NASA Electronic Parts and Packaging (NEPP) Hermeticity Task Overview, NEPP Program Task 13-294: Hermeticity Correlation Study
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For commercial, military, and aerospace applications, low-cost, small, reliable, and lightweight gas and liquid hermetically sealed valves with post initiation on/off capability are highly desirable for pressurized systems. Applications include remote fire suppression, single-use system-pressurization systems, spacecraft propellant systems, and in situ instruments. Current pyrotechnic- activated rupture disk hermetic valves were designed for physically larger systems and are heavy and integrate poorly with portable equipment, aircraft, and small spacecraft and instrument systems. Additionally, current pyrotechnically activated systems impart high g-force shock loads to surrounding components and structures, which increase the risk of damage and can require additional mitigation. The disclosed mechanism addresses the need for producing a hermetically sealed micro-isolation valve for low and high pressure for commercial, aerospace, and spacecraft applications. High-precision electrical discharge machining (EDM) parts allow for the machining of mated parts with gaps less than a thousandth of an inch. These high-precision parts are used to support against pressure and extrusion, a thin hermetically welded diaphragm. This diaphragm ruptures from a pressure differential when the support is removed and/or when the plunger is forced against the diaphragm. With the addition of conventional seals to the plunger and a two-way actuator, a derivative of this design would allow nonhermetic use as an on/off or metering valve after the initial rupturing of the hermetic sealing disk. In addition, in a single-use hermetically sealed isolation valve, the valve can be activated without the use of potential leak-inducing valve body penetrations. One implementation of this technology is a high-pressure, high-flow-rate rupture valve that is self-rupturing, which is advantageous for high-pressure applications such as gas isolation valves. Once initiated, this technology is self-energizing and requires low force compared to current pyrotechnic-based burst disk hermetic valves. This is a novel design for producing a single-use, self-rupturing, hermetically sealed valve for isolation of pressurized gas and/or liquids. This design can also be applied for single-use disposable valves for chemical instruments. A welded foil diaphragm is fully supported by two mated surfaces that are machined to micron accuracies using EDM. To open the valve, one of the surfaces is moved relative to the other to (a) remove the support creating an unsupported diaphragm that ruptures due to over pressure, and/or (b) produce tension in the diaphragm and rupture it.
The present invention is a versatile hermetic seal leak detection apparatus for testing hermetically sealed containers and devices for leaks without the need to create a custom or specially manufactured testing chamber conforming to the dimensions of the specific object under test. The size of the testing chamber may be mechanically adjusted by the novel use of bellows to reduce and optimize the amount of gas space in a test chamber which surrounds the hermetically sealed object under test. The present invention allows the size of the test chamber to be selectively adjusted during testing to provide an optimum test chamber gas space. The present invention may be further adapted to isolate and test specific portions of the hermetically sealed object under test for leaks.
During the last decade there has been increasing interest in the use of lasers in place of electrical systems to ignite various pyrotechnic and explosive materials. The principal driving force for this work was the requirement for safer energetic components which would be insensitive to electrostatic and electromagnetic radiation. In the last few years this research has accelerated since the basic concepts have proven viable. At the present time it is appropriate to shift the research emphasis in laser initiation from the scientific arena--whether it can be done--to the engineering realm--how it can be put into actual practice in the field. Laser initiation research and development at EG&G Mound was in three principal areas: (1) laser/energetic material interactions; (2) development of novel processing techniques for fabricating hermetic (helium leak rate of less than 1 x 10(exp -8) cu cm/s) laser components; and (3) evaluation and testing of laser-ignited components. Research in these three areas has resulted in the development of high quality, hermetic, laser initiated components. Examples are presented which demonstrate the practicality of fabricating hermetic, laser initiated explosive or pyrotechnic components that can be used in the next generation of ignitors, actuators, and detonators.
Through an Air Force Research Laboratory sponsored STM program, reliable, low-cost, low-weight, non-hermetic coatings for multi-chip-module(MCK applications were developed. Using the combination of Sandia Laboratory ATC-01 test chips, AvanTeco's moisture sensor chips(MSC's), and silicon slices, we have shown that organic and organic/inorganic overcoatings are reliable and practical non-hermetic moisture and oxidation barriers. The use of the MSC and unpassivated ATC-01 test chips provided rapid test results and comparison of moisture barrier quality of the overcoatings. The organic coatings studied were Parylene and Cyclotene. The inorganic coatings were Al2O3 and SiO2. The choice of coating(s) is dependent on the environment that the device(s) will be exposed to. We have defined four(4) classes of environments: Class I(moderate temperature/moderate humidity). Class H(high temperature/moderate humidity). Class III(moderate temperature/high humidity). Class IV(high temperature/high humidity). By subjecting the components to adhesion, FTIR, temperature-humidity(TH), pressure cooker(PCT), and electrical tests, we have determined that it is possible to reduce failures 50-70% for organic/inorganic coated components compared to organic coated components. All materials and equipment used are readily available commercially or are standard in most semiconductor fabrication lines. It is estimated that production cost for the developed technology would range from $1-10/module, compared to $20-200 for hermetically sealed packages.
Prototypes have been developed of potential hermetic sample sealing techniques for encapsulating samples in a ≈1-cm-diameter thin-walled sample tube that are compatible with IMSAH (Integrated Mars Sample Acquisition and Handling) architecture. Techniques include a heat-activated, finned, shape memory alloy plug; a contracting shape memory alloy activated cap; an expanding shape memory alloy plug; and an expanding torque plug. Initial helium leak testing of the shape memory alloy cap and finned shape memory alloy plug seals showed hermetic- seal capability compared against an industry standard of <1×10-8 atm-cc/s He. These tests were run on both clean tubes and dirty tubes dipped in MMS (Mojave Mars Simulant). The leak tests were also performed after thermal cycling between -135 and +55 ºC to ensure seal integrity after Martian diurnal cycles. Developmental testing is currently being done on the expanding torque plug, and expanding shape memory alloy plug seal designs. The finned shape memory alloy (SMA) plug currently shows hermetic sealing capability based on preliminary tests.
The present invention is a hermetic seal leak detection apparatus, which can be used to test for hermetic seal leaks in instruments and containers. A vacuum tight chamber is created around the unit being tested to minimize gas space outside of the hermetic seal. A vacuum inducing device is then used to increase the gas chamber volume inside the device, so that a slight vacuum is pulled on the unit being tested. The pressure in the unit being tested will stabilize. If the stabilized pressure reads close to a known good seal calibration, there is not a leak in the seal. If the stabilized pressure reads closer to a known bad seal calibration value, there is a leak in the seal. The speed of the plunger can be varied and by evaluating the resulting pressure change rates and final values, the leak rate/size can be accurately calculated.
Polymer cathode tantalum capacitors have lower ESR (equivalent series resistance) compared to other types of tantalum capacitors and for this reason have gained popularity in the electronics design community. Their use allows improved performance of power supply systems along with substantial reduction of size and weight of the components used. However, these parts have poor thermal stability and can degrade in humid environments. Polymer hermetically sealed (PHS) capacitors avoid problems related to environmental degradation of molded case parts and can potentially replace current wet and solid hermetically sealed capacitors. In this work, PHS capacitors manufactured per DLA LAM DWG#13030 are evaluated for space applications. Several lots of capacitors manufactured over period from 2010 to 2014 were tested for the consistency of performance, electrical and thermal characteristics, highly accelerated life testing, and robustness under reverse bias and random vibration conditions. Special attention was given to analysis of leakage currents and the effect of long-term high temperature storage on capacitors in as is condition and after hermeticity loss. The results show that PHS capacitors might be especially effective for low-temperature applications or for system requiring a cold start-up. Additional screening and qualification testing have been recommended to assure the necessary quality of capacitors for space projects.
The relative strengths and weaknesses of 35 commonly used hermetic flat and dual in-line packages were determined and used to rank each of the packages according to a numerical weighting scheme for package attributes. The list of attributes included desirable features in five major areas: lead and lead seal, body construction, body materials, lid and lid seal, and marking. The metal flat pack and multilayer integral ceramic flat pack and DIP received the highest rankings, and the soft glass Cerdip and Cerpak types received the lowest rankings. Loss of package hermeticity due to lead and lid seal problems was found to be the predominant failure mode from the literature/data search. However, environmental test results showed that lead and lid seal failures due to thermal stressing was only a problem with the hard glass (Ceramic) body DIP utilizing a metal lid and/or bottom. Insufficient failure data were generated for the other package types tested to correlate test results with the package ranking.
The edge sealing technique is accomplished by a combination of a chemical bond between glass and aluminum, formed by electrostatic bonding, and a metallurgical bond between aluminum and aluminum, formed by ultrasonic welding. Such a glass to metal seal promises to provide a low cost, long lifetime, highly effective hermetic seal which can protect module components from severe environments. Development of the sealing techniques and demonstration of their effectiveness by fabricating a small number of dummy modules, up to eight inches square in size, and testing them for hermeticity using helium leak testing methods are reviewed. Non-destructive test methods are investigated.
Gas supply system for hermetically sealed platforms applicable to Saturn V instrument unit
Fabrication and testing of hermetically sealed cells capable of overcharge and overdischarge
A wobble plate, metal bellows, and two shafts, assembled in a four-section housing, make it possible to transmit rotary motion through a hermetically sealed wall. In operation a rotational torque is developed by the wobble plate.
Pulse and respiratory fluctuations of intercranial pressure in hermetic cavity