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All sources NASA NTRS DOE OSTI

DOE OSTI2022

Systems and methods for post-treatment of dry adhesive microstructures

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.

Dadkhah Tehrani, Mohammad↗

DOE OSTI2020

Strongly adhesive dry transfer technique for van der Waals heterostructure

That one can stack van der Waals materials with atomically sharp interfaces has provided a new material platform of constructing heterostructures. The technical challenge of mechanical stacking is picking up the exfoliated atomically thin materials after mechanical exfoliation without chemical and mechanical degradation. Chemically inert hexagonal boron nitride (hBN) has been widely used for encapsulating and picking up vdW materials. However, due to the relatively weak adhesion of hBN, assembling vdW heterostructures based on hBN has been limited. Here, we report a new dry transfer technique. We used two vdW semiconductors (ZnPS 3 and CrPS 4 ) to pick up and encapsulate layers for vdW heterostructures, which otherwise are known to be hard to fabricate. By combining with optimized polycaprolactone (PCL) providing strong adhesion, we demonstrated various vertical heterostructure devices, including quasi-2D superconducting NbSe 2 Josephson junctions with atomically clean interface. The versatility of the PCL-based vdW stacking method provides a new route for assembling complex 2D vdW materials without interfacial degradation.

36 MATERIALS SCIENCE↗

DOE OSTI2013

Doping suppression and mobility enhancement of graphene transistors fabricated using an adhesion promoting dry transfer process

We present the facile dry transfer of graphene synthesized via chemical vapor deposition on copper film to a functional device substrate. High quality uniform dry transfer of graphene to oxidized silicon substrate was achieved by exploiting the beneficial features of a poly(4-vinylphenol) adhesive layer involving a strong adhesion energy to graphene and negligible influence on the electronic and structural properties of graphene. The graphene field effect transistors (FETs) fabricated using the dry transfer process exhibit excellent electrical performance in terms of high FET mobility and low intrinsic doping level, which proves the feasibility of our approach in graphene-based nanoelectronics.

36 MATERIALS SCIENCE↗

DOE OSTI2019

Intrinsically reversible superglues via shape adaptation inspired by snail epiphragm

Significance Achieving both superstrong adhesion and reversibility is challenging, particularly for hydrogels. Here, we report a hydrogel-based, reversible, superglue-like adhesive by combining the benefits of both liquid and dry adhesives in a single material while overcoming their respective limitations. When hydrated, the softened gel conformally adapts to the target surface by low-energy deformation, which is then locked upon drying as the elastic modulus is raised from hundreds of kilopascals to a few gigapascals, analogous to the action of the epiphragm of snails. We show that reversible superstrong adhesion could be achieved from a nonstructured material when the criterion of shape adaption is met, with minimal residual strain energy stored in the system.

36 MATERIALS SCIENCE↗

DOE OSTI2023

Thermodynamic Properties of Aggregate Coated by Different Types of Waste Plastic: Adhesion and Moisture Resistance of Asphalt-Aggregate Systems

The utilization of acidic aggregates in hot-mix asphalt (HMA) is often inevitable due to the limited supply of locally available aggregates, posing a potential threat of moisture damage to asphalt pavements. In this regard, the use of urban waste plastic to coat the low-quality aggregates is a promising way to improve the moisture resistance. This study fundamentally evaluated the compatibility between asphalt and plastic-coated aggregate by measuring surface energy, and for the first time compared the effects of different types of waste plastic including high-density polyethylene (HDPE), low-density polyethylene (LDPE), polyethylene terephthalate (PET), polyvinyl chloride (PVC), and polypropylene (PP). The plastic-coating significantly altered the chemistry of aggregate surface by increasing the nonpolar components and reducing the polar components. Such changes remarkably increased the dry adhesion energy between asphalt and aggregate and enhanced the wettability of aggregate. For the acidic aggregates, the polymeric treatment could decrease the value of wet adhesive, which indicated the debonding tendency in the presence of water was reduced. Finally, the energy ratios of the asphalt-aggregate combinations significantly increased by the surface pretreatment, which proved the effect of waste plastic coating on improving the moisture damage resistance of asphalt mixtures. By comparison, the HDPE coating was the most effective way to enhance the compatibility with asphalt, followed by PP and LDPE coatings. The PVC and PET coatings were investigated as the least effective way. In conclusion, this study cannot only contribute to the potential large-scale utilization of waste plastic but also remove the obstacles of using large quantities of acidic natural aggregate in asphalt pavements.

36 MATERIALS SCIENCE↗

DOE OSTI2016

Perspective: Mechanochemistry of biological and synthetic molecules

Coupling of mechanical forces and chemical transformations is central to the biophysics of molecular machines, polymer chemistry, fracture mechanics, tribology, and other disciplines. As a consequence, the same physical principles and theoretical models should be applicable in all of those fields; in fact, similar models have been invoked (and often repeatedly reinvented) to describe, for example, cell adhesion, dry and wet friction, propagation of cracks, and action of molecular motors. This perspective offers a unified view of these phenomena, described in terms of chemical kinetics with rates of elementary steps that are force dependent. The central question is then to describe how the rate of a chemical transformation (and its other measurable properties such as the transition path) depends on the applied force. I will describe physical models used to answer this question and compare them with experimental measurements, which employ single-molecule force spectroscopy and which become increasingly common. Multidimensionality of the underlying molecular energy landscapes and the ensuing frequent misalignment between chemical and mechanical coordinates result in a number of distinct scenarios, each showing a nontrivial force dependence of the reaction rate. I will discuss these scenarios, their commonness (or its lack), and the prospects for their experimental validation. Finally, I will discuss open issues in the field.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2015

Electrokinetics of scalable, electric-field-assisted fabrication of vertically aligned carbon-nanotube/polymer composites

Composite thin films incorporating vertically aligned carbon nanotubes (VACNTs) offer promise for a variety of applications where the vertical alignment of the CNTs is critical to meet performance requirements, e.g., highly permeable membranes, thermal interfaces, dry adhesives, and films with anisotropic electrical conductivity. However, current VACNT fabrication techniques are complex and difficult to scale up. In this paper, we describe a solution-based, electric-field-assisted approach as a costeffective and scalable method to produce large-area VACNT composites. Multiwall-carbon nanotubes are dispersed in a polymeric matrix, aligned with an alternating-current (AC) electric field, and electrophoretically concentrated to one side of the thin film with a direct-current (DC) component to the electric field. This approach enables the fabrication of highly concentrated, individually aligned nanotube composites from suspensions of very dilute (Φ=4×10 –4 ) volume fraction. We experimentally investigate the basic electrokinetics of nanotube alignment under AC electric fields, and show that simple models can adequately predict the rate and degree of nanotube alignment using classical expressions for the induced dipole moment, hydrodynamic drag, and the effects of Brownian motion. The composite AC þ DC field also introduces complex fluid motion associated with AC electro-osmosis and the electrochemistry of the fluid/electrode interface. We experimentally probe the electric-field parameters behind these electrokinetic phenomena, and demonstrate, with suitable choices of processing parameters, the ability to scalably produce large-area composites containing VACNTs at number densities up to 10 10 nanotubes/cm 2 . This VACNT number density exceeds that of previous electric-fieldfabricated composites by an order of magnitude, and the surface-area coverage of the 40nm VACNTs is comparable to that of chemical-vapor-deposition-grown arrays of smaller-diameter nanotubes.

42 ENGINEERING↗

DOE OSTI2021

Superconducting qubits in a flip-chip architecture

Flip-chip architectures have recently enabled significant scaling-up of multi-qubit circuits and have been used to assemble hybrid quantum systems that combine different substrates, for example, for quantum acoustics experiments. The standard flip-chip method uses superconducting galvanic connections between two substrates, typically implemented using sophisticated indium wafer-bonding systems, which give highly reliable and temperature-cyclable assemblies, but are expensive, somewhat inflexible in design, and require robust substrates that can sustain the large compressive forces required to cold-weld the indium bonds. A much simpler method is to assemble dies using very low-force contacts and air-dried adhesives, although this does not provide a galvanic contact between the dies. In this work, we demonstrate that the latter technique can be used to reliably couple superconducting qubit circuits, in which the qubits are on separate dies, without the need for a galvanic connection. We demonstrate full vector qubit control of each qubit on each of the two dies, with high-fidelity single-shot readout, and further demonstrate entanglement-generating excitation swaps as well as benchmark a controlled-Z entangling gate between the two qubits on the two dies. This exemplifies a simple and inexpensive assembly method for two-plus-one-dimensional quantum circuit integration that supports the use of delicate or unusually shaped substrates.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

DOE OSTI2012

Active, Programmable Elastomeric Surfaces with Tunable Adhesion for Deterministic Assembly by Transfer Printing

Active, programmable control of interfacial adhesion is an important, desired feature of many existing and envisioned systems, including medical tapes, releasable joints, and stamps for transfer printing. Here a design for an elastomeric surface that offers switchable adhesion strength through a combination of peel-rate dependent effects and actuation of sub-surface fluid chambers is presented. Microchannels and open reservoirs positioned under a thin surface membrane can be pressurized in a controlled manner to induce various levels of surface deformation via inflation. These pressurized structures demonstrate utility in controllably decreasing the strength of adhesion of flat, solid objects to the elastomeric surface, particularly in the limit of low peel-rates. Experimental and theoretical studies of these systems reveal the key mechanisms, and guide optimized geometries for broad control over adhesion, in a programmable and reversible manner. Implementing these concepts in stamps for transfer printing enables new modes for deterministic assembly of micro- and nanoscale materials onto diverse types of substrates. Furthermore, collections of silicon plates delivered onto plastic, paper and other surfaces with single or multiply addressable stamps illustrate some of the capabilities.

36 MATERIALS SCIENCE↗

DOE OSTI2015

Adhesive interactions of geckos with wet and dry fluoropolymer substrates

Fluorinated substrates like Teflon® (poly(tetrafluoroethylene); PTFE) are well known for their role in creating non-stick surfaces. Previously, we showed that even geckos, which can stick to most surfaces under a wide variety of conditions, slip on PTFE. Surprisingly, however, geckos can stick reasonably well to PTFE if it is wet. In an effort to explain this effect, we have turned our attention to the role of substrate surface energy and roughness when shear adhesion occurs in media other than air. In this study, we removed the roughness component inherent to commercially available PTFE and tested geckos on relatively smooth wet and dry fluoropolymer substrates. We found that roughness had very little effect on shear adhesion in air or in water and that the level of fluorination was most important for shear adhesion, particularly in air. Surface energy calculations of the two fluorinated substrates and one control substrate using the Tabor–Winterton approximation and the Young–Dupré equation were used to determine the interfacial energy of the substrates. Using these interfacial energies we estimated the ratio of wet and dry normal adhesion for geckos clinging to the three substrates. Consistent with the results for rough PTFE, our predictions show a qualitative trend in shear adhesion based on fluorination, and the quantitative experimental differences highlight the unusually low shear adhesion of geckos on dry smooth fluorinated substrates, which is not captured by surface energy calculations. Our work has implications for bioinspired design of synthetics that can preferentially stick in water but not in air.

36 MATERIALS SCIENCE↗

DOE OSTI2024

Adhesion and Contact Aging of Acrylic Pressure-Sensitive Adhesives to Swollen Elastomers

Fluid-infused (or swollen) elastomers are known for their antiadhesive properties. The presence of excess fluid at their surface is the main contributor to limiting contact formation and minimizing adhesion. Despite their potential, the mechanisms for adhesion and contact aging to fluid-infused elastomers are poorly understood beyond contact with a few materials (ice, biofilms, glass). This study reports on adhesion to a model fluid-infused elastomer, poly(dimethylsiloxane) (PDMS), swollen with silicone oil. The effects of oil saturation, contact time, and the opposing surface are investigated. Specifically, adhesion to two different adherents with comparable surface energies but drastically different mechanical properties is investigated: a glass surface and a soft viscoelastic acrylic pressure-sensitive adhesive film (PSA, modulus ~25 kPa). Adhesion between the PSA and swollen PDMS [with 23% (w/w) silicone oil] retains up to 60% of its value compared to contact with unswollen (dry) PDMS. In contrast, adhesion to glass nearly vanishes in contact with the same swollen elastomer. Adhesion to the PSA also displays stronger contact aging than adhesion to glass. Contact aging with the PSA is comparable for dry and unsaturated PDMS. Moreover, load relaxation when the PSA is in contact with the PDMS does not correlate with contact aging for contact with the dry or unsaturated elastomer, suggesting that contact aging is likely caused by chain interpenetration and polymer reorganization within the contact region. Closer to full saturation of the PDMS with oil, adhesion to the PSA decreases significantly and shows a delay in the onset of contact aging that is weakly correlated to the poroelastic relaxation of the elastomer. Additional confocal imaging suggests that the presence of a layer of fluid trapped at the interface between the two solids could explain the delayed (and limited) contact aging to the oil-saturated PDMS.

36 MATERIALS SCIENCE↗

DOE OSTI2024

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Additive manufacturing of functional devices on various rigid and flexible substrates is rising rapidly due to their design flexibility, rapid manufacturing, and lower cost. Current printing technologies are ink-based and focused on printing silver (Ag) as conductive lines due to its matured ink formulation process, low sintering temperature, ease of printing, and low oxidation rate. However, Ag is the 68th most abundant element on Earth, while copper (Cu) is the 25th, making it much cheaper (>100×) while having a comparable conductivity to Ag. Therefore, printing Cu has become technologically and economically more attractive than Ag. Nevertheless, Cu printing is still a significant challenge in ink-based printing methods due to the higher sintering temperature relative to the glass-transition temperature of most flexible substrates, the higher oxidation rate, the challenging ink formulation process, and ink stability concerns. Here, we demonstrate printing highly conductive Cu on flexible polyimide substrates using a dry printing technique. Cu nanoparticles (~3–30 nm) are generated by on-demand laser ablation of a solid Cu target inside the printer head and under argon background gas. These Cu nanoparticles are then transported through a nozzle and onto the substrate, where they are laser-sintered in real time. The argon gas plays three critical roles in laser plume condensation for nanoparticle generation, transport, and sheath gas to avoid oxidation during sintering. The sintered nanoparticles thus show high electrical conductivity and mechanical stability under static and cyclic tests. Our dry printing technique can potentially revolutionize how electronic devices and sensors are additively manufactured for earth and space applications.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2020

Adhesion-force micro-scale study of desiccating granular material

Experiments on five-, four-, three- and two-wet-hydrophilic-grain clusters were performed to investigate evolution of adhesion of granular media during drying on the micro-scale. The experiments show that the adhesion-force of a cluster initially grows at most to three times the original value before decreasing to zero by the end of evaporation. The adhesion-force is composed of capillary pressure force acting over the liquid/solid contact surface area, and surface tension forces acting over the three-phase contact perimeter length. This is in contrast with most macro-scale phenomenological models, in which the only desaturation process variables affecting strength are suction and saturation. Both the contact surface area and contact perimeter length are reduced to zero upon complete liquid evaporation. The morphology of an evaporating water body evolves through slow flow controlled by evaporation rate, interrupted by various modes of fast air entry, which are non-equilibrium jumps of liquid/gas interfaces (Haines jumps). The instabilities involve large adhesion force discontinuities and substantial water mass reconfiguration with water flow in an extremely short time, which makes the process transient. The reconfigurations can reduce the original multi-grain water clusters to four-, three- and two-grain clusters by way of three different instability modes: of thin-sheet instability, or meniscus snap-through instability, depending on the sign of the Gauss curvature of the liquid surface, or finally, for two-grain bridges only, a liquid wire pinch-off. For larger meso-scale assemblies, however, the global adhesion-force evolution is little affected by the jumps. The air entries are potential sites for drying cracks. The (approximately) calculated capillary pressure for two- and three-grain clusters, in no cases is seen to reach high values, predicted from water retention curves.

Engineering↗

DOE OSTI2021

The Role of Water on the Interfacial Adhesion in Si Solar Modules

Delamination of solar module interfaces often occurs in field-tested solar modules after decades of service due to environmental stressors such as humidity. As water diffuses into the module, failure mechanisms like corrosion and delamination are significantly affected. In the presence of water, the interfaces between EVA and the cell, glass, and backsheet all experience losses of adhesion exposing the module to accelerated degradation. Understanding the relation between interfacial adhesion and water content inside PV modules can help mitigate detrimental power losses. Water content measurements via short wave infrared reflectometry combined with 180 degrees peel tests were used to study and quantify the effect of water ingress and egress on adhesion. Changes in adhesion strength for different module interfaces are quantified, correlating spatial distribution of water content to adhesion for damp heat and dry heat exposed samples. After 1000 hours of damp heat exposure, decreases in adhesion strength of approximately 1 N/mm were noted for all interfaces.

adhesion↗

DOE OSTI2025

High-performance reversible adhesive from PET waste for underwater, structural, and pressure-sensitive applications

Developing versatile, tough, and sustainable adhesives that function effectively in both wet and dry environments is a major challenge. Here, we report a bioinspired design for versatile, tough, and reversible adhesives upcycled from consumer poly(ethylene terephthalate) (PET) waste. Our approach uses solvent-free, room-temperature dynamic cross-linking of deconstructed PET macromonomers with a diacetoacetate cross-linker, generating a dynamic, vinylogous urethane–bonded, amphiphilic adhesive. Tunable cross-linker concentration and amphiphilicity yield versatile adhesives suitable for underwater, structural, and pressure-sensitive applications on diverse substrates. Our adhesive exhibits high lap-shear strength and work of debonding under both wet and dry conditions, outperforming common commercial adhesives. The dynamic bonds enable thermal repair, on-demand multicycle debonding/rebonding, facile removal, and chemical recycling. Our strategy of transforming plastic waste into versatile, tough, and reversible adhesives offers a sustainable solution for both plastic waste management and next-generation adhesive design while also providing a commercially viable pathway for valorizing plastic waste.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2024

Investigating the Crosslinking, Degradation, and Adhesion Behavior of Photovoltaic Encapsulants Under Thermal Accelerated Aging

Degradation of photovoltaic (PV) module encapsulant characteristics that lead to mechanical embrittlement and delamination remains a cause of failure in solar installations. A multiscale reliability model connecting the encapsulant mechanical and fracture properties to the degraded molecular structure and interfacial bonding to adjacent solar cell and glass substrates was previously published. The model, developed primarily for poly(ethylene-co-vinyl acetate) acetate (EVA) encapsulants, remains to be experimentally validated. Determining the degradation and crosslinking kinetics of alternative encapsulants, such as polyolefin elastomer (POE) and EVA/POE/EVA composites (EPE), can generalize the model. In this work, we subject fully cured EVA, POE, and EPE encapsulants to accelerated thermal aging to determine how high temperatures impact reaction kinetics. An increase in gel content (crosslinking) and decrease in crystallinity of the encapsulants under hot-aerobic (90 degrees C, 22% RH) and hot-anaerobic (90 degrees C, sealed in N 2 air) aging were observed, even in the absence of UV and crosslinking initiators. Fourier transform infrared spectroscopy (FTIR)-attenuated total reflectance analysis showed insignificant encapsulant degradation, demonstrating the critical role of UV and moisture in accelerating degradation. Adhesion testing performed on coupon-level specimens (cell/encapsulant/glass laminates) showed decreases in adhesion energy, Gc , from 5000 h of hot-dry (90 degrees C, ~1% RH) and hot-humid (90 degrees C, 60% RH) aging. POE coupons demonstrated the best stability, followed by EPE then EVA. For EVA and POE, hot-humid aged coupons experienced a larger decrease in Gc due to enhanced hydrolytic degradation. Hot-dry aging condition demonstrated that thermal degradation of the interface could be significant even if the encapsulant experiences negligible degradation in the absence of UV and elevated humidity.

accelerated aging↗

DOE OSTI2015

Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted for by the glass transition temperature, T g , depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, T ref , by the same amount as the T g depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive T g depression, and joint strength is not recoverable by drying. Furthermore, a critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.

36 MATERIALS SCIENCE↗

DOE OSTI2025

Full-film dry transfer of MBE-grown van der Waals materials

Abstract Molecular beam epitaxy (MBE) has been used to create high-quality, large-scale two-dimensional van der Waals (2D vdW) materials. However, due to the strong adhesion between the substrate and deposited materials, the peel-off and dry transfer of MBE-grown vdW films onto other substrates has been challenging. This limits the study and use of MBE films for heterogeneous integration including stacked and twisted heterostructures. In this work, we develop a polymer-assisted dry transfer method and successfully perform full-film transfer of various MBE-grown 2D vdW materials including transition metal dichalcogenides, topological insulators and 2D magnets. In particular, we transfer air-sensitive 2D magnets, characterize their magnetic properties, and compare them with as-grown materials. The results show that the transfer technique does not degrade the magnetic properties, with the Curie temperature and hysteresis loops exhibiting similar behaviors after the transfer. Our results enable further development of heterogeneous integration of 2D vdW materials based on MBE growth.

Li, Ziling (ORCID:0000000203537036)↗