Apollo communications system support. Improvements in contact printing and metal masking techniques Final report, 1 Aug. 1967 - 29 Mar. 1968
Production methods for contact prints in emulsions or chromium coated glass plate
Herman, D. S.↗
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Novel Overhang Support Designs for Powder-Based Electron Beam Additive Manufacturing (EBAM)
NASA Marshall Space Flight Center, in collaboration with the University of Alabama, has developed a contact-free support structure used to fabricate overhang-type geometries via EBAM. The support structure is used for 3-D metal-printed components for the aerospace, automotive, biomedical and other industries. Current techniques use support structures to address deformation challenges inherent in 3-D metal printing. However, these structures (overhangs) are bonded to the component and need to be removed in post-processing using a mechanical tool. This new technology improves the overhang support structure design for components by eliminating associated geometric defects and post-processing requirements.
Nabors, Sammy A.↗
Mod silver metallization: Screen printing and ink-jet printing
Basic material efforts have proven to be very successful. Adherent and conductive films were achieved. A silver neodecanoate/bismuth 2-ethylhexanoate mixture has given the best results in both single and double layer applications. Another effort is continuing to examine the feasibility of applying metallo-organic deposition films by use of an ink jet printer. Direct line writing would result in a saving of process time and materials. So far, some well defined lines have been printed.
Vest, R. W.↗
Electromagnetically Clean Solar Arrays
The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the wiring on the back of the panel. Each step increases the potential for occurrence of latent defects, loss of process control, and attrition of components. An EMCSA panel includes an integral cover made from a transparent material. The silicone cover supplants the individual cover glasses on the cells and serves as an additional unitary structural support that offers the advantage, relative to glass, of the robust, forgiving nature of the silcone material. The cover contains pockets that hold the solar cells in place during the lamination process. The cover is coated with indium tin oxide to make its surface electrically conductive, so that it serves as a contiguous, electrically grounded shield over the entire panel surface. The cells are mounted in proximity to metallic printed wiring. The painted-wiring layer comprises metal-film traces on a sheet of Kapton (or equivalent) polyimide. The traces include contact pads on one side of the sheet for interconnecting the cells. Return leads are on the opposite side of the sheet, positioned to form the return currents substantially as mirror images of, and in proximity to, the cell sheet currents, thereby minimizing magnetic moments. The printed-wiring arrangement mimics the back-wiring arrangement of conventional solar arrays, but the current-loop areas and the resulting magnetic moments are much smaller because the return-current paths are much closer to the solar-cell sheet currents. The contact pads are prepared with solder fo electrical and mechanical bonding to the cells. The pocketed cover/shield, the solar cells, the printed-wiring layer, an electrical bonding agent, a mechanical-bonding agent, a composite structural front-side face sheet, an aluminum honeycomb core, and a composite back-side face sheet are all assembled, then contact pads are soldered to the cells and the agents are cured in a single lamination process.
Stem, Theodore G.↗
Fast Assessment of Metal Performance through Dislocation Physics and Machine Learning
The microstructure of metals is key to their mechanical properties. The types, density, composition and morphology of crystal defects all have pronounced impact on the properties. Changes to the microstructure occurring during processing and use can be very striking. The emerging technology additive manufacturing (AM) has the potential to improve performance by allowing optimized designs, but the process and environments can lead to unusual microscale features whose properties must be understood and characterized to enable higher technological readiness levels and application. Experimentally, an extensive evaluation of mechanical properties of 3D printed metals is a challenge, and anomalous effects related to the AM process add complexity. We present a new machine learning (ML) model predicting mechanical response based on dislocation mediated plasticity simulations. A large set of 3D discrete dislocation dynamics simulations with wide ranges of loading conditions is transformed to preprocessed data ready for training with the ML model. The trained model can predict the mechanical response of Mo30W for a given microstructure evolution, providing key information essential for optimization of AM processing.
Jaehyun Cho↗
Fast Assessment of Metal Performance through Dislocation Physics and Machine Learning
The microstructure of metals is key to their mechanical properties. The types, density, composition and morphology of crystal defects all have pronounced impact on the properties. Changes to the microstructure occurring during processing and use can be very striking. The emerging technology additive manufacturing (AM) has the potential to improve performance by allowing optimized designs, but the process and environments can lead to unusual microscale features whose properties must be understood and characterized to enable higher technological readiness levels and application. Experimentally, an extensive evaluation of mechanical properties of 3D printed metals is a challenge, and anomalous effects related to the AM process add complexity. We present a new machine learning (ML) model predicting mechanical response based on dislocation mediated plasticity simulations. A large set of 3D discrete dislocation dynamics simulations with wide ranges of loading conditions is transformed to preprocessed data ready for training with the ML model. The trained model can predict the mechanical response of Mo30W for a given microstructure evolution, providing key information essential for optimization of AM processing.
Jaehyun Cho↗
Process Development for Automated Solar Cell and Module Production. Task 4: Automated Array Assembly
A baseline sequence for the manufacture of solar cell modules was specified. Starting with silicon wafers, the process goes through damage etching, texture etching, junction formation, plasma edge etch, aluminum back surface field formation, and screen printed metallization to produce finished solar cells. The cells were then series connected on a ribbon and bonded into a finished glass tedlar module. A number of steps required additional developmental effort to verify technical and economic feasibility. These steps include texture etching, plasma edge etch, aluminum back surface field formation, array layup and interconnect, and module edge sealing and framing.
Source record↗
SPS solid state antenna power combiner
A concept for a solar power satellite antenna power combiner which utilizes solid state dc-rf converters is described. To avoid the power combining losses associated with circuit hybrids it is proposed that the power from multiple solid state amplifiers be combined by direct coupling of each amplifier's output to the radiating antenna structure. The selected power-combining antenna consists of a printed (metalized) microstrip circuit on a ceramic type dielectric substrate which is backed by a shallow lightweight aluminum cavity which sums the power of four microwave sources. The antenna behaves like two one-half wavelength slot-line antennas coupled together via their common cavity structure. A significant feature of the antenna configuration selected is that the radiated energy is summed to yield a single radiated output phase which represents the average insertion phase of the four power amplifiers. This energy may be sampled and, by comparison with the input signal, one can phase error correct to maintain the insertion phase of all solid state power combining modules at exactly the same value. This insures that the insertion phase of each SPS power combining antenna module is identical. An experiment verification program is described.
Fitzsimmons, G. W.↗
SPS solid state antenna power combiner
Solid state dc-rf converters offer potential improvements in reliability, mass and low voltage operation, provided that anticipated efficiencies in excess of 80 percent can be realized. Field effect transistors offer the greatest potential in the SPS frequency band at 2.45 GHz. To implement this approach it is essential that means be found to sum the power of many relatively low power solid state sources in a low-loss manner, and that means be provided to properly control the phase of the outputs of the large number of solid state sources required. To avoid the power combining losses associated with circuit hybrids it was proposed that the power from multiple solid state amplifiers be combined by direct coupling of each amplifier's output to the radiating antenna structure. The selected power-combining antenna consists of a unique printed (metalized) microstrip circuit on a ceramic type dielectric substrate which is backed by a shallow lightweight aluminum cavity which sums the power of four microwave sources. The antenna behaves like two one-half wavelength slot-line antennas coupled together via their common cavity structure.
Fitzsimmons, G. W.↗
Microstrip Antenna Arrays on Multilayer LCP Substrates
A research and development effort now underway is directed toward satisfying requirements for a new type of relatively inexpensive, lightweight, microwave antenna array and associated circuitry packaged in a thin, flexible sheet that can readily be mounted on a curved or flat rigid or semi-rigid surface. A representative package of this type consists of microwave antenna circuitry embedded in and/or on a multilayer liquid- crystal polymer (LCP) substrate. The circuitry typically includes an array of printed metal microstrip patch antenna elements and their feedlines on one or more of the LCP layer(s). The circuitry can also include such components as electrostatically actuated microelectromechanical systems (MEMS) switches for connecting and disconnecting antenna elements and feedlines. In addition, the circuitry can include switchable phase shifters described below. LCPs were chosen over other flexible substrate materials because they have properties that are especially attractive for high-performance microwave applications. These properties include low permittivity, low loss tangent, low water-absorption coefficient, and low cost. By means of heat treatments, their coefficients of thermal expansion can be tailored to make them more amenable to integration into packages that include other materials. The nature of the flexibility of LCPs is such that large LCP sheets containing antenna arrays can be rolled up, then later easily unrolled and deployed. Figure 1 depicts a prototype three- LCP-layer package containing two four-element, dual-polarization microstrip-patch arrays: one for a frequency of 14 GHz, the other for a frequency of 35 GHz. The 35-GHz patches are embedded on top surface of the middle [15-mil (approx.0.13-mm)-thick] LCP layer; the 14- GHz patches are placed on the top surface of the upper [9-mil (approx. 0.23-mm)-thick] LCP layer. The particular choice of LCP layer thicknesses was made on the basis of extensive analysis of the effects of the thicknesses on cross-polarization levels, bandwidth, and efficiency at each frequency.
Thompson, Dane↗
In-Space Manufacturing and Planetary Surface Construction: A "Make It, Don't Take It" Approach to Long Duration Human Exploration
This presentation will focus on technology development efforts at NASA Marshall Space Flight Center (MSFC) related to the long term sustainability of human spaceflight operations. NASA’s in-space manufacturing (ISM) project is developing approaches for on-demand manufacturing of metals, printed electronics, and recycling. These technologies will be demonstrated onboard the International Space Station (ISS) before transitioning to more logistically remote platforms such as Gateway or a foundational lunar surface habitat. Based on quantitative analyses, the operations and logistics approach used for ISS (which relies on storage of a large volume of spares and frequent cargo resupply), will not be transferrable to long duration, long endurance missions beyond low earth orbit. The deployment of manufacturing and recycling technologies on crewed platforms will enable on-demand manufacturing of spares at the point of use and conversion of nuisance materials to manufacturing feedstock, reducing both launch mass and waste material. This talk will also include information on NASA’s 3D Printed Habitat Centennial Challenge, which concluded in 2019 and served to advance the state of the art for large scale 3D printing with indigenous materials similar to those which would be available on a planetary surface. MSFC also recently began work on the Moon-to-Mars Planetary Autonomous Construction Technologies (MMPACT) project, which seeks to demonstrate capabilities for the creation of infrastructure on the lunar surface via construction of landing pads and habitats with lunar regolith based materials.
materials↗
Hot Cracking Behavior and Beam-Induced Grain Refinement in Electron Beam Freeform Fabricated Al 7075
Electron beam freeform fabrication (EBF 3 ) is a high deposition rate, wire-based directed energy deposition (DED) additive manufacturing (AM) process used to print metallic parts in a vacuum environment. While high specific strength 7xxx-series Al alloys are of interest in the aerospace and automotive industries, these alloys suffer from hot cracking issues during fusion welding and AM. In this work, linear deposits of Al 7075 were fabricated with EBF 3 to study the effects of baseplate thickness, preheat temperature, and beam focus on hot cracking behavior. Solidification cracks were observed in the first deposition layer, and by the third layer coalesced into large “macrocracks” running vertically through the build height. Fine, intergranular liquation “microcracks” appeared between macrocracks below the root of the final deposit layer fusion zone. Increasing the substrate preheat temperature from 165°C to 320°C deepened the partially melted zone and resulted in a more than twofold increase in the liquation microcrack density. Analysis of Scheil solidification diagrams revealed that fugitive losses of Zn and Mg during deposition increased the susceptibility to solidification cracking and promoted substrate liquation cracking. Focused electron beam (EB) conditions combined with a high aspect ratio elliptical raster pattern resulted in bands of refined, equiaxed grains. The refined microstructure suppressed solidification macrocracking and caused a nearly fivefold reduction in liquation crack density, demonstrating that beam-induced grain refinement may be a promising low-cost method for reducing hot cracking during AM.
aluminum↗
Ink-jet printing of silver metallization for photovoltaics
The status of the ink-jet printing program at Purdue University is described. The drop-on-demand printing system was modified to use metallo-organic decomposition (MOD) inks. Also, an IBM AT computer was integrated into the ink-jet printer system to provide operational functions and contact pattern configuration. The integration of the ink-jet printing system, problems encountered, and solutions derived were described in detail. The status of ink-jet printing using a MOD ink was discussed. The ink contained silver neodecanate and bismuth 2-ethylhexanoate dissolved in toluene; the MOD ink decomposition products being 99 wt% AG, and 1 wt% Bi.
Vest, R. W.↗
Ink jet printing of silver metallization for photovoltaics
Progress was made in the continuing development of the ink jet printing system for thick film circuits. The unit being used is a prototype ink jet printer. One of the first tasks completed was the complete documentation of this ink jet printing system as it existed. It was determined that this was an essential step in deciding what modifications were needed to the system and how these modifications would be implemented. Design modification studies were started for electronic, mechanical, and programming aspects of the ystem. The areas needeing improvement were discussed and applicable changes decided upon. Some improvments were completed. Although the general areas needing improving were identified and some changes decided upon, the exact details of how other changes can be implemented are yet been decided.
Vest, R. W.↗
Molybdenum-tin as a solar cell metallization system
The operations of solar cell manufacture are briefly examined. The formation of reliable, ohmic, low-loss, and low-cost metal contacts on solar cells is a critical process step in cell manufacturing. In a commonly used process, low-cost metallization is achieved by screen printing a metal powder-glass frit ink on the surface of the Si surface and the conductive metal powder. A technique utilizing a molybdenum-tin alloy for the metal contacts appears to lower the cost of materials and to reduce process complexity. The ink used in this system is formulated from MoO3 with Sn powder and a trace amount of titanium resonate. Resistive losses of the resulting contacts are low because the ink contains no frit. The MoO3 is finally melted and reduced in forming gas (N2+H2) to Mo metal. The resulting Mo is highly reactive which facilitates the Mo-Si bonding.
Boyd, D. W.↗
Plasma Etching Improves Solar Cells
Etching front surfaces of screen-printed silicon photovoltaic cells with sulfur hexafluoride plasma found to increase cell performance while maintaining integrity of screen-printed silver contacts. Replacement of evaporated-metal contacts with screen-printed metal contacts proposed as one way to reduce cost of solar cells for terrestrial applications.
Bunyan, S. M.↗
Development of Aluminum Feedstock for Additive Manufacturing
The rapid evolution of materials science and manufacturing technologies in recent years has offered new pathways to manipulate materials for bespoke manufacturing. Here we aim to develop feedstocks for applications such as radiator panels, fuel tanks, and structural components for outfitting. As a strong, light weight and thermally conductive material aluminum is ideal for these applications. An often-overlooked source of aluminum waste is food packaging used on the International Space Station. Reusing this waste stream will reduce the cost and logistics of regular sparing. In Space Manufacturing (ISM) will utilize this technology is such areas as sparing and outfitting. However, processing aluminum can present challenges, especially in the context of additive manufacturing and sintering, due to its high reactivity and tendency to form a tenacious oxide layer. Identifying appropriate binders and sintering profiles can overcome these challenges. Herein we present our work on obtaining aluminum powder derived from food packaging, binder selection for aluminum feedstock, and a demonstration of bound metal deposition printing.
aluminum↗
Metal Fused Filament Fabrication of Titanium Alloy for In Space Manufacturing
Metal Fused Filament Fabrication of Titanium Alloy for In Space Manufacturing
3D printing↗