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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Debonding-on-demand reversible adhesives via heat or light with competitive adhesion strength to conventional epoxy adhesives

Stimuli responsive debonding-on-demand (DoD) reversible adhesives are of great interest for the circular economy. However, the reversible adhesives developed so far often lack competitive adhesion strength in a bonding state. In this work, reversible epoxy adhesives based on Diels–Alder (DA) chemistry were developed and exhibited a competitive adhesion strength (e.g., 12 – 16 MPa of a lap shear strength) to commercial non-reversible epoxy adhesives. The reversible epoxy formulation showed superior thermal stability up to 110°C, and transition to a debonding state in the order of 0.1 MPa at 140°C, consequently, an on/off-type debonding behavior. The transition to a debonding state was attributed to crosslinking density control (e.g., decrease by 33% – 49%) through the reversible DA chemistry and the proximity to the glass transition. Next, for debonding by light stimulus, photothermal refractory plasmonic titanium nitride (TiN) nanoparticles were incorporated in the reversible epoxy, which can generate the required heat for debonding upon exposure to visible light. Photothermal debonding allows for precise debonding at target areas and tunable adhesion strength by controlling the exposure area and light intensity. The DA adhesive formulations containing 0.5 wt.% TiN nanoparticles presented a debonding state with zero adhesion under light exposure with intensity of 1670 mW/cm 2 (inducing 140°C). Even after three cycles of reattachment, the DA adhesive formulations retained 96% of the pristine sample’s adhesion strength measured at 110°C. Therefore, the DA adhesives are attractive candidates as reversible DoD systems applicable in higher temperatures.

42 ENGINEERING↗
DOE OSTI2024

Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures

This paper studied the evolution of air voids at the substrate-adhesive interface during the curing and bonding process of an epoxy-based adhesive between two glass substrates due to the sequence of adhesive placement, external pressure, and plasma treatment on substrates for bonding. The experimental results showed that a higher quantity of interfacial voids were generated during adhesive curing when the substrate was attached to the adhesive compared to when the adhesive was applied and distributed on the substrate. Such interfacial voids can be efficiently removed or reduced by applying slight pressure on the bonded structure during adhesive curing, or by leveraging plasma-treated substrates, as less reported in the literature. This work provided practical suggestions for preparing adhesive joints with minimized interfacial air voids to enhance bonding performance, particularly for dissimilar joints such as metal-CFRTP (carbon-fiber-reinforced thermoplastic polymer), as well as combinations with different types of polymer composites.

Qiao, Yao [BATTELLE (PACIFIC NW LAB)] (ORCID:00000↗
DOE OSTI2025

Chemically Recyclable and Tunable Polyolefin-Like Multiblock Copolymer Adhesives

Adhesives are important in creating multilayer products, such as in packaging and construction. Most current hot-melt adhesives such as poly(ethylene-co-vinyl acetate) (EVA) and polyurethanes lack chemical recyclability and do not easily de-bond, complicating recycling. Here, we achieved tunable adhesive properties of chemically recyclable polyolefin-like multiblock copolymers through regulating the incorporation of crystalline hard blocks, amorphous soft blocks, and ester content highlighted by adhesive strengths up to 6.80 MPa. We further demonstrated applications of these adhesives in multi-layer films and showed that the adhesives can be readily de-bonded, recovered, and chemically recycled. Overall, this study into structure-property relationships, including effects of crystallinity, soft-block incorporation, and ester content of the multiblock copolymers on adhesive properties, has resulted in a modular hot-melt adhesive platform that exhibits chemical recyclability for virgin-quality adhesive re-generation, reprocessability for repeated reuse of the recovered adhesive, and tunability for designing adhesives with a wide range of low to high (up to ~80% stronger than EVA) adhesion strengths.

36 MATERIALS SCIENCE↗
NASA NTRS1973

Shuttle active thermal control system development testing. Volume 7: Improved radiator coating adhesive tests

Silver/Teflon thermal control coatings have been tested on a modular radiator system projected for use on the space shuttle. Seven candidate adhesives have been evaluated in a thermal vacuum test on radiator panels similar to the anticipated flight hardware configuration. Several classes of adhesives based on polyester, silicone, and urethane resin systems were tested. These included contact adhesives, heat cured adhesives, heat and pressure cured adhesives, pressure sensitive adhesives, and two part paint on or spray on adhesives. The coatings attached with four of the adhesives, two silicones and two urethanes, had no changes develop during the thermal vacuum test. The two silicone adhesives, both of which were applied to the silver/Teflon as transfer laminates to form a tape, offered the most promise based on application process and thermal performance. Each of the successful silicone adhesives required a heat and pressure cure to adhere during the cryogenic temperature excursion of the thermal-vacuum test.

Reed, M. W.↗
NASA NTRS1975

Design guidelines for hybrid microcircuits; organic adhesives for hybrid microcircuits

The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail.

Perkins, K. L.↗
NASA NTRS1975

Investigation of organic adhesives for hybrid microcircuits

The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed.

Perkins, K. L.↗
NASA NTRS1977

Analysis and testing of adhesive bonds

An adhesive fracture mechanics approach is described with reference to the identification and design of the best tests for evaluating a given adhesive, the definition of the most meaningful fundamental parameters by which adhesives might be characterized, and the application of these parameters to the design of joints and to the prediction of their performance. Topics include standard adhesive test techniques, the theory of adhesive fracture, and adhesive fracture energy tests. Analytical methods and computer techniques for adhesive bonding, chemical and physical aspects of adhesive fracture, and specific applications and aspects of adhesive fracture mechanics are discussed.

Anderson, G. P.↗
NASA NTRS1977

Exploratory Study on the Effects of Novel Diamine Curing Agents and Isocyanate Precursors on the Properties of New Epoxy and Urethane Adhesives

This report covers the results of investigations directed toward studying the effects of novel aromatic diamine structures on epoxy adhesive properties and includes work done under a modification to the original contract. Three aromatic diamines based on diphenylsulfone and benzophenone were studied as epoxy adhesive curing agents. Previously found differences in adhesive strengths for meta vs para orientation were not found in these series. The use of aluminum and alumina as fillers in a m,m'-methylene dianiline-cured epoxy adhesive was not found to be beneficial to adhesive strength. Alumina filled adhesives had much lower strength than unfilled adhesives. The unfilled m,m'-methylene dianiline-based epoxy adhesive had excellent resistance to moisture relative to a p,p'-methylene dianiline-based adhesive and maintained good strengths up to 250 F. A glass fiber composite based on a m,m'-methylene dianiline-cured epoxy appeared to be equivalent to the p,p'-methylene dianiline-cured epoxy as judged by short beam shear tests.

Glasgow, D. Gerald↗
DOE OSTI2026

An Experimental and Numerical Study of Plasma Treatment Effects on Adhesive Joints of Metals, CFRTPs, and Metal–CFRTP Combinations

This work investigates the effects of plasma surface treatment on both the local adherend–adhesive interfacial strength and the global lap shear strength (LSS) of adhesively-bonded joints composed of metals, CFRTPs, and metal-CFRTP combinations, using AA6061 and CFRPPA as representative examples. Experimental and computational results show that plasma treatment improved the ratio of CFRPPA–adhesive interfacial normal strength to adhesive tensile strength (sint,n/scri,t,adhesive) from 0.59–1.00 to 0.91–1.73, leading to an average 90% increase in LSS for CFRPPA-related joints. In contrast, the LSS and sint,n/scri,t,adhesive values of AA6061–AA6061 joints (>=2.27) remained nearly unchanged after plasma treatment. The enhanced joint bonding was further supported by post-failure surface morphologies from three-dimensional profilometry and simulations, showing a transition from dominant interfacial failure to mixed modes involving interfacial, cohesive, and slight fiber-peeling failures. The LSS evolution with respect to sint,n/scri,t,adhesive was numerically established until the saturation of the LSS of various joints, and the behavior of AA6061–CFRPPA T-joints with varying interfacial strengths was also modeled. This study highlights the importance of local interfacial bonding strength, rather than global LSS, for understanding and optimizing the mechanical performance of adhesively-bonded composite–metal and composite-composite structures via different surface modification strategies.

Qiao, Yao (ORCID:0000000265867604)↗
DOE OSTI2026

Corrosion Resistance of Lignin-Based Thermoplastic Adhesive-Bonded Aluminum Joints

Adhesive-bonded joints are essential for lightweight, multimaterial automotive structures. We developed a lignin-based thermoplastic adhesive with adhesion strength comparable to conventional epoxy adhesives (20–23 MPa), while offering exceptional durability, recyclability, and corrosion resistance. Unlike commercial epoxy adhesives requiring refrigerated storage, our adhesive retains its bonding potential after a year of ambient conditioning. Bonded joints can be repeatedly disassembled and rejoined with less than 2% strength loss. After 500 h of salt fog exposure, the adhesive-bonded aluminum joints exhibited a 24% strength reduction, compared to 61% reduction in strength of joints based on a commercial epoxy adhesive.

Yu, Zeyang [ORNL] (ORCID:0000000209002374)↗
DOE OSTI2025

High-performance reversible adhesive from PET waste for underwater, structural, and pressure-sensitive applications

Developing versatile, tough, and sustainable adhesives that function effectively in both wet and dry environments is a major challenge. Here, we report a bioinspired design for versatile, tough, and reversible adhesives upcycled from consumer poly(ethylene terephthalate) (PET) waste. Our approach uses solvent-free, room-temperature dynamic cross-linking of deconstructed PET macromonomers with a diacetoacetate cross-linker, generating a dynamic, vinylogous urethane–bonded, amphiphilic adhesive. Tunable cross-linker concentration and amphiphilicity yield versatile adhesives suitable for underwater, structural, and pressure-sensitive applications on diverse substrates. Our adhesive exhibits high lap-shear strength and work of debonding under both wet and dry conditions, outperforming common commercial adhesives. The dynamic bonds enable thermal repair, on-demand multicycle debonding/rebonding, facile removal, and chemical recycling. Our strategy of transforming plastic waste into versatile, tough, and reversible adhesives offers a sustainable solution for both plastic waste management and next-generation adhesive design while also providing a commercially viable pathway for valorizing plastic waste.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS1973

Development of design allowables data for adhesives for attaching reusables surface insulation, addendum 1A

The task consisted of conducting mechanical and thermal tests to establish design allowables data on a new room temperature vulcanizing (RTV) silicone adhesive, X3-6004. Low modulus, coupled with relatively low density and good low-temperature properties of this adhesive, places it in contention as a candidate for attaching reusable surface insulation on the space shuttle. Data obtained show that the modulus values of X3-6004 are significantly lower than those of RTV-560 and the other three adhesives characterized at test temperatures from 550 to -175 F. At -175, -200 and -270 F, the modulus of X3-6004 is approximately the same as GE RTV-560 and the other three silicone adhesives. The X3-6004 adhesive exhibits good processing properties. It has a 12 percent lower density than RTV-560. Although lower in overall strength properties as compared to the other adhesives in the program, X3-6004 has adequate adhesion to 2024T81 aluminum to compete as an adhesive for attaching reusable surface insulation. It does exhibit some tendency to revert and soften at temperatures above 350 F when in a confined area.

Owen, H. P.↗
NASA NTRS1977

Exploratory study on the effects of novel diamine curing agents and isocyanate precursors on the properties on new epoxy and urethane adhesives

Aromatic diamines based on diphenyl sulfone and benzophenone were studied as epoxy adhesive curing agents. Previously found differences in adhesive strengths for meta vs para orientation were not found in these series. The use of aluminum and alumina as fillers in a m,m prime-methylene dianiline-cured epoxy adhesive was not found to be beneficial to adhesive strength. Alumina filled adhesives had much lower strength than unfilled adhesives. The unfilled m,m prime-methylene dianiline-based epoxy adhesive had excellent resistance to moisture relative to a p,p prime-methylene dianiline-based adhesive and maintained good strengths up to 250 F. A glass fiber composite based on a m,m prime-methylene dianiline-cured epoxy appeared to be equivalent to the p,p prime-methylene dianiline-cured epoxy as judged by short beam shear tests.

Glasgow, D. G.↗