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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials

The hot disk transient plane source (TPS) method is a widely used standard technique (ISO 22007-2) for the characterization of thermal properties of materials, especially the thermal conductivity, k. Despite its well-established reliability for a wide variety of common materials, the hot disk TPS method is also known to suffer from a substantial systematic errors when applied to low-k thermal insulation materials. Here, we present a combined numerical and experimental study on the influence of the geometry of hot disk sensor on measured value of low-k materials. We demonstrate that the error is strongly affected by the finite thickness and thermal mass of the sensor's insulation layer was well as the corresponding increase of the effective heater size beyond the radius of the embedded metal heater itself. We also numerically investigate the dependence of the error on the sample thermal properties, confirming that the errors are worse in low-k samples. A simple correction function is also provided, which converts the apparent (erroneous) result from a standard hot disk TPS measurement to a more accurate value. A standard polyimide sensor was also optimized using both wet and dry etching to provide more accurate measurement directly. Experimentally corrected value of k for Airloy x56 aerogel and a commercial silica aerogel using the numerical correction factor derived based on the standard TPS sensor is in excellent agreement with the directly measured value from the TPS sensor using the optimized polyimide sensor. Finally, both of these methods can reduce the errors to less than 4% as compared to around 40% error of overestimation from raw values measured with the pristine sensor. Such results show that both the numerical correction to a pristine senor or an optimized sensor are capable of providing highly accurate value of thermal conductivity for such materials.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Topology optimization for the design of porous electrodes

Porous electrodes are an integral part of many electrochemical devices since they have high porosity to maximize electrochemical transport and high surface area to maximize activity. Traditional porous electrode materials are typically homogeneous, stochastic collections of small-scale particles and offer few opportunities to engineer higher performance. Fortunately, recent breakthroughs in advanced and additive manufacturing are yielding new methods to structure and pattern porous electrodes across length scales. These architected electrodes are emerging as a promising new technology to continue to drive improvement; however, it is still unclear which structures to employ and few tools are available to guide their design. Here we address this gap by applying topology optimization to the design of porous electrodes. We demonstrate our framework on two applications: a porous electrode driving a steady Faradaic reaction and a transiently operated electrode in a supercapacitor. We present computationally designed electrodes that minimize energy losses in a half-cell. For low-conductivity materials, the optimization algorithm creates electrode designs with a hierarchy of length scales. Further, the designed electrodes are found to outperform undesigned, homogeneous electrodes. Finally, we present three-dimensional porous electrode designs. We thus establish a topology optimization framework for designing porous electrodes.

25 ENERGY STORAGE↗
DOE OSTI2020

Intrinsic Photoconductivity of few-layered ZrS 2 Phototransistors via Multiterminal Measurements

We report intrinsic photoconductivity studies on one of the least examined layered compounds, ZrS 2 .Few-atomic layer ZrS 2 field-effect transistors were fabricated on the Si/SiO 2 substrate and photoconductivity measurements were performed using both two- and four-terminal configurations under the illumination of 532 nm laser source. We measured photocurrent as a function of the incident optical power at several source-drain (bias) voltages. We observe a significantly large photoconductivity when measured in the multiterminal (four-terminal) configuration compared to that in the two-terminal configuration. For an incident optical power of 90 nW, the estimated photosensitivity and the external quantum efficiency (EQE) measured in two-terminal configuration are 0.5 A/W and 120%, respectively, under a bias voltage of 650 mV. Under the same conditions, the four-terminal measurements result in much higher values for both the photoresponsivity (R) and EQE to 6 A/W and 1400%, respectively. This significant improvement in photoresponsivity and EQE in the four-terminal configuration may have been influenced by the reduction of contact resistance at the metal-semiconductor interface, which greatly impacts the carrier mobility of low conducting materials. This suggests that photoconductivity measurements performed through the two-terminal configuration in previous studies on ZrS 2 and other 2D materials have severely underestimated the true intrinsic properties of transition metal dichalcogenides and their remarkable potential for optoelectronic applications.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Extreme sensitivity of higher-order interatomic force constants and thermal conductivity to the energy surface roughness of exchange-correlation functionals

In this Letter, we report that the fourth-order interatomic force constants (4th-IFCs) are significantly sensitive to the energy surface roughness of exchange-correlation (XC) functionals in density functional theory calculations. This sensitivity, which is insignificant for the second- (2nd-) and third-order (3rd-) IFCs, varies for different functionals in different materials and can cause misprediction of thermal conductivity by several times of magnitude. As a result, when calculating the 4th-IFCs using the finite difference method, the atomic displacement needs to be taken large enough to overcome the energy surface roughness, in order to accurately predict phonon lifetime and thermal conductivity. We demonstrate this phenomenon on a benchmark material (Si), a high-thermal conductivity material (BAs), and a low thermal conductivity material (NaCl). For Si, we find that the LDA, PBE, and PBEsol XC functionals are all smooth to the 2nd- and 3rd-IFCs but all rough to the 4th-IFCs. This roughness can lead to a prediction of nearly one order of magnitude lower thermal conductivity. For BAs, all three functionals are smooth to the 2nd- and 3rd-IFCs, and only the PBEsol XC functional is rough for the 4th-IFCs, which leads to a 40% underestimation of thermal conductivity. For NaCl, all functionals are smooth to the 2nd- and 3rd-IFCs but rough to the 4th-IFCs, leading to a 70% underprediction of thermal conductivity at room temperature. In conclusion, with these observations, we provide general guidance on the calculation of 4th-IFCs for an accurate thermal conductivity prediction.

42 ENGINEERING↗
DOE OSTI2020

Porous thermally insulating compositions containing hollow silica particles

A thermally insulating composition comprising hollow spherical silica particles and a coating of a material having a thermal conductivity of less than 0.3 W/m·K on surfaces of said silica particles. In particular embodiments, the low conductivity coating material may be a polymer, such as polystyrene or polyvinylpyrrolidone, or the low conductivity coating material may be a quaternary ammonium salt of the Formula (1), i.e., R1R2R3R4N+A−, with at least one of R1, R2, R3, and R4 being an alkyl group containing at least ten carbon atoms (and A− is a counter anion), or the low conductivity coating material may be phenyl-C61-butyric acid methyl ester covalently bound to the hollow spherical silica particles. Also described herein is a method of thermally insulating a surface by applying a coating of the thermally insulating composition, described above, onto the surface.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Low thermal conductivity in Bi 8 CsO 8 SeX 7 (X = Cl, Br) by combining different structural motifs

Understanding the structure–property relationships of materials in order to supress thermal conductivity is crucial for developing efficient thermoelectric generators and thermal barrier coatings. Low thermal conductivity materials can often contain a single dominant phonon scattering mechanism. Here, we highlight how combining different structural features into one material can aid in the design and identification of new materials with low thermal conductivities. We synthesise two new mixed-anion materials, Bi 8 CsO 8 SeX 7 (X = Cl and Br), with low thermal conductivities of 0.27(2) and 0.22(2) W m -1 K -1 respectively, measured along their c-axes at room temperature. The Bi 8 CsO 8 SeX 7 materials possess a combination of bond strength hierarchies, Cs + vacancies, and low frequency Cs + rattling. These different features significantly inhibit phonon transport along different crystallographic directions. Due to sharp bond strength contrast between the van der Waals gaps and [Bi 2 O 2 ] 2+ layers, the Bi 8 CsO 8 SeX 7 materials exhibit thermal conductivities <50% of the theoretical minimum when measured along the stacking direction. Conversely, the thermal conductivity associated with the ab-plane is reduced by Cs + rattling when compared to the structurally and compositionally related BiOCl.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2021

Temperature Homogeneity under Selective and Localized Microwave Heating in Structured Flow Reactors

Selective heating of different phases of multiphase systems via microwaves can result in energy savings and suppression of side reactions. However, materials properties and operating conditions that maximize temperature gradients are poorly understood. Here we utilize computational fluid dynamics (CFD) computations and temperature measurements in structured flow reactors (monoliths) in a monomodal microwave cavity to assess the temperature difference between the walls and the fluid and develop a simple lumped model to estimate when temperature gradients exist. We also explore the material’s thermal and electrical properties of structured reactors for isothermal catalyst conditions. We propose that CFD simulations can be used as a nonintrusive, predictive tool of temperature homogeneity. Importantly, we demonstrate that localized heating in the bed under several conditions rather than selective heating is responsible for the selectivity enhancement. Furthermore, our results indicate that structured beds made of high thermal conductivity materials avoid arcing and enable temperature homogeneity and low electrical conductivity materials allow microwaves to penetrate the domain.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2022

Low Thermal Conductivity in Heteroanionic Materials with Layers of Homoleptic Polyhedra

Although BiAgOSe, an analogue of a well-studied thermoelectric material BiCuOSe, is thermodynamically stable, its synthesis is complicated by the low driving force of formation from the stable binary and ternary intermediates. Here we have developed a “subtraction strategy” to suppress byproducts and produce pure phase BiAgOSe using hydrothermal methods. Electronic structure calculations and optical characterization show that BiAgOSe is an indirect bandgap semiconductor with a bandgap of 0.95 eV. The prepared sample exhibits lower lattice thermal conductivities (0.61 W·m –1 ·K –1 at room temperature and 0.35 W·m –1 ·K –1 at 650 K) than BiCuOSe. Further, lattice dynamical simulations and variable temperature diffraction measurements demonstrate that the low lattice thermal conductivity arises from both the low sound velocity and high phonon–phonon scattering rates in BiAgOSe. These in turn result primarily from the soft Ag–Se bonds in the edge-sharing AgSe 4 tetrahedra and large sublattice mismatch between the quasi-two-dimensional [Bi 2 O 2 ] 2+ and [Ag 2 Se 2 ] 2– layers. These results highlight the advantages of manipulating the chemistry of homoleptic polyhedra in heteroanionic compounds for electronic structure and phonon transport control.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2021

Phonon-engineered extreme thermal conductivity materials

Materials with ultrahigh or low thermal conductivity are desirable for many technological applications, such as thermal management of electronic and photonic devices, heat exchangers, energy converters and thermal insulation. Recent advances in simulation tools (first principles, the atomistic Green’s function and molecular dynamics) and experimental techniques (pump–probe techniques and microfabricated platforms) have led to new insights on phonon transport and scattering in materials and the discovery of new thermal materials, and are enabling the engineering of phonons towards desired thermal properties. Here, we review recent discoveries of both inorganic and organic materials with ultrahigh and low thermal conductivity, highlighting heat-conduction physics, strategies used to change thermal conductivity, and future directions to achieve extreme thermal conductivities in solid-state materials.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Intrinsic anharmonicity and thermal properties of ultralow thermal conductivity Ba 6 Sn 6 Se 13

Ultralow thermal conductivity materials continue to be of great interest for technologically important applications such as thermal insulators and thermoelectrics. Often, such materials possess constituents with extensive dynamic disorder, or “rattlers,” or structural disorder such as metallic glasses. Nevertheless, targeted crystalline bonding order and anharmonicity can provide effective means for the scattering of the phonons in certain materials. Our combined experimental and theoretical investigation of Ba 6 Sn 6 Se 13 reveals such a material, with ultralow thermal conductivity measured over a large temperature range. Optic phonon modes hybridize with acoustic modes at relatively low energies resulting in strong acoustic-optic scattering and limited phonon lifetimes. Moreover, our investigations reveal various avoided crossings at low energies that contribute to phonon scattering. These are derived from chiral phase symmetries and may result in nontrivial topological behaviors for phonon band crossings in this chiral material. This work contributes to the ongoing research on low thermal conductivity materials and the underlying mechanisms that affect their thermal behaviors. Manipulation of these effects may provide pathways for enhancement of material properties for targeted thermal applications using similar materials.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Atomistic insights into the synergistic effects of tensile strain and hydroxyl group on increasing the thermal conductivity of monohydric alcohols as latent heat storage materials

The low thermal conductivity of linear monohydric alcohols significantly limits their performance when used as latent heat storage materials. It was found that imposing certain mechanical strains on nanomaterials with highly ordered structures can lead to appreciable thermal conductivity enhancement. To explore the potential of enhancing the intrinsic thermal conductivity of monohydric alcohols, a simplified ideal crystal model was employed for molecular arrangement in this work. The variation of atomistic heat transfer as a function of tensile strains was exploited by non-equilibrium molecular dynamics simulations. Furthermore, the influence of stretching on the vibration density of states and the corresponding molecular morphology were revealed. The results suggested that the thermal conductivity of monohydric alcohols with such simplified ideal crystalline structures can increase by about 170 % at the strain of 0.1. The distance between neighboring interfaces was found to determine the energy of inter-molecular interactions at the crystal grain boundaries. The hydrogen bonds energy has not reached the critical value when increasing tensile strains from 0 to 0.1. In contrast, the strongest van der Walls interactions for alkanes were obtained at the strain of 0.06 where the interfacial distances of alkanes have achieved their equilibrium distances. In addition, the interfacial heat transfer coefficient of ideal crystal monohydric alcohols at hydroxyl interfaces was found to be threefold than that between methyl interfaces, in consistent with the strength of inter-molecular interactions between functional groups at the interfaces.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Higher-order phonon scattering: advancing the quantum theory of phonon linewidth, thermal conductivity and thermal radiative properties

Phonon scattering plays a central role in the quantum theory of phonon linewidth, which in turn governs important properties including infrared spectra, Raman spectra, lattice thermal conductivity, thermal radiative properties, and also signifi- cantly affects other important processes such as hot electron relaxation. Since Maradudin and Fein’s classic work in 1962, three-phonon scattering had been considered as the dominant intrinsic phonon scattering mechanism and has seen tremendous advances. However, the role of the higher-order four-phonon scattering had been persistently unclear and so was ignored. The tremendous complexity of the formalism and computational challenges stood in the way, prohibiting the direct and quantitative treatment of four-phonon scattering. In 2016, a rigorous four-phonon scattering formalism was developed, and the prediction was realized using empirical potentials. In 2017, the method was extended using first-principles calculated force constants, and the thermal conductivities of boron arsenides (BAs), Si and diamond were predicted. The predictions for BAs were later confirmed by several independent experiments. Four-phonon scattering has since been investigated in a range of materials and established as an important intrinsic scattering mechanism for thermal transport and radiative properties. Specifically, four-phonon scattering is important when the fourth-order scattering potential or phase space becomes relatively large. The former scenario includes: (i) nearly all materials when the temperature is high; (ii) strongly anharmonic (low thermal conductivity) materials, including most rocksalt compounds, halides, hydrides, chalcogenides and oxides. The latter scenario includes: (iii) materials with large acoustic–optical phonon band gaps, such as XY compounds with a large atomic mass ratio between X and Y; (iv) two- dimensional materials with reflection symmetry, such as single-layer graphene, single-layer boron nitride and carbon nanotubes; and (v) phonons with a large density of states, such as optical phonons, which are important for Raman, infrared and thermal radiative properties. Four-phonon scattering is expected to gain broad interest in various technologically important materials for thermoelectrics, thermal barrier coatings, thermal energy storage, phase change, nuclear power, ultra-high temperature ceramics, infrared spectra, Raman spectra, radiative transport, hot electron relaxation and radiative cooling. Four-phonon scattering has been, and will continue to be, established as an important intrinsic phonon scattering mechanism beyond three-phonon scattering. The prediction of four-phonon scattering will transition from a breakthrough to a new routine in the next decade.

Feng, Tianli↗
DOE OSTI2020

Thermal Properties of the Quaternary Chalcogenide BaCdSnSe 4

The fields of nonlinear optics, photovoltaics, and thermoelectrics have been strongly impacted by materials research, and quaternary chalcogenides are one general class of materials that has recently generated strong interest. An understanding of the thermal properties is paramount in these and other applications of interest. The thermal properties of BaCdSnSe 4 , a quaternary chalcogenide that is of interest for applications in nonlinear optics, are reported. Specifically, the thermal conductivity over a large temperature range and heat capacity are evaluated in light of the structural features of this material. Low thermal conductivity results from the complex unit cell as well as local dynamic disorder from Cd in the CdSe 4 tetrahedra in the crystal structure. Finally, the results and analyses reported herein are presented to enhance the fundamental understanding of the thermal properties of these materials, and can be related and applied to other quaternary chalcogenides that are of interest for energy-related applications.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Quantum prediction of ultra-low thermal conductivity in lithium intercalation materials

Lithium-intercalated layered transition-metal oxides, Li x TMO 2, brought about a paradigm change in rechargeable batteries in recent decades and show promise for use in memristors, a type of device for future neural computing and on-chip storage. Thermal transport properties, although being a crucial element in limiting the charging/discharging rate, package density, energy efficiency, and safety of batteries as well as the controllability and energy consumption of memristors, are poorly managed or even understood yet. Here, for the first time, we employ quantum calculations including high-order lattice anharmonicity and find that the thermal conductivity κ of Li x TMO 2 materials is significantly lower than hitherto believed. More specifically, the theoretical upper limit of κ of LiCoO 2 is 6 W/m-K, 2–6 times lower than the prior theoretical predictions. Delithiation further reduces κ by 40–70% for LiCoO 2 and LiNbO 2 . Grain boundaries, strain, and porosity are yet additional causes of thermal-conductivity reduction, while Li-ion diffusion and electrical transport are found to have only a minor effect on phonon thermal transport. The results elucidate several long-standing issues regarding the thermal transport in lithium-intercalated materials and provide guidance toward designing high-energy-density batteries and controllable memristors.

25 ENERGY STORAGE↗
DOE OSTI2022

Analysis of Conduction Cooling Strategies for Wire Arc Additive Manufacturing

Metal additive manufacturing (AM) processing consists of numerous parameters which take time to optimize for various geometries. One aspect of the metal AM process that continues to be explored is the control of thermal energy accumulation during component manufacturing due to the melting and solidification of the feedstock. Excessive energy accumulation causes thermal failure of the component while minimal energy accumulation causes lack of fusion with the build plate or previous layer. The ability to simulate the thermal response of an AM component can increase research efficiency by reducing the time to optimize thermal energy accumulation. This paper presents an effective implementation of finite element analysis to determine the thermal response of a wire arc additive manufactured component with various build plate sizes and cooling methods including, integral build plate cooling, oversized build plates with passive cooling, and non-integral build plate cooling. The use of integral build plate cooling channels was shown to decrease the interpass temperature at the conclusion of the build process by 55% and build plate temperature by 96% compared to the conventionally deposited sample with 20 second dwell time. The use of a tall build plate with passive cooling was shown to reduce the interpass temperature by 32% as compared to the conventionally deposited sample with 20 second dwell time. Each cooling strategy evaluated decreased the interpass temperature within a range of 20–55% which enables higher deposition rates and decreased dwell times during depositions. The cooling strategies are designed to be implemented in a hybrid or retrofit AM platform to mitigate concerns of the thermal input from the additive process having detrimental effects on the precision of the machining process. This paper shows that accurate simulations of all strategies can be used to accurately predict the thermal response of the various strategies discussed. These cooling strategies will allow for increased deposition rates with comparable interpass temperature and decreased dwell time, increasing deposition efficiency. This model and these simulations are verified by experimental results. It is concluded that passive strategies, such as the over-sized tall build plate, can be used when liquid coolant in the AM environment could negatively affect the deposition process. Active cooling strategies, such as the integral build plate cooling could be used if low thermal conductivity materials are deposited or higher material deposition rates are desired. This paper discusses the use of active and passive cooling used during AM and shows how a simulation model can be used to make design choices for cooling strategies. The model also enables verification of select critical process parameters such as dwell times for a desired interpass temperature.

Heinrich, Lauren↗
DOE OSTI2020

Experimental Investigation of Low Cost, Low Thermal Conductivity Thermal Barrier Coating on HCCI Combustion, Efficiency, and Emissions

In-cylinder surface temperature is of heightened importance for Homogeneous Charge Compression Ignition (HCCI) combustion since the combustion mechanism is thermo-kinetically driven. Thermal Barrier Coatings (TBCs) selectively manipulate the in-cylinder surface temperature, providing an avenue for improving thermal and combustion efficiency. A surface temperature swing during combustion/expansion reduces heat transfer losses, leading to more complete combustion and reduced emissions. At the same time, achieving a highly dynamic response sidesteps preheating of charge during intake and eliminates the volumetric efficiency penalty. The magnitude and temporal profile of the dynamic surface temperature swing is affected by the TBC material properties, thickness, morphology, engine speed, and heat flux from the combustion process. This study follows prior work of authors with Yttria Stabilized Zirconia, which systematically engineered coatings for HCCI combustion. Herein, a modeling study was used to assess the impacts of various TBC material properties, e.g. density, thickness, and thermal conductivity on the temperature swing effect. Reducing conductivity emerged as a most promising avenue, rather than reducing both the density and effective conductivity by increasing porosity, the current work emphasizes a material with natively low conductivity. A novel TBC formulation was developed, leverages a class of materials that, to the author’s best knowledge, have not been used as a thermal barrier coating previously. Here, a systematic experimental investigation was carried out using single-cylinder research engine. Experimental engine studies utilizing the novel ‘glassy’ low-K coating exhibit advanced ignition phasing and reduced combustion duration relative to the baseline engine. Heat transfer measurements indicate a net reduction in heat flux over the entire cycle, although main effect is felt during expansion, and the reduced heat transfer losses manifest in higher gross indicated thermal efficiency by approximately 5-6% on a relative basis.

42 ENGINEERING↗
DOE OSTI2020

Ultralow Thermal Conductivity in Cs–Sb–Se Compounds: Lattice Instability versus Lone-Pair Electrons

Lone-pair electrons (LPE) are known to lead to large anharmonicity in materials and thus to low lattice thermal conductivity (k). Materials with LPE typically have lower k than those with similar compositions but without LPE. In this study, we investigate thermal transport properties in Cs-Sb-Se ternary compounds by first principles methods and show that LPE do not necessarily guarantee the lowest k.

04 OIL SHALES AND TAR SANDS↗
DOE OSTI2021

Accelerated Discovery and Design of Ultralow Lattice Thermal Conductivity Materials Using Chemical Bonding Principles

Semiconductors with very low lattice thermal conductivities are highly desired for applications relevant to thermal energy conversion and management, such as thermoelectrics and thermal barrier coatings. Although the crystal structure and chemical bonding are known to play vital roles in shaping heat transfer behavior, material design approaches of lowering lattice thermal conductivity using chemical bonding principles are uncommon. In this work, an effective strategy of weakening interatomic interactions and therefore suppressing lattice thermal conductivity based on chemical bonding principles is presented and a high-efficiency approach of discovering low κ L materials by screening the local coordination environments of crystalline compounds is developed. The resulting first-principles calculations uncover 30 hitherto unexplored compounds with (ultra)low lattice thermal conductivities from 13 prototype crystal structures contained in the Inorganic Crystal Structure Database. Furthermore, an approach of rationally designing high-performance thermoelectrics is demonstrated by additionally incorporating cations with stereochemically active lone-pair electrons. Here these results not only provide atomic-level insights into the physical origin of the low lattice thermal conductivity in a large family of copper/silver-based compounds but also offer an efficient approach to discover and design materials with targeted thermal transport properties.

36 MATERIALS SCIENCE↗