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Results for “cryogenic structure thermal isolation”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Flexible linkages for thermal management at cryogenic temperatures

Cryogenic system design often presents the competing requirements of thermal coupling between components while de-coupling them structurally. Good thermal coupling is necessary for adequate thermal management during cryogenic operation of the system and to reduce the cooldown time from the ambient to cryogenic temperature. Structural de-coupling is essential to reduce thermal stresses during cooldown, mitigate the trasmission of vibration and loads to sensitive and/or fragile components, and compensate for integration misalignments. Flexible thermal links (FTLs) are an essential component of cryogenic systems that provides a balance between thermal coupling and structural isolation.

42 ENGINEERING↗
DOE OSTI2020

Thermal / structural analysis of the HB 650 thermal shield

Fermilab’s PIP-II project’s superconducting linear accelerator will drive the next generation of particle accelerators through a revolution in beam intensity. Key to beam intensification are the high efficiencies of niobium-tin superconducting radiofrequency (SRF) cavities operating at cryogenic temperatures near 5 Kelvin. A multifaceted approach is employed to achieve and maintain the extreme temperature. Vacuum provides the first barrier to thermal convection. Physical thermal intercept zones further isolate the exterior shell vacuum vessel at 300 Kelvin from the supercooled beamline. The first thermal intercept lies just inside the exterior vacuum vessel forming the 40 Kelvin zone. This 40K thermal shield is the focus of this investigation. In preparation for operation, the thermal shield is cooled from 300K to 40K in a slow process over 2-1/2 days. The factors limiting the cooling rate are a high thermal gradient which produces thermal strain and high mechanical stress. D ecreasing the time required to reach operational temperatures is the desired research goal. Physical testing data and finite element method (FEM) computer models from the Single Spoke Resonator – 1 (SSR1) and Linac Coherent Light Source (LCLS-II) cryomodules will be evaluated to determine needed design changes. The thermal shield design for the High Beta 650 MHz (HB650) will be modified and analyzed using FEM computer models to determine maximum cooling rate with a target of 50 thermal cycles of life. Maximum allowable stress will be determined through low cycle fatigue calculations.

43 PARTICLE ACCELERATORS↗
DOE OSTI2025

Synthesizing intermetallic thermoelectric materials using metal flux growth method

With zero energy poverty by 2050 goals, exploring innovative energy technologies is essential. Thermoelectric materials (TEMs) have the potential to harness waste heat and convert it to electricity (e.g., for spacecraft power, sensors, and cryogenic cooling). Two limitations of thermoelectric compounds are their low efficiency and limited pool of materials. Optimizing the efficiency of TEMs is challenging due to the interdependent relationship between electrical and thermal conductivity. A deeper understanding of electronic properties and lattice thermal conductivity is necessary to “understand, predict and ultimately control” the thermoelectric properties of TEMs. Understanding the influence of light-atom-doping and intrinsic defects on the electronic properties of the f-element containing TEMs are important questions that need to be answered to design and synthesize TEMs with optimal parameters. The purpose of this work is to understand how doping f-element based TEMs with light elements, such as carbon and boron, would impact the crystal structure, bond lengths, band gaps, and thermoelectric characteristics. High-quality f¬-element containing intermetallic single crystals are grown in metal flux media. In molten metal flux growth method, one or more low-melting metals such as aluminum, gallium, tin, and bismuth are used in excess as the reaction medium. As these are solution-state reactions, we can use lower temperatures than solid-state reactions and isolate the kinetic products instead of the thermodynamically stable compound. Then these are characterized using X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, magnetization, electrical and thermal conductivities, and thermoelectric power.

37 - INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL C↗