Search NASA⌕ Search

SEARCH · Search NASA

Results for “adhesion”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Debonding-on-demand reversible adhesives via heat or light with competitive adhesion strength to conventional epoxy adhesives

Stimuli responsive debonding-on-demand (DoD) reversible adhesives are of great interest for the circular economy. However, the reversible adhesives developed so far often lack competitive adhesion strength in a bonding state. In this work, reversible epoxy adhesives based on Diels–Alder (DA) chemistry were developed and exhibited a competitive adhesion strength (e.g., 12 – 16 MPa of a lap shear strength) to commercial non-reversible epoxy adhesives. The reversible epoxy formulation showed superior thermal stability up to 110°C, and transition to a debonding state in the order of 0.1 MPa at 140°C, consequently, an on/off-type debonding behavior. The transition to a debonding state was attributed to crosslinking density control (e.g., decrease by 33% – 49%) through the reversible DA chemistry and the proximity to the glass transition. Next, for debonding by light stimulus, photothermal refractory plasmonic titanium nitride (TiN) nanoparticles were incorporated in the reversible epoxy, which can generate the required heat for debonding upon exposure to visible light. Photothermal debonding allows for precise debonding at target areas and tunable adhesion strength by controlling the exposure area and light intensity. The DA adhesive formulations containing 0.5 wt.% TiN nanoparticles presented a debonding state with zero adhesion under light exposure with intensity of 1670 mW/cm 2 (inducing 140°C). Even after three cycles of reattachment, the DA adhesive formulations retained 96% of the pristine sample’s adhesion strength measured at 110°C. Therefore, the DA adhesives are attractive candidates as reversible DoD systems applicable in higher temperatures.

42 ENGINEERING↗
DOE OSTI2024

Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures

This paper studied the evolution of air voids at the substrate-adhesive interface during the curing and bonding process of an epoxy-based adhesive between two glass substrates due to the sequence of adhesive placement, external pressure, and plasma treatment on substrates for bonding. The experimental results showed that a higher quantity of interfacial voids were generated during adhesive curing when the substrate was attached to the adhesive compared to when the adhesive was applied and distributed on the substrate. Such interfacial voids can be efficiently removed or reduced by applying slight pressure on the bonded structure during adhesive curing, or by leveraging plasma-treated substrates, as less reported in the literature. This work provided practical suggestions for preparing adhesive joints with minimized interfacial air voids to enhance bonding performance, particularly for dissimilar joints such as metal-CFRTP (carbon-fiber-reinforced thermoplastic polymer), as well as combinations with different types of polymer composites.

Qiao, Yao [BATTELLE (PACIFIC NW LAB)] (ORCID:00000↗
DOE OSTI2025

Chemically Recyclable and Tunable Polyolefin-Like Multiblock Copolymer Adhesives

Adhesives are important in creating multilayer products, such as in packaging and construction. Most current hot-melt adhesives such as poly(ethylene-co-vinyl acetate) (EVA) and polyurethanes lack chemical recyclability and do not easily de-bond, complicating recycling. Here, we achieved tunable adhesive properties of chemically recyclable polyolefin-like multiblock copolymers through regulating the incorporation of crystalline hard blocks, amorphous soft blocks, and ester content highlighted by adhesive strengths up to 6.80 MPa. We further demonstrated applications of these adhesives in multi-layer films and showed that the adhesives can be readily de-bonded, recovered, and chemically recycled. Overall, this study into structure-property relationships, including effects of crystallinity, soft-block incorporation, and ester content of the multiblock copolymers on adhesive properties, has resulted in a modular hot-melt adhesive platform that exhibits chemical recyclability for virgin-quality adhesive re-generation, reprocessability for repeated reuse of the recovered adhesive, and tunability for designing adhesives with a wide range of low to high (up to ~80% stronger than EVA) adhesion strengths.

36 MATERIALS SCIENCE↗
DOE OSTI2026

An Experimental and Numerical Study of Plasma Treatment Effects on Adhesive Joints of Metals, CFRTPs, and Metal–CFRTP Combinations

This work investigates the effects of plasma surface treatment on both the local adherend–adhesive interfacial strength and the global lap shear strength (LSS) of adhesively-bonded joints composed of metals, CFRTPs, and metal-CFRTP combinations, using AA6061 and CFRPPA as representative examples. Experimental and computational results show that plasma treatment improved the ratio of CFRPPA–adhesive interfacial normal strength to adhesive tensile strength (sint,n/scri,t,adhesive) from 0.59–1.00 to 0.91–1.73, leading to an average 90% increase in LSS for CFRPPA-related joints. In contrast, the LSS and sint,n/scri,t,adhesive values of AA6061–AA6061 joints (>=2.27) remained nearly unchanged after plasma treatment. The enhanced joint bonding was further supported by post-failure surface morphologies from three-dimensional profilometry and simulations, showing a transition from dominant interfacial failure to mixed modes involving interfacial, cohesive, and slight fiber-peeling failures. The LSS evolution with respect to sint,n/scri,t,adhesive was numerically established until the saturation of the LSS of various joints, and the behavior of AA6061–CFRPPA T-joints with varying interfacial strengths was also modeled. This study highlights the importance of local interfacial bonding strength, rather than global LSS, for understanding and optimizing the mechanical performance of adhesively-bonded composite–metal and composite-composite structures via different surface modification strategies.

Qiao, Yao (ORCID:0000000265867604)↗
DOE OSTI2026

Corrosion Resistance of Lignin-Based Thermoplastic Adhesive-Bonded Aluminum Joints

Adhesive-bonded joints are essential for lightweight, multimaterial automotive structures. We developed a lignin-based thermoplastic adhesive with adhesion strength comparable to conventional epoxy adhesives (20–23 MPa), while offering exceptional durability, recyclability, and corrosion resistance. Unlike commercial epoxy adhesives requiring refrigerated storage, our adhesive retains its bonding potential after a year of ambient conditioning. Bonded joints can be repeatedly disassembled and rejoined with less than 2% strength loss. After 500 h of salt fog exposure, the adhesive-bonded aluminum joints exhibited a 24% strength reduction, compared to 61% reduction in strength of joints based on a commercial epoxy adhesive.

Yu, Zeyang [ORNL] (ORCID:0000000209002374)↗
DOE OSTI2025

High-performance reversible adhesive from PET waste for underwater, structural, and pressure-sensitive applications

Developing versatile, tough, and sustainable adhesives that function effectively in both wet and dry environments is a major challenge. Here, we report a bioinspired design for versatile, tough, and reversible adhesives upcycled from consumer poly(ethylene terephthalate) (PET) waste. Our approach uses solvent-free, room-temperature dynamic cross-linking of deconstructed PET macromonomers with a diacetoacetate cross-linker, generating a dynamic, vinylogous urethane–bonded, amphiphilic adhesive. Tunable cross-linker concentration and amphiphilicity yield versatile adhesives suitable for underwater, structural, and pressure-sensitive applications on diverse substrates. Our adhesive exhibits high lap-shear strength and work of debonding under both wet and dry conditions, outperforming common commercial adhesives. The dynamic bonds enable thermal repair, on-demand multicycle debonding/rebonding, facile removal, and chemical recycling. Our strategy of transforming plastic waste into versatile, tough, and reversible adhesives offers a sustainable solution for both plastic waste management and next-generation adhesive design while also providing a commercially viable pathway for valorizing plastic waste.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2025

Functional group activation and coupling agent migration induced by plasma treatment in adhesive for enhanced toughness of metal-composite joints

Commercial adhesive paste was additionally activated using low-power oxygen plasma with different plasma exposure durations to investigate its interfacial bonding contribution in adhesively-bonded Aural-5/CFRP-PA6 double cantilever beam (DCB) joints with plasma-treated adherends. The plasma-treated adhesive showed enhanced functional peak intensities in Fourier transfer infrared spectroscopy (FTIR) as plasma exposure time was increased, and some degree of oxidation was also detected via X-ray photoelectron spectroscopy (XPS). A small molecule, dicyandiamde (coupling agent) in adhesive was migrated to adhesive layer, where double concentration of coupling agent was detected after 10 minutes of plasma treatment. As a result, characterization of the adhesive/CFRP-PA6 interface after DCB fracture showed additional chemical bonds formed through amine-initiated epoxy ring opening polymerization, as well as amide bonds and ester bonds. In conclusion, these additional bonds at the adhesive/CFRP-PA6 interfaces led to significantly increased failure extensions and fracture energies of the joints as the plasma exposure time on the adhesive increased, compared to the joints with plasma-treated adherends but non-plasma-treated adhesive as commonly seen in the literature.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Micro-structural features and material properties impact on adhesive metal joints via computational modeling and machine learning

The quality of structural bonding in practical applications depends on various factors arising from materials, pre-processing conditions, and manufacturing. Understanding how these factors influence bonding performance and determining their relative importance are of significant interest. Thus, this study evaluates the effects of microstructural features and material properties on the structural strength of adhesively-bonded metal joints at the submillimeter scale, utilizing a combination of Finite Element Modeling (FEM) and Machine Learning (ML) with Gradient Boosting Regression (GBR). The microstructural features include adhesive thickness, internal voids within the adhesive, adherend-adhesive interfacial voids, void size and volume fraction, and surface roughness. The material properties include the constitutive behavior of the adhesive, as well as the adherend-adhesive interfacial strength and fracture energy. The changes in structural strength and morphologies of the bonded metal structures with respect to different microstructural features and material properties were clarified by FEM. By further leveraging ML-GBR, the sequence of importance of these factors affecting bonding performance across various scenarios was summarized. This work provides valuable insights into the development of improved structural bonding for adhesive joints in industries such as automotive , aerospace, and beyond.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Adhesively Bonded Copper and Polyimide for Flexible Printed Circuit Boards: A Data-Driven Degradation Study Under Accelerated Aging

The long-term durability of polyimide laminated adhesive based flexible printed circuit boards (PCBs) is critical to the microelectronics industry. The interface of the adhesive layer binding the polyimide and copper layers is particularly vulnerable since decreased bonding strength can lead to deadhesion, performance loss, and premature device failure. Here, in this study, adhesive-bonded polyimide and copper samples are subjected to 1000 h of damp heat exposure (85 °C/85%RH) to evaluate the impact of moisture and copper inclusion on the adhesive bonding performance. Significant copper diffusion through the adhesive layer is observed, which, combined with moisture uptake, is found to substantially weaken interfacial adhesion in copper-containing samples, thereby reducing device lifetime. Observed surface and bulk material changes are correlated to adhesion strength using the network structural equation modeling (netSEM) approach, resulting in a robust predictive model of performance degradation based on measurable materials properties.

Chemistry↗
DOE OSTI2025

Adhesion of Self-Complementary, Sinusoidal Surfaces Fabricated Using Two-Photon Polymerization

Microscale, pick-and-place assembly is a non-lithographic assembly method poised to impact diverse fields including flexible electronics, microfluidics and robotics. However, a major technological challenge is the need to deterministically control adhesion between parts. Here, switchable adhesion involving 3D-printed, self-complementary surfaces is demonstrated. Mechanical properties of metasurfaces pressed against flat, rigid substrates are modeled using finite element methods. A series of flat slabs and metastructured slabs with 2D sinusoidal surfaces are printed using two-photon polymerization (2PP) of a shape-memory resin. The surface frequency of featured slabs was varied between $3.\bar3$ mm −1 and $26.\bar6$ mm −1 with similar amplitudes. Adhesion between printed metasurfaces and glass and between printed, self-complementary metasurfaces is studied above and below the cured resin’s glass transition temperature (∼45 °C). Simple heating of adhering surfaces to above 60 °C lowers adhesion, and compression of surfaces while above the glass transition temperature followed by cooling to room temperature elevates adhesion. The nominal adhesive strength between printed, self-complementary surfaces, as determined by the maximum observable pull-off stress, exceeds 3 MPa. Further tailoring complementary surfaces for adhesion control may facilitate microscale disassembly for recovery of components or precious metals.

amorphous materials↗
DOE OSTI2026

Strong and recyclable bio-derived poly(ester amide) hot-melt adhesive

Bio-based adhesives offer inherent advantages over conventional petrochemical-derived systems, including renewable sourcing, reduced environmental impact and potential degradability. However, most bio-based adhesives suffer from poor adhesion strength, limited substrate compatibility and a lack of chemical recyclability. Here, in this work, we present a bio-derived multiblock poly(ester amide) adhesive that leverages microphase segregation between different segments to reconcile mechanical robustness with strong interfacial bonding. Notably, this multiblock architecture is accessed through a one-pot, selective acceptorless dehydrogenative polymerization, obviating the need for multistep synthesis. The materials exhibit excellent adhesion across a range of substrates including metals, glass and wet wood surpassing commercial benchmarks, while also demonstrating thermal stability, tunable mechanical properties and closed-loop chemical recyclability even in the presence of other commodity plastics. Furthermore, the adhesive strength of these materials could be tuned for various potential applications through control over the chemical composition of the polymer. By integrating renewable feedstocks, high-performance functionality and efficient chemical circularity within a single platform, this work provides a viable pathway toward more sustainable adhesive technologies and contributes to advancing circular materials manufacturing.

09 BIOMASS FUELS↗
DOE OSTI2026

Lessons from the IEC Durability of Adhesion Accelerated Test Sequence

The IEC 62788-1-1 and IEC 63209-2 standards use aging sequences for durability of adhesion in photovoltaic (PV) modules, which may be evaluated using the single cantilever beam (SCB) test. Because the encapsulant forms critical interfaces with the front glass and solar cells, degradation at those interfaces under ultraviolet (UV) exposure, elevated temperature, and humidity can lead to interfacial delamination - compromising the long-term reliability. In this work, adhesion durability of UV-transmitting poly(ethylene-co-vinyl acetate) (EVA) encapsulant to glass and to silicon solar cells is evaluated after sequenced UV and damp heat aging (85C/85%RH). Laminates were prepared using StarPhire solar front glass with thin glass or PERC cells, and two EVA formulations with different concentrations of siloxane coupling agent. Adhesion was quantified by measuring critical debond energy using the SCB method. Both formulations exhibit similar qualitative trends, while different adhesion is observed at the periphery despite the use of low-shrink manufacturing. The results show that while glass/EVA adhesion remains stable or increases after UV exposure and shows only moderate changes after damp heat, the EVA/cell interface exhibits an irreversible loss of adhesion following UV and then damp heat exposure. Although glass/EVA interfaces generally exhibit lower debond energies, the EVA/cell interface is significantly more vulnerable to UV-driven degradation, identifying it as the dominant reliability risk location through early- and intermediate-module life. These results demonstrate that accelerated aging sequences can expose large, interface-specific losses in adhesion durability and underscore the importance of interface engineering for long-term PV module reliability.

14 SOLAR ENERGY↗
DOE OSTI2025

Stereomicrostructure-regulated biodegradable adhesives

Commercial adhesives are petroleum-based thermoset networks or nonbiodegradable thermoplastic hot melts, making them ideal targets for replacement by biodegradable alternatives. Poly(3-hydroxybutyrate) (P3HB) is a biorenewable and biodegradable alternative to conventional plastics, but microbial P3HB, which has a stereoperfect stereomicrostructure, exhibits no adhesion. Here, in this study, by elucidating the fundamental relationship between chemocatalytically engineered P3HB stereomicrostructures and adhesion properties, we found that biodegradable syndio-rich P3HB exhibits high adhesion strength and outperforms common commercial adhesives, whereas syndiotactic, isotactic, or iso-rich P3HB shows no measurable adhesion. The syndio-rich stereomicrostructure brings about desired thermomechanical and viscoelastic properties of P3HB that enable strong adhesion to a range of substrates tested, including aluminum, steel, glass, and wood, and its performance is insensitive to molar mass and reprocessing or reuse.

36 MATERIALS SCIENCE↗
DOE OSTI2026

Decoupling the effects of substrate hardness and roughness upon particle adhesion in cold spray

There are two stages of particle adhesion relevant to cold spray: adhesion of the first layer to the substrate, followed by inter-particle adhesion during subsequent deposition. In this work we study the second of these, in which particles strike a previously-deposited layer that is roughened and hardened by prior particle impacts. Specifically, we decouple the effects of surface roughness and hardness on particle adhesion for copper-on-copper impacts. We measure changes to the critical velocity, V cr , in single particle impacts produced by the Laser Induced Particle Impact Test on several surfaces including a cold sprayed surface and a polished version of that surface. We find that increases in both substrate roughness and hardness suppress particle adhesion to higher velocities, indeed in rather equal proportion by ∼10–15% each. This suggests that there is a higher V cr associated with coating build-up (particle-particle bonding) that is overall ∼30% higher than V cr for particle-substrate adhesion.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Corrosion resistant hot melt adhesive to bind metals

Hot melt adhesives (HMAs) play an important role in many industries, and their demand is expected to grow. HMAs don't require any solvents, and their application results in the formation of strong bonds with the substrate upon cooling within seconds. These properties differentiate them from liquid glues and make them preferable for practical application. Currently, commercial HMAs are used in bonding lightweight materials such as paper, polymers, and cartons, and have limited usage in areas necessitating the bonding of heavier objects like metals. Here, in this study, we report a design and testing of versatile platform comprising an ion-coordinating polymer and ionic fillers for performance optimization and understanding of structure–property relationships, enabling the rational design of HMAs with improved adhesion to metal surfaces. All-atom Molecular dynamics (MD) simulations and various characterization methods are used to elucidate the adhesion mechanism in model composite system containing polyethylene oxide mixed with chemically diverse salt particles. The maximum adhesion strength is found in composites with Al(OH) 3 and FeCl 3 fillers. Interestingly, the presence of Al(OH) 3 also provides a multifunctional anticorrosion property as measured electrochemically using the Tafel method. The discovered path to formulations with improved adhesion to metal surfaces constitutes an important step toward advancing HMAs for use in the structural and semi-structural metal work domain.

Adhesive and cohesive forces↗
DOE OSTI2025

In Situ Measurement of Adhesion for Multimetallic Nanoparticles

The adhesion of nanoparticles to their supports is key to their performance and stability. However, scientific advances in this area have been hampered by the difficulty of experimentally probing adhesion. To date, only a single technique has been developed that can directly measure nanoparticle adhesion, and this technique is inherently limited to monometallic systems. We present a versatile technique for the direct measurement of adhesion for bimetallic nanoparticle systems. This technique combines the spatial resolution of transmission electron microscopy with the force resolution of an atomic force microscope to probe individual, well-characterized nanoparticles. A first study of supported bimetallic nanoparticles provides new insights into the complex impact of alloying on nanoparticle adhesion, explained by charge transfer between constituent metals. The new experimental technique is readily extensible to study other multimetallic nanoparticle systems, including the effects of particle size, shape, and orientation, thus enabling advances in our understanding of nanoparticle physics.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components

The successful adoption of additive manufacturing for the rapid prototyping of direct-write printed electronics requires the establishment of quantifiable metrics that can interrogate device performance. One measure of performance is the adhesion strength between the substrate and printed film interface, which is critical since the strength of this interface can dictate the accuracy and reliability of the printed device. In this work, a non-contact laser-induced spallation technique was used to quantify the adhesion of silver printed films on aluminum alloy substrates. The laser-based method was compared to a standardized pull-off adhesion test, which provided baseline measurements of adhesion strength. The sintering conditions were shown to play an important role in the film-substrate adhesion strength, as well as the cohesion and ductility of the film itself. The methods and results described in this work support the establishment of process control steps that are necessary for quickly verifying the reliability of printed devices prior to their deployment in critical experiments.

Adhesion test↗
DOE OSTI2026

Interfacial Adhesion Mechanism of Anionic Polyelectrolyte Brushes Induced by Oppositely Charged Macromolecular Counterions

Abstract Polyelectrolyte brushes are widely used as model systems for investigating electrostatic interactions at soft interfaces and to achieve exceptional lubrication properties. Previous studies have primarily focused on their behavior in the presence of multivalent counterions, which induce brush collapse, ionic crosslinking, and pronounced changes in interfacial structures. However, interactions between polyelectrolyte brushes and oppositely charged macromolecular counterions, such as polycations, remain poorly understood. Here, we prepare well-defined polystyrene sulfonate (PSS) brushes fabricated via surface-initiated grafting and employ surface forces apparatus measurements to investigate their interactions with oppositely charged polycations. In contrast to multivalent ions, polycations do not induce noticeable brush collapse, but instead generate significant adhesion between symmetric PSS brush layers. This adhesion increases with both contact time and applied load, eventually reaching a steady plateau, indicating that the interaction is governed not simply by electrostatic screening but by the gradual formation of polycation-mediated bridging under confinement. Furthermore, the introduction of monovalent Na+ ions disrupts the adhesive interaction even at very low concentrations, suggesting that the bridging function of the adsorbed polycation is highly sensitive to competitive ionic screening. In comparison, measurements with trivalent counterions reveal the expected brush collapse behavior but minimal dependence of adhesion on contact time, highlighting a clear mechanistic distinction from the polymeric counterion case. Collectively, these results demonstrate that molecular size, configurational restriction, and confinement-induced rearrangement, rather than charge valency alone, govern the interaction behavior of macromolecular counterions at brush interfaces. This work provides new insight into the molecular origins of adhesion and the regulation of interfacial interactions in charged polymer brush systems.

Park, Jinwoo [Argonne National Laboratory , , , ,;↗