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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Thermal Testing and Analysis Techniques for Wires and Wire Bundles

Determining wire and wire bundle amperage capacity (i.e., “ampacity”) currently relies on the use of standards to derate wire ampacity when in a bundle configuration. The feasibility of developing physics-based and regression thermal models of single wires and wire bundles to determine ampacity using a customized test apparatus was investigated during a pathfinder study. A wire bundle test apparatus was developed for measuring the temperatures of single wires and wire bundles and collected wire conductor temperature data under high vacuum and atmospheric conditions and varying environmental temperatures and currents for the two most common wire types used on spacecraft.

Thermal↗
NASA NTRS1977

Studies of friction and wear characteristics of various wires for wire-brush skids

The friction and wear characteristics of 22 types and sizes of wires for potential use in wire-brush skids were studied. These characteristics were determined by placing brushes made from candidate wires on a belt sander whose moving belt simulated landing roll-out distance. At the same time, the drag force and wear behavior were monitored. Data were obtained over distances up to 3048 m (10,000 ft) at preselected bearing pressures of 172 to 1034 kPa (25 to 150 psi). In general, the friction coefficient developed by the candidate wires was found to be independent of bearing pressure and ranged between 0.4 and 0.6 under the test conditions of this investigation. The friction coefficient was not degraded when the surface was wetted and appears to be independent of wire diameter except perhaps when wire size is relatively large compared with the surface asperities. Generally, the high friction demonstrated by the soft materials was accompanied by high wear rates; conversely, the hard materials provided greater wear resistance but offered lower friction. For all test wires, the wear was shown to increase with increasing bearing pressure, in general, for the same bearing pressure, wear increased with increasing wire diameter and decreased when the surface was wetted.

Dreher, R. C.↗
NASA NTRSDate not supplied

Thermal Testing and Analysis Techniques for Wires and Wire Bundles

Determining wire and wire bundle amperage capacity (i.e., “ampacity”) currently relies on the use of standards to derate wire ampacity when in a bundle configuration. The feasibility of developing physics-based and regression thermal models of single wires and wire bundles to determine ampacity using a customized test apparatus was investigated during a pathfinder study. A test facility was developed and various wire and wire bundle articles were tested under a variety of temperature and pressure conditions using an efficient test matrix formulated using Design of Experiments (DOE) techniques. Physics-based models were developed and correlated to the test results. Regression models were formulated and compared to test results and standards.

Thermal↗
NASA NTRS1972

Investigation of factors affecting the heater wire method of calibrating fine wire thermocouples

An analytical investigation was made of a transient method of calibrating fine wire thermocouples. The system consisted of a 10 mil diameter standard thermocouple (Pt, Pt-13% Rh) and an 0.8 mil diameter chromel-alumel thermocouple attached to a 20 mil diameter electrically heated platinum wire. The calibration procedure consisted of electrically heating the wire to approximately 2500 F within about a seven-second period in an environment approximating atmospheric conditions at 120,000 feet. Rapid periodic readout of the standard and fine wire thermocouple signals permitted a comparison of the two temperature indications. An analysis was performed which indicated that the temperature distortion at the heater wire produced by the thermocouple junctions appears to be of negligible magnitude. Consequently, the calibration technique appears to be basically sound, although several practical changes which appear desirable are presented and discussed. Additional investigation is warranted to evaluate radiation effects and transient response characteristics.

Keshock, E. G.↗
NASA NTRS2014

Metering Wheel-Wire Track Wire Boom Deployment Mechanism

The NASA MMS Spin Plane Double Probe (SDP) Deployer utilizes a helical path, rotating Metering Wheel and a spring loaded Wire "Holding" Track to pay out a "fixed end" 57 meter x 1.5 mm diameter Wire Boom stored between concentric storage cylinders. Unlike rotating spool type storage devices, the storage cylinders remain stationary, and the boom wire is uncoiled along the length of the cylinder via the rotation of the Metering Wheel. This uncoiling action avoids the need for slip-ring contacts since the ends of the wire can remain stationary. Conventional fixed electrical connectors (Micro-D type) are used to terminate to operational electronics.

Granoff, Mark S.↗
NASA NTRS1983

Constant-temperature hot-wire anemometer practice in supersonic flows. II - The inclined wire

The performance of a constant-temperature inclined hot-wire in a supersonic flow is critically examined. It is shown that calibration techniques applicable to subsonic flow, such as the cosine cooling law cannot be used when the flow is supersonic. Calibration and measurement procedures appropriate to supersonic flow are suggested, together with the possible limits on their validity. Experimental results for different wires indicate that the sensitivities do not seem to depend on flow direction according to any simple correlation. When the sensitivity exhibits a strong dependence on flow direction, the wire should be discarded to avoid errors due to nonlinear effects.

Smits, A. J.↗
NASA NTRS1987

Use of reinforced inorganic cement materials for spark wire and drift chamber wire frames

The results of a survey, materials test, and analysis study directed toward the development of an inorganic glass-fiber reinforced cement material for use in the construction of space qualified spark wire frames and drift chamber frames are presented. The purpose for this research was to evaluate the feasibility of using glass fiber reinforced cement (GFRC) for large dimensioned structural frames for supporting a number of precisely located spark wires in multiple planes. A survey of the current state of the art in fiber reinforced cement materials was made; material sample mixes were made and tested to determine their laboratory performances. Tests conducted on sample materials showed that compressive and flexural strengths of this material could approach values which would enable fabrication of structural spark wire frames.

Source record↗
NASA NTRS2010

Comparison of Analysis, Simulation, and Measurement of Wire-to-Wire Crosstalk

In this investigation, we compare crosstalk analysis, simulation, and measurement results for electrically short configurations. Methods include hand calculations, PSPICE simulations, Microstripes transient field solver, and empirical measurement. In total, four representative physical configurations are examined, including a single wire over a ground plane, a twisted pair over a ground plane, generator plus receptor wires inside a cylindrical conduit, and a single receptor wire inside a cylindrical conduit. Part 1 addresses the first two cases, and Part 2 addresses the final two. Agreement between the analysis, simulation, and test data is shown to be very good.

Bradley, Arthur T.↗
NASA NTRS2010

Comparison of Analysis, Simulation, and Measurement of Wire-to-Wire Crosstalk

In this investigation, we compare crosstalk analysis, simulation, and measurement results for electrically short configurations. Methods include hand calculations, PSPICE simulations, Microstripes transient field solver, and empirical measurement. In total, four representative physical configurations are examined, including a single wire over a ground plane, a twisted pair over a ground plane, generator plus receptor wires inside a cylindrical conduit, and a single receptor wire inside a cylindrical conduit. Part 1 addresses the first two cases, and Part 2 addresses the final two. Agreement between the analysis methods and test data is shown to be very good.

Bradley, Arthur T.↗
NASA NTRS1983

Two-Wire to Four-Wire Audio Converter

Simple circuit provides interface between normally incompatible voicecommunication lines. Circuit maintains 40 dB of isolation between input and output halves of four-wire line permitting two-wire line to be connected. Balancing potentiometer, Rg, adjusts gain of IC2 to null feed through from input to output. Adjustment is done on workbench just after assembly.

Talley, G. L., Jr↗
NASA NTRS1994

NASA wiring program: Survey of NASA experiences in wiring system safety

The objective of this program is to address safety and reliability issues of complete wiring systems. The plans for carrying out the objective include the following: determine the wiring system design factors; investigate circuit protection technologies; and address manufacturing and maintenance procedures.

Stavnes, Mark W.↗
NASA NTRS1983

Constant-temperature hot-wire anemometer practice in supersonic flows. I - The normal wire

The performance of a constant-temperature normal hot-wire in a supersonic flow is critically examined. It is shown that this instrument is inherently unsuitable for measuring turbulent temperature correlations because of the highly nonlinear response to temperature fluctuations, particularly at low overheat ratios. The instrument is therefore limited to measurements of mean and fluctuating mass-flow rates. Suitable calibration procedures, as well as the limits on spatial and temporal resolution are discussed, and corrections for mean stagnation temperature changes are suggested.

Smits, A. J.↗
NASA NTRS1992

Frequency response in short thermocouple wires

Theoretical expressions are derived for the steady state frequency response of a thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for a nonuniform wire with unequal material properties and wire diameters across the junction. The amplitude ratio at low frequency omega approaches 0 agrees with the results of Scadron and Warshawsky (1952) for a steady state temperature distribution. Moreover, the frequency response for a nonuniform wire in the limit of infinite length l approaches infinity is shown to reduce to a simple expression that is analogous to the classic first order solution for a thermocouple wire with uniform properties. Theoretical expressions are also derived for the steady state frequency response of a supported thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for both a supported one material wire and a two material wire with unequal material properties across the junction. For the case of a one material supported wire, an exact solution is derived which compares favorably with an approximate expression that only matches temperatures at the support junction. Moreover, for the case of a two material supported wire, an analytical expression is derived that closely correlates numerical results. Experimental measurements are made for the steady state frequency response of a supported thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for both a supported one material wire (type K) and a two material wire (type T) with unequal material properties across the junction. The data for the amplitude ratio and phase angle are correlated to within 10 pct. with the theoretical predictions of Forney and Fralick (1991). This is accomplished by choosing a natural frequency omega sub n for the wire data to correlate the first order response at large gas temperature frequencies. It is found that a large bead size, however, will increase the amplitude ratio at low frequencies but decrease the natural frequency of the wire. The phase angle data are also distorted for imperfect junctions.

Forney, L. J.↗
NASA NTRSDate not supplied

Heat Transfer Analysis in Wire Bundles for Aerospace Vehicles

Design of wiring for aerospace vehicles relies on an understanding of "ampacity" which refers to the current carrying capacity of wires, either, individually or in wire bundles. Designers rely on standards to derate allowable current flow to prevent exceedance of wire temperature limits due to resistive heat dissipation within the wires or wire bundles. These standards often add considerable margin and are based on empirical data. Commercial providers are taking an aggressive approach to wire sizing which challenges the conventional wisdom of the established standards. Thermal modelling of wire bundles may offer significant mass reduction in a system if the technique can be generalized to produce reliable temperature predictions for arbitrary bundle configurations. Thermal analysis has been applied to the problem of wire bundles wherein any or all of the wires within the bundle may carry current. Wire bundles present analytical challenges because the heat transfer path from conductors internal to the bundle is tortuous, relying on internal radiation and thermal interface conductance to move the heat from within the bundle to the external jacket where it can be carried away by convective and radiative heat transfer. The problem is further complicated by the dependence of wire electrical resistivity on temperature. Reduced heat transfer out of the bundle leads to higher conductor temperatures and, hence, increased resistive heat dissipation. Development of a generalized wire bundle thermal model is presented and compared with test data. The steady state heat balance for a single wire is derived and extended to the bundle configuration. The generalized model includes the effects of temperature varying resistance, internal radiation and thermal interface conductance, external radiation and temperature varying convective relief from the free surface. The sensitivity of the response to uncertainties in key model parameters is explored using Monte Carlo analysis.

S L Rickman↗
NASA NTRS2015

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗