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Gating grid driver for gas radiation detectors

A gating grid driver for use with radiation detectors, such as time projection chambers and other similar devices that require a gating grid that operates in a bipolar mode with different electrostatic potentials on alternating wires. To open such gating grids, the driver shorts the alternate wires to a common voltage Va. Later, this driver closes the grid by restoring the voltage differences in the adjacent wires. By connecting the driver circuit to the gating grid via low impedance transmission lines, the driver circuit opens the gating grid in 0.35 μs, minimizing the lost drift length associated with this opening time. The circuit consists of 2 pairs of N- and P-MOSFET switches and includes two adjustable capacitors and resistors that can be used to adjust the opening time, and shift the balance of positive and negative charge for individual radiation detector.

Tangwancharoen, Suwat↗

A gating grid driver for time projection chambers

A simple but novel driver system has been developed to operate the wire gating grid of a Time Projection Chamber (TPC). This system connects the wires of the gating grid to its driver via low impedance transmission lines. When the gating grid is open, all wires have the same voltage allowing drift electrons, produced by the ionization of the detector gas molecules, to pass through to the anode wires. When the grid is closed, the wires have alternating higher and lower voltages causing the drift electrons to terminate at the more positive wires. Rapid opening of the gating grid with low pickup noise is achieved by quickly shorting the positive and negative wires to attain the average bias potential with N-type and P-type MOSFET switches. The circuit analysis and simulation software SPICE shows that the driver restores the gating grid voltage to 90% of the opening voltage in less than 0.20 µs, for small values of the termination resistors. When tested in the experimental environment of a time projection chamber larger termination resistors were chosen so that the driver opens the gating grid in 0.35 µs. In each case, opening time is basically characterized by the RC constant given by the resistance of the switches and terminating resistors and the capacitance of the gating grid and its transmission line. By adding a second pair of N-type and P-type MOSFET switches, the gating grid is closed by restoring 99% of the original charges to the wires within 3 µs.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Medium Voltage (13.8 kV) Transformer-less Grid-Connected DC/AC Converter Design and Demonstration Using 10 kV SiC MOSFETs

Medium voltage (MV) power converters using high voltage (HV) Silicon Carbide (SiC) power semiconductors result in great benefits in weight, size, efficiency and control bandwidth. However, challenges still exist on the components design considering HV insulation and noise immunity requirements in the MV SiC based power converter. A 5-level MMC based transformer-less grid-connected dc/ac converter is developed for 13.8 kV medium voltage grid using 10 kV SiC MOSFETs. The key components, including gate driver with high dv/dt immunity and fast reliable protection, isolated power supply with low parasitic capacitance, voltage/current sensors with high noise immunity, and passives following related insulation standard are provided. A 25 kV dc-link phase-leg is demonstrated, and the experimental results are presented.

Ji, Shiqi↗

Real-time Condition Monitoring of Power Modules in Grid-tied Power Converter

This paper proposes and demonstrates a real-time condition monitoring method using gate driver integrated sensing circuits and sensor fusion algorithms. Power device on-state voltage (VDSon) measurement and junction temperature (Tj) sensing circuits with high noise immunity are built and integrated into an adaptive gate driver circuit for power modules. Considering the inherently noisy measurement environment of power converters, VDSon together with several other measurements are fused together to provide accurate descriptions of the stress and degradation of each power device. Furthermore, the gate driver circuit can actively control the turn-on gate voltage (VGSon) for each device based on the stress and degradation state. The proposed sensing circuits and power device condition assessment algorithms are implemented in a 75 KVA grid-tied power converter. This paper focuses on the sensing circuits hardware designs and testing in grid-tied power converter prototype and device stress index generation. More comprehensive results on the device state of health index generation will be presented in future work.

Fan, Junchong↗

Flexible Intelligent Real-time dc-ac grid Emulator (FIRE): Power Electronic Hardware-in-the-Loop (PE-HIL) Amplifier

Grid modernization efforts are leading to increased penetration of power electronics in the existing alternating current (ac) bulk power systems (BPS). Some examples of power electronics based applications that are being developed in BPS include high-voltage direct current (HVdc) systems, renewable generation systems, energy storage systems, and others. One of the requirements to succeed in the goals of grid modernization (like increased efficiency and reliability) is to setup a platform that can evaluate basic building blocks of such systems. For example, the basic building block of a modular multilevel converter (MMC)-based HVdc system is a submodule (SM). The evaluation platform will provide means to innovate new SM circuit architectures, new semiconductor devices in the SM, new gate-drivers, new controllers, and others. The flexible intelligent real-time dc-ac grid emulator (FIRE) platform incorporates the evaluation capability to evaluate the basic building blocks. The FIRE platform incorporates this evaluation capability through the power electronic hardware-in-the-loop (PE-HIL) concept. The PE-HIL for MMC-HVdc system can evaluate SMs in the MMC. In this paper, the design of amplifier required to perform PE-HIL simulation is presented. Experimental results of the amplifier and the simulation results of the PE-HIL concept utilizing the amplifier are presented.

Debnath, Suman↗

Hardware Design of Medium Voltage SiC-Based Modular Multilevel Converters for Grid-Tied Applications

This paper presents a design of a 10 kV silicon carbide (SiC) MOSFET based modular multilevel converter (MMC). The MMC functions as the interconnection between a 24 kV dc bus and a 13. SkV distribution grid. This paper focuses on the hardware design of the MMC and its submodules. The gate driver, auxiliary power supply and bus bur in submodules are major components that need to meet high dv/dt immunity and high insulation voltage requirements. The gate driver achieves over 200 kV/us common mode transient immunity (CMTI). Its associated auxiliary power supply is based on an on-board transformer with over 30 kV insulation capability and 1.4 pF barrier capacitance. The busbar achieves less than 11 kV/cm electric field in the air to avoid partial discharges. Validation tests of the MMC submodule were performed by double pulse tests at 5 kV and buck converter tests at3 kV, 52A (peak). Reliable operations were achieved in validation tests.

auxiliary power supply↗

A 75 kVA Intelligent Power Stages (IPS) Unit Design for Future Grid-interface Application

The demand for grid-interface converter with flexible dc bus is driven by the fast development of energy storage system (ESS), electric vehicle (EV) charging system, and versatile residential load. This paper first proposes a two-stage intelligent power stage (IPS) unit for future grid-interface applications. To achieve zero common-mode (CM) voltage emissions, step-up and step-down voltage gain, a 3-level four-switch buck-boost (3-L FSBB) dc-dc converter is adopted with fully zero voltage switching (ZVS). In one IPS unit, an advanced fiberoptic communication with sub-nanosecond synchronization is developed for different enhanced gate drivers. Moreover, an enhanced gate driver integrated current and voltage sensors is designed for monitoring and diagnostics. To achieve a whole low-profile design, three 12 oz heavy copper planar ac inductors are designed and implemented. Finally, a 75 kVA IPS unit was built to verify both the thermal and electrical design.

Cao, Yuliang↗

Additively Manufactured Photovoltaic Inverter (AMPVI)

Successful integration of hundreds of gigawatts of solar photovoltaics (PV) into the electric power system requires transformative power conversion system design that optimizes various trade-offs among conflicting objectives, such as performance, reliability, functionality, and cost. To address this need, National Renewable Energy Laboratory, Oak Ridge National Laboratory, and Purdue University teamed up to develop a unique PV inverter design. The Additively Manufactured Photovoltaic Inverter (AMPVI) combines newer wide bandgap high-voltage silicon carbide (SiC) semiconductor devices with revolutionary concepts such as additive manufacturing and multi-objective magnetic design optimization. The AMPVI will not only provide superior technical capabilities in terms of energy conversion but also mitigate market barriers for SiC-based PV inverters. The benefits for this design will include better utilization of PV power due to higher DC voltage, lower operations and maintenance costs, better system efficiency, longer system lifetime, and advanced grid support functionalities for easier grid integration. All these advantages will lead to a significant reduction of the levelized cost of energy for PV systems. Activities in Budget Period 1 (BP1) of this 3-year integrated project were focused on development and component-level validation of the foundational building blocks needed for the AMPVI. Multiple interrelated tasks were completed in parallel during work towards the initial development of the high-voltage SiC-based power block, gate driver, controller board, and control algorithms. Initial development of magnetic design tools and initial inverter thermal and mechanical design was also completed in this period. All these activities ensured that the initial prototype (called “alpha-prototype”) power block and controller would be ready after BP1 for integration into the first inverter prototype (i.e., the alpha-prototype inverter) in BP2.

14 SOLAR ENERGY↗

Wide Bandgap Generation (WBGen): Developing the Future Wide Bandgap Power Electronics Engineering Workforce

This Final Technical Report (FTR) summarizes the work conducted at the Center for Power Electronics Systems (CPES) under the Wide-Bandgap Generation (WBGen) fellowship and traineeship program established by the Advanced Manufacturing and Technologies Office (AMMTO) of the U.S. Department of Energy Office of Energy Efficiency and Renewable Energy (EERE) at Virginia Tech, which had as main objective to train the next generation of U.S. citizen power engineers with wide-bandgap (WBG) power semiconductor expertise, with the intent to aid in fulfilling the future workforce needs in this field. The latter was deemed of strategic importance given the fast-paced growth observed—and predicted—in the demand of this technical expertise, whose practitioners have become the enablers and executioners of the electrification transformation process that not just the U.S., but the whole world, is currently undergoing as it seeks for more effective and efficient ways to use energy. As such, the WBGen program set forth to achieve its educational goals, which in addition sought to broaden the range of WBG-based power electronics by conducting research and development on high-efficiency grid apparatus and high-efficiency electrical power systems, and to also enhance the power engineering curriculum by formalizing WBG-oriented design procedures replacing existent yet now obsolete design procedures developed for Silicon (Si) based power electronics. This effort led CPES to spearhead the development of a new major within The Bradley Electrical and Computer Engineering (ECE) Department at Virginia Tech, namely Electronic Power and Energy Systems (EPES), which coalesced power electronics and power systems courses to provide undergraduate students with a strong formation in the power engineering field, while creating a pipeline of graduate students that could pursue the WBG-based curriculum and conduct research at CPES. In all, in what is considered a true success, eight of the twenty WBGen fellows that graduated program were recruited from the ECE department undergraduate cohort. The traineeship emphasized as well, from its beginning, the partnership with industry and national laboratories, which took advantage of the successful industry consortium at CPES that has historically been formed by 80–90 power and energy companies working in close collaboration with the center. This gave WBGen fellows the accessibility and possibility to conduct internships at partner facilities during the summer months, focused solely on the evaluation, testing, and adoption of WBG devices, which were many times tightly related to their respective research work and plans. In addition, WBGen fellows conducted their main research work within the confines of research programs at CPES conducted with these industry partners, providing them with a unique opportunity to develop not just their technical expertise—while advancing their knowledge, but to also learn and practice a slew of skills needed for their professional growth. As such, the fellows tackled a variety of WBG-related research topics, from device reliability and capability aspects as well as packaging and integration, encompassing the use of advanced materials and new structures, current sharing challenges, and insulation systems, to advanced gate-drivers with integrated sensors and protection mechanisms and active current- and voltage-based control, to optimized layouts seeking to maximize the switching and power processing performance of these devices, to power processing solutions adopting Gallium-Nitride (GaN) and Silicon-Carbide (SiC) power semiconductors for a variety of applications; including radiation-hardened converters for space dc distribution systems, direct three-phase ac-to-ac power converters for aerospace systems, dc-ac inverters for automotive traction drives, high-frequency isolated dc-dc battery chargers also for heavy transportation systems, and medium-voltage dc-dc and dc-ac converters for distribution systems and future power grids. The WBGen program ultimately graduated a total of 20 power engineers, all experts on WBG-based power electronics, awarding 18 M.S. and 2 PhD degrees in the process. These fellows, all U.S. citizens, allowed CPES to increase the number of citizens students to 33 % at the peak of the program, as the traineeship made possible the recruitment of talent with more attractive graduate research assistantship (GRA) contracts. Unfortunately, the present U.S. citizen enrollment at CPES has declined back to historic levels—approximately 10 %, as the regular GRA rates are not competitive enough when compared with entry-level industry jobs. In all, WBGen fellows published a total of 7 peer-reviewed journal articles, 44 papers at international technical conferences, made 42 presentations at international technical conferences, and filed 4 invention disclosures and patent applications, which have since then been granted by the U.S. Patent and Trademark Office (USPTO). Their contribution to CPES, Virginia Tech, the United States, and the world, has been significant, and continues to yield results thanks to the exemplary career that the fellows have initiated at many of the partners of the program, which include Wolfspeed, Raytheon Technologies, Infineon, Lockheed Martin, Dominion Energy, Northrop Grumman, Rivian, Aerospace Corporation, Sandia National Laboratory, National Renewable Energy Laboratory, John Hopkins University, and Virginia Tech.

14 SOLAR ENERGY↗

50-kW 1kV DC bus air-cooled inverter with 1.7 kV SiC MOSFETs and 3D-printed novel power module packaging structure for grid applications

The traditional heatsink design technologies for forced air-cooling and power semiconductors with low junction temperatures have constrained the converters to be designed with massive heatsinks. The low power losses of WBG device technology and higher junction temperature operation over a wide operating range of power have not been fully utilized with liquid-cooled systems. The other major limitation has also been the traditional power module packaging “stack” approach with baseplate. This paper presents a novel power stage design which involves 1.7 kV silicon carbide (SiC) MOSFETs, a heatsink design with Genetic Algorithm (GA) and built using 3D printing technology, and a novel integrated modular power module for high power density. The air-cooled module assembly has a SiC MOSFET phase leg module with split high-side and low-side switches and a gate driver with cross-talk and short circuit protection functions. The heatsink design was modeled using a co-simulation environment with finite element analysis software and GA in MATLAB and COMSOL. The proposed concepts were verified and validated through experiments at each stage of development. The power stage was evaluated at 800V, 900 V, and 1kV for 20 kHz switching frequency and 50-kW load. The experimental results show that the CEC efficiency is 98.4 %. In addition to the efficiency, a power density of 75 W/in 3 was also achieved.

Chinthavali, Madhu Sudhan↗

Two-Layer Predictive Controller for V2G and G2V Services Using on Wireless Power Transfer Technology

This paper presents a comprehensive solution that allows electric vehicles (EV) to autonomously charge and discharge their batteries wirelessly during long term parking and/or the transient stops. A two-layer power-flow controller for bidirectional wireless power transfer system (BWPTS) in EVs applications is proposed. The proposed controller can manage the bidirectional power-flow between EV and surrounding infrastructures such as power grid, home microgrid, building micro-grid, road or another vehicle. It consists of two levels of control; the first is responsible for communicating with the surrounding infrastructures and gathering information from driver, charging station, power grid and battery management system and then, based on these information, it estimates the EV's psychological price as a function of its battery's state-of-charge (SOC) and compares it with the energy price to decide whether to charge, discharge or abstain, and how much the charging or discharging rate. The second layer receives the reference signal from the first one and generates the control parameters for two synchronized resonant converters (one is on the vehicle side and the other is on the grid side) to provide the requited power-flow. The proposed controller is adaptively estimating the system parameters to consider the misalignment conditions effects on the system performance. The parameter estimation is achieved using only one voltage sensor. The second layer control is designed based on a new analytical modeling for the power flow in the system. For verification purposes, a prototype for BWPTS was built and driven by the proposed controller, which was implemented using a field-programmable gate array (FPGA) integrated circuit. The proposed controller provides very fast and stable response during both the transient and steady state operation in comparison with the conventional PI controller.

33 ADVANCED PROPULSION SYSTEMS↗

Advanced Power Electronics and Electric Machines

The advanced power electronics and electric machines (APEEM) research group at the National Renewable Energy Laboratory (NREL) has developed world-class experimental and modeling capabilities for designing and evaluating efficient and reliable power electronics and electric machines thermal management systems. They also design, fabricate and characterize advanced power electronics packaging, and are developing state-of-health monitoring techniques. These researchers deliver safe, reliable, high performing, power-dense components that allow seamless integration between renewable energy sources, electric transportation, and the grid, helping to make widespread electric vehicle (EV) adoption and greenhouse gas emissions reduction more feasible. This document outlines the group's major capabilities in the areas of power electronics; module development and characterization; thermal modeling and management; thermomechanical reliability analysis of devices, modules, inverters/converters, and electric machines; physics-of-failure-based reliability analysis; and microelectronics. It also overviews the group's state-of-the-art equipment for fluid-based thermal management; thermal measurement & characterization; thermomechanical reliability analysis; micro- and power electronics measurement & characterization; and prototype fabrication, as well as the group's world-class modeling and simulation capabilities.

advanced gate drivers↗