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Results for “aerosol-jet printing”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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DOE OSTI2024

Aerosol-Jet Printed Transferable Millimeter-Wave Circuits

Printed millimeter wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-Dimension Heterogeneous Integration (3DHI) to improve performance beyond traditional systems. Here, in this paper, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A PDMS stamp assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.

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DOE OSTI2024

High Precision, High Frequency Printed Antennas

An emerging trend in advanced manufacturing is printed electronics and sensors. The ability to print customized electronics and sensors integrated into functional packages is a growing need within a variety of growing markets such as smart manufacturing, internet of things (IoT), and the small satellite industry. Both Oak Ridge National Laboratory (ORNL) and the MITRE Corporation have seedling research efforts evaluating the potential for future printed electronic systems. High frequency, wide-bandwidth phased array antennas (i.e. >45 GHz) open the door to new applications. However, such sensors require currently prohibitively small feature sizes for commercial 3D printing technologies along with increasing challenges with connecting the driving electronics to such features. An additional finding with related advanced manufacturing challenges is the rapid production of 3D additive connectors for integration with commercial printed circuit boards (PCBs), primarily for advanced in-circuit inspection techniques. This work is developing additive manufacturing processes for producing connected and conductive fine scale 3D features. The primary focus was on aerosol-jet printing (AJP), which has a small minimum resolution (<50 µm) but is traditionally printed flat with small height/width aspect ratios <<1, and developing controls to enable fully 3D, high aspect ratio, and unsupported features. In Phase 1 of this effort, baselines of process performance were characterized, and test coupons produced for both ultra-high frequency antennas and microstructures to support reverse engineering of PCBs. In Phase 2, these efforts will be extended for system demonstration of ultra-high frequency antenna arrays, as well as reverse engineering circuitry for dense PCBs.

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DOE OSTI2025

Direct‐Write Printed Contacts to Layered and 2D Materials

Advancements in fabrication methods have shaped new computing device technologies. Among these methods, depositing electrical contacts to the channel material is fundamental to device characterization. Novel layered and 2D materials are promising for next-generation computing electronic channel materials. Direct-write printing of conductive inks is introduced as a surprisingly effective, significantly faster, and cleaner method to contact different classes of layered materials, including graphene (semi-metal), MoS 2 (semiconductor), Bi-2212 (superconductor), and Fe 5 GeTe 2 (metallic ferromagnet). Based on the electrical response, the quality of the printed contacts is comparable to what is achievable with resist-based lithography techniques. These devices are tested by sweeping gate voltage, temperature, and magnetic field to show that the materials remain pristine post-processing. This work demonstrates that direct-write printing is an agile method for prototyping and characterizing the electrical properties of novel layered materials.

2D materials↗