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In the presentation thermal management of electric traction drives is discussed and capabilities of NREL's Advanced Power Electronics and Electric Machines group is reviewed. Emphasis is made on jet impingement cooling technique of electric machines with driveline fluids and experimental measurements of associated heat transfer coefficients.
The adoption of silicon carbide (SiC) devices in the electric vehicle (EV) industry is increasing due to their superior performance over silicon devices. SiC devices enable further miniaturization of EV inverters, increasing their power density, which results in thermal management challenges. Here in this paper, the limits of single-phase jet impingement cooling are explored for an automotive SiC power module. We propose embedding pin fins in the direct-bonded-copper (DBC) substrate of the power module package using laser powder bed fusion additive manufacturing. The thermalhydraulic performance of the DBC-embedded pin fins is compared against folded fins that are directly soldered to the DBC substrate. A heat conduction analysis was conducted on a SiC package to determine the target heat transfer coefficient (HTC) for the heat sink. A water-ethylene glycol (WEG) jet impingement on the proposed concepts was studied using unit-cell models to achieve the target HTC. The studied designs put emphasis on the reliability and manufacturability requirements of the automotive industry. The thermal performance of DBC-embedded pin fins outperformed the DBC-soldered folded fins. The performance of the DBC-embedded pin fins is benchmarked against WEG-based cooling systems of commercial EVs. With the proposed cooling solution, we have shown a pathway of reducing the specific thermal resistance by 75% compared to BMW i3 thermal management system without any penalty on pressure drop or parasitic power.
Efficient thermal management of power electronics systems is crucial for higher reliability. With the miniaturization of systems, high-loss-density electronics require cooling systems that can extract a large amount of heat. This study explored a liquid-jet-impingement-based direct substrate cooling system for single-sided and double-sided cooling to improve heat extraction efficiency and improve the power density by reducing the volume and mass. The cooling system was implemented for a SiC-based direct bonded copper substrate. Numerical simulations were performed to determine the effects of nozzle diameter, the number of nozzles, and nozzle array orientation on single-sided cooling and thermal performance gain over double-sided cooling. A novel manifold design was proposed that reduced the volume and mass of the manifold and still achieved the target power density. The performance of the proposed design was compared with the pin-fin-based cooling system used in the BMW I3 module, and a comparative analysis was done.
A turbine rotor includes a base and a plurality of blades. A central nose is radially inward of the blades and defines an axis of rotation. A plurality of cooling manifolds is disposed within the turbine rotor and includes impingement cooling jets extending through a rear surface of the turbine rotor. An internal cooling manifold extends radially inward of the impingement cooling jets and extends between the base and the rear surface of the turbine rotor. A central nose cooling manifold extends into the central nose and is fluidically connected to the internal cooling manifold. A base cooling manifold is fluidically connected to the central nose manifold and extends radially outward from the central nose cooling manifold. A blade cooling manifold is fluidically connected to the base cooling manifold and extends within the blade. Trailing edge jets extend from the blade cooling manifold and through the trailing edge of blades.
A turbine rotor includes a base and a plurality of blades. A central nose is radially inward of the blades and defines an axis of rotation. A plurality of cooling manifolds is disposed within the turbine rotor and includes impingement cooling jets extending through a rear surface of the turbine rotor. An internal cooling manifold extends radially inward of the impingement cooling jets and extends between the base and the rear surface of the turbine rotor. A central nose cooling manifold extends into the central nose and is fluidically connected to the internal cooling manifold. A base cooling manifold is fluidically connected to the central nose manifold and extends radially outward from the central nose cooling manifold. A blade cooling manifold is fluidically connected to the base cooling manifold and extends within the blade. Trailing edge jets extend from the blade cooling manifold and through the trailing edge of blades.
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The presentation was developed for the U.S. Department of Energy (DOE) Vehicle Technologies Program 2020 Annual Merit Review and Peer Evaluation Meeting. It reports on progress and accomplishments of DOE funded Integrated Traction Drive Thermal Management project. Highlighted are NREL's research accomplishments during FY 2020. Challenges associated with thermal management of integrated traction drives for electric vehicles arise due to the limited packaging space, coolant distribution, electrical connections, and ambient temperatures. For this project at NREL, research focuses on enabling thermal management technologies to support a modular, compact, self-contained integrated electric drive unit with motor and power electronics. Integration approaches, based on packaging location and coolant options for power electronics integrated with candidate motor technologies to reduce cables and connectors, are reviewed and compared using finite element analysis (FEA) tools. Automatic transmission fluid (ATF) jet impingement cooling characterization is carried out experimentally (measuring heat transfer coefficients) and using computational fluid dynamics (CFD) modeling.
This paper describes modeling and experimental work to design and demonstrate a silicon carbide (SiC), single-side-cooled power module. Two SiC metal-oxide-semiconductor field-effect transistors (MOSFET) were used for each switch position and packaged on a metalized ceramic substrate. Thermal modeling was first conducted to optimize the module packaging to minimize junction-to-fluid thermal resistance and device temperature variations. This procedure identified the optimal device placement and baseplate thickness to maximize thermal performance. A heat exchanger - incorporating impinging jets of water-ethylene glycol - was designed to cool the module's baseplate to minimize thermal resistance and pumping power. The heat exchanger used relatively low fluid velocities (<1.5 m/s) to minimize erosion-corrosion effects and relatively large fluid channel sizes (>=1 mm) to prevent clogging. The power module concept was fabricated, and experiments were conducted to measure its thermal performance. Direct current was used to power the module devices, and junction temperatures were measured via device temperature-sensitive parameters. The experimental results were found to be in good agreement with model predictions (within 2%) and yielded junction-to-fluid thermal resistance values as low as about 15 mm2 K/W at relatively low pumping power values. The results demonstrate the improved performance associated with jet impingement cooling and represent an improvement over existing channel-flow-type cold plates, which can enable improvements to power density and reliability.
This project describes the modeling process to design the packaging and heat exchanger for a half-bridge wide-bandgap (WBG) power semiconductor module. The module uses two silicon carbide, metal-oxide-semiconductor field-effect transistor (MOSFET) devices per switch position that are soldered to an aluminum nitride, direct-bond copper (DBC) substrate. A baseplate cooling configuration (e.g., no thermal grease) is used along with a water-ethylene glycol, jet-impingement-style heat exchanger. The heat exchanger was designed to be fabricated using prototyping equipment from the National Renewable Energy Laboratory, complies with automotive standards (for minimal channel sizes, flow rates, and coolant), and considers reliability aspects (i.e., erosion/corrosion). Device-scale computational fluid dynamics (CFD) is used first to design the slot jet impingement cooling configuration and compute the effective heat transfer coefficient (HTC) of the concept. The computed HTCs are then used as boundary conditions for a finite element study to optimize the package geometry (e.g., device layout and baseplate thickness) to minimize thermal resistance and minimize temperature variation between the module's four devices. Finally, a fluid manifold is designed to generate the slot jets and cool the devices. Module-scale CFD predicts a relatively low junction-to-fluid thermal resistance of 16.7 mm2 K/W, a 1.4 degrees C temperature variation between devices, and a total pressure drop of 5,860 Pa (0.85 psi) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance.
The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.
With the development of high-power and high-torque machines, requirements for high-power density electronics are increasing. Thermal management of such systems requires high heat extraction. Conventional air cooling based heat sinks and cold plate based liquid cooling have their own benefits for various applications but has limitations for high power density applications. The current study explores a jet impingement based direct substrate cooling system that was implemented for a SiC based direct bonded Cu substrate for various power losses. Numerical comparison between jet impingement cooling and conventional horizontal/indirect cooling (pin fin heat sink and genetic algorithm-optimized heat sink) showed that the area weighted average of the heat transfer coefficient (HTC) is high for both horizontal cooling designs, and the local HTC is higher for jet impingement. Design iterations were undertaken to resolve the bottleneck of this cooling system. Increasing the number of nozzles helped to cover more area at the direct bonded Cu bottom plate, which drops the chip temperature considerably. With a constant flow rate, increasing the number of nozzles would decrease local jet velocity, which reduces the heat extraction by jet impingement. This issue can be addressed by reducing the diameter of nozzle but doing so results in a high pressure drop where the design constraint is 2 psi. A flared nozzle design is proposed, which has a higher spreading angle of the jet that increases the flow coverage and reduces the pressure drop of the coolant loop.
A single-finger unit of the Helium-Cooled Modular Divertor with Multiple Jets (HEMJ) with a plasma-facing surface (PFS) area of about 2 cm 2 has been studied in a helium (He) loop at He mass flow rates m˙ H ≤ 8 g/s and nearly prototypical conditions. Based on previous studies of the single finger of the HEMJ, our Georgia Institute of Technology group is planning to experimentally study larger divertors. Given that the HEMJ test section was heated with an induction heater and that it is impractical to scale this up to divertors with larger PFS areas, a reversed heat flux approach is being considered to measure heat transfer coefficients (HTCs). In this approach, the direction of the heat flux is reversed with water cooling and high-temperature He heating of the outer shell attached to the PFS. This work presents an initial experimental and numerical evaluation of this approach for a single HEMJ finger. Experiments with brass and copper-chromium-zirconium outer shells were conducted at dimensionless He mass flow rates or Reynolds numbers Re = 1 × 10 4 to 4.7 × 10 4 , an inlet pressure of 10 MPa, temperatures as great as 673 K, and maximum heat flux of 8.4 MW/m 2 . The experiments verify that the He-side HTCs are independent of the direction of the heat flux. Here, the results agree well with previous Nusselt number correlation and pressure loss coefficients for the HEMJ obtained using the normal heating approach.
This study includes the design, validation, and fabrication via direct metal laser sintering (DMLS) of a gas turbine nozzle guide vanes (NGV) that incorporates three innovative cooling schemes specifically enabled by additive manufacturing. The novel NGV design is the culmination of an extensive research and development effort over a period of 4 years that included low- and high-speed cascade testing coupled with unsteady computational fluid dynamics for numerous candidate innovative cooling architectures. The final vane design (SJ-vane) consists of sweeping jet (SJ) film cooling holes on the suction surface (SS), sweeping jet impingement holes at the leading edge and double-wall partial length triangular pin-fin with impinging jet at the trailing edge. For comparison purposes, a second DMLS enabled vane (777-vane) was designed and fabricated with prototypical cooling circuits to serve as a baseline. This vane consists of a shaped film cooling holes on the suction surface, circular impingement holes at the leading edge, and full-length cylindrical pin-fins at the trailing edge. Experiments with the two DMLS enabled vanes were performed at the Ohio State University Turbine Reacting Flow Rig (TuRFR) at engine-relevant temperature (1375 K) and Mach number conditions. Infrared (IR) thermography was utilized to measure the wall temperature of the pressure and suction surface at several coolant mass flowrates to estimate the overall cooling effectiveness (ϕ). Results showed improved cooling performance for the advanced cooling schemes (sweeping jet film cooling, impingement cooling, and triangular pin-fin cooling) compared with the baseline cooling schemes.
The future of electrification of vehicles and other systems will require the creation of high-power density power electronics with low junction-to-fluid thermal resistance cooling solutions. One way to create this solution is to move high-heat-flux liquid cooling (single- or two-phase) as close to the power electronics components as possible. One novel approach involves submersion in dielectric fluids as the cooling solution. We first provide the range of fluid properties and develop a figure of merit (FOM) to aid in dielectric fluid selection. Next, we perform computational fluid dynamics/heat transfer (CFD/HT) modeling using single-phase cooling (submerged jet impingement on an enhanced surface) to validate the dielectric fluid FOM. Results of the study show that the developed FOM is a good representation of the performance of the fluids when compared to the results of the CFD/HT analysis. Both FOM and the CFD/HT analysis show that based on pure thermohydraulic considerations, several commercially available fluids present higher performance, on the order of 5% of water. Finally, the FOM can be used to quickly assess the thermohydraulic performance of a dielectric fluid, as well as the secondary application-specific properties such as boiling point, saturation pressure, flash point, and global warming potential, thereby allowing for fluid candidates to be readily compared.
Turbulent impinging jets have been proposed to cool high heat flux plasma-facing components such as the solid tungsten target plates of the divertor in long-pulse magnetic fusion energy reactors. In particular, the T-tube modular divertor, originally developed by the ARIES Team, consists of two concentric cylindrical tubes where helium flows through a slot in the inner tube, forming an approximately planar jet that impinges upon and cools the inner surface of the pressure boundary (namely, the outer tube) and the ~15-cm 2 plasma-facing W target. The objective of this work is to demonstrate that large eddy simulations (LESs) accurately simulate the thermal transport in canonical flows that comprise the cooling flow in the T-tube, as well as validate temperatures from LES with experimental measurements in a simplified T-tube geometry. Wall‑resolved LESs, validated by experimental data and verified by direct numerical simulations (DNSs), provide benchmark data for two canonical flows in the T‑tube, namely, planar impinging and wall jets, for Reynolds numbers Re B = 4 × 10 3 to 2 × 10 4 . Our LES results are within 4% to 12% root-mean-square error (RMSE) of surface Nusselt number distributions (Nu) from experiments and DNSs. The validated LES results are then used as the ground truth to evaluate four Reynolds‑averaged Navier-Stokes (RANS) turbulence closures, namely, the k‑ω SST, realizable k‑ε, GEKO, and γ‑SST models. The k‑ω SST model has the best overall performance in terms of heat transfer, giving surface Nu within 12% RMSE of the LES results for high‑ReB impinging jets and reduced overprediction in the wall‑jet region. The GEKO model with default constants has the next best performance, providing slightly better Nu predictions for low ReB impinging jets (versus k-ω SST) but worse overall performance over the full range of ReB studied here. The realizable k‑ε turbulence model significantly overestimates turbulence near the stagnation point, while the γ‑SST model suppresses near‑wall production, biasing the simulations toward simulating laminar surface heat transfer. Simulations of the simplified T‑tube show that LES and RANS simulations with the k‑ω SST model give nearly identical average heat transfer coefficients (HTCs) over the impingement surface. The realizable k‑ε model predicts significantly lower wall temperatures due to overestimation of HTC in the outlet flow.
The objective of this research effort was to explore innovative cooling architectures enabled by additive manufacturing techniques for improved turbine cooling performance. The ability to create complex internal geometries was leveraged to better distribute coolant as well as to integrate inherently unstable flow devices to enhance internal and external heat transfer. This was accomplished with a multi-faceted approach including analytical, experimental, and computational components. This final report documents progress during the total 4.25 year effort that was extended (at no additional cost) from the original 3-year cooperative agreement. Prior to starting the project, significant effort was invested in investigating innovative cooling designs from the open literature. When the project started, we quickly down-selected to 4 configurations: impingement jet fluidic oscillators (for internal leading edge cooling), reverse film cooling (for pressure surface), sweeping film cooling jets (for suction surface), and trailing edge slot cooling with microchannels. During the 2nd year, the reverse film cooling design was shown to be sub-optimal and work on that topic was halted. The three remaining technologies were integrated into a large scale nozzle guide vane and installed into a low-speed linear cascade facility for further interrogation. Initial results showed the sweeping film cooling jets (on the suction surface) to be the most promising technology compared to a baseline diffusion shaped film hole (777 design). The benefit was particularly evident at high blowing ratios (>1.5) when the 777 coolant film separated from the downstream surface. Benefits were also evident at elevated freestream turbulence levels. The leading edge cooling with unsteady jets was less effective in terms of peak or average cooling – however it was superior to round hole impingement cooling in terms of spatial uniformity. Finally, the trailing edge cooling design with micro-channels was scrapped in favor of a pinned arrangement with centerbody. During the 3rd year, the same three technologies were integrated into a transonic linear cascade for an assessment of compressibility effects. Again, the sweeping film cooling jets proved superior at high blowing ratios while the unsteady leading edge impingement and trailing edge pin-fins with centerbody designs yielded mixed results. Finally, during the 4th and final year, these 3 technologies were integrated into a direct metal laser sintered (DMLS) nozzle guide vane for testing in a high temperature, transonic annular vane cascade. The facility matches the flow temperature, Mach number, and coolant pressure ratios of an actual gas turbine. Before doing this, an additional series of tests were completed to validate a redesigned trailing edge cooling architecture. This final design included a centerbody with triangular pins between the centerbody and the vane external skin. The majority of these triangular pins are fabricated with a 30% gap to the centerbody – reducing their pressure drop considerably while still providing excellent heat transfer augmentation. This additional test campaign required an additional 3-month extension request to complete testing in the high temperature NGV test facility (Turbine Reacting Flow Rig – TuRFR). Testing of the DMLS vane in TuRFR pitted the 3 innovative cooling technologies against more traditional technologies (shaped 777 film hole, round impingement jet, and full pin arrangement in the trailing edge. The sweeping film cooling jets (on the suction surface) showed approximately 15% improvement in overall effectiveness compared to the 777 film hole while the trailing edge showed up to 20% improvement. The leading edge impingement was disappointing with a substantially lower effectiveness than traditional direct impingement. In summary, the study was successful in demonstrating that DMLS-enabled cooling technologies can yield significant gains in cooling performance.
This paper describes the design and performance of a dielectric fluid cooling concept for automotive power electronics. The concept combines a low-thermal-resistance package (which eliminates metalized ceramic substrates) with a high-performance convective cooling strategy (slot jets impinging on finned surfaces). Modeling was first used to design the cooling system to maximize thermal performance and minimize pumping power. Additionally, a prototype was then fabricated, and experiments were conducted to validate the model predictions using three fluids at various fluid flow rates (16.7 cm 3 /s [1 L/min] to 68.3 cm 3 /s [4.1 L/min]) and inlet temperatures (30C and 70C). The final design was compact (120-cm 3 total volume, including heat exchanger and conceptual power modules) and cooled 12 devices (e.g., silicon carbide). The validated model was then used to predict the junction-to-fluid thermal resistance and pumping power for various conditions, including 40C fluid temperature. The results predict thermal resistance values as low as 19 mm 2 K/W are possible using the dielectric fluid cooling approach. The dielectric fluid cooling system is predicted to provide thermal resistance and pumping power values that are approximately 56% and 90% lower, respectively, compared to an automotive power electronics cooling system.
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