In-situ Testing to Acquire HR-EBSD and DIC Strain Data Within a Coincident Domain
For this project, an inked rubber stamp was applied to a small Inconel 625 specimen. The stamp transferred a thin pattern with microscale features for digital image correlation (DIC). The pattern is easily visible at lower voltages and thin enough to not obstruct backscattered electrons. The unique characteristics of the pattern enabled the concurrent acquisition of DIC and high-resolution electron backscatter diffraction (HR-EBSD) data while the specimen was loaded in-situ. The challenges of in-situ testing and combining EBSD with DIC measurements are discussed. By combining the elastic strains (from HR-EBSD) and total strains (from DIC) the result of this approach is an estimate of stress- strain behavior at points across the specimen surface. This combined dataset can then be used as higher-fidelity data in the calibration of crystal plasticity models.