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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Towards Prognostics for Electronics Components

Electronics components have an increasingly critical role in avionics systems and in the development of future aircraft systems. Prognostics of such components is becoming a very important research field as a result of the need to provide aircraft systems with system level health management information. This paper focuses on a prognostics application for electronics components within avionics systems, and in particular its application to an Isolated Gate Bipolar Transistor (IGBT). This application utilizes the remaining useful life prediction, accomplished by employing the particle filter framework, leveraging data from accelerated aging tests on IGBTs. These tests induced thermal-electrical overstresses by applying thermal cycling to the IGBT devices. In-situ state monitoring, including measurements of steady-state voltages and currents, electrical transients, and thermal transients are recorded and used as potential precursors of failure.

Saha, Bhaskar↗
NASA NTRS1967

Bacteriostatic conformal coating for electronic components

Coating for electronic components used in space applications has bacteriostatic qualities capable of hindering bacterial reproduction, both vegetative and sporulative viable microorganisms. It exhibits high electrical resistivity, a low outgassing rate, and is capable of restraining electronic components when subjected to mechanical vibrations.

Bland, C.↗
NASA NTRS2009

Prognostics for Electronics Components of Avionics Systems

Electronics components have and increasingly critical role in avionics systems and for the development of future aircraft systems. Prognostics of such components is becoming a very important research filed as a result of the need to provide aircraft systems with system level health management. This paper reports on a prognostics application for electronics components of avionics systems, in particular, its application to the Isolated Gate Bipolar Transistor (IGBT). The remaining useful life prediction for the IGBT is based on the particle filter framework, leveraging data from an accelerated aging tests on IGBTs. The accelerated aging test provided thermal-electrical overstress by applying thermal cycling to the device. In-situ state monitoring, including measurements of the steady-state voltages and currents, electrical transients, and thermal transients are recorded and used as potential precursors of failure.

Celaya, Jose R.↗
NASA NTRS2010

Multilayer electronic component systems and methods of manufacture

Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Thompson, Dane↗
NASA NTRS1979

Localized cooling of electronic components

Board-mounted electronic components are cooled quickly and conveniently for troubleshooting with aid of device that produces cold jet of dry oxygen. It can cool nonflat and hard-to-reach components.

Source record↗
DOE OSTI2026

The Heterogeneous Integration of Electronic Components

Heterogeneous integration (HI) of electronics components is broadly recognized as a powerful and crucial enabler for the continued growth of computing and communication. From 2010 onwards, the value of HI is increasingly visible in the advanced packaging used in artificial intelligence, high-performance computing, smartphones and communications product implementations. In this Perspective, we argue that HI is crucial to semiconductors and more broadly to the continued evolution of computing and communications. We use leading-edge advanced packaging examples to represent the value, advancements and opportunities for HI. To succeed, it is critical to develop comprehensive HI roadmaps that inform collaborations across the design, manufacturing and reliability spectrum between systems architects, packaging and semiconductor technologists to common goals. Although this article does not provide a full roadmap, we instead detail additional parameters for artificial intelligence, smartphone and other cellular communication devices, and their constituent building blocks including interconnects, power electronics, photonics, thermal management, reliability, modelling and co-design, to foster greater collaboration opportunities among academia, research laboratories and industry.

42 ENGINEERING↗
DOE OSTI2025

Microbead Encapsulation for Protection of Electronic Components

Here, this study investigates the application of microbeads as an innovative encapsulation technique to protect electronic components from harsh mechanical strain. Traditional encapsulation methods using hard epoxy provide substantial mechanical support but create thermal expansion mismatch issues, potentially leading to electronic component failure. We explore the use of finely powdered microbeads to achieve protective structures combining stiffness and energy absorption. The research focuses on key variables, including microbead size, microbead roughness, compaction of microbeads, and circuit board mounting in the encapsulation, all of which influence the encapsulation’s effectiveness. Experimental setups and testing protocols were developed to assess the performance of various microbead materials under different impact conditions. Results demonstrate that microbead encapsulation significantly reduces strain on circuit boards, minimizing the risk of damage during mechanical shocks. However, challenges remain, such as optimizing microbead characteristics and modeling their behavior within large-scale circuit board assemblies. Despite these challenges, the findings suggest that microbead encapsulation offers a promising alternative to conventional methods, enhancing the durability and reliability of electronic components in high-stress environments.

42 ENGINEERING↗
NASA NTRS1965

Novel probe simplifies electronic component testing

Test probe, in conjunction with standard equipment, tests axial-lead electronic components in their original packages. The probe can be modified to test any electronic component with automatic or nonautomatic equipment.

Syner, W. F.↗
NASA NTRS1977

Honeycomb chassis for electronic components

In new electronic chassis support, machined honeycomb members are used to change basic relationship between chassis and support structure. Improved chassis combines internal and external support and heat dissipation by altering chassis internal geometry. Honeycomb materials allow mechanical support and thermal load sharing to be combined at lower weight and lower cost than previous equipment.

Read, W. S.↗
NASA NTRS2001

Electronic Components and Systems for Cryogenic Space Applications

Electronic components and systems capable of operation at cryogenic temperatures are anticipated in many future NASA space missions such as deep space probes and planetary surface exploration. For example, an unheated interplanetary probe launched to explore the rings of Saturn would reach an average temperature near Saturn of about - 183 C. In addition to surviving the deep space harsh environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing payload development and launch costs. Terrestrial applications where components and systems must operate in low temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. An on-going research and development program at the NASA Glenn Research Center focuses on the development of reliable electronic devices and efficient power systems capable of surviving in low temperature environments. An overview of the program will be presented in this paper. A description of the low temperature test facilities along with selected data obtained from in-house component testing will also be discussed. Ongoing research activities that are being performed in collaboration with various organizations will also be presented.

Patterson, R. L.↗
NASA NTRS1985

Electrostatic instabilities in plasmas with two electron components

This paper considers the linear theory of electrostatic Vlasov instabilities driven by the relative drift between two Maxwellian electron components in an unmagnetized, homogeneous plasma bearing zero current. The dispersion properties, threshold drift speeds and growth rates of the electron beam instability, the conventional ion acoustic instability, and the ion acoustic beam instability are compared in detailed parametric studies. A new way of illustrating the parameter regimes in whih each of these three instabilities has the lowest threshold drift speed is demonstrated. This leads to clearly illustrated criteria for determining when enhanced electrostatic fluctuations between the ion and the electron plasma frequencies may be observed in plasmas with two electron components. In the case of a hot beam this criterion is a beam density n(b) which satisfies n(b)/n(e) is between 0.05 and 0.30 where n(e) is the total electron density.

Gary, S. P.↗