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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

LC-Opt: Benchmarking Reinforcement Learning and Agentic AI for End-to-End Liquid Cooling Optimization in Data Centers

Liquid cooling is critical for thermal management in high-density data centers with the rising AI workloads. However, machine learning-based controllers are essential to unlock greater energy efficiency and reliability, promoting sustainability. We present LC-Opt, a Sustainable Liquid Cooling (LC) benchmark environment, for reinforcement learning (RL) control strategies in energy-efficient liquid cooling of high-performance computing (HPC) systems. Built on the baseline of a high-fidelity digital twin of Oak Ridge National Lab's Frontier Supercomputer cooling system, LC-Opt provides detailed Modelica-based end-to-end models spanning site-level cooling towers to data center cabinets and server blade groups. RL agents optimize critical thermal controls like liquid supply temperature, flow rate, and granular valve actuation at the IT cabinet level, as well as cooling tower (CT) setpoints through a Gymnasium interface, with dynamic changes in workloads. This environment creates a multi-objective real-time optimization challenge balancing local thermal regulation and global energy efficiency, and also supports additional components like a heat recovery unit (HRU). We benchmark centralized and decentralized multi-agent RL approaches, demonstrate policy distillation into decision and regression trees for interpretable control, and explore LLM-based methods that explain control actions in natural language through an agentic mesh architecture designed to foster user trust and simplify system management. LC-Opt democratizes access to detailed, customizable liquid cooling models, enabling the ML community, operators, and vendors to develop sustainable data center liquid cooling control solutions.

Naug, Avisek [Hewlett Packard Enterprise]↗
DOE OSTI2026

Cooling Matters: Benchmarking Large Language Models and Vision-Language Models on Liquid-Cooled Versus Air-Cooled H100 GPU Systems

The unprecedented growth in artificial intelligence (AI) workloads, recently dominated by large language models (LLMs) and vision-language models (VLMs), has intensified power and cooling demands in data centers. This study benchmarks LLMs and VLMs on two HGX nodes, each with 8× NVIDIA H100 graphics processing units (GPUs), using liquid and air cooling. Leveraging GPU Burn, Weights & Biases, and IPMItool, we collect detailed thermal, power, and computation data. Results show that the liquid-cooled systems maintain GPU temperatures between 41-50$^\circ$C, while the air-cooled counterparts fluctuate between 54-72$^\circ$C under load. This thermal stability of liquid-cooled systems yields 17% higher performance (54 TFLOPs/ GPU vs. 46 TFLOPs/GPU), performance-per-watt, reduced energy overhead, and greater system efficiency than the air-cooled counterparts. These findings underscore the energy and sustainability benefits of liquid cooling, offering a compelling path forward for hyperscale data centers seeking to optimize AI infrastructure. https://github.com/iscaas/Cooling-Matters.

Latif, Imran↗
DOE OSTI2026

Data Center High-Temperature Liquid Cooling and Heat Reuse Techno-Economic Study: Preprint

Data centers are energy-intensive facilities with growing demands for efficiency and cost-effective operations. Smaller, more distributed edge inference data centers are expected to proliferate as AI applications require low latency closer to the user of AI tools, which presents a growing opportunity to explore the systems implications of liquid cooling on water and energy use. This study analyzes the implementation of high-temperature liquid cooling systems in a prototypical inference 1-MW data center and explores the potential for heat reuse across varying climates with a goal to optimize energy efficiency, reduce capital and operational costs, and identify opportunities for high-performance cooling and water use reduction infrastructure. This analysis evaluated configurations utilizing a peak day hourly sizing and systems performance spreadsheet to evaluate design and operational conditions from which component sizes, installed cost, operational cost, and performance metrics were determined for the Base case and the Elevated case. The techno-economic analysis included heat reuse applications across a range of heat recovery temperatures and heat rejection options. The analysis shows that high-temperature liquid cooling allows for improved energy efficiency, lower water consumption, and lower capital costs compared to traditional cooling approaches. Transitioning to elevated water inlet/outlet temperatures (50 degrees C/60 degrees C) eliminates the need for chillers, cooling towers, and heat recovery equipment in many scenarios across three distinct climate zones. This results in up to 75% capital cost savings for the cooling and heat recovery equipment, and with significantly reduced water consumption, especially in non-heat reuse applications. Heat generated from data centers can also be repurposed for space heating, domestic hot water, and other applications, and is most cost-effective when data center outlet temperatures exceed 55-60 degrees C.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2024

A Digital Twin Framework for Liquid-cooled Supercomputers as Demonstrated at Exascale

We present ExaDigiT, an open-source framework for developing comprehensive digital twins of liquid-cooled supercomputers. It integrates three main modules: (1) a resource allocator and power simulator, (2) a transient thermo-fluidic cooling model, and (3) an augmented reality model of the supercomputer and central energy plant. The framework enables the study of "what-if" scenarios, system optimizations, and virtual prototyping of future systems. Using Frontier as a case study, we demonstrate the framework's capabilities by replaying six months of system telemetry for systematic verification and validation. Such a comprehensive analysis of a liquid-cooled exascale supercomputer is the first of its kind. ExaDigiT elucidates complex transient cooling system dynamics, runs synthetic or real workloads, and predicts energy losses due to rectification and voltage conversion. Throughout our paper, we present lessons learned to benefit HPC practitioners developing similar digital twins. We envision the digital twin will be a key enabler for sustainable, energy-efficient supercomputing.

Brewer, Wes↗
DOE OSTI2023

Liquid Cooling for HPC - National Renewable Energy Lab

NREL has nearly a decade of experience in liquid cooling or HPC. The technical approach will be presented along with success stories on energy, cost and emission savings over two generations of HPC systems. Lessons learned will also be shared.

energy efficient computing↗
DOE OSTI2024

Three-dimensional airgap electric machines employing winding embedded liquid cooling

Various examples are provided related to 3D airgap electric machines and winding embedded liquid cooling. In one example, an electric machine includes a stator assembly with stator windings supported by a stator core and an outer rotor assembly includes a radial plate surrounding the stator assembly and an endplate at a first end of the radial plate adjacent to the first end of the stator core. The stator windings can include a first portion extending along an axial length of the stator core and a second portion at a first end of the stator core that extends radially inward towards a shaft of the electric machine. The radial plate can include magnets distributed about the radial plate. In another example, a stator assembly includes stator windings supported by a stator core with a winding support including cooling channels distributed between the stator windings. The winding support can be nonmagnetic.

Islam, Md Sariful↗
DOE OSTI2021

Sandia’s Liquid-Cooled Data Center Boosts Efficiency and Resiliency

The Federal Energy Management Program (FEMP) encourages federal agencies and organizations to improve data center energy efficiency, which can offer tremendous opportunities for energy and cost savings. In this success story, a novel liquid cooling system provides reliable, resilient, and energy-efficient cooling for high performance computing (HPC) systems at Sandia National Laboratories.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2021

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Power semiconductor die placement on substrates used in high-power modules is generally optimized to minimize electrical parasitic (e.g., stray inductance, common-mode capacitance), taking into account the minimum spacing between semiconductor dies for thermal decoupling. The layout assumes sufficient heat spreading and transfer from dies to the cooling structure. Insulated metal substrate-based power module designs may lead to asymmetrical thermal resistance across the dies, which may cause significant temperature differences among the devices. Such unintentional thermal asymmetries can lead to oversizing the cooling system design or underusing the semiconductor power processing capability. This article proposes a thermal imbalance mitigation method that uses evolutionary optimized liquid-cooled heat sinks to improve the thermal loading among devices.

42 ENGINEERING↗
DOE OSTI2021

Sandia's Liquid-Cooled Data Center Boosts Efficiency and Resiliency

The Federal Energy Management Program (FEMP) encourages federal agencies and organizations to improve data center energy efficiency, which can offer tremendous opportunities for energy and cost savings. In this success story, a novel liquid cooling system provides reliable, resilient, and energy-efficient cooling for high-performance computing (HPC) systems at Sandia National Laboratories.

data center↗
DOE OSTI2026

Case Study of Integrating High-Temperature Heat Pump with LiBr-H2O Absorption Chiller for Data Center Liquid Cooling

Data centers (DCs) are physical infrastructures that support artificial intelligence workloads. The rapid growth of artificial intelligence is putting substantial pressure on the US power grid. Most of electricity consumed by IT equipment, accounting for 50%-60% of total DC power, ultimately becomes waste heat. This heat is dissipated by DC’s cooling facilities, accounting for an additional 30%-40% of total DC power. Recovering and repurposing this waste heat offers a significant opportunity to enhance energy efficiency and reduce operating costs of DCs. One potential pathway is converting heat to cold using thermal-driven absorption chillers, therefore, reducing the power consumption in DC cooling facilities. Existing studies mainly demonstrate the technical and economic feasibility of repurposing DC’s waste heat for cooling applications but provide limited technical details on how to integrate the thermal-driven absorption chillers with DC cooling systems. In addition, the low-grade waste heat available from DCs must be upgraded to higher temperatures suitable for absorption chillers. This paper presents a case study on integrating high-temperature heat pumps with a LiBr-H2O absorption chiller to use DC waste heat for cooling. A thermodynamic model of single-effect, LiBr-H2O absorption chiller and an empirical model of high-temperature heat pumps were built. The case study considers ASHRAE W17 liquid-cooled DC, with facility service water supplied at 17.0℃ and returned at 25.3℃. The thermal behaviors of absorption chiller components were predicted for the generation temperature ranging from 75.0℃ to 115.0℃. Based on the available waste heat in the integrated system, two waste heat recovery strategies were evaluated: a facility service water-based strategy and cooling water-based strategy. Results indicated that the cooling water-based strategy achieves higher Coefficient of Performance (COPs) than the facility service water-based strategy. The relatively low cooling COPs of single-effect LiBr-H2O absorption chillers could be offset by high heating COP of high temperature heat pumps. The maximum cooling COP of absorption chiller and the overall COP of integrated systems occur at lower generation temperatures, but these conditions also yield lower cooling capacities. In practice, system operation should balance the trade-off between the COP and cooling capacity

Wang, Pengtao [ORNL] (ORCID:0000000214713429)↗
DOE OSTI2021

Ion heating in the PISCES-RF liquid-cooled high-power, steady-state, helicon plasma device

Radio frequency (RF) driven helicon plasma sources are commonly used for their ability to produce high-density argon plasmas ( n > 10 19 m -3 ) at relatively moderate powers (typical RF power < 2 kW). Typical electron temperatures are <10 eV and typical ion temperatures are <0.6 eV. A newly designed helicon antenna assembly (with concentric, double-layered, fully liquid-cooled RF-transparent windows) operates in steady-state at RF powers up to 10 kW. We report on the dependence of argon plasma density, electron temperature and ion temperature on RF power. At 10 kW, ion temperatures >2 eV in argon plasmas are measured with laser induced fluorescence, which is consistent with a simple volume averaged 0D power balance model. 1D Monte Carlo simulations of the neutral density profile for these plasma conditions show strong neutral depletion near the core and predict neutral temperatures well above room temperatures. The plasmas created in this high-power helicon source (when light ions are employed) are ideally suited for fusion divertor plasma-material interaction studies and negative ion production for neutral beams.

Physics↗
DOE OSTI2021

PISCES-RF: a liquid-cooled high-power steady-state helicon plasma device

Radio-frequency (RF) driven helicon plasma sources can produce relatively high-density plasmas (n > 1019 m -3 ) at relatively moderate powers (<2 kW) in argon. However, to produce similar high-density plasmas for fusion relevant gases such as hydrogen (H), deuterium (D) and helium (He), much higher RF powers are needed. For very high RF powers, thermal issues of the RF-transparent dielectric window, used in the RF source design, limit the plasma operation timescales. To mitigate this constraint, we have designed, built and tested a novel helicon plasma source assembly with a fully liquid-cooled RF-transparent window which allows steady state operations at high power (up to 20 kW) and successfully produces high-density plasma with both argon and H. Deionized (DI) water, flowing between two concentric dielectric RF windows, is used as the coolant. We show that a full azimuthal blanket of DI water does not prevent high-density plasma production. From calorimetry on the DI water, we measure the net heat removed by the coolant at steady state conditions. Using infra-red imaging, we calculate the constant plasma heat deposition and measure the final steady state temperature distribution patterns on the inner surface of the ceramic layer. The heat deposition pattern follows the helical shape of the antenna. We also show the consistency between the heat absorbed by the DI water, as measured by calorimetry, and the total heat due to the combined effect of the plasma heating and the absorbed RF. These results are being used to answer critical engineering questions for the 200 kW RF device materials plasma exposure experiment being designed at the Oak Ridge National Laboratory as a next generation plasma material interaction device.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2023

Performance Evaluation of Liquid-Cooled Open Stand-Alone Refrigerated Cases

This project is part of a joint effort between Commonwealth Edison Company (ComEd) and the National Renewable Energy Laboratory (NREL) to evaluate the energy and demand savings potential of emerging efficient buildings technologies. This project quantifies the energy efficiency benefits from retrofitting an air-cooled, constant-speed compression, self-contained medium-temperature open-vertical display case with a high efficiency water-cooled condensing unit. In addition to a water-cooled heat rejection mechanism, the high-efficiency condensing unit utilizes a variable-speed compressor, electronic expansion valve and advanced controls system. The focus of this project, however, was mainly on capturing the energy savings potentials of the water-cooled condenser, variable-speed compression and electronic expansion valve, and not on the advanced controls. The results of this evaluation will be considered by ComEd and CLEAResult for future energy efficiency rebate offerings.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2022

Numerical and Experimental Study of a Novel Additively Manufactured Metal-Polymer Composite Heat-Exchanger for Liquid Cooling Electronics

In order to meet increasing power-dissipation requirements of the electronics industry, compact, low-cost, and lightweight heat exchangers (HXs) are desired. With proper design, materials, and manufacture, polymer composite heat exchangers could meet these requirements. This paper presents a novel crossflow air-to-water, low-cost, and lightweight metal-polymer composite HX. This HX, which is entirely additively manufactured, utilizes a novel cross-media approach that provides direct heat exchange between air and liquid sides by using connecting fins. A robust numerical model was developed, which includes the dimensional effects of additive manufacturing. The study consists of a simplified 3D CFD model based on ellipsoidal-shaped staggered tube banks for the laminar range. It then uses an analytical approach to compute entire HX performance. The model is validated experimentally within 8% for thermal performance, 12% for air-side impedance, and 18% for water-side impedance. Finally, HX is compared with a conventional CPU radiator and performs within 10% of the conventional unit for reasonable flow rates and pressure-drop ranges. Moreover, HX also provides added design and cost advantages over the conventional unit, which makes the HX a potential candidate for electronic cooling applications.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2026

Ultra-low thermal resistance and pressure drop copper and copper-tungsten diamond-shaped pin fin cold plates for liquid cooling of electronics

Modern and future data centers face increasing cooling challenges due to increasing chip thermal design power and die size, along with the need to reduce energy consumption used for cooling. High performance cooling solutions that maintain a low chip junction temperature are needed to ensure electronics reliability. This work develops an ultra-low thermal resistance and low pressure drop 75 mm × 75 mm cold plate, intended for next-generation electronics cooling. The cold plate features an array of diamond-shaped pin fins and integrated copper tungsten heat spreader, selected for its low coefficient of thermal expansion which reduces thermomechanical deformation and allows for closer integration of the cold plate with silicon dies. Starting with 300 candidate designs, three-dimensional computational fluid dynamics simulations predict the thermal-hydraulic performance of cold plate subsections. The highest performing geometries are evaluated with high fidelity simulations. Four cold plates are manufactured for experiments: three with diamond-shaped pin fins and one with straights fins for comparison purposes. The cold plates are fabricated from copper-tungsten (CuW), copper (Cu), or aluminum-silicon-magnesium alloy (AlSi10Mg). The diamond-shaped pin fins achieve a roughly 15 % lower thermal resistance compared to the conventional straight fin microchannel. The highest performing design achieves a chip-to-coolant (including thermal interface material) thermal resistance of 9.0 K/kW in CuW and 6.9 K/kW in Cu under a 1 kW heat load with an inlet-to-outlet pressure drop of 9.0 kPa and water as the working fluid. This work demonstrates ultra-low thermal resistance and pressure drop cold plates for large die, high heat load applications, and shows that CuW is an attractive cold plate material for improved reliability in next generation data center cooling.

Coefficient of thermal expansion↗