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At least 19 records

Metal oxide impregnated conformal coatings for ionizing radiation shielding

Conformal coatings provide environmental protection for sensitive military electronics. Preliminary MCNP™ modeling of metal oxide impregnated acrylic conformal coatings indicates an effective shield for gammas below 10 keV and a reduction in neutron displacement damage to Si-based electronics across the Watt spectrum. This work provides data which can allow an optimal overall shielding worth per total weight to eventually be evaluated.

Hayes, Robert Bruce↗

Reduction of Calcofluor in Solithane Conformal Coatings of Printed Wiring Boards

An investigation on the outgassing of a pigment employed as a fluorescent medium in conformal coatings has been performed. The conformal coatings in question are used to protect printed wiring boards from environmental hazards such as dust and moisture. The pigment is included in the coating at low concentration to allow visual inspection of the conformal coating for flaw detection. Calcofluor, the fluorescent pigment has been found to be a significant outgasser under vacuum conditions and a potential source of contamination to flight hardware. A minimum acceptable concentration of Calcofluor for flaw detection is desirable. Tests have been carried out using a series of Solithane(TM) conformal coating samples, with progressively lower Calcofluor concentrations, to determine the minimum required concentration of Calcofluor. It was found that the concentration of Calcofluor could be reduced from 0.115% to 0.0135% without significant loss in the ability to detect flaws, while at the same time significant reductions in Calcofluor outgassing and possible contamination of systems could be realized.

Miller, Michael K.↗

Effects of Conformal Coat on Tin Whisker Growth

A whisker from a tin plated part was blamed for the loss of a commercial spacecraft in 1998. Although pure tin finishes are prohibited by NASA, tin plated parts, such as hybrids, relays and commercial off the shelf (COTS) parts, are something discovered to have been installed in NASA spacecraft. Invariably, the assumption is that a conformal coat will prevent the growth of, or short circuits caused by, tin whiskers. This study measures the effect a Uralane coating has on the initiation and growth of tin whiskers, on the ability of this coating to prevent a tin whisker from emerging from the coating, and on the ability to prevent shorting. A sample of fourteen brass substrates (1 inch by 4 inches by 1/16 inch) were plated by two separate processes: half of the specimens were 'bright' tin plated directly over the brass substrate and half received a copper flash over the brass substrate prior to 'bright' tin plating. Each specimen was coated on one half of the substrate with three bi-directional sprays of Uralane 5750 to a nominal thickness of 25 to 75 micrometers (1 to 3 mils). Several specimens of both types, Cu and non-Cu flashed, were placed in an oven maintained at 50 C as others' work suggests that this is the optimal temperature for whisker formation. The remaining specimens were maintained at room ambient conditions. The surfaces of each specimen have been regularly inspected using both optical (15 to 400x power) and Scanning Electronic Microscopy (SEM). Many types of growths, including needle-like whiskers, first appeared approximately three months after plating on the non-conformally coated sides of all specimens. At four months, 4 to 5 times more growth sites were observed on the coated side; however, the density of growth sites on the non-conformally coated side has since increased rapidly, and now, at one year, is about the same for both sides. The density of growth sites is estimated at 90/sq mm with 30 percent of the sites growing whiskers (needle-like forms) with the potential to cause short circuit bridging. The average growth rate of the needle-like whiskers on the non-conformally coated areas is about 130 micrometers per year with some outliers reaching 800 micrometers after one year. It is more difficult to make growth measurements under the conformal coat. As yet no whiskers have been observed to penetrate through the coating surface, however, a number of tin nodules appear on the verge of breaking through the thinner regions of the coating surface. These domes are developing sharper and sharper tips, as if a growing whisker is about to push its way through a tough skin. Our observations are that the specimens with copper flash show a much lower density of nucleation sites and significantly slower whisker growth compared to the specimens that have only bright tin plating over brass. The specimens kept at room temperature have a higher whisker density than those stored at 50 C. This is an unexpected result and does not agree with the published findings of others. All of the whiskers originate from small surface defects (thin, tiny scratches) that appear over the entire surface of each specimen.

Kadesch, Jong S.↗

Requirements for Conformal Coating and Staking of Printed Wiring Boards and Electronic Assemblies

In order to maintain the high standards of the NASA conformal coating and staking program, this publication: prescribes NASA's requirements for assuring reliable conformal coating and staking for printed wiring boards and electronic assemblies; describes and incorporates basic considerations necessary to assure reliable conformal coating and staking; establishes the supplier's responsibility to train and certify personnel; provides for supplier documentation of the fabrication and inspection procedures to be used for NASA work, including supplier innovations and changes in technology; and provides visual workmanship standards to aid those responsible for determining quality conformance to the established requirements.

Source record↗

Development of improved potting and conformal coating compounds

Improved organic potting and conformal coating materials protect fragile electronic components and circuitry from mechanical shock and vibration, moisture, and corrosion. These materials meet specifications covering resistance to cycling, radiation, flammability, and sterilizing agents for certain space applications.

Webster, J. A.↗

Long-term thermal aging of parylene conformal coating under high humidity and its effects on tin whisker mitigation

Usage of pure tin (Sn) or Sn-rich alloy in electronics industry is growing, which makes them more susceptible to the spontaneous growth of tin whiskers. The risk of having these whiskers can be dramatically mitigated by applying a conformal coating provided that it not only possesses excellent mechanical and adhesion properties but also maintains these properties throughout their service. Parylene C is commonly used as a conformal coating because of its favorable mechanical and physical properties, as well as superior conformal coverage. The purpose of this paper is to investigate the degradation of parylene C coating during the thermal aging in high humidity environment (85°C/85% relative humidity for up to 5000hrs) and its effect on the tin whisker mitigation capacity. It was observed that during aging at high temperature and high humidity (HTHH) environment, the oxidation occurs at early times, followed by bond scission, resulting in the loss of strength of the coating. Thinner parylene coating (12.5-μm-thick) had better coating adhesion on the silane-treated tin surface, so provided the better protection for tin whisker penetration than the thicker counterpart (25-μm-thick). After 2500hrs of aging, due to the degradation of the silane agent at the tin/parylene interface, the adhesion of the parylene coating was significantly weakened on the tin surface, which resulted in extensive corrosion of the tin solderpads. The loss of adhesion of the coating, along with the corrosion of the tin surface facilitated the tin whisker nucleation at the interface while the loss of mechanical strength and the brittleness made the coating easily penetrated by the growing whiskers. Tin whiskers with a smaller diameter were buckled and grew along the delaminated region while those with a larger diameter penetrated and continued to grow through the coating. Hence, the effectiveness of the parylene coatings on tin whisker mitigation is significantly reduced under long exposure to such high temperature and high humidity.

36 MATERIALS SCIENCE↗

Electroplated Au for conformal coating of high aspect ratio silicon structures

A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.

Rowen, Adam M.↗

Conformally coated scaffold design using water-tolerant Pr 1.8 Ba 0.2 NiO 4.1 for protonic ceramic electrochemical cells with 5,000-h electrolysis stability

Protonic ceramic electrochemical cells (PCECs) have potential as long-duration energy storage systems. However, their operational stability is limited under industrially relevant conditions due to the intrinsic chemical instability of doped barium cerate-based electrolytes and oxygen electrodes against H 2 O, as well as the poor electrode–electrolyte interfacial contact. Here, in this study, we present a conformally coated scaffold (CCS) design to comprehensively address these issues. A porous proton-conducting scaffold is constructed and conformally coated with Pr 1.8 Ba 0.2 NiO 4.1 electrocatalyst, which has high chemical stability against H 2 O, triple conductivity and hydration capability, and protects vulnerable electrolytes from H 2 O. The CCS structure consolidates the electrode–electrolyte interfacial bonding to enable fast proton transfer in the percolated network. This design enables PCECs to reach electrolysis stability for 5,000 h at −1.5 A cm−2 and 600 °C in 40% H 2 O. This work provides a general strategy to stabilize PCECs and offers guidance for designing resilient and stable solid-state energy storage systems.

Protonic ceramic electrochemical cell↗

Production development of organic nonflammable spacecraft potting, encapsulating and conformal coating compounds. Volume 4: Executive summary

The necessity of having nonflammable versions of potting and encapsulating compounds and conformal coatings for space vehicles is discussed. The formulation, EPOCAST 87517 A/B, was found to have the best balance of thermal, electrical, mechanical, physical, and chemical properties of those evaluated. The requirements which this formulation did not meet are listed, and other formulations which were evaluated are summarized. Recommendations for improving EPOCAST 87517 A/B are included.

Lieberman, S. L.↗