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AIAA Ascend 2021 Conference On Demand Manufacturing of Electronics Panel Abstract
1. Session Proposal o Session Title NASA’s In Space Manufacturing and the On Demand Manufacturing of Electronics o Session Topic Primary -- Space Logistics, Autonomy, and Robotics; Secondary – Transformative Research and Technologies o Session Format: Panel Discussion. o Requested Session Duration: 60 minutes o Short Session Description: The goal of NASA’s On Demand Manufacturing of Electronics project is to develop and demonstrate the feasibility of a low-gravity, on-demand manufacturing system for flexible hybrid electronic devices on the International Space Station. This panel will feature several key collaborators and team members from the commercial sector, academia, and internal to NASA, each of which are contributing an unique and vital role to the design and implementation of this new technology system. o Extended Session Description (Please describe in detail the activity proposed, including how you intend to use the requested session duration. This session description will be provided to the reviewers for consideration and will not be displayed in the online agenda.): The session will be moderated by Curtis Hill, the Project Lead for the On Demand Manufacturing of Electronics (ODME), and he will start by giving a brief introduction to the ODME project which is working to produce a demo system for the manufacturing of electronic devices on the International Space Station. Panelists consisting of collaborators and team members to the ODME project will then give a brief (~5 min) introduction highlighting their contributions to the project, followed by time for Q&A from the audience. The panel will consist of: 1. Kenneth Church, nScrypt. nScrypt is a leader in multi-material printing with a modular system that incorporates a direct write thick film print head, a polymer fused filament fabrication print head, a laser sintering attachment, a drill head attachment for milling, and a pick and place. The system can print a layer and scan for accuracy of prints. The combination of multiple print heads and scanning allows for the on-demand production of intricate electronic components. 2. Andy Kurk, TechShot, Inc. Techshot, Inc. has collaborated extensively with NASA on the in space manufacturing of both printed electronics and fused metal materials. They are currently working to develop and integrate a test system for printed electronics, and a flight demonstration on the International Space Station is anticipated in 2024. 3. Ed Hendricks, NextFlex. NextFlex has the goal of advancing the manufacture of flexible hybrid electronics in the U.S. They are working with ODME on the development of AstroSense, an additively manufactured, wireless, flexible, and wearable health sensor. 4. Dr. Pradeep Lall, Auburn University. Professor Lall is the MacFarlane Endowed Distinguished Professor in the Department of Mechanical Engineering with a Courtesy Joint Appointment in the Department of Electrical and Computer Engineering and a Courtesy Joint Appointment in the Department of Finance. He is collaborating with NASA’s ODME project to develop multilayer printable devices and to develop techniques to test the quality of a printed electronic device. 5. Dr. Wei Gao, California Institute of Technology. Professor Gao is an Assistant Professor of Medical Engineering. His group is developing fully printed, flexible, and wearable biosensors for crew health monitoring in collaboration with NASA’s ODME project. In addition, they are working on using sweat to power biofuel cells for wearable, self-powered electronic devices. 6. Beth Paquette, NASA Goddard. The ODME branch at NASA Goddard is spearheading a sounding rocket flight demo to prove the capability of a printed electronic device with multiple sensors. In addition, they focus on thin film and flexible energy storage evaluations. o Session Goal(s)/Outcome(s): Please list the learning objectives and/or tangible outcomes (technical paper or other publication). The goal of this session is to highlight the internal and collaborative efforts of NASA’s On Demand Manufacturing of Electronics project to develop a system for printing electronics that will be tested on the International Space Station in 2024. In addition, the session with facilitate discussion with the community on the state of the art of printable electronics, current challenges, and new avenues for collaboration.
Ultra-Low SWaP CO 2 Sensing for Demand Control Ventilation (Final Report)
In this project PARC and Energy ETC aimed to develop an ultra-low cost, size, weight, and power (SWaP) printed CO 2 sensor system for occupancy detection to enable Demand Control Ventilation (DCV) on a per-room basis. The CO 2 sensor technology is based on the temperature variation when CO 2 reversibly physisorbs to a highly conductive and high surface area sorbent surface, and is compatible with integration with PARC innovations in printed sensors and flexible electronics, for which PARC is a globally leading research center. The printed CO 2 sensor itself is designed to be compatible with PARC’s “peel-and-stick” platform of ultra-low power, low-cost, distributed sensors, and to facilitate real-time DCV based on overall indoor air quality (IAQ). Previously, PARC has developed flexible hybrid electronics (FHE) compatible materials to measure humidity, temperature, light, strain, and gases such as carbon monoxide, methane, ammonia, and hydrogen sulfide. Through this project, PARC developed FHE-compatible materials to measure CO 2 . Thus, with one <$15 FHE “peel-and-stick” based sensor node, a building management system (BMS) will be able to capture a complete picture of the indoor environment. This includes IAQ, light, temperature, and other comfort factors that impact building operations. Combined with optimized DCV, this low-cost sensor capability can be a key enabler of annual primary energy savings of ~ 0.3-0.4 Quad in commercial buildings while ensuring healthy IAQ. Energy ETC is a leader in supplier-agnostic BMS deployments and will design the commissioning and deployment procedures to maximize system interoperability.
Damage Detection Sensor System for Aerospace and Multiple Applications
NASA has identified structural health monitoring and damage detection and verification as critical needs in multiple technology roadmaps. The sensor systems can be customized for detecting location, damage size, and depth, with velocity options and can be designed for particular environments for monitoring of impact or physical damage to a structure. The damage detection system has been successfully demonstrated in a harsh environment and remote integration tested over 1000 miles apart. Multiple applications includes: Spacecraft and Aircraft; Inflatable, Deployable and Expandable Structures; Space Debris Monitoring; Space Habitats; Military Shelters; Solar Arrays, Smart Garments and Wearables, Extravehicular activity (EVA) suits; Critical Hardware Enclosures; Embedded Composite Structures; and Flexible Hybrid Printed Electronics and Systems. For better implementation and infusion into more flexible architectures, important and improved designs in advancing embedded software and GUI interface, and increasing flexibility, modularity, and configurable capabilities of the system are currently being carried out.
Process Development for Printing Copper Conductible Ink on Flexible Substrates Using Aerosol Jet Technology
Rise in demand for wearable consumer electronics products has given an impetus to the development of flexible electronics technology encompassing flexible substrates and compatible circuitry. Also, additive manufacturing of flexible electronics is emerging rapidly via several techniques such as Inkjet and Aerosol Jet Printing (AJP). The basic component of all flexible circuits to be printed by these technologies is conductible ink, which is generally silver ink. Few studies exist on the printing of copper conductible ink and not many copper ink formulations are available in the market as that of silver inks. This study aims to develop a process development study for deposition of copper conductible lines on flexible substrates using the aerosol jet printing technology. The process development study includes investigation of photosintering parameters for obtaining desirable electrical resistance and shear load to failure values for the printed line. Different pre-drying techniques such as oven pre-drying and platen pre-drying have been used for improving the electrical and mechanical properties of the conductive traces. Techniques such as optical microscopy and white light interferometry have been used for the characterization of print quality of the conductible lines.
Understanding and mitigating process drift in aerosol jet printing
Aerosol jet printing offers a versatile, high-resolution prototyping capability for flexible and hybrid electronics. Despite its rapid growth in recent years, persistent problems such as process drift hinder the adoption of this technology in production environments. Here we explore underlying causes of process drift during aerosol jet printing and introduce an engineered solution to improve deposition stability. In this work it is shown that the ink level within the cartridge is a critical factor in determining atomization efficiency, such that the reduction in ink volume resulting from printing itself can induce significant and systematic process drift. By integrating a custom 3D-printed cartridge with an ink recirculation system, ink composition and level within the cartridge are better maintained. This strategy allows extended duration printing with improved stability, as evidenced by 30 h of printing over 5 production runs. This provides an important tool for extending the duration and improving reliability for aerosol jet printing, a key factor for integration in practical manufacturing operations.
Real‐Time Optical Process Monitoring for Structure and Property Control of Aerosol Jet Printed Functional Materials
Abstract Aerosol jet printing is a popular digital additive manufacturing method for flexible and hybrid electronics, but it lacks sophisticated real‐time process control schemes that would enable more widespread adoption in manufacturing environments. Here, an optical measurement system is introduced to track the aerosol density upstream of the printhead. The measured optical extinction, combined with the aerosol flow rate, is directly related to deposition rate and accurately predicts functional materials properties such as the electrical resistance of printed graphene films. This real‐time system offers a compelling solution for process drift and batch‐to‐batch variability, rendering it a valuable tool for both real‐time control of aerosol jet printing and fundamental studies of the underlying process science.
Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods
In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.
Predicting Deposition Rate and Closing the Loop on Aerosol Jet Printing with In‐Line Light Scattering Measurements
Aerosol jet printing is a compelling noncontact, digital manufacturing technology for flexible, hybrid, and conformal electronics, but batch‐to‐batch variability and process drift inhibit systematic study and translation to production environments. Emerging measurement techniques for the aerosol volume fraction, a key parameter governing deposition rate, have shown promise for real‐time response, including a recent demonstration of human‐in‐the‐loop control. By integrating improved light scattering measurements with custom software, a robust environment for real‐time monitoring is established and fully automated closed‐loop control over the deposition rate during printing is enabled. The physical basis for scattering measurements as a feedback source is examined and the quantitative insight this provides for ink development and fundamental process studies is highlighted. Three candidate process variables for closed‐loop control, namely the atomizer voltage, carrier gas flow rate, and print speed, are then evaluated. The atomizer voltage demonstrates the best extended duration validity because it addresses atomization variability directly, but carrier gas flow rate and print speed provide faster and more deterministic responses. This methodology is then demonstrated for electrical properties using a silver nanoparticle ink, maintaining 98% of printed patterns within 10% of the mean resistance value over 3 h of printing.
In-situ qualification and physics-based process design for aerosol jet printing via spatially correlated light scattering measurements
Aerosol jet printing is a contactless, digital, and additive technique broadly used for manufacturing flexible, hybrid, and conformal electronics. However, batch-to-batch variability has hindered widespread industry adoption and scaling to production volumes. Recently, light scattering measurements have emerged as a tool to measure aerosol volume fraction – a key parameter determining deposition rate – and have proven an effective feedback source for closed loop control on timescales ranging from minutes to hours. Here, the efficacy of light scattering measurements as a tool for in-situ qualification over shorter time durations is explored. To be the linear relationship between light scattering measurements and deposition rate was validated at 500 ms time intervals, allowing deposition rate to be mapped to positional coordinates and providing a new data stream to drive quality control assessments. Because light scattering measurements are indicative of a physical process parameter, they were substituted into equations for resistance and sheet resistance, resulting in predictions nominally within 10% of measured values for sets of printed devices. Finally, to highlight a more active utility, light scattering measurements were employed in a print repair framework, successfully repairing prints with randomly induced defects to within 5% of the measured resistance of a control set.
Intrinsic thermal interfacial resistance measurement in bonded metal–polymer foils
Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in electronic packaging, batteries, and heat recovery systems. To design the thermal circuit in such systems, it is essential to measure the thermal interfacial resistance (TIR) across ~1 µm to 100 µm junctions. Previously reported TIR of metal–polymer junctions utilize ASTM E1530-based two-block systems that measure the TIR by applying pressure across the interface through external heating and cooling blocks. Here, we report a novel modification of the ASTM-E1530 technique that employs integrated heaters and sensors to provide an intrinsic TIR measurement of an adhesively bonded metal–polymer junction. We design the measurement technique using finite element simulations to either passively suppress or actively compensate the lateral heat diffusion through the polymer, which can minimize the systematic error to ≲5%. Through proof-of-concept experiments, we report the TIR of metal–polymer interfaces made from DuPont’s Pyralux double-side copper-clad laminates, commonly used in flexible printed circuit boards. Our TIR measurement errors are <10%. We highlight additional sources of errors due to non-idealities in the experiment and discuss possible ways to overcome them. Our measurement technique is also applicable to interfaces that are electrically insulating such as adhesively joined metal–metal junctions and sputter-coated or welded metal–polymer junctions. Altogether, the technique is capable of measuring TIR ≳10 –5 m 2 KW –1 in bonded metal–polymer foils and can be tailored for in situ measurements in flexible electronics, circuit packaging, and other hybrid metal–polymer systems.
The STAR Forward Silicon Tracker
The Forward Silicon Tracker (FST) is a pivotal component of the forward upgrade of the Solenoidal Tracker at RHIC (STAR), designed to discern hadron charge signs with a momentum resolution better than 30% for 0.2 < p T < 2GeV/c in the 2.5 < η < 4 pseudorapidity range. Its compact design features three disks along the beam direction, minimized material budget, and scattering effects. The FST uses Hamamatsu’s p-in-n silicon strip sensors with a double metal layer that enables efficient signal routing to the readout electronics, enhancing overall detector performance. The flexible hybrid boards, essential for the readout system, are constructed with Kapton and copper layers to optimize signal handling and power distribution. These boards connect silicon strips to analogue pipeline ASIC APV25-S1 chips, which read up to 128 channels each. A cooling system with nonconducting, volatile NOVEC 7200 coolant at 22.2 °C mitigates ASIC-generated heat. Furthermore, the FST enhances forward tracking performance at STAR as an integral part of the forward upgrade.
Advancing flexible electronics and additive manufacturing
There is high interest in the synergism of thin-film and flexible electronics with additive manufacturing. This review primarily focuses on the prospective developments in convergence with flexible electronics manufacturing technologies. Specifically, this paper covers the latest 3D printing and hybrid manufacturing technologies, the utility of specific types of materials, their functionalization and characterization, post-processing and testing strategies toward fabricating robust and application-specific flexible electronics. Besides exploring the advances in this area of research—it also highlights the limitations and gaps that have been observed in the previous years that will challenge and offer opportunities for advancing research and development. Lastly, the future of 3D-printed flexible electronics is discussed in the aspects of customizability, scalability, and its game-changing and state-of-the-art potential for intelligent sensing, instrumentation, and wearables for various medical, engineering, and industrial applications.
Correlation of Spatiotemporal Dynamics of Polarization and Charge Transport in Blended Hybrid Organic–Inorganic Perovskites on Macro- and Nanoscales
Progress in flexible organic electronics necessitates a full understanding of how local inhomogeneities impact electronic and ionic conduction pathways and underlie macroscopic device characteristics. In this work, we used frequency- and time-resolved macro- and nanoprobe measurements to study spatiotemporal characteristics of multiscale charge transport dynamics in a series of ternary-blended hybrid organic inorganic perovskites (HOIPs) (MA 0.95– x FA x Cs 0.05 PbI 3 ). We show that A-site cation composition defines charge transport mechanisms across broad temporal (10 2 –10 –6 s) and spatial (millimeters–picometers) scales. Ab initio molecular dynamic simulations suggest that insertion of FA results in a dynamic lattice, improved ion transport, and dipole screening. We demonstrate that correlations between macro- and nanoscale measurements provide a pathway for accessing distribution of relaxation in nanoscale polarization and charge transport dynamics of ionically conductive functional perovskites.
Chemically Controllable Porous Polymer–Nanocrystal Composites with Hierarchical Arrangement Show Substrate Transport Selectivity
Functional organic–inorganic hybrid materials with tunable properties are useful across many application areas, ranging from gas storage to electronics, flame retardants, separations, and catalysis. Combining polymers, with a suite of functional groups and conformational flexibility, and inorganic nanoparticles, with tunable surface chemistry and composition, yields hybrids with novel functional properties. Specifically, in catalysis, control of the electronic environment at a metal interface is paramount in determining the catalytic properties. In this contribution, we describe a modular process to prepare porous polymer–nanocrystal (NC) composites in a hierarchical, multilayered synthesis, in which multiple parameters can be accurately tuned: polymer functional groups and the corresponding pore structure, the polymer layer thickness, and the NC size, shape, and composition. This process provides for a variety of controlled materials with high surface area, tunable chemistry, and thermal and chemical stabilities. Furthermore, we demonstrate their utility for shape- and size-selective catalytic conversions both in oxidation and hydrogenation reactions, where they show increased selectivity by orders of magnitude compared to conventional polymer-supported metal catalysts. In light of the high degree of control in the composite structure, this method allows for the design and realization of catalysts for several reactions and reaction environments and for nanomaterials with other applications.
Morphological Ordering of the Organic Layer for High-Performance Hybrid Thermoelectrics
Inorganic-organic hybrids, such as Te-PEDOT:PSS core/shell nanowires, have emerged as a class of promising thermoelectric materials with combined attributes of mechanical flexibility and low cost. However, the poorly understood structure-property relationship calls for further investigation for performance enhancement. Here, through precise treatments of focused electron beam irradiation and thermal annealing on individual Te-PEDOT:PSS nanowires, new, nonchemical mechanisms are introduced to specifically engineer the organic phase, and the measured results provide an unprecedented piece of evidence, confirming the dominant role of organic shell in charge transport. Paired with the Kang-Snyder model and molecular dynamics simulations, this work provides mechanistic insights in terms of heating-enabled morphological ordering of the polymer chains. The measured results show that thermal annealing on the 42 nm nanowire results in a ZT value of 0.78 at 450 K. In conclusion, through leveraging the interfacial self-assembly of the organic phase to construct a high electrical conductivity domain, this work lays out a clear framework for the development of next-generation soft thermoelectrics.
High Conductivity and Flexible Hybrid Solid State Electrolyte (Final Report: DOE-EE0007807)
The project objective is to develop flexible hybrid electrolyte with garnet nanofibers to achieve the following: (1) flexible, with greater mechanical strength (~ 10 MPa) and thermal stability than polymer electrolytes; (2) high room-temperature ionic conductivity, ~ 0.5 mS/cm; (3) stable interface with lithium metal and effective blocking of lithium dendrites at current densities up to 3 mA/cm 2 ; and (4) battery performance with Li S chemistry with an energy density of ≥ 450 Wh/kg (and ≥ 1000 Wh/L) and maintaining ≥ 80% of capacity up to 500 cycles. We synthesized garnet nanofibers, filled the porous region with polymer electrolyte, and characterized and tuned the flexible hybrid membrane properties. The flexible hybrid SSE microstructure was analyzed by leveraging the UMD AIMLab Focused Ion Beam Scanning Electron Microscopy (FIB-SEM) tools and integrated with electrochemical methods at the UMERC Battery Fabrication Lab to investigate the properties and stability with Li metal anode. We developed a fundamental understanding of the mechanism of Li ionic diffusion in garnet nanofibers and their mechanical properties, as well as these properties for hybrid garnet-fiber/polymer hybrids. Work progressed toward the study of the electrode assembly during electrochemical cycling of the anode.
Integrated automation for manufacturing of electronic assemblies
Since 1985, the Naval Ocean Systems Center has been identifying and developing needed technology for flexible manufacturing of hybrid microelectronic assemblies. Specific projects have been accomplished through contracts with manufacturing companies, equipment suppliers, and joint efforts with other government agencies. The resulting technology has been shared through semi-annual meetings with government, industry, and academic representatives who form an ad hoc advisory panel. More than 70 major technical capabilities have been identified for which new development is needed. Several of these developments have been completed and are being shared with industry.