Apollo communications system support. Improvements in contact printing and metal masking techniques Final report, 1 Aug. 1967 - 29 Mar. 1968
Production methods for contact prints in emulsions or chromium coated glass plate
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Production methods for contact prints in emulsions or chromium coated glass plate
The development of a process for fabricating 2 x 4 cm back surface field silicon solar cells having screen printed wraparound contacts is described. This process was specifically designed to be amenable for incorporation into the automated nonvacuum production line. Techniques were developed to permit the use of screen printing for producing improved back surface field structures, wraparound dielectric layers, and wraparound contacts. The optimized process sequence was then used to produce 1852 finished cells. Tests indicated an average conversion efficiency of 11% at AMO and 28 C, with an average degradation of maximum power output of 1.5% after boiling water immersion or thermal shock cycling. Contact adherence was satisfactory after these tests, as well as long term storage at high temperature and high humidity.
Two master resolution friskets were produced on Kodak film types SO-368 and SO-242. These target masters consisted of 21 density steps with three-bar resolution targets at five modulation levels within each step. The target masters were contact printed onto Kodak separation negative film, type 4131, using both a contact printing frame and enlarger as one method of exposure, and a Miller-Holzwarth contact printer as the other exposing device. Red, green, and blue Wratten filters were used to filter the exposing source. Tray processing was done with DK-50 developer diluted 1:2 at a temperature of 70 F. The resolution values were read for the SO-368 and SO-242 target masters, and the red, green, and blue separation negatives.
The use of Cibachrome products as a solution to problems encountered when contact printing Kodak film type SO-397 onto Kodak Ektrachrome color reversal paper type 1993 is investigated. A roll of aerial imagery consisting of Kodak film types SO-397 and 2443 was contact printed onto Cibachrome and Kodak materials and compared in terms of color quality, resolution, cost, and compatibility with existing equipment and techniques. Objective measurements are given in terms of resolution and sensitometric response. Comparison prints and transparencies were viewed and ranked according to overall quality and aesthetic appeal. It is recommended that Cibachrome Print material be used in place of Kodak Ektachrome paper because it is more easily processed, the cost is equivalent, and it provides improved resolution, color quality, and image fade resistance.
Low cost solar cells and arrays with high end-of-life efficiency are evaluated through two approaches: one, to obtain increased device efficiency at no increase in cost and two, to reduce the manufacturing costs of space solar cells and arrays. Technology efforts encompass high efficiency epitaxial cells, high efficiency wraparound contact solar cells, economical diffusion sources, automated cell fabrication and development of easily applied, durable cover glasses. The examination of ion-implanted profile tailored junctions and additional development of screen printed contact technology to cell development are also considered.
The large scale production of silicon solar cell array panels is discussed. The cost and performance of three manufacturing sequences designed to convert silicon sheet and wafers into solar panels is analyzed. The production of ion implanted and furnace annealed solar cells made using solar grade n- and p-type wafers is examined. The performance of production size lots is examined with regard to the relationship between the ion implant and furnace anneal parameters and the ability to form consistently good thick film screen printed contacts. The spray on antireflection coating process is evaluated. The performance of several lots of cells before and after coating is measured. The structure and refractive index of the RCA I (TiO2) coating is compared with commercial solutions. Sensitivity of coated, screen printed cells to the post heat treatment required to cure the films is assessed.
High altitude color photography was used to determine soil type variation over large areas at a contact print scale of 1:125,000. It was found that color variation and land form could be used as a basis for assigning seven soil mapping units to the area as depicted on stereoscopic pairs of the color photography. A unit is assigned by soil scientists on the basis of similarity of soil features in the area to predetermined physical and chemical characteristics of the same soil type.
The author has identified the following significant results. Using the 12S Digicol color additive viewer and eight color classification map has been produced of a portion of the study area. Channel 3 of the MSS produced the best map. Enlargements of the MSS data have been accomplished by using the Data Analysis Station. The attached film recorder has three color guns which are capable of placing 2400 square elements across a 9 inch film. It has been found that by repeating ERTS element 9 times and each scan line 13 times that a map of a scale approximately 1:62,000 can be produced as a color negative film strip. This can be contact printed to produce a color map of the scale. As yet this procedure does not correct for image skew caused by rotation which is believed to be the major source of distortion and blockiness in the image. However, the final product which has not undergone any photographic enlargement is superior to photographically enlarged maps of the same scale.
The author has identified the following significant results. Three sites were evaluated for land use inventory: Finger Lakes - Tompkins County, Lower Hudson Valley - Newburgh, and Suffolk County - Long Island. Special photo enhancement processes were developed to standardize the density range and contrast among S190A negatives. Enhanced black and white enlargements were converted to color by contact printing onto diazo film. A color prediction model related the density values on each spectral band for each category of land use to the spectral properties of the various diazo dyes. The S190A multispectral system proved to be almost as effective as the S190B high resolution camera for inventorying land use. Aggregate error for Level 1 averaged about 12% while Level 2 aggregate error averaged about 25%. The S190A system proved to be much superior to LANDSAT in inventorying land use, primarily because of increased resolution.
A method of post-development intensification of photographic images using a newly developed autoradiographic procedure is described. Radioactive Thiourea-S35 is combined with silver in the developed emulsion, which is then contact printed with a receiver emulsion. The beta decay from S35 produces an enhanced autoradiographic image. The laboratory technique is described and results of astronomical applications are presented.
Acquisition of polyimide materials for inter-metal dielectrics was obtained from three vendors, with considerable evaluation conducted on the Dupont PI2550 material. Experimental results indicate this material can be patterned using contact printing to line width far below 0.1 mils. Optimum line width is acquired using plasma etch equipment. Metal lift-off experiments on thermal evaporated films were optimized for application to sputtered deposited films. Alternate metal-lift-off experiments are proposed for future investigation. Dry processing equipment studies and future trends in VLSI fabrication techniques are on-going.
The HEX bumper was originally developed for use with the Defensive Shields Demonstration (DSD) Program. The University of Dayton Research Institute was a subcontractor to the Martin Marietta Astronautics Group in Denver Colorado at the time the HEX bumper was designed for use on the DSD Program. The design originated at the University and was essentially made available to interested parties. All HEX bumpers used in the DSD Program were fabricated at the University by rolling sheet stock through a special set of rollers. Two pieces of 3003-H14 aluminum sheet were rolled to produce the bumpers evaluated in Shots 4-1302 and 4-1304. A brief summary of the results of these tests is given in below. Contact prints of the multiple-exposure, orthogonal view radiographs of the debris clouds produced by the tests are attached. A sketch of the HEX bumper design is also attached.
Indium-tin-oxide (ITO) thin film strain gages were successfully demonstrated at temperatures beyond 1500 C. High temperature static strain tests revealed that the piezoresistive response and electrical stability of the ceramic sensors depended on the thickness of the ITO films comprising the active strain elements. When 2.5 microns-thick ITO films were employed as the active strain elements, the piezoresistive response became unstable at temperatures above 1225 C. In contrast to this, ceramic sensors prepared with 5 microns-thick ITO were stable beyond 1430 C and sensors prepared with 8 microns-thick ITO survived more than 20 hr of operation at 1481 C. Very thick (10 microns) ITo strain gages were extremely stable and responsive at 1528 C. ESCA depth profiles confirmed that an interfacial reaction between the ITO strain gage and alumina substrate was responsible for the high temperature electrical stability observed. Similar improvements in high temperature stability were achieved by doping the active ITO strain elements with aluminum. Several Sic-Sic CMC constant strain beams were instrumented with ITO strain gages and delivered to NASA for testing. Due to the extreme surface roughness of the CMC substrates, new lithography techniques and surface preparation methods were developed. These techniques relied heavily on a combination of Sic and A12O3 cement layers to provide the necessary surface finish for efficient pattern transfer. Micro-contact printing using soft lithography and PDMS stamps was also used to successfully transfer the thin film strain gage patterns to the resist coated CMC substrates. This latter approach has considerable potential for transferring the thin film strain gage patterns to the extremely rough surfaces associated with the CMC's.
Interdigitated back contact solar cells are made by screen printing dopant materials onto the back surface of a semiconductor substrate in a pair of interdigitated patterns. These dopant materials are then diffused into the substrate to form junctions having configurations corresponding to these patterns. Contacts having configurations which match the patterns are then applied over the junctions.
Etching front surfaces of screen-printed silicon photovoltaic cells with sulfur hexafluoride plasma found to increase cell performance while maintaining integrity of screen-printed silver contacts. Replacement of evaporated-metal contacts with screen-printed metal contacts proposed as one way to reduce cost of solar cells for terrestrial applications.
A proof-of-concept solar cell process has been developed that is adaptable to automation. This involved the development of a new contact system, a new antireflection coating system, a drift field cell design and a new contoured surface treatment. All these processes are performed without the use of vacuum chambers and expensive masking techniques, thus providing the possibility of reduced costs by automation using conventional semiconductor processing machinery. The contacts were printed on the cells by conventional silk screen machinery. The P(+) back field was formed by diffusing in aluminum from a printed aluminum back contact. The antireflection coating was formed by spinning on and baking a TiO2-SiO2 glass film. Air-mass-zero efficiencies of over 10% were achieved using this completely vacuum-free process.
The technological readiness of the proposed process sequence was reviewed. Process steps evaluated include: (1) plasma etching to establish a standard surface; (2) forming junctions by diffusion from an N-type polymeric spray-on source; (3) forming a p+ back contact by firing a screen printed aluminum paste; (4) forming screen printed front contacts after cleaning the back aluminum and removing the diffusion oxide; (5) cleaning the junction by a laser scribe operation; (6) forming an antireflection coating by baking a polymeric spray-on film; (7) ultrasonically tin padding the cells; and (8) assembling cell strings into solar circuits using ethylene vinyl acetate as an encapsulant and laminating medium.
Thick film technology is applicable to three areas of silicon solar cell fabrication; metallization, junction formation, and coating for protection of screened ohmic contacts, particularly wrap around contacts, interconnection and environmental protection. Both material and process parameters were investigated. Printed ohmic contacts on n- and p-type silicon are very sensitive to the processing parameters of firing time, temperature, and atmosphere. Wrap around contacts are easily achieved by first printing and firing a dielectric over the edge and subsequently applying a low firing temperature conductor. Interconnection of cells into arrays can be achieved by printing and cofiring thick film metal pastes, soldering, or with heat curing conductive epoxies on low cost substrates. Printed (thick) film vitreous protection coatings do not yet offer sufficient optical uniformity and transparency for use on silicon. A sprayed, heat curable SiO2 based resin shows promise of providing both optical matching and environmental protection.