Results for “langasite SAWR”

DOE OSTI2022

Temperature and Dynamic Strain Measurements Using a Single SAWR Sensor

Dynamic strain sensing is relevant in numerous applications involving structural health monitoring, condition-based maintenance, operation efficiency preservation, and work environment safety. These sensors are particularly critical for high-temperature (HT) harsh-environment (HE) industries such as aerospace, automotive, power plants, and advanced manufacturing. In HT/HE, sensor implementation and measurement present challenges such as maintaining sensor stability, accounting for temperature cross-sensitivity, providing HT attachment, and packaging of the sensors and system. Surface acoustic wave resonator (SAWR) sensors can address these needs and offer additional benefits such as compact size and wireless interrogation capability. The SAWR sensitivity to dynamic strain is temperature dependent, making it necessary to measure the sensor temperature in order to use the correct dynamic strain calibration curve. In this work, a method for determining the temperature, dynamic strain magnitude, and dynamic strain spectral components using a single SAWR sensor is presented. Here, the established technique for determining operational temperature and dynamic strain magnitude/spectral components using only one SAWR simplifies the sensor measurement system, thus being very attractive for HT /HE applications.

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DOE OSTI2021

Impact of Thermal Stress on Attachment and Stability of High Temperature Strain Sensors

Static and dynamic strain sensing is required in high-temperature (HT), harsh-environments (HE) for industrial, aerospace, and energy sector applications to ensure equipment and process safety, reduce the cost of operation and maintenance, and increase process efficiency. Challenges that arise in HT HE sensing applications include device mounting, packaging, integrity, and stability to HT HE conditions. In previously reported work, static and dynamic strain surface acoustic wave resonator (SAWR) sensors were fabricated on langasite (LGS) and mounted on Inconel 625 strain beams for wireless testing up to 400°C. In this work, it has been identified that after subjecting the mounted SAWR strain sensor to thermal cycling between 100°C and 425°C, the measured sensitivity to dynamic strain decreased by 73% due to cracking at the adhesive/LGS interface, further deteriorating after additional thermal cycles. Strain modeling of the mounted LGS sensor chip up to 400°C revealed the existence of concentrated strain at the borders of the LGS chip. Microcracks caused by dicing make the chip boarders the most susceptible location for cracks to initiate when the sensor is subjected to thermal stress. In an attempt to mitigate the high strain at the LGS chip borders due to heating, adhesive shaping is proposed in this work. Simulations indicate a strain reduction of 50% at the border is achieved using both circular and triangular adhesive shapes, while also reducing the maximum strain over the entire adhesive/LGS interface by around 30%. Furthermore, the technique is thus promising for improving the integrity, reliability, and stability of static and dynamic strain sensors, particularly while operating under HT HE with several hundreddegree Celsius temperature excursions.

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