor is able to maintain maximum core temperatures below designated safety thresholds during normal operation, shutdown, and accident conditions. This report documents the preliminary thermal hydraulic analysis of the HC-HTGR core design performed with a 1D fluid-3D solid coupled model built using the System Analysis Module (SAM). This assembly level model was utilized to inform the core assembly design, predict the temperature distribution in the peak power assembly including the peak fuel temperature, coolant channel outlet temperatures, and graphite temperature gradients. A key result of this analysis was the determination that the peak fuel temperature remains below the safety threshold of 1250°C. Additionally, this model was used to assess the assembly coolant channel and bypass flow mass flow rate distribution. Following the assembly level analysis, attention turned to the development of a full core reduced order model to be used to predict the core wide coolant flow distribution and to model certain operational and accidental transients.

21 SPECIFIC NUCLEAR REACTORS AND ASSOCIATED PLANTS↗
NASA NTRS2006

Multiphysics Thermal-Fluid Analysis of a Non-Nuclear Tester for Hot-Hydrogen Materials Development

The objective of this effort is to analyze the thermal field of a non-nuclear tester, as a first step towards developing efficient and accurate multiphysics, thermo-fluid computational methodology to predict environments for hypothetical solid-core, nuclear thermal engine thrust chamber design and analysis. The computational methodology is based on a multidimensional, finite-volume, turbulent, chemically reacting, radiating, unstructured-grid, and pressure-based formulation. The multiphysics invoked in this study include hydrogen dissociation kinetics and thermodynamics, turbulent flow, convective, radiative and conjugate heat transfers.

Wang, Ten-See↗
NASA NTRS1993

Thermal-fluid analysis of the fill and drain operations of a cryrogenic fuel tank

The Generic Research Cryogenic Tank was designed to establish techniques for testing and analyzing the behavior of reusable fuel tank structures subjected to cryogenic fuels and aerodynamic heating. The Generic Research Cryogenic Tank tests will consist of filling a pressure vessel to a prescribed fill level, waiting for steady-state conditions, then draining the liquid while heating the external surface to simulate the thermal environment associated with hypersonic flight. Initial tests of the Generic Research Cryogenic Tank will use liquid nitrogen with future tests requiring liquid hydrogen. Two-dimensional finite-difference thermal-fluid models were developed for analyzing the behavior of the Generic Research Cryogenic Tank during fill and drain operations. The development and results of the two-dimensional fill and drain models, using liquid nitrogen, are provided, along with results and discussion on extrapolating the model results to the operation of the full-size Generic Research Cryogenic Tank. These numerical models provided a means to predict the behavior of the Generic Research Cryogenic Tank during testing and to define the requirements for the Generic Research Cryogenic Tank support systems such as vent, drain, pressurization, and instrumentation systems. In addition, the fill model provided insight into the unexpected role of circumferential conduction in cooling the Generic Research Cryogenic Tank pressure vessel during fill operations.

Stephens, Craig A.↗
DOE OSTI2024

Primary System Thermal Fluids Analysis Model Development for the Compact High Temperature Gas Reactor (HC-HTGR) (Final Report)

Horizontal Compact High Temperature Gas Reactor (HC-HTGR) is being designed by a multi-disciplinary team of nuclear, mechanical, and structural engineers under the support of a DOE-NE Advanced Reactor Demonstration Program’s Advanced Reactor Concepts-20 (ARC-20) award. The objective of this ARC-20 project is to deliver a conceptual design for the proposed HC-HTGR and support its commercialization as a safe, low-cost HTGR. Argonne National Laboratory (Argonne) is collaborating on the thermal hydraulic design and analysis of HC-HTGR reactor pressure vessel internals to ensure the reactor maintains sufficient safety margins during normal operation, shutdown, and accident conditions.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
NASA NTRS2002

Twelfth Thermal and Fluids Analysis Workshop

The Twelfth Thermal and Fluids Analysis Workshop (TFAWS 01) was held at the Bevill Center, The University of Alabama in Huntsville, Huntsville, Alabama, September 10-14, 2001. The theme for the hands-on training workshop and conference was "Engineering Excellence and Advances in the New Millenium." Forty-five technical papers were presented in four sessions: (1) Thermal Spacecraft/Payloads, (2) Thermal Propulsion/Vehicles, (3) Interdisciplinary Papers, and (4) Fluids Papers. Thirty-nine papers were published in these proceedings. The remaining six papers were not available in electronic format at the time of publication. In addition to the technical papers, there were (a) nine hands-on classes on thermal and flow analyses software, (b) thirteen short courses and product overview lectures, (c) five keynote lectures and, (d) panel discussions consisting of eight presentations. The workshop resulted in participation of 195 persons representing NASA Centers, Government agencies, aerospace industries, academia, software providers, and private corporations.

Majumdar, Alok↗
NASA NTRS2001

The Tenth Thermal and Fluids Analysis Workshop

The Tenth Thermal arid Fluids Analysis Workshop (TFAWS 99) was held at the Bevill Center, University of Alabama in Huntsville, Huntsville, Alabama, September 13-17, 1999. The theme for the hands-on training workshop and conference was "Tools and Techniques Contributing to Engineering Excellence". Forty-seven technical papers were presented in four sessions. The sessions were: (1) Thermal Spacecraft/Payloads, (2) Thermal Propulsion/Vehicles, (3) Interdisciplinary Paper, and (4) Fluids Paper. Forty papers were published in these proceedings. The remaining seven papers were not available in electronic format at the time of publication. In addition to the technical papers, there were (a) nine hands-on classes on thermal and flow analyses software, (b) twelve short courses, (c) thirteen product overview lectures, and (d) three keynote lectures. The workshop resulted in participation of 171 persons representing NASA Centers, Government agencies, aerospace industries, academia, software providers, and private corporations.

Majumdar, Alok↗
NASA NTRS1995

The Sixth Annual Thermal and Fluids Analysis Workshop

The Sixth Annual Thermal and Fluids Analysis Workshop consisted of classes, vendor demonstrations, and paper sessions. The classes and vendor demonstrations provided participants with the information on widely used tools for thermal and fluids analysis. The paper sessions provided a forum for the exchange of information and ideas among thermal and fluids analysis. Paper topics included advances an uses of established thermal and fluids computer codes (such as SINDA and TRASYS) as well as unique modeling techniques and applications.

Source record↗
NASA NTRS1992

The Fourth Annual Thermal and Fluids Analysis Workshop

The Fourth Annual Thermal and Fluids Analysis Workshop was held from August 17-21, 1992, at NASA Lewis Research Center. The workshop consisted of classes, vendor demonstrations, and paper sessions. The classes and vendor demonstrations provided participants with the information on widely used tools for thermal and fluids analysis. The paper sessions provided a forum for the exchange of information and ideas among thermal and fluids analysts. Paper topics included advances and uses of established thermal and fluids computer codes (such as SINDA and TRASYS) as well as unique modeling techniques and applications.

Source record↗
NASA NTRS1993

The Fifth Annual Thermal and Fluids Analysis Workshop

The Fifth Annual Thermal and Fluids Analysis Workshop was held at the Ohio Aerospace Institute, Brook Park, Ohio, cosponsored by NASA Lewis Research Center and the Ohio Aerospace Institute, 16-20 Aug. 1993. The workshop consisted of classes, vendor demonstrations, and paper sessions. The classes and vendor demonstrations provided participants with the information on widely used tools for thermal and fluid analysis. The paper sessions provided a forum for the exchange of information and ideas among thermal and fluids analysts. Paper topics included advances and uses of established thermal and fluids computer codes (such as SINDA and TRASYS) as well as unique modeling techniques and applications.

Source record↗
NASA NTRS1999

Ninth Thermal and Fluids Analysis Workshop Proceedings

The Ninth Thermal and Fluids Analysis Workshop (TFAWS 98) was held at the Ohio Aerospace Institute in Cleveland, Ohio from August 31 to September 4, 1998. The theme for the hands-on training workshop and conference was "Integrating Computational Fluid Dynamics and Heat Transfer into the Design Process." Highlights of the workshop (in addition to the papers published herein) included an address by the NASA Chief Engineer, Dr. Daniel Mulville; a CFD short course by Dr. John D. Anderson of the University of Maryland; and a short course by Dr. Robert Cochran of Sandia National Laboratories. In addition, lectures and hands-on training were offered in the use of several cutting-edge engineering design and analysis-oriented CFD and Heat Transfer tools. The workshop resulted in international participation of over 125 persons representing aerospace and automotive industries, academia, software providers, government agencies, and private corporations. The papers published herein address issues and solutions related to the integration of computational fluid dynamics and heat transfer into the engineering design process. Although the primary focus is aerospace, the topics and ideas presented are applicable to many other areas where these and other disciplines are interdependent.

Sakowski, Barbara↗
NASA NTRS2015

ISS-CREAM Thermal and Fluid System Design and Analysis

Thermal and Fluids Analysis Workshop (TFAWS), Silver Spring MD NCTS 21070-15. The ISS-CREAM (Cosmic Ray Energetics And Mass for the International Space Station) payload is being developed by an international team and will provide significant cosmic ray characterization over a long time frame. Cold fluid provided by the ISS Exposed Facility (EF) is the primary means of cooling for 5 science instruments and over 7 electronics boxes. Thermal fluid integrated design and analysis was performed for CREAM using a Thermal Desktop model. This presentation will provide some specific design and modeling examples from the fluid cooling system, complex SCD (Silicon Charge Detector) and calorimeter hardware, and integrated payload and ISS level modeling. Features of Thermal Desktop such as CAD simplification, meshing of complex hardware, External References (Xrefs), and FloCAD modeling will be discussed.

Thermal analysis↗