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DOE OSTI2022

Temperature and Dynamic Strain Measurements Using a Single SAWR Sensor

Dynamic strain sensing is relevant in numerous applications involving structural health monitoring, condition-based maintenance, operation efficiency preservation, and work environment safety. These sensors are particularly critical for high-temperature (HT) harsh-environment (HE) industries such as aerospace, automotive, power plants, and advanced manufacturing. In HT/HE, sensor implementation and measurement present challenges such as maintaining sensor stability, accounting for temperature cross-sensitivity, providing HT attachment, and packaging of the sensors and system. Surface acoustic wave resonator (SAWR) sensors can address these needs and offer additional benefits such as compact size and wireless interrogation capability. The SAWR sensitivity to dynamic strain is temperature dependent, making it necessary to measure the sensor temperature in order to use the correct dynamic strain calibration curve. In this work, a method for determining the temperature, dynamic strain magnitude, and dynamic strain spectral components using a single SAWR sensor is presented. Here, the established technique for determining operational temperature and dynamic strain magnitude/spectral components using only one SAWR simplifies the sensor measurement system, thus being very attractive for HT /HE applications.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Static Strain Modelling, Calibration, and Measurements for High-Temperature Wireless SAW Resonator Operation

Static strain measurements are relevant for Integrated System Health Monitoring of civil structures, aircrafts, power plants and advanced manufacturing equipment, with implications for safety, process efficiency, and maintenance costs. Wireless strain sensing is highly desirable where the presence of wires poses significant safety concerns, increases maintenance, and thus overall costs, or where they are not feasible, such as in applications which contain moving parts. This paper presents wireless interrogation of surface acoustic wave resonators (SAWRs) fabricated on langasite (LGS) along Euler angles (0°, 138.5°, 32.9°) and aimed at the detection of static strain at hightemperature (HT, above 100°C). Both commercial HT strain gauges and finite element analysis (FEA Abaqus software) were used and compared for SAWR strain calibration from room temperature (RT) to HT. In addition, this work investigated a compromise between high temperature operation vs. sensitivity based on the thickness of ceramic adhesive used. For instance, a reduction in the adhesive thickness from about 150 μm to 135 μm, resulted in a 39% increase in sensitivity at RT. It was also observed that the sensitivity dropped up to 34% from RT to 200°C. Furthermore, wireless operation, calibration, and increase in sensitivity constitute important advances in the use of LGS SAW devices to monitor static stress in high-temperature harsh environments.

42 ENGINEERING↗
DOE OSTI2021

Impact of Thermal Stress on Attachment and Stability of High Temperature Strain Sensors

Static and dynamic strain sensing is required in high-temperature (HT), harsh-environments (HE) for industrial, aerospace, and energy sector applications to ensure equipment and process safety, reduce the cost of operation and maintenance, and increase process efficiency. Challenges that arise in HT HE sensing applications include device mounting, packaging, integrity, and stability to HT HE conditions. In previously reported work, static and dynamic strain surface acoustic wave resonator (SAWR) sensors were fabricated on langasite (LGS) and mounted on Inconel 625 strain beams for wireless testing up to 400°C. In this work, it has been identified that after subjecting the mounted SAWR strain sensor to thermal cycling between 100°C and 425°C, the measured sensitivity to dynamic strain decreased by 73% due to cracking at the adhesive/LGS interface, further deteriorating after additional thermal cycles. Strain modeling of the mounted LGS sensor chip up to 400°C revealed the existence of concentrated strain at the borders of the LGS chip. Microcracks caused by dicing make the chip boarders the most susceptible location for cracks to initiate when the sensor is subjected to thermal stress. In an attempt to mitigate the high strain at the LGS chip borders due to heating, adhesive shaping is proposed in this work. Simulations indicate a strain reduction of 50% at the border is achieved using both circular and triangular adhesive shapes, while also reducing the maximum strain over the entire adhesive/LGS interface by around 30%. Furthermore, the technique is thus promising for improving the integrity, reliability, and stability of static and dynamic strain sensors, particularly while operating under HT HE with several hundreddegree Celsius temperature excursions.

47 OTHER INSTRUMENTATION↗