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Precision Cleaning - Path to Premier

ITT Space Systems Division s new Precision Cleaning facility provides critical cleaning and packaging of aerospace flight hardware and optical payloads to meet customer performance requirements. The Precision Cleaning Path to Premier Project was a 2007 capital project and is a key element in the approved Premier Resource Management - Integrated Supply Chain Footprint Optimization Project. Formerly precision cleaning was located offsite in a leased building. A new facility equipped with modern precision cleaning equipment including advanced process analytical technology and improved capabilities was designed and built after outsourcing solutions were investigated and found lacking in ability to meet quality specifications and schedule needs. SSD cleans parts that can range in size from a single threaded fastener all the way up to large composite structures. Materials that can be processed include optics, composites, metals and various high performance coatings. We are required to provide verification to our customers that we have met their particulate and molecular cleanliness requirements and we have that analytical capability in this new facility. The new facility footprint is approximately half the size of the former leased operation and provides double the amount of throughput. Process improvements and new cleaning equipment are projected to increase 1st pass yield from 78% to 98% avoiding $300K+/yr in rework costs. Cost avoidance of $350K/yr will result from elimination of rent, IT services, transportation, and decreased utility costs. Savings due to reduced staff expected to net $4-500K/yr.

Mackler, Scott E.↗

NASA Tech Briefs, January 2008

Topics covered include: Induction Charge Detector with Multiple Sensing Stages; Generic Helicopter-Based Testbed for Surface Terrain Imaging Sensors; Robot Electronics Architecture; Optimized Geometry for Superconducting Sensing Coils; Sensing a Changing Chemical Mixture Using an Electronic Nose; Inertial Orientation Trackers with Drift Compensation; Microstrip Yagi Antenna with Dual Aperture-Coupled Feed; Patterned Ferroelectric Films for Tunable Microwave Devices; Micron-Accurate Laser Fresnel-Diffraction Ranging System; Efficient G(sup 4)FET-Based Logic Circuits; Web-Enabled Optoelectronic Particle-Fallout Monitor; SiO2/TiO2 Composite for Removing Hg from Combustion Exhaust; Lightweight Tanks for Storing Liquefied Natural Gas; Hybrid Wound Filaments for Greater Resistance to Impacts; Making High-Tensile-Strength Amalgam Components; Bonding by Hydroxide-Catalyzed Hydration and Dehydration; Balanced Flow Meters without Moving Parts; Deflection-Compensating Beam for Use inside a Cylinder; Four-Point-Latching Microactuator; Curved Piezoelectric Actuators for Stretching Optical Fibers; Tunable Optical Assembly with Vibration Dampening; Passive Porous Treatment for Reducing Flap Side-Edge Noise; Cylindrical Piezoelectric Fiber Composite Actuators; Patterning of Indium Tin Oxide Films; Gimballed Shoulders for Friction Stir Welding; Improved Thermal Modulator for Gas Chromatography; Nuclear-Spin Gyroscope Based on an Atomic Co-Magnetometer; Utilizing Ion-Mobility Data to Estimate Molecular Masses; Optical Displacement Sensor for Sub-Hertz Applications; Polarization/Spatial Combining of Laser-Diode Pump Beams; Spatial Combining of Laser-Diode Beams for Pumping an NPRO; Algorithm Optimally Orders Forward-Chaining Inference Rules; Project Integration Architecture; High Power Amplifier and Power Supply; Estimating Mixing Heights Using Microwave Temperature Profiler; and Multiple-Cone Sunshade for a Spaceborne Telescope.

Source record↗

A Case Study Using Modeling and Simulation to Predict Logistics Supply Chain Issues

Optimization of critical supply chains to deliver thousands of parts, materials, sub-assemblies, and vehicle structures as needed is vital to the success of the Constellation Program. Thorough analysis needs to be performed on the integrated supply chain processes to plan, source, make, deliver, and return critical items efficiently. Process modeling provides simulation technology-based, predictive solutions for supply chain problems which enable decision makers to reduce costs, accelerate cycle time and improve business performance. For example, United Space Alliance, LLC utilized this approach in late 2006 to build simulation models that recreated shuttle orbiter thruster failures and predicted the potential impact of thruster removals on logistics spare assets. The main objective was the early identification of possible problems in providing thruster spares for the remainder of the Shuttle Flight Manifest. After extensive analysis the model results were used to quantify potential problems and led to improvement actions in the supply chain. Similarly the proper modeling and analysis of Constellation parts, materials, operations, and information flows will help ensure the efficiency of the critical logistics supply chains and the overall success of the program.

Tucker, David A.↗

Development of Two High-Energy Bus ‘Cores’ for Rapid Support of Low-TRL and Educational Payloads: A Software-Configured EPS Combined with Flexible C&DH

For several years the TechEdSat flight series (TES-n), developed by the Nano Orbital Workshop (NOW) group at NASA Ames, has relied upon an in-house developed unit to serve both EPS (Electrical Power System) and C&DH (Command and Data Handling) roles along with low data-rate telemetry functions, i.e., serving as the ‘core’ of the spacecraft bus. This ‘core’ has a considerable task given the rapid cadence of the TES program and the typically low-TRL of payloads; configurability and compatibility are key to prevent mission-specific hardware. However, at only 15 watts the current core has become insufficient to support the program’s growing missions and increasingly demanding payloads. To this end, the NOW program is developing new cores to support two TES mission classes: a single-PCB ‘MiniCore’ designed to support 80-watt missions 6U or smaller in LEO, and a three-PCB, radiation-tolerant ‘StackCore’ designed to support 6U and larger missions over 500 watts in LEO and beyond. The ‘MiniCore’ design consists of three main segments: a processor-agnostic C&DH, a software-configured EPS, and a backup low data-rate radio. The design philosophy was to enable rapid-manufacture in a turbulent supply chain, hence the design consists of COTS parts with a focus on those able to be drop-in replaced with radiation-tolerant versions when demanded by the mission. As a single PC-104 sized circuit board, power density and ease of integration also dominated design, demanding the use of modern features such as single-point USB-C for easy charging and monitoring of the spacecraft on the ground. The ‘MiniCore’ can support 80 watts of load, 140 watt-hours of storage, and over 20 watts of optimized solar generation with extensive power monitoring throughout. The ‘MiniCore’ supports one battery pack, six solar-panels, six loads, five actuators, Iridium SBD, and an internal 802.15.4 network. Additionally, the processor-agnostic design can accept any PJRC Teensy 3.x or Adafruit Feather microcontroller unit to enable processor scaling with mission requirements or environment. It is expected a development unit of this design will be completed before conference. The ‘StackCore’ design consists of three stacked PC-104 sized circuit boards: one dedicated to power generation and storage, one dedicated to power distribution, and one dedicated to C&DH tasks. This delineation is necessary to support the transition from highly integrated ICs to discrete analog circuitry, enabling a primarily analog control power system able to operate without software in a radiation environment with finer monitoring compared to the ‘MiniCore’ design. The planned base architecture supports over 500 watts of load, 250 watt-hours of storage, and over 80 watts of optimized solar generation. The power distribution board allows for the use of daughter cards hosting custom converters or interfaces for payloads, in addition to the software-configured supplies used on the ‘MiniCore’. This core stack will be managed by a Vorago ARM M4 microcontroller and support the same wireless communications as the ‘MiniCore’, with optional integration of a NOW S-band radio and attitude determination sensors for ‘black box’ functionality. It is expected the prototype will still be in development during conference.

Spacecraft↗

Development of Two High-Energy Bus ‘Cores’ for Rapid Support of Low-TRL and Educational Payloads: A Software-Configured EPS Combined with Flexible C&DH

For several years the TechEdSat flight series (TES-n), developed by the Nano Orbital Workshop (NOW) group at NASA Ames, has relied upon an in-house developed unit to serve both EPS (Electrical Power System) and C&DH (Command and Data Handling) roles along with low data-rate telemetry functions, i.e., serving as the ‘core’ of the spacecraft bus. This ‘core’ has a considerable task given the rapid cadence of the TES program and the typically low-TRL of payloads; configurability and compatibility are key to prevent mission-specific hardware. However, at only 15 watts the current core has become insufficient to support the program’s growing missions and increasingly demanding payloads. To this end, the NOW program is developing new cores to support two TES mission classes: a single-PCB ‘MiniCore’ designed to support 80-watt missions 6U or smaller in LEO, and a three-PCB, radiation-tolerant ‘StackCore’ designed to support 6U and larger missions over 500 watts in LEO and beyond. The ‘MiniCore’ design consists of three main segments: a processor-agnostic C&DH, a software-configured EPS, and a backup low data-rate radio. The design philosophy was to enable rapid-manufacture in a turbulent supply chain, hence the design consists of COTS parts with a focus on those able to be drop-in replaced with radiation-tolerant versions when demanded by the mission. As a single PC-104 sized circuit board, power density and ease of integration also dominated design, demanding the use of modern features such as single-point USB-C for easy charging and monitoring of the spacecraft on the ground. The ‘MiniCore’ can support 80 watts of load, 140 watt-hours of storage, and over 20 watts of optimized solar generation with extensive power monitoring throughout. The ‘MiniCore’ supports one battery pack, six solar-panels, six loads, five actuators, Iridium SBD, and an internal 802.15.4 network. Additionally, the processor-agnostic design can accept any PJRC Teensy 3.x or Adafruit Feather microcontroller unit to enable processor scaling with mission requirements or environment. It is expected a development unit of this design will be completed before conference. The ‘StackCore’ design consists of three stacked PC-104 sized circuit boards: one dedicated to power generation and storage, one dedicated to power distribution, and one dedicated to C&DH tasks. This delineation is necessary to support the transition from highly integrated ICs to discrete analog circuitry, enabling a primarily analog control power system able to operate without software in a radiation environment with finer monitoring compared to the ‘MiniCore’ design. The planned base architecture supports over 500 watts of load, 250 watt-hours of storage, and over 80 watts of optimized solar generation. The power distribution board allows for the use of daughter cards hosting custom converters or interfaces for payloads, in addition to the software-configured supplies used on the ‘MiniCore’. This core stack will be managed by a Vorago ARM M4 microcontroller and support the same wireless communications as the ‘MiniCore’, with optional integration of a NOW S-band radio and attitude determination sensors for ‘black box’ functionality. It is expected the prototype will still be in development during conference.

Spacecraft↗

Development of Two High-Energy Bus ‘Cores’

For several years the TechEdSat flight series (TES-n), developed by the Nano Orbital Workshop (NOW) group at NASA Ames, has relied upon an in-house developed unit to serve both EPS (Electrical Power System) and C&DH (Command and Data Handling) roles along with low data-rate telemetry functions, i.e., serving as the ‘core’ of the spacecraft bus. This ‘core’ has a considerable task given the rapid cadence of the TES program and the typically low-TRL of payloads; configurability and compatibility are key to prevent mission-specific hardware. However, at only 15 watts the current core has become insufficient to support the program’s growing missions and increasingly demanding payloads. To this end, the NOW program is developing new cores to support two TES mission classes: a single-PCB ‘MiniCore’ designed to support 80-watt missions 6U or smaller in LEO, and a three-PCB, radiation-tolerant ‘StackCore’ designed to support 6U and larger missions over 500 watts in LEO and beyond. The ‘MiniCore’ design consists of three main segments: a processor-agnostic C&DH, a software-configured EPS, and a backup low data-rate radio. The design philosophy was to enable rapid-manufacture in a turbulent supply chain, hence the design consists of COTS parts with a focus on those able to be drop-in replaced with radiation-tolerant versions when demanded by the mission. As a single PC-104 sized circuit board, power density and ease of integration also dominated design, demanding the use of modern features such as single-point USB-C for easy charging and monitoring of the spacecraft on the ground. The ‘MiniCore’ can support 80 watts of load, 140 watt-hours of storage, and over 20 watts of optimized solar generation with extensive power monitoring throughout. The ‘MiniCore’ supports one battery pack, six solar-panels, six loads, five actuators, Iridium SBD, and an internal 802.15.4 network. Additionally, the processor-agnostic design can accept any PJRC Teensy 3.x or Adafruit Feather microcontroller unit to enable processor scaling with mission requirements or environment. It is expected a development unit of this design will be completed before conference. The ‘StackCore’ design consists of three stacked PC-104 sized circuit boards: one dedicated to power generation and storage, one dedicated to power distribution, and one dedicated to C&DH tasks. This delineation is necessary to support the transition from highly integrated ICs to discrete analog circuitry, enabling a primarily analog control power system able to operate without software in a radiation environment with finer monitoring compared to the ‘MiniCore’ design. The planned base architecture supports over 500 watts of load, 250 watt-hours of storage, and over 80 watts of optimized solar generation. The power distribution board allows for the use of daughter cards hosting custom converters or interfaces for payloads, in addition to the software-configured supplies used on the ‘MiniCore’. This core stack will be managed by a Vorago ARM M4 microcontroller and support the same wireless communications as the ‘MiniCore’, with optional integration of a NOW S-band radio and attitude determination sensors for ‘black box’ functionality. It is expected the prototype will still be in development during conference.

Avery Brock↗

Application Table: A Bridge Connecting the Designing “With-The-Material” and “The-Material” Paradigms

Over the last few decades, advances in high-performance computing, new material characterization methods, and, more recently, an emphasis on integrated computational materials engineering (ICME) have been a catalyst for multiscale modeling and simulation-based design of materials and structures in the aerospace industry. In 2016 NASA sponsored a 2040 Vision study (which appeared in 2018) to define the potential 25-year future state required for integrated multiscale modeling of materials and systems (e.g., load-bearing structures) to accelerate the pace and reduce the expense of innovation in future aerospace and aeronautical systems. The study envisions a cyber-physical-social ecosystem comprised of experimentally verified and validated (V & V) computational models, tools, and techniques, along with the associated digital tapestry, that impacts the entire supply chain to enable cost-effective, rapid, and revolutionary design of “fit-for-purpose” materials, components, and systems. Consequently, the development of a robust information management system that incorporates (across the full life cycle) both experimental (real data) and virtual data resulting from the application of various simulation tools (at single or multiple length scales), therefore enabling the virtual design and optimization of materials throughout their processing – internal structure – property – performance envelope, has become critical. This need is also fueled by the demands for higher efficiency in material testing; consistency, quality, and traceability of data; product design; engineering analysis; as well as control of access to proprietary or sensitive information. This is particularly true when attempting to merge ICME practices with recent additive manufacturing technology which will enable production of the resulting 2040 Vision material and structural designs. At NASA Glenn Research Center we are exploring the future of material science through the use of novel characterization methodologies, high performance computing, and recently an emphasis on integrated computational materials engineering (ICME). Herein, recent efforts to incorporate an Application Table within NASA Glenn Research Center’s ICME Granta MI database is presented. The goal is to provide a place where material and structural application information/requirements can be linked so as to marry the “design the-material” and the “design-with-material” paradigms and thereby enable application-driven design and optimization of materials and structures by providing a central location that links material processing at various length scales to the application’s performance requirements. This paper discusses the specifics of this Application Table as well as best practices and key principles for the development of a robust materials information management system to enable the 2040 Vision integrated materials and structures ecosystem. Furthermore, it presents the intended role of the Application Table in the future of ICME design of “fit-for-purpose” materials, showing the need for a well-established framework that can successfully bridge the gap between the design “the material” and design “with-the-material” paradigms.

Materials↗

Application Table: A Bridge Connecting the Designing “With-the-Material” and “the-Material”

Over the last few decades, advances in high-performance computing, new material characterization methods, and, more recently, an emphasis on integrated computational materials engineering (ICME) have been a catalyst for multiscale modeling and simulation-based design of materials and structures in the aerospace industry. In 2016 NASA sponsored a 2040 Vision study (which appeared in 2018) to define the potential 25-year future state required for integrated multiscale modeling of materials and systems (e.g., load-bearing structures) to accelerate the pace and reduce the expense of innovation in future aerospace and aeronautical systems. The study envisions a cyber-physical-social ecosystem comprised of experimentally verified and validated (V & V) computational models, tools, and techniques, along with the associated digital tapestry, that impacts the entire supply chain to enable cost-effective, rapid, and revolutionary design of “fit-for-purpose” materials, components, and systems. Consequently, the development of a robust information management system that incorporates (across the full life cycle) both experimental (real data) and virtual data resulting from the application of various simulation tools (at single or multiple length scales), therefore enabling the virtual design and optimization of materials throughout their processing – internal structure – property – performance envelope, has become critical. This need is also fueled by the demands for higher efficiency in material testing; consistency, quality, and traceability of data; product design; engineering analysis; as well as control of access to proprietary or sensitive information. This is particularly true when attempting to merge ICME practices with recent additive manufacturing technology which will enable production of the resulting 2040 Vision material and structural designs. At NASA Glenn Research Center we are exploring the future of material science through the use of novel characterization methodologies, high performance computing, and recently an emphasis on integrated computational materials engineering (ICME). Herein, recent efforts to incorporate an Application Table within NASA Glenn Research Center’s ICME Granta MI database is presented. The goal is to provide a place where material and structural application information/requirements can be linked so as to marry the “design the-material” and the “design-with-material” paradigms and thereby enable application-driven design and optimization of materials and structures by providing a central location that links material processing at various length scales to the application’s performance requirements. This paper discusses the specifics of this Application Table as well as best practices and key principles for the development of a robust materials information management system to enable the 2040 Vision integrated materials and structures ecosystem. Furthermore, it presents the intended role of the Application Table in the future of ICME design of “fit-for-purpose” materials, showing the need for a well-established framework that can successfully bridge the gap between the design “the material” and design “with-the-material” paradigms.

Materials↗

Lightweight Thrust Chamber Assemblies using Multi-Alloy Additive Manufacturing and Composite Overwrap

Additive Manufacturing (AM) has brought significant design and fabrication opportunities for complex components with internal features such as liquid rocket engine thrust chambers not previously possible. This technology allows for significant cost savings and schedule reductions in addition to new performance optimization through weight reduction and increased margins. Specific to regeneratively-cooled combustion chambers and nozzles for liquid rocket engines, additive manufacturing offers the ability to form the complex internal coolant channels and the closeout of the channels to contain the high pressure liquid propellants with a single operation. Much of additive manufacturing development has focused on monolithic alloys using Laser Powder Bed Fusion (L-PBF), which do not allow for complete optimization of the structure. The National Aeronautics and Space Administration (NASA) completed feasibility of an AM bimetallic L-PBF GRCop-84 copper-alloy combustion chamber with an AM electron beam freeform Inconel 625 structural jacket under the Low Cost Upper Stage Propulsion (LCUSP) Project. A follow-on project called Rapid Analysis and Manufacturing Propulsion Technology (RAMPT) is under development to further expand large-scale multi-alloy thrust chambers while maturing composite overwrap technology for significant weight savings opportunities. The RAMPT project has three primary objectives: 1) Advancing blown powder Directed Energy Deposition (DED) to fabricate integral-channel large scale nozzles, 2) Develop composite overwrap technology to reduce weight and provide structural capability for thrust chamber assemblies, and 3) Develop bimetallic and multi-metallic additively manufactured radial and axial joints to optimize material performance. In addition to these primary manufacturing developments, analytical modeling efforts compliment the process development to simulate the AM processes to reduce build failures and distortions. The RAMPT project is also maturing the supply chain for various manufacturing processes described above in addition to L-PBF of GRCop-42. This paper will present an overview of the RAMPT project, the process development and hardware progress to date, material and hot-fire testing results, along with future developments.

Additive Manufacturing↗

Recent Developments of Thermal Protection Materials to Enable Lower Cost Space Missions

Introduction: Starting with the Commercial Crew Program, a new paradigm has emerged at NASA. Rather than designing rockets and spacecrafts for every mission optimized to achieve science, NASA has begun to use a service-based model and utilizing public-private partnership in developing the vehicles that can bring broader benefits as well as lower the cost for NASA missions. Commercial companies own and operate those vehicles. This allows NASA to not design missions from the bottom up, and has cost, risk, and schedule savings implications. On the other side, the constraints require meeting the requirements in terms of mass, volume, power, etc. By leveraging NASA developed technologies, commercial companies can quickly demonstrate the commercial mission concept, and, through technology transfer, adopt needed technology to address supply chain problems. A downside is that the technology has to be sufficiently mature to be transferred by NASA, which means that it requires significant investment, expertise, and time to develop. Space entities are focused on rapid development with an emphasis on manufacturing and integration innovation with reduced cost and schedule and quick entrance into the market. Thermal Protection Systems (TPS) are mission critical, but their development takes years, and involve access to arc jets or unique test facilities. Therefore, their development is both risky and investment heavy. NASA ARC developed several new TPS materials over the last decade (C-PICA, HEEET, 3MDCP, 3DMAT, ADEPT woven TPS) and brought them to high TPS maturity, making them enablers for commercials space missions from LEO, Lunar Sample Return, Mars, and Venus missions. LEO missions are relevant to future Mars missions due to the comparable entry conditions. External Partners' Missions: C-PICA is a recent improvement on NASA’s heritage PICA lightweight TPS ablator. C-PICA is now considered an enabling technology for New Frontiers and other NASA missions. C-PICA was infused into several missions from external partners. Varda Space Industries’ Winnebago-1 spacecraft successfully returned to Earth from LEO on Feb. 21st, 2024, using a C-PICA heatshield. Inversion Space’s Ray vehicle will test both ARC’s C-PICA and SIRCA TPS materials on a LEO return mission later in 2024. The Kentucky Re-Entry Probe Experiment (KREPE) is another example of a low-cost flight experiment to demonstrate the use of small entry capsules to gather data with three instrumented Kentucky Re-entry and Universal Payload System (KRUPS) capsules. NASA Arc provided C-PICA and Soft-PICA for two of the next KRUPS capsules scheduled to re-enter Earth from the ISS later in 2024. Finally, Rocket Lab’s low-cost mission to Venus, scheduled to launch in December 2024, will search for habitable conditions in Venus’ cloud layer, making use of NASA ARC provided HEEET insulation layer heat shield, and SIRCA backshell TPS materials. Future NASA Missions: NASA’s ability to help commercial missions can lead to future low-cost missions for several reasons: Competition encourages lower cost; technology maturation is now done at an integrated system level; and a common design architecture between commercial and scientific applications requires no specialized engineering design. From an engineering perspective, both of these commercial LEO capsules aforementioned are capable of a Mars entry; the commercial payload mut be replaced with as science payload. Finally, several NASA mission concepts, that could be candidates for future SIMPLEx program calls, such as VATMOS-SR and Nephele, both proposing to target the Venusian atmosphere, would make use of the HEEET insulation layer TPS for part of their heat shield.

TPS materials↗

Recent Developments of Thermal Protection Materials to Enable Lower Cost Space Missions

Introduction: Starting with the Commercial Crew Program, a new paradigm has emerged at NASA. Rather than designing rockets and spacecrafts for every mission optimized to achieve science, NASA has begun to use a service-based model and utilizing public-private partnership in developing the vehicles that can bring broader benefits as well as lower the cost for NASA missions. Commercial companies own and operate those vehicles. This allows NASA to not design missions from the bottom up, and has cost, risk, and schedule savings implications. On the other side, the constraints require meeting the requirements in terms of mass, volume, power, etc. By leveraging NASA developed technologies, commercial companies can quickly demonstrate the commercial mission concept, and, through technology transfer, adopt needed technology to address supply chain problems. A downside is that the technology has to be sufficiently mature to be transferred by NASA, which means that it requires significant investment, expertise, and time to develop. Space entities are focused on rapid development with an emphasis on manufacturing and integration innovation with reduced cost and schedule and quick entrance into the market. Thermal Protection Systems (TPS) are mission critical, but their development takes years, and involve access to arc jets or unique test facilities. Therefore, their development is both risky and investment heavy. NASA ARC developed several new TPS materials over the last decade (C-PICA, HEEET, 3MDCP, 3DMAT, ADEPT woven TPS) and brought them to high TPS maturity, making them enablers for commercials space missions from LEO, Lunar Sample Return, Mars, and Venus missions. LEO missions are relevant to future Mars missions due to the comparable entry conditions. External Partners' Missions: C-PICA is a recent improvement on NASA’s heritage PICA lightweight TPS ablator. C-PICA is now considered an enabling technology for New Frontiers and other NASA missions. C-PICA was infused into several missions from external partners. Varda Space Industries’ Winnebago-1 spacecraft successfully returned to Earth from LEO on Feb. 21st, 2024, using a C-PICA heatshield. Inversion Space’s Ray vehicle will test both ARC’s C-PICA and SIRCA TPS materials on a LEO return mission later in 2024. The Kentucky Re-Entry Probe Experiment (KREPE) is another example of a low-cost flight experiment to demonstrate the use of small entry capsules to gather data with three instrumented Kentucky Re-entry and Universal Payload System (KRUPS) capsules. NASA Arc provided C-PICA and Soft-PICA for two of the next KRUPS capsules scheduled to re-enter Earth from the ISS later in 2024. Finally, Rocket Lab’s low-cost mission to Venus, scheduled to launch in December 2024, will search for habitable conditions in Venus’ cloud layer, making use of NASA ARC provided HEEET insulation layer heat shield, and SIRCA backshell TPS materials. Future NASA Missions: NASA’s ability to help commercial missions can lead to future low-cost missions for several reasons: Competition encourages lower cost; technology maturation is now done at an integrated system level; and a common design architecture between commercial and scientific applications requires no specialized engineering design. From an engineering perspective, both of these commercial LEO capsules aforementioned are capable of a Mars entry; the commercial payload mut be replaced with as science payload. Finally, several NASA mission concepts, that could be candidates for future SIMPLEx program calls, such as VATMOS-SR and Nephele, both proposing to target the Venusian atmosphere, would make use of the HEEET insulation layer TPS for part of their heat shield.

TPS materials↗

Progressively Enabling Earth Independent Medical Operations (EIMO)

This panel presents the findings from a series of Technical Interchange Meetings (TIMs) hosted by the Exploration Medical Capability Element (ExMC) in NASA’s Human Research Program. The topics for the TIMs were derived from a 2-day conference of senior leaders and subject matters experts that collectively outlined a multi-faceted strategy designed to optimize crew health and performance through an increasingly autonomous medical approach. The first abstract in this panel outlines the scope of issues related to data collection, usage, transmission and computing capacity to facilitate EIMO. The second presentation provides an overview of the challenges in developing curricula and advanced training tools to baseline knowledge, skills and abilities (KSA), verify clinical competency and assure retention during prolonged durations inherent in exploration-class missions. An overview of the complicated medical supply and resource chain necessary to facilitate EIMO is provided in the third presentation of this panel. The final presentation in this EIMO panel surveys the breadth and depth of demands on cognitive load expected to be experienced by crew on an exploration mission and proposes strategies to mitigate the prospect of cognitive overload through methods to shift task load from the crew to multi-modal artificial intelligence based medical support systems. Taken together, these presentations summarize the challenges to be expected and potential solution spaces to be explored and developed to progressively enable increasing autonomous medical operations to support crewed missions beyond low earth orbit. Through EIMO focused pre-mission planning, integrated data architecture design, innovative training development and AI-assisted task load management, the gradual transition of medical care and decision making from terrestrial to space-based assets enabling support of astronaut health and performance and reducing overall mission risk is achievable.

Jay Lemery↗

Progressively Enabling Earth Independent Medical Operations (EIMO)

This panel presents the findings from a series of Technical Interchange Meetings (TIMs) hosted by the Exploration Medical Capability Element (ExMC) in NASA’s Human Research Program. The topics for the TIMs were derived from a 2-day conference of senior leaders and subject matters experts that collectively outlined a multi-faceted strategy designed to optimize crew health and performance through an increasingly autonomous medical approach. The first abstract in this panel outlines the scope of issues related to data collection, usage, transmission and computing capacity to facilitate EIMO. The second presentation provides an overview of the challenges in developing curricula and advanced training tools to baseline knowledge, skills and abilities (KSA), verify clinical competency and assure retention during prolonged durations inherent in exploration-class missions. An overview of the complicated medical supply and resource chain necessary to facilitate EIMO is provided in the third presentation of this panel. The final presentation in this EIMO panel surveys the breadth and depth of demands on cognitive load expected to be experienced by crew on an exploration mission and proposes strategies to mitigate the prospect of cognitive overload through methods to shift task load from the crew to multi-modal artificial intelligence based medical support systems. Taken together, these presentations summarize the challenges to be expected and potential solution spaces to be explored and developed to progressively enable increasing autonomous medical operations to support crewed missions beyond low earth orbit. Through EIMO focused pre-mission planning, integrated data architecture design, innovative training development and AI-assisted task load management, the gradual transition of medical care and decision making from terrestrial to space-based assets enabling support of astronaut health and performance and reducing overall mission risk is achievable.

John Lemery↗

NASA Tech Briefs, December 2009

Topics include: A Deep Space Network Portable Radio Science Receiver; Detecting Phase Boundaries in Hard-Sphere Suspensions; Low-Complexity Lossless and Near-Lossless Data Compression Technique for Multispectral Imagery; Very-Long-Distance Remote Hearing and Vibrometry; Using GPS to Detect Imminent Tsunamis; Stream Flow Prediction by Remote Sensing and Genetic Programming; Pilotless Frame Synchronization Using LDPC Code Constraints; Radiometer on a Chip; Measuring Luminescence Lifetime With Help of a DSP; Modulation Based on Probability Density Functions; Ku Telemetry Modulator for Suborbital Vehicles; Photonic Links for High-Performance Arraying of Antennas; Reconfigurable, Bi-Directional Flexfet Level Shifter for Low-Power, Rad-Hard Integration; Hardware-Efficient Monitoring of I/O Signals; Video System for Viewing From a Remote or Windowless Cockpit; Spacesuit Data Display and Management System; IEEE 1394 Hub With Fault Containment; Compact, Miniature MMIC Receiver Modules for an MMIC Array Spectrograph; Waveguide Transition for Submillimeter-Wave MMICs; Magnetic-Field-Tunable Superconducting Rectifier; Bonded Invar Clip Removal Using Foil Heaters; Fabricating Radial Groove Gratings Using Projection Photolithography; Gratings Fabricated on Flat Surfaces and Reproduced on Non-Flat Substrates; Method for Measuring the Volume-Scattering Function of Water; Method of Heating a Foam-Based Catalyst Bed; Small Deflection Energy Analyzer for Energy and Angular Distributions; Polymeric Bladder for Storing Liquid Oxygen; Pyrotechnic Simulator/Stray-Voltage Detector; Inventions Utilizing Microfluidics and Colloidal Particles; RuO2 Thermometer for Ultra-Low Temperatures; Ultra-Compact, High-Resolution LADAR System for 3D Imaging; Dual-Channel Multi-Purpose Telescope; Objective Lens Optimized for Wavefront Delivery, Pupil Imaging, and Pupil Ghosting; CMOS Camera Array With Onboard Memory; Quickly Approximating the Distance Between Two Objects; Processing Images of Craters for Spacecraft Navigation; Adaptive Morphological Feature-Based Object Classifier for a Color Imaging System; Rover Slip Validation and Prediction Algorithm; Safety and Quality Training Simulator; Supply-Chain Optimization Template; Algorithm for Computing Particle/Surface Interactions; Cryogenic Pupil Alignment Test Architecture for Aberrated Pupil Images; and Thermal Transport Model for Heat Sink Design.

Source record↗