Search NASA⌕ Search

SEARCH · Search NASA

Results for “adhesive failure”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Experiments and modelling of adhesive failure initiation of an epoxy underfill: a study of electronic packaging survivability

Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. For this study, data from epoxy bond failure in mock electronic part assemblies were correlated to finite element analyses to predict adhesive failure initiation. Experiments were performed to determine failure loads for various loading locations and nonlinear viscoelastic analyses were performed for the same loading locations to determine a maximum principal strain failure parameter. Predictions showed that a maximum principal strain failure parameter defined from one test could be used as an indicator of adhesive failure of an epoxy bond undergoing other modes of loading. Failure initiation predictions matched experimental data using a maximum principal strain failure parameter for an epoxy bond undergoing mixed modes of loading for both unfilled and alumina oxide filled 828DEA epoxy. Such experimental setup is deemed appropriate for future epoxy testing.

42 ENGINEERING↗
NASA NTRS1984

Fracto-emission accompanying adhesive failure

The fractoemission characteristics of various material interfaces have been investigated experimentally. The interfaces studied include brittle materials/epoxy, glass/elastomers and brittle materials/pressure sensitive adhesives. Results are presented for both large (1 sq cm) planar surfaces together with a few small microns fibers (E-glass, S-glass, Kevlar, and graphite), and a small (10-500 micron) particles in polymer matrices. The composition and energies of the particles emitted during adhesive failure were measured over a wide range of time scales by means of conventional particle counting techniques and photon imaging. Measurements of the time dependence, energy distribution, crack velocity dependence, and spatial distribution of fractoemissive particles are also presented. Some correlations between the various fractoemission components are described in detail.

Dickinson, J. T.↗
NASA NTRS2019

The Analysis of Adhesive Residue Failure

Adhesives have always been, and will continue to be, a crucial component of assembling flight hardware. Unfortunately, adhesives have a long standing history of being a source of costly contaminations. There are currently no existing documents that can aid a technician in discerning the proper adhesive/substrate combinations, nor the optimal solvent to use when removing adhesive residue. This project seeks to evaluate the performance of adhesive tapes on various flight hardware substrates in order to create an easy-to-use guide for spacecraft ground processing. The analyses performed were the adhesive/solvent solubility, SEM examinations, and peel adhesion tests. The solubility tests showed that amyl acetate, acetone, and MEK were the most successful in dissolving the adhesives. The SEM data gives preliminary insight into the morphology of the residues. Lastly, the peel adhesion testing proved that there is no relationship between the length of time the adhesive was applied and its adhesive strength.

Smiley, Adrienne↗
NASA NTRS1972

A fracture mechanics analysis of adhesive failure in a single lap shear joint.

Discussion of adhesive fracture of single lap shear joints in terms of a maximum stress criterion and an energy balance. The Goland and Reissner (1944) analysis is used to determine the stress distribution in the adhesive assembly, and the results obtained are introduced into an energy balance to determine the initiation of adhesive fracture. In the stress analysis the loads at the edges of the joint are first determined. This is a problem in which the deformation of the joint sheets must be taken into account and is solved by using the finite-deflection theory of cylindrically bent plates. Then the stress in the joint due to applied loads is determined. This problem is formulated as one in plane strain consisting of two rectangular sheets of equal thickness and unit width. With the aid of this stress analysis and the stresses obtained from the conditions of equilibrium the contributions to the energy change with crack length are calculated. The analysis performed is then compared with a maximum stress criterion for a lap joint.

Devries, K. L.↗
DOE OSTI2023

A Micro-scale Numerical Investigation of Internal and Interfacial Void Defects in Adhesive on Failure Behavior of Adhesively-Bonded Materials with Rough Surfaces

This paper studied the effects of air void defects on the failure behavior of adhesively-bonded materials under global shear via micro-scale computational modeling. The numerical results indicated that interfacial void defects can largely facilitate interfacial debonding of a weaker adherend/adhesive interface under shear. However, this is not the case for a stronger adherend/adhesive interface, showing the reduction on the nominal shear strength of an adhesive joint is mainly due to internal void defects. The reduced bonding performance due to voids can be improved by leveraging an appropriate surface roughness. This preliminary investigation is a first step to better understand the micro-mechanics of interfacial failure in the adhesion of a roughened/patterned adherend via surface modification(s) and an adhesive, and also shows the importance of minimizing interfacial void defects in particular at a weaker adherend/adhesive interface via different techniques.

Qiao, Yao↗
NASA NTRS1986

The role of damage-softened material behavior in the fracture of composites and adhesives

Failure mechanisms of materials under very high strains experienced at and ahead of the crack tip such as formation, growth, and interaction of microvoids in ductile materials, microcracks in brittle solids or crazes in polymers and adhesives are represented by one-dimensional, nonlinear stress-strain relations possessing different ways by which the material loses capacity to carry load up to fracture or total separation. A double cantilever beam (DCB) type specimen is considered. The nonlinear material is confined to a thin strip between the two elastic beams loaded by a wedge. The problem is first modeled as a beam on a nonlinear foundation. The pertinent equation is solved numerically as a two-point boundary value problem for both the stationary and the quasi-stationay propagating crack. A finite element model is then used to model the problem in more detail in order to assess the adequacy of the beam model for the reduction of experimental data to determine in-situ properties of the thin interlayer.

Ungsuwarungsri, T.↗
NASA NTRS1982

Surface characterization and failure analysis of thermally aged, polyimide bonded titanium

This study of high temperature stable adhesive systems using 6Al-4V titanium adherends found that certain adhesive/adherends exhibit a change from cohesive to adhesive failure mode during long term 450 F thermal aging. Lap-shear specimens which exhibited adhesive failures were subjected to failure analysis using scanning transmission electron microscopy (STEM) and surface analysis techniques. Data is presented which supports the conclusion of interfacial failures for these samples.

Peters, P. D.↗
NASA NTRS1982

The effects of inherent flaws on the time and rate dependent failure of adhesively bonded joints

Inherent flaws, as well as the effects of rate and time, are shown by tests on viscoelastic adhesive-bonded single lap joints to be as critical in joint failure as environmental and stress concentration effects, with random inherent flaws and loading rate changes resulting in an up to 40% reduction in joint strength. It is also found that the asymptotic creep stress, below which no delayed failure may occur, may under creep loading be as much as 45% less than maximum adhesive strength. Attention is given to test results for the case of titanium-LARC-3 adhesive single-lap specimens.

Sancaktar, E.↗
DOE OSTI2023

A Hybrid Physics-Based, Data-Driven Approach to Model Damage Accumulation in Corrosion of Polymeric Adhesives

The degradation of polymeric adhesives in dissimilar joints is a menace to electric and structural components of the automotive industry. In polymeric adhesives, failure often occurs due to damage accumulated from discrete environmental sources—thermal degradation, oxidation, hydrolysis, radiation, and moisture—that are combined with progressive damage mechanisms, such as aging and fatigue. Because most damage mechanisms that lead to degradation act in parallel, the estimation of the lifetime of a polymeric material becomes a significant reliability issue, no study currently exists that can simultaneously consider even two of these phenomena. Most current efforts are directed toward a single-phenomenon, single-model approach in which a model is developed to cover one specific damage mechanism. While this approach is advantageous in exploring single mechanisms, it is strongly inconclusive for degradation that occurs by multiple damage mechanisms. Our team plans to take a fresh perspective by designing a hybrid constitutive/data-driven approach that allows models of different damage mechanisms to be integrated into one model and then used to explore the degradation-induced failure of polymeric adhesives. The theoretical-computational part of this work is divided into four research components as described in the Approach section below.

36 MATERIALS SCIENCE↗
NASA NTRS1978

Adhesive/cohesive strength of a ZrO2.1-2 w/o Y2O3/NiCrAIY thermal barrier coating

The room temperature adhesive/cohesive strength of a 0.05 cm thick ZrO2.12w/oY2O3/0.013 cm thick NiCrAlY thermal barrier coating system (TBC) was investigated. The weakest link was the oxide/NiCrAlY interface region with a strength of 6.2 MN/sq m. The fracture was about half cohesive oxide failure, half oxide/NiCrAlY adhesive failure and 1 percent cohesive NiCrAlY failure. The TBC failed in a similar manner in 950 C tensile and compression tests. The oxide stripped from the TBC had a cohesive strength of 24.6 MN/sq m. The NiCrAlY had a cohesive strength of 25.1 MN/sq m. The NiCrAlY and oxide failed primarily at interparticle boundaries.

Levine, S. R.↗
NASA NTRS1985

Characterization of mode 1 and mixed-mode failure of adhesive bonds between composite adherends

A combined experimental and analytical investigation of an adhesively bonded composite joint was conducted to characterize both the static and fatigue beyond growth mechanism under mode 1 and mixed-mode 1 and 2 loadings. Two bonded systems were studied: graphite/epoxy adherends bonded with EC 3445 and FM-300 adhesives. For each bonded system, two specimen types were tested: a double-cantilever-beam specimen for mode 1 loading and a cracked-lapshear specimen for mixed-mode 1 and 2 loading. In all specimens tested, failure occurred in the form of debond growth. Debonding always occurred in a cohesive manner with EC 3445 adhesive. The FM-300 adhesive debonded in a cohesive manner under mixed-mode 1 and 2 loading, but in a cohesive, adhesive, or combined cohesive and adhesive manner under mode 1 loading. Total strain-energy release rate appeared to be the driving parameter for debond growth under static and fatigue loadings.

Mall, S.↗
NASA NTRS1986

Characterization of mode I and mixed-mode failure of adhesive bonds between composite adherends

A combined experimental and analytical investigation of an adhesively bonded composite joint was conducted to characterize both the static and fatigue beyond growth mechanism under mode 1 and mixed-mode 1 and 2 loadings. Two bonded systems were studied: graphite/epoxy adherends bonded with EC 3445 and FM-300 adhesives. For each bonded system, two specimen types were tested: a double-cantilever-beam specimen for mode 1 loading and a cracked-lapshear specimen for mixed-mode 1 and 2 loading. In all specimens tested, failure occurred in the form of debond growth. Debonding always occurred in a cohesive manner with EC 3445 adhesive. The FM-300 adhesive debonded in a cohesive manner under mixed-mode 1 and 2 loading, but in a cohesive, adhesive, or combined cohesive and adhesive manner under mode 1 loading. Total strain-energy release rate appeared to be the driving parameter for debond growth under static and fatigue loadings.

Mall, S.↗
DOE OSTI2020

Investigation of Failure Modes, Mechanisms and Driving Forces for Electrically Conductive Adhesives as Interconnects in PV Modules

In this work we describe our current progress into investigating the reliability of ECA interconnects for PV modules. Preliminary thermal cycling experiments demonstrated that both cohesive and adhesive failure of the ECA joint are relevant failure modes that result in an increase of the joints electrical resistance. A thorough viscoelastic characterization of the candidate ECA was conducted to enable accurate numerical modeling of the joint’s response to thermal cycling. Combined with critical and subcritical fracture measurements, the numerical model elucidates that an additional fatigue mechanism exists which can result in fracture well below subcritical debonding threshold values. It is also demonstrated that fracture of the ECA is more sensitive to humidity than temperature and subcritical debonding mechanisms do exist which are again more sensitive to humidity.

41 EE - Solar Energy Technologies Office (EE-4S)↗
NASA NTRS2014

Adaptive Shape Functions and Internal Mesh Adaptation for Modelling Progressive Failure in Adhesively Bonded Joints

Enhanced finite elements are elements with an embedded analytical solution that can capture detailed local fields, enabling more efficient, mesh independent finite element analysis. The shape functions are determined based on the analytical model rather than prescribed. This method was applied to adhesively bonded joints to model joint behavior with one element through the thickness. This study demonstrates two methods of maintaining the fidelity of such elements during adhesive non-linearity and cracking without increasing the mesh needed for an accurate solution. The first method uses adaptive shape functions, where the shape functions are recalculated at each load step based on the softening of the adhesive. The second method is internal mesh adaption, where cracking of the adhesive within an element is captured by further discretizing the element internally to represent the partially cracked geometry. By keeping mesh adaptations within an element, a finer mesh can be used during the analysis without affecting the global finite element model mesh. Examples are shown which highlight when each method is most effective in reducing the number of elements needed to capture adhesive nonlinearity and cracking. These methods are validated against analogous finite element models utilizing cohesive zone elements.

computational mechanics↗
DOE OSTI2023

Structure, Function, and Application of Self–Healing Adhesives from Mistletoe Viscin

Berries from the European Mistletoe (Viscum album) possess a sticky tissue called viscin that facilitates adhesion and germination onto host trees. Recent studies of viscin have demonstrated its adhesive capacity on a range of natural and synthetic surfaces including wood, skin, metals, and plastic. Yet, the underlying mechanisms remain poorly understood. Here, an investigation of the adhesive performance of mistletoe viscin is performed, demonstrating its hygroscopic nature and ability to self-heal following adhesive failure. It is identified that adhesion originates from a water-soluble adhesive component that can be extracted, isolated, and characterized independently. Lap shear mechanical testing indicates that the mistletoe adhesive extract (MAE) outperforms native viscin tissue, as well as gum arabic and arabinogalactan—common plant-based adhesives. Furthermore, humidity uptake experiments reveal that MAE can reversibly absorb nearly 100% of its mass in water from the atmosphere. In-depth spectroscopic and mass spectrometry investigations reveal a composition consisting primarily of an atypical arabinogalactan, with additional sugar alcohols. Finally, several proof-of-concept applications are demonstrated using MAE for hygro-responsive reversible adhesion between various surfaces including skin, plastic, PDMS, and paper, revealing that MAE holds potential as a biorenewable and reusable adhesive for applications in cosmetics, packaging, and potentially, tissue engineering.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Reliability and Lifetime Prediction Model of Sintered Silver Under High-Temperature Cycling

Although excellent reliability has been reported for sintered silver as a die-attach material under both thermal and power cycling loads in power electronics applications, the promise of this material as a large-area attachment at temperatures beyond 200 degrees C needs to be investigated. This paper presents insights into the thermomechanical behavior and reliability of sintered silver under extreme thermal cycling conditions. In this study, we bonded sintered silver samples and subjected it to a thermal cycling profile of -40 °C to 200 °C with high ramp rates. We periodically monitored samples under thermal cycling to detect the presence of any failure mechanisms using a scanning acoustic microscope. We also included 95Pb5Sn solder in the study to obtain reference data. Results show the occurrence of cracks in sintered silver followed by a rapid rate of crack growth that exceeded the failure criterion in just 50 cycles. The predominant failure mechanism we observed was adhesive failure. As a large-area attachment, solder exhibited a higher reliability than sintered silver but failed within 100 cycles. Finally, we performed thermomechanical modeling to compute strain energy density values and correlated these with the experimentally observed crack growth rates to formulate a lifetime prediction model for sintered silver.

30 DIRECT ENERGY CONVERSION↗
NASA NTRS2004

Space Shuttle Columbia Reconstruction Effort: An Analysis of the Thermal Protection System.

Upon the breakup of the Space Shuffle Columbia, which occurred during peak heating, at an altitude of 200,000 feet, and traveling at Mach 19, the daunting responsibility was placed upon National Aeronautics and Space Administration (NASA) to determine the root cause of the accident. One of the foremost tasks was to begin locating Columbia's debris, which was scattered acr ss a 2,000 square miles area of Texas and into western Louisiana. Each potential shuttle debris piece found was categorized and the longitude and latitude noted. This provided crucial data to the vehicle's breakup trajectory path and aided in locating key shuffle components. Since the airframe and tiles would be the primary focus during the reconstruction effort at the Kennedy Space center in Florida, packing and shipping was crucial to the preservation of the shape and condition of each recovered object. Over 83,000 pieces of Columbia, in a five-month timeframe, were located. The recovered tiles still bonded to structure indicated failures modes due to heating and aerodynamic loads. Also, different types of tile bond failure modes were observed, with adhesion failures at the Koropon layer or material failure at the tile's densification layer. Numerous tiles had the identification markings burned off, slumping of the Reaction-Cured Glass (RCG) coating, and of the Ll-900 silica base material. The conditions in which the tiles were found resulted in developing methods to aid in the identification of the tile. Correctly identifying each tile was critical to understanding the heating patterns of the tiles in relationship to the vehicle, since it was known that the lower left wing received the initial external tank foam impact. With the aid of multiple disciplines, the clues found in the TPS debris, lead to the root cause of the breakup of Columbia.

Micklos, Ann M.↗