The NASA Electronic Parts and Packaging (NEPP) Program - Automotive Electronics
Overview of NEPP Automotive Electronics Plans.
reliability↗
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The NASA Electronic Parts and Packaging (NEPP) Program: NEPP Overview - Automotive Electronics
The results of NASAs studies into the appropriateness of using U.S. Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Council's AECQ standardization program, the second part provides a summary of the results of NASA's procurement and testing experiences and other lessons learned along with preliminary test results.
Reliability↗
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
Abstract Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With the rise of electric and hybrid electric vehicles (EVs and HEVs), combined with a desire to miniaturize, the challenge of removing enough heat from electronic devices in automotive vehicles is evolving. This paper closely examines the new challenges in thermal management in various driving environments and aims to classify each existing cooling method in terms of performance. Particular focus is placed upon emerging solutions regarded to hold great potential, such as phase-change materials (PCMs). PCMs have been regarded for some time as a means of transferring heat quickly away from the region with the electronic components and are widely regarded as a possible means of carrying out cooling in large scale from small areas, because of their high latent heat of fusion, high specific heat, temperature stability, and small volume change during phase change, etc. They have already been utilized as a method of passive cooling in electronics in various ways, but their adoption in automotive power electronics, such as in traction inverters, has yet to be fulfilled. A brief discussion is made on some of the potential areas of application and challenges relating to more widespread adoption of PCMs, with reference to a case study using computational model of a commercially available power module used in automotive applications.
Engineering↗
The energy footprint of automotive electronic sensors
We discuss how Information and communication technologies (ICT) have emerged as one of the leading technologies to reduce global emissions, particularly in the mobility sector. Automotive electronics, such as sensors/actuators and microcontrollers (commonly known as electronic control units (ECU) which control one or more of the electrical systems or subsystems in a vehicle), play a key role in ICT. Sensors/actuators are key in electronic ICT devices, starting with the data collection and data communication with the internet. The latest two big trends of electrification and automation in vehicles, are projected to increase the use of worldwide automotive sensors from 7.5 billion units in 2017 to 11.0 billion units by the year 2024. A representative state-of-the art automotive sensor system, (i.e., an ultrasonic backup system), including the ECUs controlling the vehicle electrical systems/subsystems, has been considered to estimate the energy footprint in terms of manufacturing and operational energy of global automotive sensors use. A widely used life cycle energy assessment method (i.e., cumulative energy demand) was used as both direct and indirect (including the extraction, manufacturing, and disposal of the raw and auxiliary materials) energy use can be considered for the energy footprint estimation. The embodied manufacturing energy impacts of the system was estimated to be 559 MJ/system, compared to the 417 MJ/system for lifetime system power and additional gasoline use. The share of purchased energy to the embodied energy where the upstream energy isn't included in the former case, is less than 10% and ~ 85% for the component manufacturing and vehicle operation energy uses, respectively. As the purpose of this ultrasonic backup system is to prevent rear crashes, an estimated 1.0 MJ/system is avoided from reduced lifetime vehicular repairs (from an estimated 11% chance of requiring a rear bumper replacement). While all of this is small compared to the overall automotive manufacturing and use energy, the 11 billion automotive sensors expected to be produced in 2024 could require 1540 PJ for manufacturing and those sensors would require an additional 780–1150 PJ for lifetime energy use.
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics
This paper describes the design and performance of a dielectric fluid cooling concept for automotive power electronics. The concept combines a low-thermal-resistance package (which eliminates metalized ceramic substrates) with a high-performance convective cooling strategy (slot jets impinging on finned surfaces). Modeling was first used to design the cooling system to maximize thermal performance and minimize pumping power. Additionally, a prototype was then fabricated, and experiments were conducted to validate the model predictions using three fluids at various fluid flow rates (16.7 cm 3 /s [1 L/min] to 68.3 cm 3 /s [4.1 L/min]) and inlet temperatures (30C and 70C). The final design was compact (120-cm 3 total volume, including heat exchanger and conceptual power modules) and cooled 12 devices (e.g., silicon carbide). The validated model was then used to predict the junction-to-fluid thermal resistance and pumping power for various conditions, including 40C fluid temperature. The results predict thermal resistance values as low as 19 mm 2 K/W are possible using the dielectric fluid cooling approach. The dielectric fluid cooling system is predicted to provide thermal resistance and pumping power values that are approximately 56% and 90% lower, respectively, compared to an automotive power electronics cooling system.
30 DIRECT ENERGY CONVERSION↗
Thermomechanical Reliability Aspects of Automotive Power Electronics: Current Status and Future Trends
Common failure locations (e.g., wire bonds, solder interface) and mechanisms within traditional automotive power electronics package designs and reliability concerns associated with packaging at higher temperatures and higher heat fluxes will be discussed. Examples of packaging solutions that increase mechanical reliability will be presented and state-of-health (SOH) estimation using offline and online (in situ) techniques will be described.
ADVANCED PROPULSION SYSTEMS,DIRECT ENERGY CONVERSI↗
An Overview Of NASA Automotive Component Reliability Studies
The results of NASAs studies into the appropriateness of using US Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Councils AECQ standardization program, the second part provides a summary of the results of NASAs procurement and testing experiences and other lessons learned along with preliminary test results.
alternate grade electronics↗
An Overview of NASA Automotive Component Reliability Studies
The results of NASAs studies into the appropriateness of using US Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Councils AECQ standardization program, the second part provides a summary of the results of NASAs procurement and testing experiences and other lessons learned along with preliminary test results.
Automotive electronics↗
An Overview of NASA Automotive Component Reliability Studies
The results of NASAs studies into the appropriateness of using US Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Councils AECQ standardization program, the second part provides a summary of the results of NASAs procurement and testing experiences and other lessons learned along with preliminary test results.
Automotive electronics↗
Automotive Power Electronics and Electric Machine Thermal Management
The transition to modular and scalable electrified vehicle transportation requires technologies to improve power density within cost and reliability constraints to maximize vehicle platform flexibility. Key research challenges arise due to the limited packaging space, coolant distribution, electrical connections, and ambient temperatures. Challenges include thermal management for compact power-dense electric machines and the associated power electronics for power management within the vehicle. High-temperature silicon and wide-bandgap (WBG) based power electronics systems are of interest to enable compact and efficient electric drive systems. The higher temperatures present packaging challenges for thermal management and reliability. In this work, we provide an overview of research for thermal characteristics of materials, packages and thermal management approaches for enabling compact power dense automotive electric drive systems.
DIRECT ENERGY CONVERSION↗
Automotive Power Electronics Cooling Technology Research at NREL
This presentation describes power electronics thermal management technologies used for on-road EVs. Examples are provided and heat exchangers are described. Advanced cooling technologies developed are NREL to enable increased power density and enable high WBG temperature operation are then presented. The performance (e.g., thermal resistance, pumping power) of the advanced power electronics cooling technologies are compared to the performance of current, on-road technology.
ADVANCED PROPULSION SYSTEMS↗
Ceramic Powders
In developing its product line of specialty ceramic powders and related products for government and industrial customers, including companies in the oil, automotive, electronics and nuclear industries, Advanced Refractory Technologies sought technical assistance from NERAC, Inc. in specific areas of ceramic materials and silicon technology, and for assistance in identifying possible applications of these materials in government programs and in the automotive and electronics industry. NERAC conducted a computerized search of several data bases and provided extensive information in the subject areas requested. NERAC's assistance resulted in transfer of technologies that helped ART staff develop a unique method for manufacture of ceramic materials to precise customer specifications.
Source record↗
Road Vehicle Functional Safety in Ground-Level Radiation Environments
This presentation gives an overview of the natural space radiation environment, the ground-level radiation environment, and single-event effects (SEEs). We then discuss the impact of SEEs for road vehicle functional safety and issues with commercial electronic components in these high-reliability systems. Finally, we introduce some forward-looking concepts that the radiation effects and automotive electronics communities will have to address as aggressive technology insertion continues.
Pellish, Jonathan↗
Development of in-situ polymerized intrinsically conductive resin and low-cost carbon pigments offering high conductivity for sensing, EMI shielding and lighting protection
Electrically conductive composites are emerging across diverse industries such as electronic, automotive, aerospace, advanced air mobility, biomedical, infrastructure, defense and security offering static charge dissipation, electromagnetic interference shielding, lighting protection, sensing, dicing, corrosion monitoring, etc. Conductivity enhanced composites provide several advantages compared to conventional metals including weight reduction, corrosion resistance, energy efficient processability, tunable properties and multifunctionality. Polymers are typically insulating in nature and require conducting filler for electron transport. However, dispersion and polymer-filler interphases are critical and often disrupt conducting pathways. Besides, conductive fillers such as graphene, carbon nanotube, MXene, silver nanowire, etc. are expensive, limiting their wide adoption in composite industry. On the other hand, a limited number of intrinsically conductive polymers are available among which polyaniline (PANI) has been widely studied due to its high conductivity, thermal and chemical stability. However, PANI is difficult to process and exhibits weak mechanical properties. In brief, there is a significant demand for electrically conductive polymer formulation with cost-effective conducting fillers that offer processability in scale to expand the market of conductivity enhanced materials.
Kumar, Vipin [Oak Ridge National Laboratory (ORNL)↗
NEPP Evaluation of Automotive Grade Tantalum Chip Capacitors
Automotive grade tantalum (Ta) chip capacitors are available at lower cost with smaller physical size and higher volumetric efficiency compared to military/space grade capacitors. Designers of high reliability aerospace and military systems would like to take advantage of these attributes while maintaining the high standards for long-term reliable operation they are accustomed to when selecting military-qualified established reliability tantalum chip capacitors (e.g., MIL-PRF-55365). The objective for this evaluation was to assess the long-term performance of off-the-shelf automotive grade Ta chip capacitors (i.e., manufacturer self-qualified per AEC Q-200). Two (2) lots of case size D manganese dioxide (MnO2) cathode Ta chip capacitors from 1 manufacturer were evaluated. The evaluation consisted of construction analysis, basic electrical parameter characterization, extended long-term (2000 hours) life testing and some accelerated stress testing. Tests and acceptance criteria were based upon manufacturer datasheets and the Automotive Electronics Council's AEC Q-200 qualification specification for passive electronic components. As-received a few capacitors were marginally above the specified tolerance for capacitance and ESR. X-ray inspection found that the anodes for some devices may not be properly aligned within the molded encapsulation leaving less than 1 mil thickness of the encapsulation. This evaluation found that the long-term life performance of automotive grade Ta chip capacitors is generally within specification limits suggesting these capacitors may be suitable for some space applications.
Automotive↗
Ilmenite as Dual-Use Material
This paper addresses the subject of dual-use space technology transfer of a novel, non-traditional material termed ilmenite, found in a large percentage in the moon rocks brought back by NASA's APOLLO missions. The paper is somewhat premature in the sense that though the material as a mineral has been known for a long time, very little is known about pure single crystal ilmenite and hence few applications have been demonstrated. Yet, in another sense, it is very timely due to the fact that ilmenite promises to be a very interesting competition to silicon, silicon carbide and other compound semiconductors, especially those that are employed in high power, high temperature and large data storage/retrieval applications. It seems to be an excellent example of a small investment-high return situation. While some of the applications of this material - for production of oxygen, for instance - have been well-known, electronic applications have received relatively little attention. One reason for this was the fact that growth of single crystal ilmenite requires precise process conditions and parameters. We believe for the first time these have been determined in the Center for Electronic Materials, Texas A&M University. The work being done at Texas A&M University and Prairie View A&M University (supported by Battelle Pacific Northwest Laboratories and the Center for Space Power) indicates the excellent potential this material has in space as well as in terrestrial applications. To mention a few: as a wide band gap semiconductor it has applications in high temperature, high power situations, especially when heat dissipation is a problem such as may occur in the Space Station; the possibility of this material radiating in the blue region, it has immense applications in optoelectronics; as a material with a high density of highly directional d-bands, it lends itself to novel processing conditions and perhaps even to 'tunability' of physical parameters; as a potential scintillating material, it has possible applications as a sensor in waste management; as an oxygen sensor it has possible applications in automotive electronics; and as a radiation resistant material, it has obvious applications in the space environment. Results - experimental and theoretical - obtained so far in our laboratories will be reported with particular emphasis on the transfer of technology involving this fascinating material.
Kumar, A. A.↗
Hygrothermal aging effects on polyimide and acrylate-based adhesive materials in high-performance flat-flex cable assemblies
Flat-flex assemblies are widely used across a diverse range of technologies, including consumer electronics, automotive systems, aerospace and defense applications, and medical devices, due to their compact form factor and flexibility. However, environmental stressors like temperature and humidity are known to degrade performance over time, though the main mechanisms for degradation remain unknown. Here, in this work, we examined the aging behavior of copper/polyimide/adhesive laminate systems under varying temperature and humidity conditions, focusing on material degradation and its effects on mechanical and dielectric properties. Results show that peel strength and breakdown voltage decrease with exposure time, temperature, and humidity; spectroscopic characterization revealed that the adhesive, and not the polyimide, is the weak link in the material stack-up. The adhesive, identified as a butyl acrylate-acrylonitrile (BA-AN) copolymer, exhibited age-related spectral changes that correlated with exposure severity and duration. Hydrolysis at BA ester and AN nitrile groups was identified as the primary degradation mechanism, producing amides, acids, and alcohols. We developed a mechanistic model that connects kinetic parameters for BA-AN spectral band decay to peel strength and breakdown voltage, and implicates hydrolysis at the AN moiety, not BA, in performance decrements. Modeling predictions at ambient conditions indicate faster decline in peel strength than dielectric strength at early times, followed by plateauing of both properties at longer times. These findings provide critical insights into laminate aging mechanisms and highlight the importance of addressing BA-AN degradation to improve the long-term reliability of these systems in high-humidity environments.
organic↗
NASA/CARES dual-use ceramic technology spinoff applications
NASA has developed software that enables American industry to establish the reliability and life of ceramic structures in a wide variety of 21st Century applications. Designing ceramic components to survive at higher temperatures than the capability of most metals and in severe loading environments involves the disciplines of statistics and fracture mechanics. Successful application of advanced ceramics material properties and the use of a probabilistic brittle material design methodology. The NASA program, known as CARES (Ceramics Analysis and Reliability Evaluation of Structures), is a comprehensive general purpose design tool that predicts the probability of failure of a ceramic component as a function of its time in service. The latest version of this software, CARESALIFE, is coupled to several commercially available finite element analysis programs (ANSYS, MSC/NASTRAN, ABAQUS, COSMOS/N4, MARC), resulting in an advanced integrated design tool which is adapted to the computing environment of the user. The NASA-developed CARES software has been successfully used by industrial, government, and academic organizations to design and optimize ceramic components for many demanding applications. Industrial sectors impacted by this program include aerospace, automotive, electronic, medical, and energy applications. Dual-use applications include engine components, graphite and ceramic high temperature valves, TV picture tubes, ceramic bearings, electronic chips, glass building panels, infrared windows, radiant heater tubes, heat exchangers, and artificial hips, knee caps, and teeth.
Powers, Lynn M.↗