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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

All sources NASA NTRS DOE OSTI

NASA NTRS2006

Embedded Resistors and Capacitors in Organic and Inorganic Substrates

Embedded resistors and capacitors were purchased from two technology; organic PWB and inorganic low temperature co-fire ceramic (LTCC). Small groups of each substrate were exposed to four environmental tests and several characterization tests to evaluate their performance and reliability. Even though all passive components maintained electrical performance throughout environmental testing, differences between the two technologies were observed. Environmental testing was taken beyond manufacturers' reported testing, but general not taken to failure. When possible, data was quantitatively compared to manufacturer's data.

printed circuit board (PCB)↗

NASA NTRS2007

RF and DC Power Handling Characterization of Thin Film Resistors Embedded on LCP

For the first time, the DC and RF power handling capability of NiCrAlSi thin film resistors on Liquid Crystal Polymer (LCP) is presented. It is shown that there is a maximum power that the resistors can handle without causing degradation of the resistors, and this value is significantly less than the power required for burn out of the resistors. EDAX shows that the resistors fail due to electromigration of Ni and Cr, and migration of C from the LCP.

Ponchak, George E.↗

NASA NTRSDate not supplied

Design and Assembly Process Implementation for Embedding Passive and Active Components Introduction to IPC-7092

"This presentation describes the design and assembly challenges for implementing passive and active components, in either formed or inserted methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and be made from organic, inorganic (ceramic) or both types of material."

embedded circuitry↗

NASA NTRS1994

Spiral microstrip antenna with resistance

The present invention relates to microstrip antennas, and more particularly to wide bandwidth spiral antennas with resistive loading. A spiral microstrip antenna having resistor element embedded in each of the spiral arms is provided. The antenna is constructed using a conductive back plane as a base. The back plane supports a dielectric slab having a thickness between one-sixteenth and one-quarter of an inch. A square spiral, having either two or four arms, is attached to the dielectric slab. Each arm of the spiral has resistor elements thereby dissipating an excess energy not already emitted through radiation. The entire configuration provides a thin, flat, high gain, wide bandwidth antenna which requires no underlying cavity. The configuration allows the antenna to be mounted conformably on an aircraft surface.

Shively, David G.↗

NASA NTRS1998

Spiral Microstrip Antenna with Resistance

A spiral microstrip antenna having resistor elements embedded in each of the spiral arms is provided. The antenna is constructed using a conductive back plane as a base. The back plane supports a dielectric slab having a thickness between one-sixteenth and one-quarter of an inch. A square spiral, having either two or four arms, is attached to the dielectric slab. Each arm of the spiral has resistor elements thereby dissipating an excess energy not already emitted through radiation. The entire configuration provides a thin, flat, high gain, wide bandwidth antenna which requires no underlying cavity. The configuration allows the antenna to be mounted conformably on an aircraft surface.

Shively, David G.↗

DOE OSTI2014

Design and fabrication of a CMOS-compatible MHP gas sensor

A novel micro-hotplate (MHP) gas sensor is designed and fabricated with a standard CMOS technology followed by post-CMOS processes. The tungsten plugging between the first and the second metal layer in the CMOS processes is designed as zigzag resistor heaters embedded in the membrane. In the post-CMOS processes, the membrane is released by front-side bulk silicon etching, and excellent adiabatic performance of the sensor is obtained. Pt/Ti electrode films are prepared on the MHP before the coating of the SnO{sub 2} film, which are promising to present better contact stability compared with Al electrodes. Measurements show that at room temperature in atmosphere, the device has a low power consumption of ∼19 mW and a rapid thermal response of 8 ms for heating up to 300 °C. The tungsten heater exhibits good high temperature stability with a slight fluctuation (<0.3%) in the resistance at an operation temperature of 300 °C under constant heating mode for 336 h, and a satisfactory temperature coefficient of resistance of about 1.9‰/°C.

36 MATERIALS SCIENCE↗

NASA NTRS2009

Embedded passives emulator FY2003 interim report

The National Aeronautics and Space Administration Electronic Parts and Packaging (NEPP) Program has been evaluating state-of-the-art Embedded Passive Technology for the printed circuit board (PCB) industry for the past several years and has conducted its own testing on embedded passive coupons (resistors and capacitors). This document is a progress report of the work performed through fiscal year 2008 by NASA and the Navy to convert an existing PWB (printed wiring board) design to a design that incorporates embedded passive components. The work is being performed through a memorandum of understanding (MOU) between the NEPP Program (NASA) and the Naval Surface Warfare Center (NSWC) Crane Emerging Critical Interconnect Technology (ECIT) Program. NSWC Crane’s ECIT Program has funding to convert two PCB designs from the military and aerospace industry to a PCB design with embedded passives. ECIT will provide a design team that will take a well characterized design and convert it to an embedded design. They will also provide electrical modeling and layout expertise as well as build the PWB in their facility in Indiana. NEPP, through the Jet Propulsion Laboratory (JPL), will assemble any passives deemed not suitable for embedding and the active components and electrically test the new design to the existing (non-embedded) design

Gerke, David↗

NASA NTRS2018

A Screening Method Using Pulsed-Power Combined with Infrared Imaging to Detect Pattern Defects in Bulk Metal Foil or Thin Film Resistors

Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70°C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.

screening↗

NASA NTRS2018

A Screening Method Using Pulsed-Power Combined with Infrared Imaging to Detect Pattern Defects in Bulk Metal Foil or Thin Film Resistors

screening↗

NASA NTRS2003

Development of reliable electronic packaging solutions for spacecraft avionics miniaturization using embedded passice devices

Miniaturization of electronic packages will play a key rule in future space avionics systems. Smaller avionics packages will reduce payloads while providing greater functionality for information processing and mission instrumentation. Current surface mount technology discrete passive devices not only take up significant space but also add weight. To that end, the use of embedded passive devices, such as capacitors, inductors and resistors will be instrumental in allowing electronics to be made smaller and lighter. Embedded passive devices fabricated on silicon or like substrates using thin film technology, promise great savings in circuit volume, as well as potentially improving electrical performance by decreasing parasitic losses. These devices exhibit a low physical profile and allow the circuit footprint to be reduced by stacking passive elements within a substrate. Thin film technologies used to deposit embedded passive devices are improving and costs associated with the process are decreasing.

Schatzel, Don↗

DOE OSTI2024

Embedded Fluidic Sensing and Control with Soft Open‐Cell Foams

Abstract The synthesis of soft matter intelligence with circuit‐driven logic has enabled a new class of robots that perform complex tasks or conform to specialized form factors in unique ways that cannot be realized through conventional designs. Translating this hybrid approach to fluidic systems, the present work addresses the need for sheet‐based circuit materials by leveraging the innate porosity of foam—a soft material—to develop pneumatic components that support digital logic, mixed‐signal control, and analog force sensing in wearables and soft robots. Analytical tools and experimental techniques developed in this work serve to elucidate compressible gas flow through porous sheets, and to inform the design of centimeter‐sized foam resistors with fluidic resistances on the order of 10 9 Pa s m −3 . When embedded inside soft robots and wearables, these resistors facilitate diverse functionalities spanning both sensing and control domains, including digital logic using textile logic gates, digital‐to‐analog signal conversion using ladder networks, and analog sensing of forces up to 40 N via compression‐induced changes in resistance. By combining features of both circuit‐based and materials‐based approaches, foam‐enabled fluidic circuits serve as a useful paradigm for future hybrid robotic architectures that fully embody the sensing and computing capabilities of soft fluidic materials.

Rajappan, Anoop↗

NASA NTRS1986

Pressure-Sensitive Resistor Material

Low-conductivity particles in rubber offer wide dynamic range. Sensor consists of particles of relatively low conductivity embedded in rubber. Resistance of sensor decreases by about 100 times as pressure on it increases from zero to 0.8 MN/M to the second power. Resistor promising candidate as tactile sensor for robots and remote manipulators.

Du Fresne, E. R.↗

NASA NTRS2010

NASA Tech Briefs, January 2010

Topics covered include: Cryogenic Flow Sensor; Multi-Sensor Mud Detection; Gas Flow Detection System; Mapping Capacitive Coupling Among Pixels in a Sensor Array; Fiber-Based Laser Transmitter for Oxygen A-Band Spectroscopy and Remote Sensing; Low-Profile, Dual-Wavelength, Dual-Polarized Antenna; Time-Separating Heating and Sensor Functions of Thermistors in Precision Thermal Control Applications; Cellular Reflectarray Antenna; A One-Dimensional Synthetic-Aperture Microwave Radiometer; Electrical Switching of Perovskite Thin-Film Resistors; Two-Dimensional Synthetic-Aperture Radiometer; Ethernet-Enabled Power and Communication Module for Embedded Processors; Electrically Variable Resistive Memory Devices; Improved Attachment in a Hybrid Inflatable Pressure Vessel; Electrostatic Separator for Beneficiation of Lunar Soil; Amorphous Rover; Space-Frame Antenna; Gear-Driven Turnbuckle Actuator; In-Situ Focusing Inside a Thermal Vacuum Chamber; Space-Frame Lunar Lander; Wider-Opening Dewar Flasks for Cryogenic Storage; Silicon Oxycarbide Aerogels for High-Temperature Thermal Insulation; Supercapacitor Electrolyte Solvents with Liquid Range Below -80 C; Designs and Materials for Better Coronagraph Occulting Masks; Fuel-Cell-Powered Vehicle with Hybrid Power Management; Fine-Water-Mist Multiple-Orientation-Discharge Fire Extinguisher; Fuel-Cell Water Separator; Turbulence and the Stabilization Principle; Improved Cloud Condensation Nucleus Spectrometer; Better Modeling of Electrostatic Discharge in an Insulator; Sub-Aperture Interferometers; Terahertz Mapping of Microstructure and Thickness Variations; Multiparallel Three-Dimensional Optical Microscopy; Stabilization of Phase of a Sinusoidal Signal Transmitted Over Optical Fiber; Vacuum-Compatible Wideband White Light and Laser Combiner Source System; Optical Tapers as White-Light WGM Resonators; EPR Imaging at a Few Megahertz Using SQUID Detectors; Reducing Field Distortion in Magnetic Resonance Imaging; Fluorogenic Cell-Based Biosensors for Monitoring Microbes; A Constant-Force Resistive Exercise Unit; GUI to Facilitate Research on Biological Damage from Radiation; On-Demand Urine Analyzer; More-Realistic Digital Modeling of a Human Body; and Advanced Liquid-Cooling Garment Using Highly Thermally Conductive Sheets.

Source record↗

NASA NTRS2003

Eroding Potentiometers

Eroding potentiometers have been devised for measuring the time-dependent positions of char fronts advancing through layers of insulating material subject to intense heating from one side. In the original application, the material layers of interest are thermal insulators in rocket motors and the heat comes from firing of the motors, but the principle of operation is equally applicable to other insulating materials subject to intense heating (e.g., ablative fire-retardant materials). Measuring the thickness decrement of propellant (in hybrid motors in particular) is another possible application of this transducer. Telemetry informs mission control of the propellant left after each burn. An eroding potentiometer could be characterized, more precisely, as an eroding two-wire resistor. It includes a twisted pair of thin, insulated wires oriented along the thickness of, and embedded in, the layer of thermal-insulation material to be tested (see figure). The electrical insulation material on the wires should be one for which the charring temperature is about the same as (or perhaps slightly less than) that of the thermal- insulation material to be tested. In the original rocket-motor application, the wires have a diameter of 0.003 in. (.0.08 mm), are made of manganin, and are coated with polyimide for electrical insulation. Outside the thermal insulation on the cold side, the wire leads are connected to a Wheatstone bridge circuit for measurement of electrical resistance change.

Eggett, Mark↗

DOE OSTI2018

Effect of High Magnetic Pulse Iteration on Electrical Property of CNT-Polypyrrole Composite: Alignment Mechanism

In this work, a pulsed magnetic field of 10 T with a duration of 1.5 ms is produced by a resistor-inductor-capacitor (RLC) discharge system. A carbon nanotube-polypyrrole (CNT-PPy) composite (9 wt%) is prepared. The influence of the pulsed magnetic field iteration on the alignment of CNTs embedded in polymer matrix is observed (up to 60 pulses). The microstructure of the magnetically aligned composites is probed by scanning probe microscopy technique. The behavior of a CNT in a magnetic field is theoretically studied, and the equivalent magnetic susceptibility for an anisotropic CNT is calculated. The theory of CNT alignment in a magnetic field is discussed. We found that the perpendicular diamagnetism of a CNT results in its alignment in a magnetic field. We showed that the magnetic torque, which is applied to a CNT, depends on the perpendicular and parallel susceptibilities of the CNT as well as on its initial orientation with respect to the magnetic direction. After exposure to magnetic pulses, the electrical property of the composites is enhanced. The results show that there is a positive correlation between the electrical conductance of CNTs and the number of applied pulses (for 30 pulses). Fourier transform infrared spectroscopy technique is used to control the polymer structure during the experiment. Our theoretical finding reveals the limited capacity of CNT’s alignment in magnetic fields.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

NASA NTRS2001

Integration of Passive Components for Spacecraft Avionics

The NASA roadmap outlining future deep space missions to Europa and other outer planetary destinations calls for continued reductions in the mass and volume of the spacecraft avionics. Spacecraft power electronics, including the power switches and converters, remain difficult to miniaturize due to the need for large numbers of discrete passive components such as resistors, capacitors, inductors and transformers. As part of the System-on-a-chip program at the Center for Integrated Space Microsystems and at the University of Arkansas, we are working to develop integrated or embedded passive components geared specifically for use in power management and distribution (PMAD) in future avionics over the next five to ten years. This will not only enable a scaling down of the power subsystems, but will make possible new architectures such as "distributed" PMAD. Additional information is contained in the original extended abstract.

Brandon, E. J.↗

NASA NTRS1976

Methods for testing high voltage connectors in vacuum, measurements of thermal stresses in encapsulated assemblies, and measurement of dielectric strength of electrodes in encapsulants versus radius of curvature

Internal embedment stress measurements were performed, using tiny ferrite core transformers, whose voltage output was calibrated versus pressure by the manufacturer. Comparative internal strain measurements were made by attaching conventional strain gages to the same type of resistors and encapsulating these in various potting compounds. Both types of determinations were carried out while temperature cycling from 77 C to -50 C.

Bever, R. S.↗

DOE OSTI2026

Geothermal-integrated thermally anisotropic building envelope for energy and peak-demand reduction

Buildings consume large amounts of energy for heating and cooling, while peak electricity demand places significant stress on the power grid. This paper presents a reduced-order co-simulation framework and load-oriented supervisory control strategy for a geothermal-integrated thermally anisotropic building envelope with a ground loop (TABE+GL). In TABE+GL, a hydronic loop embedded in the building envelope is directly coupled with a geothermal ground loop, allowing for bidirectional heat exchange between the envelope, the ground, and the indoor environment. A hybrid co-simulation framework was established by coupling a reduced-order resistor–capacitor (RC) thermal network model with EnergyPlus augmented with GHEDesigner modules. The RC model generated feasible heat flux options under three operating modes, and EnergyPlus predicted sensible loads, energy use, and pump energy demand. At each simulation step, a supervisory control algorithm selected the optimal loop configuration and duty factor that maximizes useful TABE geothermal utilization without exceeding the predicted sensible load, thereby avoiding overheating or cooling. Case studies were conducted for Los Angeles, California, Charleston, South Carolina, and Denver, Colorado. Results showed that the proposed framework reduced HVAC electricity consumption by 43%–67%, natural gas use for space heating by 11%–38%, and peak electricity demand by 43%–88%. These results highlight the potential of combining reduced-order envelope modeling, direct geothermal coupling, and load-oriented supervisory control to improve whole building energy performance and reduce peak demand across diverse weather conditions.

Howard, Daniel [Southern Adventist University]↗