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At least 19 records

The SLD Vertex Detector Upgrade (VXD3) and a Study of $b\bar{b}g$ Events [Thesis]

This thesis presents a variety of work concerning the design, construction and use of the SLD's vertex detector. SLD's pioneering 120 Mpixel vertex detector, VXD2, was replaced by VXD3, a 307Mpixel CCD vertex detector in January 1996. The motivation for the up-grade detector and its subsequent construction and testing are described in some detail. This work represents the collaborative work of a large number of people. My work was mainly carried out at EEV on the testing of the CCDs and subsequent ladders. VXD3 was commissioned during the 1996 SLD run and performed very close to design specifications.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

A Letter of Intent for MATHUSLA: a dedicated displaced vertex detector above ATLAS or CMS.

In this Letter of Intent we propose the construction of MATHUSLA (MAssive Timing Hodoscope for Ultra-Stable neutraL pArticles), a dedicated large-volume displaced vertex detector (DV) for the HL-LHC on the surface above ATLAS or CMS. Such a detector, which can be built using existing technologies with a reasonable budget in time for the HL-LHC upgrade, could search for neutral long-lived particles (LLPs) without trigger limitations and with very low or zero backgrounds, allowing it to probe LLP cross sections and lifetimes up to several orders of magnitude beyond the reach of ATLAS or CMS. MATHUSLA would also act as a cutting-edge cosmic ray telescope at CERN, exploring many open questions in cosmic ray and astro-particle physics.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Bare Module Testing for the CMS Vertex Detector Upgrade

The High-Luminosity LHC will continue exploring physics beyond the standard model with proton-proton collisions at ten times the luminosity of previous LHC runs. The physics program depends on precise measurements of charged particles near the beams. The CMS experiment will use layers of high-granularity hybrid silicon pixel detectors. Pixelation is achieved by bonding silicon to tiny electrodes, which are directly connected to the specially designed integrated circuit, CROCv2. Pixel detector components are in the pre-production phase, and evaluating prototypes of sensor-chip assemblies from different vendors provides quick feedback and improves reliability during production. This article presents the efforts to test the viability of bare detector assemblies using a manual probe station and electronic charge-injection methods.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗