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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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13 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

TRUST Testing Procedure Documentation

The TRUST testbed was designed and fabricated to conduct vibration testing and validate the behavior of hyper-elastic foams in a pre-loaded condition. The main goals of this testbed design were to ensure symmetry, proper instrumentation alignment and mounting, simplified geometry to make the data analysis validation process more straightforward, and to apply and monitor the applied pre-load. Based off of the test parameters, a shaker system was purchased. The baseplate was designed to mount directly to the bolt holes provided on the top of the shaker table. It was determined that the specimens will be cylindrical and vary in thickness from 2-10mm. The baseplate riser, center-mass, and testbed cap were designed to be cylindrical to make alignment about the center axis more straightforward. It was determined to fabricate the parts previously mentioned using Aluminum 6061-T6 due to its stiffness in order to reduce the likelihood of the stiff material impacting the data being collected for the foam specimens. The design concept used to apply the pre-load to the testbed was a through bolt/nut configuration. A through hole was included in each piece of the testbed, specimens, and instrumentation large enough to allow for 1/8” clearance between the through bolt and each of these pieces. This was imperative to avoid causing friction and complicating the validation model. A load cell was then purchased and used to measure the pre-load being applied to the testbed. It was also required to collect data for 3 axes at 3 different locations 120° apart on the center-mass. This configuration was required to be placed on the cylindrical face and toward the top and bottom of the center-mass. Slots were milled out in the middle of each sensor block with tight tolerances for mounting each of the accelerometers at 120° apart. This same approach was taken to mount 2 accelerometers on the baseplate at 180° apart. Holes were milled out of the corners of each accelerometer mounting slot to relieve the corner and allow for a flat edge at the back of each slot. Sensor blocks were mounted into the center-mass using 6-32 bolts at the required locations. This initial testbed design was fabricated at the TA53 machine shop.

42 ENGINEERING↗
DOE OSTI2023

A Smart Silicon Carbide Power Module With Pulse Width Modulation Over Wi-Fi and Wireless Power Transfer-Enabled Gate Driver, Featuring Onboard State of Health Estimator and High-Voltage Scaling Capabilities: Preprint

A wide range of utility applications require controllable switches with features such as high-voltage (HV) blocking and high-current carrying capacity especially at high pulse width modulation (PWM) frequency. Low and medium voltage utility applications such as motor drives and flexible AC transmission systems (FACTS) as well as solid state transformers (SST) could also benefit from a low-cost HV switching module. Wide band gap (WBG) semiconductors such as SiC and GaN MOSFETs are considered to be the present and next generation device choices, although they have their own limitations. For relatively HV applications with demanding thermal management, SiC is still the only choice, and GaN dominates the low voltage regime. This manuscript proposes a new half bridge power MOSFET module that is suitable for conventional H-bridge of multilevel configurations used in HV applications. Constructed from bare SiC dies, this half bridge module takes advantage of (1) optimized MOSFET placement inside the module, (2) customized heat exchanger, manifold and cooling, (3) integrated gate driver module with PWM over wi-fi to eliminate the need for low voltage signals, (4) wireless power transfer (WPT) enabled gate driver and other ancillary circuits, (5) and the option to incorporate an onboard state of health (SOH) estimator module onboard. The entire architecture has been designed and built at National Renewable Energy Laboratory (NREL), Golden, CO.

baseplate design↗
DOE OSTI2026

Reduction of baseplate distortion during directed energy deposition using compliant features

Distortion in additive manufacturing (AM) remains a barrier to its adoption in precision industries. Baseplate warpage is one such issue which compromises the feasibility of post-process precision machining. The restriction to thermal contraction of the deposited part, imposed by the baseplate, generates bending moments, that in turn causes warpage. A novel distortion mitigation strategy using baseplates with integrated compliant features, which enables thermal contraction of the build is presented. Six unique design concepts are evaluated, including a solid reference, using two deposition geometries. A laser, hot-wire, directed energy deposition (DED) process is used to deposit a symmetric cylindrical part (C-part) and a T-shaped asymmetric part (T-part). Flatness deviation of baseplates is measured using structured light 3D scanning. Measurements reveal a reduction in net flatness deviation of 58.8% for the C-part and 40.9% for the T-part, compared to the solid reference. While most designs yielded reductions exceeding 30% and 20% for the C- and T-parts, respectively, one configuration resulted in increased deviation. Finite element (FE) simulations are performed to elucidate the underlying mechanisms affecting distortion of compliant baseplates during DED. Despite variations between predictions and measurements, agreement in the general trend is observed. It also revealed that initial flatness errors in baseplates significantly affect its deviation during deposition. Predictions indicate that compliant features significantly affect the thermal distribution as well as the evolution of flatness deviation in the baseplate during deposition. Notably, one design exhibited a reduction in distortion during cooling, following its initial increase during deposition. FE predictions show a maximum reduction of 60.9% and 38.8% in net flatness deviation for the C- and T-parts, respectively. The performance of compliant baseplates is found to be governed by both its the thermal and mechanical characteristics, which are crucial factors to be considered during design.

Mathews, Ritin [ORNL] (ORCID:0000000301440828)↗
DOE OSTI2025

Thermal Optimization and Experimental Demonstration of a Silicon Carbide, Half-Bridge Power Module

This paper describes modeling and experimental work to design and demonstrate a silicon carbide (SiC), single-side-cooled power module. Two SiC metal-oxide-semiconductor field-effect transistors (MOSFET) were used for each switch position and packaged on a metalized ceramic substrate. Thermal modeling was first conducted to optimize the module packaging to minimize junction-to-fluid thermal resistance and device temperature variations. This procedure identified the optimal device placement and baseplate thickness to maximize thermal performance. A heat exchanger - incorporating impinging jets of water-ethylene glycol - was designed to cool the module's baseplate to minimize thermal resistance and pumping power. The heat exchanger used relatively low fluid velocities (<1.5 m/s) to minimize erosion-corrosion effects and relatively large fluid channel sizes (>=1 mm) to prevent clogging. The power module concept was fabricated, and experiments were conducted to measure its thermal performance. Direct current was used to power the module devices, and junction temperatures were measured via device temperature-sensitive parameters. The experimental results were found to be in good agreement with model predictions (within 2%) and yielded junction-to-fluid thermal resistance values as low as about 15 mm2 K/W at relatively low pumping power values. The results demonstrate the improved performance associated with jet impingement cooling and represent an improvement over existing channel-flow-type cold plates, which can enable improvements to power density and reliability.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

This project describes the modeling process to design the packaging and heat exchanger for a half-bridge wide-bandgap (WBG) power semiconductor module. The module uses two silicon carbide, metal-oxide-semiconductor field-effect transistor (MOSFET) devices per switch position that are soldered to an aluminum nitride, direct-bond copper (DBC) substrate. A baseplate cooling configuration (e.g., no thermal grease) is used along with a water-ethylene glycol, jet-impingement-style heat exchanger. The heat exchanger was designed to be fabricated using prototyping equipment from the National Renewable Energy Laboratory, complies with automotive standards (for minimal channel sizes, flow rates, and coolant), and considers reliability aspects (i.e., erosion/corrosion). Device-scale computational fluid dynamics (CFD) is used first to design the slot jet impingement cooling configuration and compute the effective heat transfer coefficient (HTC) of the concept. The computed HTCs are then used as boundary conditions for a finite element study to optimize the package geometry (e.g., device layout and baseplate thickness) to minimize thermal resistance and minimize temperature variation between the module's four devices. Finally, a fluid manifold is designed to generate the slot jets and cool the devices. Module-scale CFD predicts a relatively low junction-to-fluid thermal resistance of 16.7 mm2 K/W, a 1.4 degrees C temperature variation between devices, and a total pressure drop of 5,860 Pa (0.85 psi) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance.

DIRECT ENERGY CONVERSION↗
DOE OSTI2023

Material Plasma Exposure eXperiment High Heat Flux Microwave Absorber Design, Manufacture, and Articles Test

The Material Plasma Exposure eXperiment (MPEX) at Oak Ridge National Laboratory is in the final design phase. MPEX will be capable of exposing neutron-irradiated materials to plasmas for the study of plasma-material interaction. This facility will provide information about the complex effects of plasmas on materials and contribute to examining new materials that can withstand high heat fluxes and high ion fluences for future fusion devices. MPEX plasma is heated by 70-GHz or 105-GHz electron Bernstein wave/electron cyclotron heating (ECH), and the high-frequency microwaves are prone to scattering microwave power, which can have detrimental effects, especially on diagnostic components. A large portion of the injected ECH power is expected to be absorbed by plasma, but the remainder requires that microwave absorbers be placed immediately upstream and downstream of the ECH launcher to minimize stray microwaves leaving the ECH region. These microwaves can inadvertently heat components that cannot be shielded or otherwise protected. The microwave absorber design is based on an array of pyramid-shaped ceramic tiles brazed to a water-cooled explosion-bonded heat sink and a stainless steel plate to produce one tile module. Computational fluid dynamics and structural analyses were performed to optimize and validate the design. Multiple test coupons were produced to validate the process for brazing the two different tile materials to the Glidcop AL-15 baseplate. The articles were tested to evaluate the reliability and thermal performance through exposure to an electron beam with a heat flux of up to 1.5 MW/m2. Nondestructive testing was performed before and after testing to identify voids or separations that may have been introduced by the high heat flux. This paper discusses the details of high heat flux microwave absorber design, manufacturing details and associated challenges, and test results, demonstrating the effectiveness of the proposed design.

Hussain, Aftab↗
DOE OSTI2026

Thermodynamics of Bimetallic Joints between Titanium and Tantalum Produced by Laser Powder Bed Fusion

Laser powder bed fusion (LBPF) is currently the most mature metal additive manufacturing (AM) technology. While it does not have the same flexibility as directed energy deposition techniques to produce compositional gradients, LPBF can still be used to generate bimetallic parts by depositing one metal on a build plate made of another. Here, in this study, we print combinations of Ti-6Al-4V with Ta and characterize defects that occur at the interface. We use thermodynamic modeling to explain the formation of keyhole porosity and solidification cracks when Ta is built on a Ti baseplate, and the lack of defects when the materials are reversed. By understanding the mechanisms that lead to defect formation, the methodology demonstrated here can be applied to other material systems to efficiently design bimetallic LPBF processes.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2023

Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink

The next generation of integrated power electronics packages will implement wide-bandgap devices with ultrahigh device heat fluxes. Although jet impingement has received attention for power electronics thermal management, it is not used in commercial electric vehicles (EVs) because of the associated pressure drop and reliability concerns. Here, in this paper, we present a modular thermal management system designed for automotive power electronics. The system achieves superior thermal performance to benchmarked EVs, while adhering to reliability standards and with low pumping power. The system utilizes a low-cost and lightweight plastic manifold to generate jets over an optimized heat sink, which is embedded in the direct-bonded-copper (DBC) substrate. The embedded heat sink concept leverages additive manufacturing to add elliptical pin fins to the DBC substrate. The heat sink geometry is optimized for submerged jet impingement using a unit-cell model and an exhaustive search algorithm. The model predictions are validated using unit-cell experiments. A full-scale power module model is then used to compare the DBC-embedded heat sink against direct DBC cooling and baseplate-integrated heat sinks for single-sided (SS) and double-sided (DS) cooling concepts. Using the SS and DS DBC-embedded cooling concepts, the models predict a thermal resistance that represents a reduction of 75% and 85% compared to the 2015 BMW i3, respectively, for the same water-ethylene glycol inverter flow rate. We have shown that an inverter with a 100-kilo-Watt-per-liter power density is achievable with the proposed design.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2022

Response of a CMS HGCAL silicon-pad electromagnetic calorimeter prototype to 20–300 GeV positrons

The Compact Muon Solenoid collaboration is designing a new high-granularity endcap calorimeter, HGCAL, to be installed later this decade. As part of this development work, a prototype system was built, with an electromagnetic section consisting of 14 double-sided structures, providing 28 sampling layers. Each sampling layer has an hexagonal module, where a multipad large-area silicon sensor is glued between an electronics circuit board and a metal baseplate. The sensor pads of approximately 1.1 cm$^{2}$ are wire-bonded to the circuit board and are readout by custom integrated circuits. The prototype was extensively tested with beams at CERN's Super Proton Synchrotron in 2018. Based on the data collected with beams of positrons, with energies ranging from 20 to 300 GeV, measurements of the energy resolution and linearity, the position and angular resolutions, and the shower shapes are presented and compared to a detailed Geant4 simulation.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2023

Sensor Development for Liquid Water Detection in Dry Storage Casks: FY 2023 Status

Modeling efforts were undertaken in fiscal year (FY) 2023 to evaluate the feasibility and capability for sensing of liquid water inside canister-based dry cask storage systems (DCSSs). The focus was on the development of full-scale finite element models (FEMs) of ultrasound propagation through DCSS canister components. For these initial investigations, simulation of the baseplate component was targeted, envisioning water collection at the bottom of a vertically oriented canister. The effects of internal canister components (i.e., fuel basket, fuel assemblies) on ultrasound propagation in the baseplate component were evaluated in these efforts. The environment inside a DCSS confinement is intended to be inert and free of water to prevent potential corrosion of used fuel cladding or other internal hardware. Spent fuel assemblies are dried, after storage in water pools, to make sure water has been removed from assembly cavities. However, there is some uncertainty about the amount of residual water potentially left behind in a DCSS after drying processes, because water can become trapped in cavities or other small crevices in the surfaces formed by the fuel cladding, fuel assemblies, and other internal hardware components. Considering the complex space- and time-dependent temperature profiles in DCSSs, water may be in a liquid or gas phase depending on its location in the cask and how long the cask has been in storage. Evacuating most water and oxidizing agents contained within a canister is recommended by NUREG-1536 (NRC 2010), which covers DCSSs. As summarized by Salazar et al. (2020), existing guidance typically relies on achievable vacuum pumping pressures sustained over a hold period as a signal of dryness and water removal. However, time series data about water removal from full-scale commercial drying procedures are lacking (Hanson and Alsaed 2019). A review of drying specifications from several vendors led to the conclusion that if the specifications are followed correctly, the residual moisture in DCSSs should present an insignificant risk of cladding degradation (Knoll and Gilbert 1987). A more recent analysis concluded that much larger quantities of residual water could remain in DCSSs, but the amount would still not be expected to lead to significant corrosion of fuel cladding or other internal components (Jung et al. 2013). Industry drying procedures are mostly prescriptive in nature, and operational issues arising during the process could result in incomplete drying. A summary of operational issues and potential negative effects of residual water is provided by Salazar et al. (2019). Experimental efforts are ongoing to validate the extent of water removal in a DCSS based on drying procedures used at nuclear power plants through well-designed investigations of drying process efficacy and water retention (Durbin et al. 2021; Pulido et al. 2022a, Pulido et al. 2022b). This has been approached by simulating limited portions of a DCSS internal volume and fuel assemblies. So far, these efforts have focused on the effects of potential water trapping in the dashpot region of control rod guide tubes but are expected to be expanded to include the effects of other internal hardware features and failed fuel rod cladding. A method for detection and measurement of liquid water (Meyer et al. 2022; Meyer et al. 2021), in tandem with the drying information gained through experimental investigations, provides comprehensive bases for understanding the internal conditions of DCSSs and provides technical information to support licensing decisions.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗