SEARCH · Search NASA
Results for “electrical connectivity”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Characteristics of soft metals for electrical connections.
Aerospace electrical and electronic equipment reliability requirements with reference to technology of miniature electrical connection devices
SansEC: A New Dimension to Sensing Electrical Sensors with No Electrical Connections
This DVD contains an introduction to SansEC, a new electrical sensor technology without electrical connections. This new class of sensors represents a stand-alone 2-dimensional geometric pattern of electrically open circuits without electrical connections. The sensor is powered with an external, harmonic magnetic field and as the property being sensed changes, responds to frequency, amplitude or bandwidth changes. This response is interrogated using an external antenna, a single electrical component having no electrical connections. The sensor can be encased in any nonconductive material to provide protection from its environment. If the container is nonconductive, the sensor can be placed external to the container without contacting it, making installation very simple. An encased sensor can also be placed inside a container for measuring the level of any fluid or material, including acids. Any readout device can be used with the sensor, including standard or digital gauges. SansEC sensors can be used to measure real-time fluid slosh to determine if a fuel tank's internal structural isogrid can be used to replace some of the baffles surface, thus reducing the overall baffle weight and giving a better understanding of the effect that isogrids have on fluid motion. Any SansEC sensor can also be used for damage or tamper detection. When damaged, torn or tampered with, the measured response shift in frequency is commensurate to the detected damage, with the response frequency increasing with rising damage. The unique sensor design allows it to function even if damaged, because unlike other circuits, there is no single point on the sensor that, if damaged, renders it non-functional. The broad metallic coverage of the array allows the array to be one of many thermal insulation layers. Two such arrays were tested to understand the effects of high velocity damage. Each test article was targeted with metal projectiles emulating micrometeorite or orbital debris impact. Even with the damage that the sensors received every sensor was still functional with the new response baseline, and remained capable of detecting even more damage.
Chemical Detection using Electrically Open Circuits having no Electrical Connections
This paper presents investigations to date on chemical detection using a recently developed method for designing, powering and interrogating sensors as electrically open circuits having no electrical connections. In lieu of having each sensor from a closed circuit with multiple electrically connected components, an electrically conductive geometric pattern that is powered using oscillating magnetic fields and capable of storing an electric field and a magnetic field without the need of a closed circuit or electrical connections is used. When electrically active, the patterns respond with their own magnetic field whose frequency, amplitude and bandwidth can be correlated with the magnitude of the physical quantities being measured. Preliminary experimental results of using two different detection approaches will be presented. In one method, a thin film of a reactant is deposited on the surface of the open-circuit sensor. Exposure to a specific targeted reactant shifts the resonant frequency of the sensor. In the second method, a coating of conductive material is placed on a thin non-conductive plastic sheet that is placed over the surface of the sensor. There is no physical contact between the sensor and the electrically conductive material. When the conductive material is exposed to a targeted reactant, a chemical reaction occurs that renders the material non-conductive. The change in the material s electrical resistance within the magnetic field of the sensor alters the sensor s response bandwidth and amplitude, allowing detection of the reaction without having the reactants in physical contact with the sensor.
Wireless Electrical Device Using Open-Circuit Elements Having No Electrical Connections
A wireless electrical device includes an electrically unconnected electrical conductor and at least one electrically unconnected electrode spaced apart from the electrical conductor. The electrical conductor is shaped for storage of an electric field and a magnetic field. In the presence of a time-varying magnetic field, the electrical conductor so-shaped resonates to generate harmonic electric and magnetic field responses. Each electrode is at a location lying within the magnetic field response so-generated and is constructed such that a linear movement of electric charges is generated in each electrode due to the magnetic field response so-generated.
Integrity of electrical connections Completion reports for subtasks d,e,f, and g
Insulation material testing to determine reliability of electrical connections
Checking Plumbing Connections Electrically
Ports identified by Zener-diode voltages. Electronic verification circuits assist in assembly of multiple-line plumbing by helping to ensure proper lines joined to proper input and output ports. Zener diode and electronic jack added to each fixture. Zener breakdown voltage is different for each port. When fixture makes fluid connection, also makes electrical connection. Zener breakdown voltage identifies line, port, or valve to which fluid line connected.
Rotary Joints With Electrical Connections
Power and data transmitted on many channels. Two different rotary joints equipped with electrical connections between rotating and stationary parts. One joint transmits axial thrust and serves as interface between spinning and nonspinning parts of Galileo spacecraft. Other is scanning (limitedrotation) joint that aims scientific instruments from nonspinning part. Selected features of both useful to designers of robots, advanced production equipment, and remotely controlled instruments.
Device without electrical connections in tank measures liquid level
Vertical static float in a tank measures the liquid level without the use of electrical connections in the tank. The float transmits the buoyant force of the liquid to an external force transducer. It is insensitive to tank pressure and temperature changes.
Requirements for soldered electrical connections
This publication is applicable to NASA programs involving solder connections for flight hardware, mission essential support equipment, and elements thereof. This publication sets forth hand and wave soldering requirements for reliable electrical connections. The prime consideration is the physical integrity of solder connections. Special requirements may exist which are not in conformance with the requirements of this publication. Design documentation contains the detail for these requirements, and they take precedence over conflicting portions of this publication when they are approved in writing by the procuring NASA installation.
Process for Fabrication of Superconducting Vias for Electrical Connection to Groundplane in Cryogenic Detectors
Disclosed are systems, methods, and non-transitory computer-readable storage media for fabrication of silicon on insulator (SOI) wafers with a superconductive via for electrical connection to a groundplane. Fabrication of the SOI wafer with a superconductive via can involve depositing a superconducting groundplane onto a substrate with the superconducting groundplane having an oxidizing layer and a non-oxidizing layer. A layer of monocrystalline silicon can be bonded to the superconducting groundplane and a photoresist layer can be applied to the layer of monocrystalline silicon and the SOI wafer can be etched with the oxygen rich etching plasma, resulting in a monocrystalline silicon top layer with a via that exposes the superconducting groundplane. Then, the fabrication can involve depositing a superconducting surface layer to cover the via.
Dust-Tolerant Intelligent Electrical Connection System
Faults in wiring systems are a serious concern for the aerospace and aeronautic (commercial, military, and civilian) industries. Circuit failures and vehicle accidents have occurred and have been attributed to faulty wiring created by open and/or short circuits. Often, such circuit failures occur due to vibration during vehicle launch or operation. Therefore, developing non-intrusive fault-tolerant techniques is necessary to detect circuit faults and automatically route signals through alternate recovery paths while the vehicle or lunar surface systems equipment is in operation. Electrical connector concepts combining dust mitigation strategies and cable diagnostic technologies have significant application for lunar and Martian surface systems, as well as for dusty terrestrial applications. The dust-tolerant intelligent electrical connection system has several novel concepts and unique features. It combines intelligent cable diagnostics (health monitoring) and automatic circuit routing capabilities into a dust-tolerant electrical umbilical. It retrofits a clamshell protective dust cover to an existing connector for reduced gravity operation, and features a universal connector housing with three styles of dust protection: inverted cap, rotating cap, and clamshell. It uses a self-healing membrane as a dust barrier for electrical connectors where required, while also combining lotus leaf technology for applications where a dust-resistant coating providing low surface tension is needed to mitigate Van der Waals forces, thereby disallowing dust particle adhesion to connector surfaces. It also permits using a ruggedized iris mechanism with an embedded electrodynamic dust shield as a dust barrier for electrical connectors where required.
Wireless Temperature Sensing Method Using no Electrical Connections
A wireless temperature sensor includes an electrical conductor and a material spaced apart from the conductor and located within one or more of the responding electric field and responding magnetic field of the conductor. The conductor is electrically unconnected and is shaped for storage of an electric field and a magnetic field. In the presence of a time-varying magnetic field, the conductor resonates to generate harmonic electric and magnetic field responses, each of which has a frequency associated therewith. The material is selected such that it experiences changes in one of dielectric properties and magnetic permeability properties in the presence of a temperature change. Shifts from the sensor's baseline frequency response indicate that the material has experienced a temperature change.
Wireless Open-Circuit In-Plane Strain and Displacement Sensor Requiring No Electrical Connections
A wireless in-plane strain and displacement sensor includes an electrical conductor fixedly coupled to a substrate subject to strain conditions. The electrical conductor is shaped between its ends for storage of an electric field and a magnetic field, and remains electrically unconnected to define an unconnected open-circuit having inductance and capacitance. In the presence of a time-varying magnetic field, the electrical conductor so-shaped resonates to generate harmonic electric and magnetic field responses. The sensor also includes at least one electrically unconnected electrode having an end and a free portion extending from the end thereof. The end of each electrode is fixedly coupled to the substrate and the free portion thereof remains unencumbered and spaced apart from a portion of the electrical conductor so-shaped. More specifically, at least some of the free portion is disposed at a location lying within the magnetic field response generated by the electrical conductor. A motion guidance structure is slidingly engaged with each electrode's free portion in order to maintain each free portion parallel to the electrical conductor so-shaped.
Ultrasonic Inspection to Quantify Failure Pathologies of Crimped Electrical Connections
Previous work has shown that ultrasonic inspection provides a means of assessing electrical crimp quality that ensures the electrical and mechanical integrity of an initial crimp before the installation process is completed. The amplitude change of a compressional ultrasonic wave propagating at right angles to the wire axis and through the junction of a crimp termination was shown to correlate with the results of destructive pull tests, which is a standard for assessing crimp wire junction quality. Of additional concern are crimps made at high speed assembly lines for wiring harnesses, which are used for critical applications, such as in aircraft. During high-speed assembly it is possible that many faulty crimps go undetected until long after assembly, and fail in service. The position and speed of the crimping jaw become factors as the high-speed crimp is formed. The work presented in this paper is designed to cover the more difficult and more subtle area of high-speed crimps by taking into account the rate change of the measurements. Building on the previous work, we present an analysis methodology, based on transmitted ultrasonic energy and timing of the first received pulse that is shown to correlate to the gauge of the crimp/ferrule combination and the position of the crimping jaw. Results demonstrating the detectability of a number of the crimp failure pathologies, such as missing strands, partially inserted wires and incomplete crimp compression, are presented. The ability of this technique to estimate crimp height, a mechanical measure of crimp quality, is discussed.
Wireless Temperature Sensor Having No Electrical Connections and Sensing Method for Use Therewith
A wireless temperature sensor includes an electrical conductor and a dielectric material on the conductor. The conductor is electrically unconnected and is shaped for storage of an electric field and a magnetic field. In the presence of a time-varying magnetic field, the conductor resonates to generate harmonic electric and magnetic field responses, each of which has a frequency associated therewith. The material is selected such that it experiences changes in either dielectric or magnetic permeability attributes in the presence of a temperature change. Shifts from the sensor's baseline frequency response indicate that the material has experienced a temperature change.
Program For Engineering Electrical Connections
DFACS is interactive multiuser computer-aided-engineering software tool for system-level electrical integration and cabling engineering. Purpose of program to provide engineering community with centralized data base for putting in and gaining access to data on functional definition of system, details of end-circuit pinouts in systems and subsystems, and data on wiring harnesses. Objective, to provide instantaneous single point of interchange of information, thus avoiding error-prone, time-consuming, and costly shuttling of data along multiple paths. Designed to operate on DEC VAX mini or micro computer using Version 5.0/03 of INGRES.
Electrically Connecting to Pressure Vessels
Resilient conductive disk eliminates need for holes in vessel walls. Grounding disk made from wire and solder and sandwiched between electrical-component support and pressure-vessel wall. Emplaced in component support, disk squeezed to 66 percent of its thickness. Disk conforms to surfaces of support and vessel wall when support attached to wall with adhesive. Disk thus forms reliable electrical contact from support (and its electrical component) to wall.