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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Heat sink for luminaire and luminaire arrangements having a heat sink

A heat sink for a luminaire includes a central portion having a top surface and a bottom surface. The bottom surface is adapted to receive a lighting arrangement. The heat sink further includes a plurality of arms configured to dissipate heat generated by the lighting arrangement. The plurality of arms extend radially outward from the central portion. Each one of the plurality of arms is substantially arcuate between a proximal end and a distal end.

Trublowski, John↗

Heat pipe cooling system with sensible heat sink

A heat pipe cooling system which employs a sensible heat sink is discussed. With this type of system, incident aerodynamic heat is transported via a heat pipe from the stagnation region to the heat sink and absorbed by raising the temperature of the heat sink material. The use of a sensible heat sink can be advantageous for situations where the total mission heat load is limited, as it is during re-entry, and a suitable radiation sink is not available.

Silverstein, Calvin C.↗

Fourier Analysis-Based Evolutionary Multi-Objective Multiphysics Optimization of Liquid-Cooled Heat Sinks

Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation. This article proposes a design optimization method for liquid-cooled heat sinks that use a Fourier analysis-based tool and an evolutionary optimization algorithm to optimize the heat sink geometry for specified objectives. The optimized heat sink geometry is then compared with state-of-the-art solutions in literature based on finite element analysis of different designs. The proposed methodology can develop complex geometries that outperform the conventional heat sink geometries.

Sahu, Raj↗

SiC Microchannel Heat Sinks for High Heat Flux Dissipation of 1 kW/cm 2

Thermal management has become a major barrier in the development of high-power micro-devices. Microchannel heat sinks (MCHS) are a promising method to dissipate high heat fluxes from high power density devices. Reducing the thermal resistance will reduce the temperature increase of the electronic device, allowing for higher powers to be achieved while maintaining a safe operating temperature. This paper reports on the use of silicon carbide (Sic) microchannels to dissipate high heat fluxes up to 1 kW/cm 2 over a footprint of 0.25 cm 2 . The use of high aspect ratio and decreased hydraulic diameter channels has allowed for very low thermal resistances to be achieved at higher heat duties compared to previous studies. The experiments performed resulted in heater temperatures of less than 60 °C and thermal resistances as low as 0.024 cm 2 . ° $C$/W between the heater surface and fluid inlet temperature. In conclusion, the demonstrated thermal performance of the SiC MCHS is an encouraging means for dissipating heat from high power density microelectronic devices.

42 ENGINEERING↗

Electronic modules easily separated from heat sink

Metal heat sink and electronic modules bonded to a thermal bridge can be easily cleaved for removal of the modules for replacement or repair. A thin film of grease between a fluorocarbon polymer film on the metal heat sink and an adhesive film on the modules acts as the cleavage plane.

Source record↗

Mounting for diodes provides efficient heat sink

Efficient heat sink is provided by soldering diodes to metal support bars which are brazed to a ceramic base. Electrical connections between diodes on adjacent bars are made flexible by metal strips which aid in heat dissipation.

Source record↗

Passive Vaporizing Heat Sink

A passive vaporizing heat sink has been developed as a relatively lightweight, compact alternative to related prior heat sinks based, variously, on evaporation of sprayed liquids or on sublimation of solids. This heat sink is designed for short-term dissipation of a large amount of heat and was originally intended for use in regulating the temperature of spacecraft equipment during launch or re-entry. It could also be useful in a terrestrial setting in which there is a requirement for a lightweight, compact means of short-term cooling. This heat sink includes a hermetic package closed with a pressure-relief valve and containing an expendable and rechargeable coolant liquid (e.g., water) and a conductive carbon-fiber wick. The vapor of the liquid escapes when the temperature exceeds the boiling point corresponding to the vapor pressure determined by the setting of the pressure-relief valve. The great advantage of this heat sink over a melting-paraffin or similar phase-change heat sink of equal capacity is that by virtue of the =10x greater latent heat of vaporization, a coolant-liquid volume equal to =1/10 of the paraffin volume can suffice.

Knowles, TImothy R.↗

Honeycomb-Fin Heat Sink

Improved finned heat sink for electronic components more lightweight, inexpensive, and efficient. Designed for use with forced air, easily scaled up to dissipate power up to few hundred watts. Fins are internal walls of aluminum honeycomb structure. Cell structure gives strength to thin aluminum foil. Length of channels chosen for thermodynamic efficency; columns of cells combined in any reasonable number because flowing air distributed to all. Heat sink cools nearly as effectively at ends as near its center, no matter how many columns of cells combined.

Rippel, Wally E.↗

Heat transfer augmentation of natural convection heat sink through notched fin design

A novel notched fin heat sink with a central opening is proposed in the present study to augment the heat transfer performance of the natural convection heat sink under horizontal configuration. Thermal and airflow behavior in the heat sinks were studied using both experimental and numerical methods. The results showed that the performance of the conventional heat sink can be enhanced by optimizing its fin design. The basic heat sink model provided a 17% reduction in thermal resistance when its fin height and fin spacing were doubled, and it was accompanied by a 21% increase in surface area. The heat sink with a notched fin design with a less surface area offered a 13% lower thermal resistance compared to the basic model by entraining more airflow into the interior fin region. Providing a central opening in the notched fin heat sink can further reduce the thermal resistance by about 13%. Further, this study also analyzed the influence of emissivity of the heat sink on natural convection conditions. The findings demonstrated that the heat sink with an emissivity of 0.9 can reduce the thermal resistance by nearly 23% compared to one with an emissivity of 0.15.

42 ENGINEERING↗

Surface Merging Technique to Design GA-Optimized Heat Sinks

High-power density inverters require efficient and small heat dissipation systems. For liquid cooling systems, an effective heat sink design is important to enable higher heat transfer and keep the pressure drop within reasonable limits. A heat sink geometry generated from an extruded, 1D fast Fourier transform can achieve more even temperature distribution and improved heat transfer than a conventional heat sink. Building on this concept, this paper proposes a new heat sink geometry creation algorithm. Instead of one plane profile being extruded, multiple plane profiles, each created from the fast Fourier transform method, are subsequently merged by smooth surfaces along the flow direction of the heat sink. Thus, a 3D heat sink geometry is created that enables 3D coolant flow and efficient heat transfer. The volume of this design was reduced by 50% compared with pin fin heat sinks. Compared with extruded 1D fast Fourier transform heat sinks, the proposed design showed an approximately 5% device temperature reduction and a 20% pressure drop reduction.

Barua, Himel↗

Multilead, Vaporization-Cooled Soldering Heat Sink

Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

Rice, John↗

Cooling performance of an active-passive hybrid composite phase change material (HcPCM) finned heat sink: Constant operating mode

Here, the present study explores a hybrid thermal management technology based on air cooling and hybrid composite phase change material (HcPCM) filled finned heat sink for cooling performance of lower to medium heat flux dissipating electronic devices. Two-dimensional numerical simulations are conducted to study the conjugate heat transfer effects of three types of finned heat sink: air-cooled finned heat sink, HcPCM-cooled finned heat sink, and hybrid (air-HcPCM) cooled finned heat sink. A heat sink with a constant volume faction of plate-fins is designed in all cases and simultaneous effects of hybrid nanoparticles and air are investigated to keep the heat sink temperature at safe operating conditions between 40–60°C. The effect of air is incorporated into the heat sink by applying the convective heat transfer coefficient of h c = 10–100W /m 2 .K which tends to create the natural convection and forced convection heat transfer characteristics. The heat flux is varied from 25–40kW /m 2 in the current study. The hybrid nanoparticles of carbon additives (GO and MWCNTs) are dispersed into the RT-35HC, used as a PCM, with a volume fraction of 0% to 6%. Transient simulations are carried out using COMSOL Multiphysics to solve the governing equations for PCM based conjugate heat transfer model. The results showed that forced convection heat transfer improved the cooling performance of the hybrid heat sink compared to natural convection heat transfer. The addition of nanoparticles further enhanced thermal enhancement and uniform melting distribution of PCM inside the finned heat sink. The h c between 30 to 50W/m 2 .K shows optimized values for forced convection heat transfer operating conditions. The volume fraction of 2% of GO+MWCNTs nanoparticles in recommended or optimum concentration for uniform melting of PCM inside the finned heat sink.

36 MATERIALS SCIENCE↗

Direct-Interface, Fusible Heat Sink

Nonventing, regenerable, and self-contained heat sink absorbs heat in melting of ice by direct contact with forced flow of warm water. Elastic bladder contains water and ice. Connectors designed to prevent leaks easily connectable and disconnectable. Female portions embedded in wall of heat sink. After water frozen, male portions inserted and flow of warm water initiated. Water melts ice in and around female connectors, then flow passes between ice and bladder from inlet to outlet. Component of low-power portable refrigerator to operate for short time in picnic or camp setting.

Lomax, Curtis↗

Heat sink effects on weld bead: VPPA process

An investigation into the heat sink effects due to weldment irregularities and fixtures used in the variable polarity plasma arc (VPPA) process was conducted. A basic two-dimensional model was created to represent the net heat sink effect of surplus material using Duhamel's theorem to superpose the effects of an infinite number of line heat sinks of variable strength. Parameters were identified that influence the importance of heat sink effects. A characteristic length, proportional to the thermal diffusivity of the weldment material divided by the weld torch travel rate, correlated with heat sinking observations. Four tests were performed on 2219-T87 aluminum plates to which blocks of excess material were mounted in order to demonstrate heat sink effects. Although the basic model overpredicted these effects, it correctly indicated the trends shown in the experimental study and is judged worth further refinement.

Steranka, Paul O., Jr.↗

Heat sink effects on weld bead: VPPA process

An investigation into the heat sink effects due to weldment irregularities and fixtures used in the variable polarity plasma arc (VPPA) process was conducted. A basic two-dimensional model was created to represent the net heat sink effect of surplus material using Duhamel's theorem to superpose the effects of an infinite number of line heat sinks of variable strength. Parameters were identified that influence the importance of heat sink effects. A characteristic length, proportional to the thermal diffusivity of the weldment material divided by the weld torch travel rate, correlated with heat sinking observations. Four tests were performed on 2219-T87 aluminum plates to which blocks of excess material were mounted in order to demonstrate heat sink effects. Although the basic model overpredicted these effects, it correctly indicated the trends shown in the experimental study and is judged worth further refinement.

Steranka, Paul O., Jr.↗

Model Development and Experimental Validation of the Fusible Heat Sink Design for Exploration Vehicles

The Fusible Heat Sink is a novel vehicle heat rejection technology which combines a flow through radiator with a phase change material. The combined technologies create a multi-function device able to shield crew members against Solar Particle Events (SPE), reduce radiator extent by permitting sizing to the average vehicle heat load rather than to the peak vehicle heat load, and to substantially absorb heat load excursions from the average while constantly maintaining thermal control system setpoints. This multi-function technology provides great flexibility for mission planning, making it possible to operate a vehicle in hot or cold environments and under high or low heat load conditions for extended periods of time. This paper describes the model development and experimental validation of the Fusible Heat Sink technology. The model developed was intended to meet the radiation and heat rejection requirements of a nominal MMSEV mission. Development parameters and results, including sizing and model performance will be discussed. From this flight-sized model, a scaled test-article design was modeled, designed, and fabricated for experimental validation of the technology at Johnson Space Center thermal vacuum chamber facilities. Testing showed performance comparable to the model at nominal loads and the capability to maintain heat loads substantially greater than nominal for extended periods of time.

Cognata, Thomas J.↗