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At least 19 records

Flat and Level Analysis Tool (FLAT) for real-time automated segmentation and analysis of concrete slab point clouds

In the United States, the flatness and levelness of concrete floors during construction is traditionally specified by a maximum allowable gap under a 3 meter straightedge. However, the straightedge method is inexact and rarely representative of the entire floor since the technician is free to choose any location on the floor to perform the measurement. In cases requiring a higher degree of precision and repeatability, concrete floor flatness and levelness can be measured using the standard test method ASTM E1155. With the recent introduction of advanced surveying instruments such as robotic theodolites and terrestrial laser scanners (TLS), the means now exist to modernize and expedite the measurement of floor flatness and levelness. This paper details the development and demonstration of a digital tool, named the Flat and Level Analysis Tool (FLAT), to automate and expedite the segmentation and analysis of flatness and levelness from dense point cloud data of concrete floor slabs. Segmentation algorithms were developed using unsupervised machine learning to extract the set of points belonging to the concrete floor slab from a full 360 scan of a construction site. After segmentation, automated analysis algorithms report the results according to the standard method. The developed algorithms were demonstrated on a dense point cloud captured from a concrete slab-on-grade at a construction site. Results show that the digital tool can quickly provide estimates for floor flatness and levelness with minimal human involvement with comparable accuracy to manual methods.

Hayes, Nolan

Proceedings of the Flat-Plate Solar Array Project Research Forum on the Design of Flat-Plate Photovoltaic Arrays for Central Stations

The Flat Plate Solar Array Project, focuses on advancing technologies relevant to the design and construction of megawatt level central station systems. Photovoltaic modules and arrays for flat plate central station or other large scale electric power production facilities require the establishment of a technical base that resolves design issues and results in practical and cost effective configurations. Design, qualification and maintenance issues related to central station arrays derived from the engineering and operating experiences of early applications and parallel laboratory reserch activities are investigated. Technical issues are examined from the viewpoint of the utility engineer, architect/engineer and laboratory researcher. Topics on optimum source circuit designs, module insulation design for high system voltages, array safety, structural interface design, measurements, and array operation and maintenance are discussed.

Source record

Gratings Fabricated on Flat Surfaces and Reproduced on Non-Flat Substrates

A method has been developed for fabricating gratings on flat substrates, and then reproducing the groove pattern on a curved (concave or convex) substrate and a corresponding grating device. First, surface relief diffraction grating grooves are formed on flat substrates. For example, they may be fabricated using photolithography and reactive ion etching, maskless lithography, holography, or mechanical ruling. Then, an imprint of the grating is made on a deformable substrate, such as plastic, polymer, or other materials using thermoforming, hot or cold embossing, or other methods. Interim stamps using electroforming, or other methods, may be produced for the imprinting process or if the same polarity of the grating image is required. The imprinted, deformable substrate is then attached to a curved, rigid substrate using epoxy or other suitable adhesives. The imprinted surface is facing away from the curved rigid substrate. As an alternative fabrication method, after grating is imprinted on the deformable substrate as described above, the grating may be coated with thin conformal conductive layer (for example, using vacuum deposition of gold). Then the membrane may be mounted over an opening in a pressured vessel in a manner of a membrane on a drum, grating side out. The pressure inside of the vessel may be changed with respect to the ambient pressure to produce concave or convex membrane surface. The shape of the opening may control the type of the surface curvature (for example, a circular opening would create spherical surface, oval opening would create toroidal surface, etc.). After that, well-known electroforming methods may be used to create a replica of the grating on the concave or convex membrane. For example, the pressure vessel assembly may be submerged into an electro-forming solution and negative electric potential applied to the metal coated membrane using an insulated wire. Positive electric potential may be then applied to a nickel or other metal plate submerged into the same solution. Metal ions would transfer from the plate through the solution into the membrane, producing high fidelity metal replica of the grating on the membrane. In one variation, an adhesive may be deposited on the deformable substrate, and then cured without touching the rigid, curved substrate. Edges of the deformable substrate may be attached to the rigid substrate to ensure uniform deformation of the deformable substrate. The assembly may be performed in vacuum, and then taken out to atmospheric pressure conditions to ensure that no air is trapped between the deformable and rigid substrates. Alternatively, a rigid surface with complementary curvature to the rigid substrate may be used to ensure uniform adhesion of the deformable substrate to the rigid substrate. Liquid may be applied to the surface of the deformable substrate to uniformly distribute pressure across its surface during the curing or hardening of the adhesive, or the film may be pressed into the surface using a deformable object or surface. After the attachment is complete, the grooves may be coated with reflective or dielectric layers to improve diffraction efficiency.

Content, David

Development of termination and utilization concepts for flat conductor cables. Volume 1: Development of low profile flat conductor cable connecting device and permanent splice

The development of low-profile flat conductor cable (FCC) connecting device and FCC permanent splice methods are discussed. The design goal for the low-profile connecting device was to mate and unmate FCC harness to a typical spacecraft component with a maximum height of 3/8 in. The results indicate that the design, fabrication, and processing of the low-profile connecting device are feasible and practical. Some redesign will be required to achieve the goal of 3/8 in. Also, failures were experienced subsequent to salt spray and humidity exposure. Five different FCC permanent splice methods were considered. Subsequent to evaluation of these five methods, two design concepts were chosen for development tests.

Source record

Development of termination and utilization concepts for flat conductor cables. Volume 3: Cost study comparison, flat versus round conductor cable

A cost study comparing flat conductor cable (FCC) with small-gage wire (SGW) and conventional round conductor cable (RCC) is presented. This study was based on a vehicle wiring system consisting of 110,000 ft of conventional RCC equally divided between AWG sizes 20,22, and 24 using MIL-W-81044-type wire and MIL-C-26500 circular connectors. Basic cost data were developed on a similar-sized commercial jet airplane wiring system on a previous company R&D program in which advanced wiring techniques were carried through equivalent installations on an airplane mockup; and on data developed on typical average bundles during this program. Various cost elements included were engineering labor, operations (manufacturing) labor, material costs, and cost impact on payload. Engineering labor includes design, wiring system integration, wiring diagrams and cable assembly drawings, wire installations, and other related supporting functions such as the electronic data processing for the wiring. Operations labor includes mockup, tooling and production planning, fabrication, assembly, installation, and quality control cost impact on payload is the conversion of wiring system weight variations through use of different wiring concepts to program payload benefits in terms of dollars.

Source record

Conditioning flat conductors for flat conductor cable production

Apparatus can straighten, anneal, clean, and a tension to stretch a cable one percent to assure uniform cross-sectional area. A conductor passes through temperature controlled distilled water and through a toroid coil. As The conductor enters the water, steam performs the cleaning action. Quenching and annealing also take place.

Source record

Development of a flat cable system

A flat conductor cabling system for electrical/electronic interwiring is described. Six major items comprise the system: the cables, splices - one for flat cable to round wires and one for flat cable to flat cable; a series of flat cable connectors; the distributor, which is used for interconnecting the circuits; and a repair technique for the falt cable. Polyarylene, a new high performance melt-processable insulation material, permits the design of a completely standardized, modular flat conductor flat cable. The development of an advanced heat-shrinkable plastics technology involving the use of selectively bonded plastic film has resulted in the multiple termination module, used for making high-reliability sealed solder terminations to either flat conductor cable or round wires. All necessary tools and application equipment are included in the system design.

Neel, R. M.

Heat-Transfer Measurements in Free Flight at Mach Numbers up to 14.6 on a Flat-Faced Conical Nose with a Total Angle of 29 Degrees

Skin-temperature measurements have been made at several locations on a flat-faced cone-cylinder nose which was flight tested on a fivestage rocket-propeller model to a Mach number of 14.64 and a free-stream Reynolds number of 2.0 x 10(exp 6), based on flat-face diameter, at an altitude of 66,300 feet. The copper nose had a 29 deg total-angle conical section which was 1.6 flat-face diameters long. The aerodynamic-heating rates determined from the temperature measurements reached 1,440 Btu/( sec) (sq ft) on the flat face. The heating rates near the center of the flat face agreed well at Mach numbers up to 13.6 with those obtained by a theory for laminar stagnation-point heating in equilibrium dissociated air (Avco Res. Rep. 1). At Mach numbers above 13.6, the heating rates at locations near the center of the flat face became progressively lower than stagnation-point theory and. were 29 percent lower at Mach number 14.6 at the end. of the test. The reason for this behavior of the heating on the central part of the flat face was not determined. Excluding the relatively low heating rates that occurred on the central part of the nose at the highest Mach numbers, the distribution of experimental heating along the innermost 0.79 of the flat-face radius, expressed as a percentage of stagnation-point heating, was in fair agreement with the distribution predicted by laminar theory. At a location of 0.71 radii from the stagnation point, the experimental heating was very near 130 percent of the theoretical stagnation-point rate at Mach numbers from 11 to 14.5. The experimental beating rates on the conical section of the nose were in good agreement with laminar-cone theory using the assumption of theoretical sharp-cone static pressure on the conical section.

Rumsey, Charles B

Topologically Protected Flatness in Chiral Moiré Heterostructures

The observation of delicate correlated phases in twisted heterostructures of graphene and transition metal dichalcogenides suggests that moiré flat bands are intrinsically resilient against certain types of disorder. Here, we investigate the robustness of moiré flat bands in the chiral limit of the Bistritzer-MacDonald model—applicable to both platforms in certain limits—and demonstrate drastic differences between the first magic angle and higher magic angles in response to chiral symmetric disorder that arise, for instance, from lattice relaxation. We understand these differences using a hidden constant of motion that permits the decomposition of the non-Abelian gauge field induced by interlayer tunnelings into two decoupled Abelian ones. At all magic angles, the resulting effective magnetic field splits into an anomalous contribution and a fluctuating part. The anomalous field maps the moiré flat bands onto a zeroth Dirac Landau level, whose flatness withstands any chiral symmetric perturbation such as nonuniform magnetic fields due to a topological index theorem—thereby underscoring a topological mechanism for band flatness. Only the first magic angle can fully harness this topological protection due to its weak fluctuating magnetic field. In higher magic angles, the amplitude of fluctuations largely exceeds the anomalous contribution, which we find results in a physically meaningless chiral operator and an extremely large sensitivity to microscopic details and an exponential collapse of the single-particle gap. Through numerical simulations, we further study various types of disorder and identify the scattering processes that are enhanced or suppressed in the chiral limit. Interestingly, we find that the topological suppression of disorder broadening persists away from the chiral limit and is further accentuated by isolating a single sublattice polarized flat band in energy. Our analysis suggests the Berry curvature hot spot at the top of the K and K ′ valence band in the transition metal dichalcogenide monolayers is essential for the stability of its moiré flat bands and their correlated states. Published by the American Physical Society 2025

Crépel, Valentin (ORCID:0000000302403412)

Dichotomy of flat bands in the van der Waals ferromagnet Fe 5 ⁢GeTe 2

Quantum materials with bands of narrow bandwidth near the Fermi level represent a promising platform for exploring a diverse range of fascinating physical phenomena, as the high density of states within the small energy window often enables the emergence of many-body physics. On one hand, flat bands can arise from strong Coulomb interactions that localize atomic orbitals. On the other hand, quantum destructive interference can quench the electronic kinetic energy. Although both have a narrow bandwidth, the two types of flat bands should exhibit very distinct spectral properties arising from their distinctive origins. So far, the two types of flat bands have only been realized in very different material settings and chemical environments, preventing a direct comparison. Here, in this study, we report the observation of the two types of flat bands within the same material system—an above-room-temperature van der Waals ferromagnet, Fe 5−x GeTe 2 , distinguishable by a switchable iron site order. The contrasting nature of the flat bands is also identified by the remarkably distinctive temperature evolution of the spectral features, indicating that one arises from electron correlations in the Fe(1) site-disordered phase, while the other geometrical frustration in the Fe(1) site-ordered phase. Our results therefore provide a direct juxtaposition of the distinct formation mechanism of flat bands in quantum materials and an avenue for understanding the distinctive roles flat bands play in the presence of magnetism, topology, and lattice geometrical frustration, utilizing sublattice ordering as a key control parameter.

Wu, Han [Rice Univ., Houston, TX (United States)]

Atomically Flat Surfaces Developed for Improved Semiconductor Devices

New wide bandgap semiconductor materials are being developed to meet the diverse high temperature, -power, and -frequency demands of the aerospace industry. Two of the most promising emerging materials are silicon carbide (SiC) for high-temperature and high power applications and gallium nitride (GaN) for high-frequency and optical (blue-light-emitting diodes and lasers) applications. This past year Glenn scientists implemented a NASA-patented crystal growth process for producing arrays of device-size mesas whose tops are atomically flat (i.e., step-free). It is expected that these mesas can be used for fabricating SiC and GaN devices with major improvements in performance and lifetime. The promising new SiC and GaN devices are fabricated in thin-crystal films (known as epi films) that are grown on commercial single-crystal SiC wafers. At this time, no commercial GaN wafers exist. Crystal defects, known as screw defects and micropipes, that are present in the commercial SiC wafers propagate into the epi films and degrade the performance and lifetime of subsequently fabricated devices. The new technology isolates the screw defects in a small percentage of small device-size mesas on the surface of commercial SiC wafers. This enables atomically flat surfaces to be grown on the remaining defect-free mesas. We believe that the atomically flat mesas can also be used to grow GaN epi films with a much lower defect density than in the GaN epi films currently being grown. Much improved devices are expected from these improved low-defect epi films. Surface-sensitive SiC devices such as Schottky diodes and field effect transistors should benefit from atomically flat substrates. Also, we believe that the atomically flat SiC surface will be an ideal surface on which to fabricate nanoscale sensors and devices. The process for achieving atomically flat surfaces is illustrated. The surface steps present on the "as-received" commercial SiC wafer is also illustrated. because of the small tilt angle between the crystal "basal" plane and the polished wafer surface. These steps are used in normal SiC epi film growth in a process known as stepflow growth to produce material for device fabrication. In the new process, the first step is to etch an array of mesas on the SiC wafer top surface. Then, epi film growth is carried out in the step flow fashion until all steps have grown themselves out of existence on each defect-free mesa. If the size of the mesas is sufficiently small (about 0.1 by 0.1 mm), then only a small percentage of the mesas will contain an undesired screw defect. Mesas with screw defects supply steps during the growth process, allowing a rough surface with unwanted hillocks to form on the mesa. The improvement in SiC epi surface morphology achievable with the new technology is shown. An atomic force microscope image of a typical SiC commercial epilayer surface is also shown. A similar image of an SiC atomically flat epi surface grown in a Glenn laboratory is given. With the current screw defect density of commercial wafers (about 5000 defects/cm2), the yield of atomically free 0.1 by 0.l mm mesas is expected to be about 90 percent. This is large enough for many types of electronic and optical devices. The implementation of this new technology was recently published in Applied Physics Letters. This work was initially carried out in-house under a Director's Discretionary Fund project and is currently being further developed under the Information Technology Base Program.

Powell, J. Anthony

Emergence of flat bands and ferromagnetic fluctuations via orbital-selective electron correlations in Mn-based kagome metal

Kagome lattice has been actively studied for the possible realization of frustration-induced two-dimensional flat bands and a number of correlation-induced phases. Currently, the search for kagome systems with a nearly dispersionless flat band close to the Fermi level is ongoing. Here, by combining theoretical and experimental tools, we present Sc 3 Mn 3 Al 7 Si 5 as a novel realization of correlation-induced almost-flat bands in the kagome lattice in the vicinity of the Fermi level. Our magnetic susceptibility, 27 Al nuclear magnetic resonance, transport, and optical conductivity measurements provide signatures of a correlated metallic phase with tantalizing ferromagnetic instability. Our dynamical mean-field calculations suggest that such ferromagnetic instability observed originates from the formation of nearly flat dispersions close to the Fermi level, where electron correlations induce strong orbital-selective renormalization and manifestation of the kagome-frustrated bands. In addition, a significant negative magnetoresistance signal is observed, which can be attributed to the suppression of flat-band-induced ferromagnetic fluctuation, which further supports the formation of flat bands in this compound. These findings broaden a new prospect to harness correlated topological phases via multiorbital correlations in 3d-based kagome systems.

36 MATERIALS SCIENCE

Persistent flat band splitting and strong selective band renormalization in a kagome magnet thin film

Magnetic kagome materials provide a fascinating playground for exploring the interplay of magnetism, correlation and topology. Many magnetic kagome systems have been reported including the binary Fe m X n (X = Sn, Ge; m:n = 3:1, 3:2, 1:1) family and the rare earth RMn 6 Sn 6 (R = rare earth) family, where their kagome flat bands are calculated to be near the Fermi level in the para magnetic phase. While partially filling a kagome flat band is predicted to give rise to a Stoner-type ferromagnetism, experimental visualization of the mag netic splitting across the ordering temperature has not been reported for any of these systems due to the high ordering temperatures, hence leaving the nature of magnetism in kagome magnets an open question. Here, we probe the electronic structure with angle-resolved photoemission spectroscopy in a kagome magnet thin film FeSn synthesized using molecular beam epitaxy. We identify the exchange-split kagome flat bands, whose splitting persists above the magnetic ordering temperature, indicative of a local moment picture. Such local moments in the presence of the topological flat band are consistent with the compact molecular orbitals predicted in theory. We further observe a large spin-orbital selective band renormalization in the Fe d xy + d x 2 -y 2 spin majority channel reminiscent of the orbital selective correlation effects in the iron based superconductors. Our discovery of the coexistence of local moments with topological flat bands in a kagome system echoes similar findings in magic-angle twisted bilayer graphene, and provides a basis for theoretical effort towards modeling correlation effects in magnetic flat band systems.

36 MATERIALS SCIENCE

Image Alignment and Flat-Field Correction of Film and Computed Radiography Images on the LLNL Flash Testbed

Computed radiography (CR) imaging plates and film are used in HEAF firing tanks and in the NDE group. The imaging plates allow for the creation of high-resolution digital images with flash X-ray (FXR). A typical treatment of flash X-ray radiographs is flat-field correction, where the image from an experiment is normalized by a “flat-field” or “bright-field” image. This flat-field image is taken in an identical configuration to the experimental image, but without the object or experiment in the field of view (FOV). This treatment reduces spatial effects from the FXR spot size and detector misalignment, as each pixel value in the corrected image represents a ratio of collected radiation with the object in FOV to the collected radiation without the object in FOV. One challenge in the creation of a corrected image is the misalignment of the CR plate or film pack between capturing the flat-field image and the experimental image. Fiducial structures can remedy this issue. Small (3.18mm) stainless steel ball bearings serve as good fiducial structures due to their small size and high radiographic contrast. Spheres are view-agnostic geometry, always presenting a circular cross section no matter the orientation. This process was developed for images from the flash X-ray testbed. The flash testbed was used to compare the X-ray transmission at different thicknesses of aluminum and copper step wedges. Each step wedge section is a rectangular shape, so evaluation is made much simpler if the rectangles are not rotated with respect to the image. This alignment process aligns the object and flat-field images together and leaves the rectangles of each step aligned with the image.

36 MATERIALS SCIENCE

The load-carrying and thermal characteristics of flat conductor cable

The load-carrying and thermal characteristics of flat conductor cable and round wire cables have been investigated with all conductors in each cable under varying loads in air and vacuum environments. The test procedure is described and results are presented in graphic form. Derating factors for both round wire and flat conductor cable are established for operation in a vacuum environment. Rating factors are established for flat conductor cable for use with round wire loading tables. The results of these tests show that single layer flat conductor size, or that the voltage drop across flat conductor cable will be lower than that of round cable under the same load.

Adams, G. D.

Flat conductor cable commercialization project

An undercarpet flat conductor cable and a baseboard flat conductor cable system were studied for commercialization. The undercarpet system is designed for use in office and commercial buildings. It employs a flat power cable, protected by a grounded metal shield, that terminates in receptacles mounted on the floor. It is designed to interface with a flat conductor cable telephone system. The baseboard system consists of a flat power cable mounted in a plastic raceway; both the raceway and the receptacles are mounted on the surface of the baseboard. It is designed primarily for use in residential buildings, particularly for renovation and concrete and masonry construction.

Hogarth, P.

Heat transfer investigation in the junction region of circular cylinder normal to a flat plate at 90 deg location

External heat-transfer rates were measured on a flat plate in the junction region of a circular cylinder mounted normal to the plate at a location 90 deg from the stagnation point. This configuration simulates the junction of the shroud with gas-turbine vanes. Heat-transfer results are presented for laminar, transition, and turbulent boundary layers for a Mach number of 0.14 with gas temperatures of approximately 750 deg R over a flat plate at room temperature. The measurements were made in air for a unit Reynolds number, Re/cm, range of 11,000 to 58,000. Heat-transfer measurements were conducted in the 70-ft long, 4-in. diameter shock tube. A shock-wave reflection technique was used to produce a flow Mach number of 0.14. Thin-film platinum heat gages were mounted on the flat plate and along the line of the stagnation point of the cylinder to measure the local heat flux in the junction region. The experimental heat-transfer data were correlated with the laminar and turbulent boundary-layer theories for the flat plate. With the cylinder the heat fluxes on the flat plate were greatly increased in the junction region compared to the heat flux for the plate alone.

Nagamatsu, H. T.